WO2011065044A1

WO2011065044A1 - Curable resin composition and cured product thereof

Info

Publication number: WO2011065044A1
Application number: PCT/JP2010/059897
Authority: WO
Inventors: 政隆中西; 義浩川田; 智江佐々木; 静青木; 直房宮川; 窪木　健一; 瑞観鈴木; 正人鎗田; 小柳　敬夫
Original assignee: 日本化薬株式会社
Priority date: 2009-11-30
Filing date: 2010-06-11
Publication date: 2011-06-03
Also published as: CN102639590B; KR20120114237A; TW201118134A; JPWO2011065044A1; TWI485202B; CN102639590A; SG181122A1; JP5433705B2

Abstract

Provided is a curable resin composition that produces a cured product having excellent resistance to corrosion with respect to gases and the like in the environment, and excellent optical properties in terms of thermal discoloration resistance and light extracting efficiency. The essential ingredients of the curable resin composition are an organopolysiloxane (A) and a zinc salt and/or zinc complex (C). The organopolysiloxane (A) satisfies the following conditions. The organopolysiloxane (A) is an epoxy resin having at least glycidyl groups and/or epoxycyclohexyl groups in the molecules thereof.

Description

Curable resin composition and cured product thereof

The present invention relates to a curable resin composition suitable for use in electrical and electronic materials, particularly for optical semiconductors, and a cured product thereof.

Conventionally, an epoxy resin composition has been employed as a sealing material for optical semiconductor elements such as LED products in terms of a balance between performance and economy. In particular, glycidyl ether type epoxy resin compositions typified by bisphenol A type epoxy resins having excellent balance of heat resistance, transparency and mechanical properties have been widely used.
However, as a result of the shortening of the emission wavelength of LED products (mainly 480 nm for LED products that emit blue light), the sealing material is colored on the LED chip under the influence of short wavelength light, and finally It has been pointed out that illuminance decreases as an LED product.
Therefore, alicyclic epoxy resins represented by 3,4-epoxycyclohexylmethyl-3 ′, 4′epoxycyclohexylcarboxylate are more transparent than glycidyl ether type epoxy resin compositions having an aromatic ring. Since it is excellent, it has been actively studied as an LED sealing material (Patent Documents 1 and 2).

In recent years, LED products have become increasingly brighter for lighting, TV backlights, and the like, and when LEDs are turned on, they generate a lot of heat. Therefore, a resin composition using the alicyclic epoxy resin is used. Even an object is colored on the LED chip, and the illuminance is finally lowered as an LED product, and there is still a problem in terms of durability (Patent Document 3).

Japanese Unexamined Patent Publication No. 9-213997 Japanese Patent No. 3618238 WO / 2005-100445 Japanese Unexamined Patent Publication No. 2007-324256 Japanese Unexamined Patent Publication No. 2000-174347

Due to the durability problem of the epoxy resin, a resin having a siloxane skeleton (specifically, a skeleton having a Si—O bond) introduced as a silicone resin or silicone-modified epoxy resin is used as a sealing material. (Patent Document 3).
In general, it is known that a resin having a siloxane skeleton introduced therein is more stable to heat and light than an epoxy resin. Therefore, when applied to the sealing material of LED products, it was said that it was superior to epoxy resin in terms of coloring on the LED chip. However, resins incorporating a siloxane skeleton are inferior in gas permeability resistance compared to epoxy resins. Therefore, when a silicone resin or a silicone-modified epoxy resin is used as the LED sealing material, coloring on the LED chip is not a problem, but there is a problem that internal components are deteriorated and coloring occurs. . In particular, when used in a living environment, various compounds are floating, and the penetration of such compounds into the interior triggers problems. For example, when the resin is used for lighting applications, the silver component (reflectance) plated on the metal lead frame, which is a constituent member in the LED package, by allowing gas in the environment to pass through the LED sealing material. In other words, the silver plating is applied to improve the color of the LED product, and the performance as an LED product is finally lowered (Patent Documents 5 and 6).

In order to clear this gas permeation resistance problem, Patent Documents 5 and 6 use techniques such as coating a gas permeation-resistant protective agent and coating a metal part with an inorganic material. There was a problem that the productivity increased and productivity deteriorated.

The present invention has been made in view of the above prior art, and the object thereof is a curable resin capable of providing a cured product satisfying various physical properties required as an electrical semiconductor material application, particularly as an optical semiconductor sealing material. It is to provide a composition, and in particular, to provide a curable resin composition capable of giving a cured product having excellent optical properties such as corrosiveness to environmental gases and the like, heat-resistant coloring properties, and light extraction efficiency. is there.

As a result of intensive studies in view of the actual situation as described above, the present inventors have completed the present invention.
That is, the present invention
(1)
A curable resin composition comprising an organopolysiloxane (A) and a zinc salt and / or a zinc complex (C) as essential components;
However, organopolysiloxane (A) satisfies the following conditions.
Organopolysiloxane (A):
At least an epoxy resin having a glycidyl group and / or an epoxycyclohexyl group in the molecule;
(2)
The zinc salt and / or zinc complex (C) is selected from the group consisting of a zinc salt of one or more acids selected from phosphoric acid esters and phosphoric acid, and a zinc complex having the acid and the zinc salt as a ligand. The curable resin composition according to item (1), which is at least one selected from the group consisting of:
(3)
The zinc salt and / or zinc complex (C) is at least one selected from the group consisting of a zinc salt of a carboxylic acid having 1 to 30 carbon atoms and a zinc complex having the acid and the zinc salt as a ligand. The curable resin composition according to the above item (1),
(4)
The curable resin according to any one of (1) to (3) above, which contains a polyvalent carboxylic acid (B) having two or more carboxyl groups and having an aliphatic hydrocarbon group as a main skeleton. Composition,
(5)
The curable resin according to the above item (4), wherein the polyvalent carboxylic acid (B) is a compound obtained by reacting a bi- to hexafunctional polyhydric alcohol having 5 or more carbon atoms with a saturated aliphatic cyclic acid anhydride. Composition,
(6)
The curable resin composition according to any one of (1) to (5) above, which contains an acid anhydride,
(7)
The curable resin composition according to any one of (1) to (6) above, which contains a hindered amine light stabilizer and / or a phosphorus-containing antioxidant,
(8)
A cured product obtained by curing the curable resin composition according to any one of (1) to (7) above;
About.

Since the curable resin composition of the present invention is excellent in optical properties such as corrosion gas resistance, heat-resistant coloring property, and light extraction efficiency, among optical materials, particularly for optical semiconductors (LEDs) used in a living environment such as lighting. It is extremely useful as an adhesive or sealing material for products).

Hereinafter, it describes about the curable resin composition of this invention.
The epoxy resin composition of the present invention comprises an organopolysiloxane (A) and a zinc salt and / or a zinc complex (C) as essential components.
Organopolysiloxane (A) is an epoxy resin having at least a glycidyl group and / or an epoxycyclohexyl group in the molecule, and is generally a sol--using a trialkoxysilane having a glycidyl group or an epoxycyclohexyl group as a raw material. Obtained by gel reaction.
Specifically, Japanese Patent Application Publication No. 2004-256609, Japanese Patent Application Publication No. 2004-346144, Japanese Patent Application Publication No. 2004/072150, Japanese Patent Application Publication No. 2006-8747, Japanese Patent Application Publication No. WO2006 / 003990, Japanese Patent Application Publication No. Described in 2006-104248, WO2007 / 135909, JP-A-2004-10849, JP-A-2004-359933, WO2005 / 100445, JP-A-2008-174640, etc. Silsesquioxane type organopolysiloxane having a three-dimensional network structure.
The structure of the organopolysiloxane is not particularly limited. However, since a siloxane compound having a simple three-dimensional network structure is too hard, a structure that relaxes the hardness is desired. In the present invention, a block structure having a silicone segment and the aforementioned silsesquioxane structure obtained by sol-gel reaction in one molecule is particularly preferred (hereinafter referred to as block type siloxane compound (A1)).

The block-type siloxane compound (A1) is not a compound having a repeating unit in a straight chain like a normal block copolymer, but has a three-dimensional network structure, with a silsesquioxane structure as a core. The chain-like silicone segment extends and becomes a structure in which it is bonded to the next silsesquioxane structure. This structure is effective in the sense of giving a balance between hardness and flexibility to the cured product of the curable resin composition of the present invention.

The block type siloxane compound (A1) is produced using, for example, an alkoxysilane compound (a) represented by the general formula (1) and a silicone oil (b) represented by the general formula (2) as raw materials as described below. If necessary, the alkoxysilane compound (c) represented by the general formula (3) can be used as a raw material. The chain-type silicone segment of the block-type siloxane compound (A1) is formed from the silicone oil (b), and the three-dimensional network of silsesquioxane segments is the alkoxysilane (a) (and the alkoxy used as necessary). Silane (c)). Hereinafter, each raw material will be described in detail.

The alkoxysilane compound (a) is represented by the following formula (1).
XSi (OR ₂ ) ₃ (1)
(In the formula (1), X represents an organic group having a glycidyl group and / or an epoxycyclohexyl group. A plurality of R ₂ represent a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, They may be the same or different.)

X in the general formula (1) is not particularly limited as long as it is an organic group having a glycidyl group and / or an epoxycyclohexyl group. For example, β-glycidoxyethyl, γ-glycidoxypropyl, γ-glycidoxybutyl and the like glycidoxy having 1 to 4 carbon atoms, glycidyl group, β- (3,4-epoxycyclohexyl) ethyl group, γ -(3,4-epoxycyclohexyl) propyl group, β- (3,4-epoxycycloheptyl) ethyl group, β- (3,4-epoxycyclohexyl) propyl group, β- (3,4-epoxycyclohexyl) butyl group And an alkyl group having 1 to 5 carbon atoms substituted with a cycloalkyl group having 5 to 8 carbon atoms having an oxirane group such as β- (3,4-epoxycyclohexyl) pentyl group. Among these, an alkyl group having 1 to 3 carbon atoms substituted with a glycidoxy group, an alkyl group having 1 to 3 carbon atoms substituted with a cycloalkyl group having 5 to 8 carbon atoms having an epoxy group, such as β- A glycidoxyethyl group, a γ-glycidoxypropyl group, and a β- (3,4-epoxycyclohexyl) ethyl group are preferable, and a β- (3,4-epoxycyclohexyl) ethyl group is particularly preferable.
Here, when an alkoxysilane compound in which X is a glycidyl group and an alkoxysilane compound in which X is an epoxycyclohexyl group are used in combination, the alkoxysilane compound in which X is an epoxycyclohexyl group is 80 in the total amount of the alkoxysilane compound (a). It is preferable to use at% or more.

A plurality of R ₂ present in the general formula (1) represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, and may be the same or different. For example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, tert-butyl group, n-pentyl group, n-hexyl group, cyclopentyl group, cyclohexyl group, etc. Can be mentioned. R ₂ is preferably a methyl group or an ethyl group, and particularly preferably a methyl group, from the viewpoint of reaction conditions such as compatibility and reactivity.

Specific preferred examples of the alkoxysilane (a) include β-glycidoxyethyltrimethoxysilane, β-glycidoxyethyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropyltriethoxy. Silane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltriethoxysilane, and the like, particularly β- (3,4-epoxycyclohexyl) ethyltrimethoxy Silane is preferred. These alkoxysilane compounds (a) may be used independently, may use 2 or more types, and can also be used together with the alkoxysilane (c) mentioned later.

Silicone oil (b) is represented by the following formula (2)

(In the formula (2), a plurality of R _{3 s} represent an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms, and an alkenyl group having 2 to 10 carbon atoms, which may be the same or different from each other. M represents the number of repeating units.)
Is a chain silicone oil having a silanol group at the end having a structure represented by:
In the general formula (2), a plurality of R _{3 s} represent an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 14 carbon atoms, and an alkenyl group having 2 to 10 carbon atoms. May be different.
Examples of the alkyl group having 1 to 10 carbon atoms include linear, branched or cyclic alkyl groups having 1 to 10 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an i-propyl group, n-butyl group, i-butyl group, sec-butyl group, t-butyl group, n-pentyl group, i-pentyl group, amyl group, n-hexyl group, cyclopentyl group, cyclohexyl group, octyl group, 2-ethylhexyl Group, nonyl group, decyl group and the like. Among these, considering light resistance and heat resistance, a methyl group, an ethyl group, an n-propyl group, and a cyclohexyl group are preferable.
Examples of the aryl group having 6 to 14 carbon atoms include a phenyl group, an o-tolyl group, an m-tolyl group, a p-tolyl group, and a xylyl group.
Examples of the alkenyl group having 2 to 10 carbon atoms include alkenyl groups such as vinyl group, 1-methylvinyl group, allyl group, propenyl group, butenyl group, pentenyl group and hexenyl group.
R ₃ is preferably a methyl group, a phenyl group, a cyclohexyl group or an n-propyl group from the viewpoints of light resistance and heat resistance, and particularly preferably a methyl group or a phenyl group.

The number m of repeating units of the compound of the general formula (2) shows an average value of 3 to 200, preferably 3 to 100, more preferably 3 to 50. When m is less than 3, the cured product becomes too hard and the low elastic modulus characteristics are deteriorated. If m exceeds 200, the mechanical properties of the cured product tend to deteriorate, which is not preferable.

The weight average molecular weight (Mw) of the silicone oil (b) is preferably in the range of 300 to 18,000 (measured by gel permeation chromatography (GPC)). Among these, those having a molecular weight of 300 to 10,000 are preferable in consideration of the elastic modulus at a low temperature, and those having a molecular weight of 300 to 5,000 are more preferable in consideration of compatibility at the time of forming the composition. 1,000 is preferred. If the weight average molecular weight is less than 300, the properties of the chain silicone portion of the characteristic segment are difficult to be obtained, and the properties as a block type may be impaired. If it exceeds 18,000, a severe layer separation structure will be formed. When used as a material, the permeability becomes poor, making it difficult to use. In the present invention, the molecular weight of the silicone oil (b) can be calculated by polystyrene conversion and weight average molecular weight (Mw) measured under the following conditions using GPC.
Various conditions of GPC Manufacturer: Shimadzu Corporation Column: Guard column SHODEX GPC LF-G LF-804 (3)
Flow rate: 1.0 ml / min.
Column temperature: 40 ° C
Solvent: THF (tetrahydrofuran)
Detector: RI (differential refraction detector)

The kinematic viscosity of the silicone oil (b) is preferably in the range of 10 to 200 cSt, more preferably 30 to 90 cSt. When the viscosity is less than 10 cSt, the viscosity of the block type siloxane compound (A1) becomes too low and may not be suitable as an optical semiconductor sealing agent. When the viscosity exceeds 200 cSt, the viscosity of the block type siloxane compound (A1) Is unfavorable because it tends to cause an adverse effect on workability.

Specific examples of preferable silicone oil (b) include the following product names. For example, PRX-413 and BY16-873 are manufactured by Toray Dow Corning Silicone, X-21-5841 and KF-9701 are manufactured by Shin-Etsu Chemical Co., Ltd., XC96-723 and TSR-160 are manufactured by Momentive. YR-3370, YF-3800, XF-3905, YF-3057, YF-3807, YF-3802, YF-3897, YF-3804, XF-3905, manufactured by Gelest, DMS-S12, DMS-S14 , DMS-S15, DMS-S21, DMS-S27, DMS-S31, DMS-S32, DMS-S33, DMS-S35, DMS-S42, DMS-S45, DMS-S51, PDS-0332, PDS-1615, PDS -9931 and the like. Among these, from the viewpoint of molecular weight and kinematic viscosity, PRX-413, BY16-873, X-21-5841, KF-9701, XC96-723, YF-3800, YF-3804, DMS-S12, DMS-S14, DMS -S15, DMS-S21 and PDS-1615 are preferred. Among these, X-21-5841, XC96-723, YF-3800, YF-3804, DMS-S14, and PDS-1615 are particularly preferable from the viewpoint of molecular weight in order to give the silicone segment flexibility characteristics. These silicone oils (b) may be used alone or in combination of two or more.

Next, the alkoxysilane (c) will be described in detail. The alkoxysilane (c) has a structure of the following formula (3).
R ₄ (OR ₅ ) ₃ (3)
(R ₄ in the general formula (3) represents a methyl group or a phenyl group. A plurality of R _{5 s} represent a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms and are identical to each other. Or different.)

In the general formula (3), a plurality of R _{5 s} represent a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms and may be the same or different from each other. For example, methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, tert-butyl group, n-pentyl group, n-hexyl group, cyclopentyl group, cyclohexyl group, etc. Can be mentioned. R ₅ is preferably a methyl group or an ethyl group from the viewpoint of reaction conditions such as compatibility and reactivity.

Specific examples of preferable alkoxysilane (c) include methyltrimethoxysilane, phenyltrimethoxysilane, methyltriethoxysilane, and phenyltriethoxysilane. Of these, methyltrimethoxysilane and phenyltrimethoxysilane are preferred.

In the present invention, the alkoxysilane (c) is used for adjusting the molecular weight of the block type siloxane compound (A1), for improving the compatibility when it is used as a composition, and for the heat resistance, light resistance, low permeability of the cured product. In order to adjust wettability, low gas permeability, etc., it can be used in combination with alkoxysilane (a).

When the alkoxysilane (c) is used, the alkoxysilane (c) is preferably used in the range of 5 to 70 mol% of the total mol of the alkoxysilanes (a) and (c), more preferably 5 to 50 mol%. Preferably, 10 to 40 mol% is particularly preferable. If it is larger than 70 mol%, the crosslink density of the cured product is lowered and the mechanical strength is lowered, which is not preferable.

As a reaction ratio of alkoxysilane (a), silicone oil (b), and alkoxysilane (c), alkoxysilane (a) (and used as necessary) with respect to 1 equivalent of silanol group of silicone oil (b). The reaction is preferably carried out at an equivalent value of the alkoxy group in the alkoxysilane (c)) of 1.5 to 200, preferably 2 to 200, particularly preferably 2 to 100.
When the equivalent value exceeds 200, the cured product using the block-type siloxane compound (A1) becomes too hard and the desired low elastic modulus characteristic is lowered.

Hereinafter, a preferred method for producing the block type siloxane compound (A1) will be specifically described.
As a manufacturing method of a block type siloxane compound (A1), it is preferable to pass through the manufacturing process shown by the following (i) and (ii).
Production process (i): Process for carrying out dealcoholization condensation of silanol-terminated silicone oil (b) and alkoxysilane (a) having an alkoxy group (and alkoxysilane (c) used if necessary) Production process (ii) : A step of hydrolyzing and condensing alkoxy groups of alkoxysilane (a) (and alkoxysilane (c) used as necessary) by adding water Production steps (i) and (ii) go through each step The reaction can be performed in any order.

Specific examples of preferred production methods include the following three production methods.
<Manufacturing method (I)>
First, as a production process (i), a silicone oil (b) having a silanol group at the terminal and an alkoxysilane (a) which is a silicon compound having an alkoxy group (and an alkoxysilane (c) used if necessary) A step of obtaining an alkoxysilane-modified product (d) by performing alkoxysilane modification on the terminal of the silicone oil by a dealcoholization condensation reaction is performed.
Next, alkoxysilane (a) (and alkoxysilane (c) used as necessary) which is a silicon compound having an alkoxy group as production step (ii), and alkoxy of silicone oil obtained in production step (i) A method of producing a block-type siloxane compound (A1) by passing water through the silane-modified product (d) and performing a hydrolysis-condensation reaction between alkoxy groups.
<Manufacturing method (b)>
First, as a production process (i), an alkoxy group in the molecule is obtained by performing a hydrolysis-condensation reaction between alkoxy groups by adding water of the alkoxysilane (a) (and the alkoxysilane (c) used if necessary). The process of obtaining silsesquioxane (e) which has this is performed.
Next, through a reaction of silicone oil (b) and silsesquioxane (e) as a production step (ii), a step of subjecting the alkoxy group and silanol group remaining in the silsesquioxane structure to a dealcoholization condensation reaction, A method for producing a block-type siloxane compound (A1).
<Manufacturing method (c)>
First, as a production process (i), a silicone oil (b) having a silanol group at the terminal and an alkoxysilane (a) which is a silicon compound having an alkoxy group (and an alkoxysilane (c) used if necessary) After the end of the silicone oil is modified with alkoxysilane by a dealcoholization condensation reaction to obtain an alkoxysilane-modified product (d), water is added to the system, and the remaining alkoxysilane (a ) (And alkoxysilane (c) used as necessary), and a method of producing a block-type siloxane compound (A1) by carrying out a hydrolytic condensation reaction between alkoxy groups of the modified alkoxysilane (d).

In the present invention, from the viewpoint of shortening the production process, it is preferable to use the above production method (c) in which the reaction is sequentially carried out in one pot.
Hereinafter, the production method (c) will be described more specifically.
When the reaction is carried out in one pot, the silanol having an alkoxy group formed in the production step (ii) is performed in the reverse order of the production method (c) described above, that is, when the production step (ii) is performed after the production step (ii). There is a high possibility that the sesquioxane oligomer and the silicone oil (b) are incompatible with each other, the dealcoholization condensation polymerization does not proceed in the subsequent production step (i), and the silicone oil is left behind. On the other hand, if the method of performing manufacturing process (ii) in one pot after manufacturing process (i) like manufacturing method (c) is used, silicone oil (b) and alkoxysilane (a) or alkoxylane (c) Since the compatibility is relatively high, the problem that the reaction does not proceed without compatibility as described above can be avoided. Furthermore, since a large amount of unreacted low-molecular alkoxysilane is present with respect to the silanol group, it is preferable from the viewpoint of reactivity. In the case of carrying out in one pot, first, in the production step (i), the dealcohol condensation of the silicone oil (b) and the alkoxysilane (a) (and the alkoxysilane (c) used if necessary) is carried out, and the terminal of the silicone oil is obtained. Is modified with alkoxysilyl to obtain an alkoxysilane-modified product (d). Since water is not added in the production step (i), hydrolysis condensation between alkoxy groups does not occur, and when the reaction is performed using 3 equivalents or more of alkoxy groups per 1 equivalent of silanol groups, the alkoxysilane modification The body (d) is considered to exist in a structure represented by the following formula (4).

(In the formula (4), R ₃ and m have the same meaning as described above, and a plurality of R _{6 s} independently represent X or R ₄ , and R ₇ is bonded to the same silicon as —OR _7. When R ₆ is X, the R ₂ is shown, and when R ₆ bonded to the same silicon as —OR ₇ is the R ₄ , the R ₅ is shown.)

In the production process (i), if an alkoxy group is reacted in an amount less than 1 equivalent to 1 equivalent of a silanol group, the alkoxy group does not exist at the end of the production process (i), so the process cannot proceed to the production process (ii). In addition, when the alkoxy group is reacted in an amount of 1 to 1.5 equivalents, two or more alkoxy groups in the alkoxysilane (a) (and the alkoxysilane (c) used if necessary) are converted into silicone oil (b ) And the silanol group, the polymer becomes too high at the end of the production step (i) and gelation occurs. For this reason, it is necessary to make an alkoxy group react with 1.5 equivalent or more with respect to 1 equivalent of silanol groups. From the viewpoint of reaction control, 2 equivalents or more are preferable, and 3 equivalents or more are more preferable.

After the production step (i) is completed, a second-stage reaction (production step (ii)) is performed in which water is added as it is to hydrolyze and condense alkoxy groups.
In the production step (ii), the following reactions (I) to (III) occur.
(I) Condensation reaction between alkoxy groups of alkoxysilane (a) (and alkoxysilane (c) used as necessary) remaining in the system.
(II) A condensation reaction between alkoxy groups of the alkoxysilane-modified product (d) obtained in the production step (i) and the alkoxysilane (a) (and the alkoxysilane (c) used as necessary).
(III) Partial condensate of the alkoxysilane modified product (d) obtained in the production step (i) and the alkoxysilane (a) (and the alkoxysilane (c) used if necessary) produced by (I) Condensation reaction between alkoxy groups.
In the production step (ii), the above reaction occurs in combination, and the formation of the silsesquioxane segment and the condensation with the silicone oil-derived chain silicone segment are simultaneously performed.

The production of the block type siloxane compound (A1) can be carried out without a catalyst, but if it is no catalyst, the reaction proceeds slowly, and it is preferably carried out in the presence of a catalyst from the viewpoint of shortening the reaction time. As the catalyst that can be used, any compound that exhibits acidity or basicity can be used. Examples of the acidic catalyst include inorganic acids such as hydrochloric acid, sulfuric acid and nitric acid, and organic acids such as formic acid, acetic acid and oxalic acid. Examples of basic catalysts include sodium hydroxide, potassium hydroxide, lithium hydroxide, alkali metal hydroxides such as cesium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate, etc. Inorganic bases such as alkali metal carbonates and organic bases such as ammonia, triethylamine, diethylenetriamine, n-butylamine, dimethylaminoethanol, triethanolamine, and tetramethylammonium hydroxide can be used. Among these, an inorganic base is particularly preferable in terms of easy catalyst removal from the product, and sodium hydroxide and potassium hydroxide are particularly preferable. The amount of the catalyst added is usually 0.001 to 7.5% by weight, preferably 0, based on the total weight of the alkoxysilane (a) (and the alkoxysilane (c) used if necessary) in the reaction system. 0.01 to 5% by weight.
As a method for adding the catalyst, it is added directly or used in a state dissolved in a soluble solvent or the like. Among them, it is preferable to add the catalyst in a state in which the catalyst is dissolved in advance in alcohols such as methanol, ethanol, propanol and butanol. At this time, adding as an aqueous solution using water or the like causes the condensation of the alkoxysilane (a) (and the alkoxysilane (c) used as necessary) unilaterally as described above, The silsesquioxane oligomer produced thereby and the silicone oil (b) may not be compatible with each other and may become cloudy.

The production of the block type siloxane compound (A1) can be carried out without solvent or in a solvent. Moreover, a solvent can also be added in the middle of a manufacturing process. The solvent for use is not particularly limited as long as it is a solvent that dissolves alkoxysilane (a), alkoxysilane (c), silicone oil (b), and alkoxysilane-modified product (d). Examples of such solvents include aprotic polar solvents such as dimethylformamide, dimethylacetamide, and tetrahydrofuran, ketones such as methyl ethyl ketone, methyl isobutyl ketone, and cyclopentanone, ethyl acetate, butyl acetate, ethyl lactate, and butanoic acid. Examples thereof include esters such as isopropyl, alcohols such as methanol, ethanol, propanol and butanol, hydrocarbons such as hexane, cyclohexane, toluene and xylene. In the present invention, reaction in alcohols is preferable from the viewpoint of reaction control, and methanol and ethanol are more preferable. The amount of solvent used is not particularly limited as long as the reaction proceeds smoothly, but alkoxysilane (a) (and alkoxysilane (c) used as necessary), a compound of silicone oil (b) Usually, about 0 to 900 parts by weight is used with respect to 100 parts by weight. The reaction temperature is usually 20 to 160 ° C., preferably 40 to 140 ° C., particularly preferably 50 to 150 ° C., depending on the amount of catalyst. The reaction time is usually 1 to 40 hours, preferably 5 to 30 hours, in each production step.

After completion of the reaction, the catalyst is removed by quenching and / or washing with water as necessary. When washing with water, depending on the type of solvent used, it is preferable to add a solvent that can be separated from water. Preferred solvents include ketones such as methyl ethyl ketone, methyl isobutyl ketone and cyclopentanone, esters such as ethyl acetate, butyl acetate, ethyl lactate and isopropyl butanoate, hydrocarbons such as hexane, cyclohexane, toluene and xylene. Can be illustrated.

In this reaction, the catalyst may be removed only by washing with water, but the reaction is carried out under acidic or basic conditions. It is preferable to remove the adsorbent by filtration after adsorbing the catalyst using
Any compound that is acidic or basic can be used for the neutralization reaction. Examples of the compound exhibiting acidity include inorganic acids such as hydrochloric acid, sulfuric acid and nitric acid, and organic acids such as formic acid, acetic acid and oxalic acid. Examples of compounds showing basicity include alkali metal hydroxides such as sodium hydroxide, potassium hydroxide, lithium hydroxide and cesium hydroxide, sodium carbonate, potassium carbonate, sodium bicarbonate, potassium bicarbonate. Inorganic bases such as alkali metal carbonates, phosphoric acid, sodium dihydrogen phosphate, disodium hydrogen phosphate, trisodium phosphate, phosphates such as polyphosphoric acid, sodium tripolyphosphate, ammonia, triethylamine, diethylenetriamine, n-butylamine, Organic bases such as dimethylaminoethanol, triethanolamine, and tetramethylammonium hydroxide can be used. Among these, in particular, inorganic bases or inorganic acids are preferable because they can be easily removed from the product, and phosphates that can more easily adjust the pH to near neutral are more preferable.

Examples of the adsorbent include activated clay, activated carbon, zeolite, inorganic / organic synthetic adsorbent, ion exchange resin, and the like, and specific examples include the following products.
As the activated clay, for example, Toshin Kasei Co., Ltd., activated clay SA35, SA1, T, R-15, E, Nikkanite G-36, G-153, G-168 are manufactured by Mizusawa Chemical Co., Ltd. Galeon Earth, Mizuka Ace, etc. are listed. Examples of the activated carbon include CL-H, Y-10S, and Y-10SF manufactured by Ajinomoto Fine Techno Co., and S, Y, FC, DP, SA1000, K, A, KA, M, manufactured by Phutamura Chemical Co., Ltd. Examples thereof include CW130BR, CW130AR, and GM130A. Examples of zeolite include, for example, molecular sieves 3A, 4A, 5A, and 13X, manufactured by Union Showa. As a synthetic adsorbent, for example, Kyoward 100, 200, 300, 400, 500, 600, 700, 1000, 2000 manufactured by Kyowa Chemical Co., Ltd., Amberlist 15JWET, 15DRY, manufactured by Rohm and Haas Co., Ltd. 16WET, 31WET, A21, Amberlite IRA400JCl, IRA403BLCl, IRA404JCl, and Dow Chemical 66, HCR-S, HCR-W2, MAC-3, and the like are available from Dow Chemical.
The adsorbent is added to the reaction solution, followed by treatment such as stirring and heating to adsorb the catalyst, and then the adsorbent is filtered and the residue is washed with water to remove the catalyst and adsorbent.

After completion of the reaction or after quenching, the product can be purified by conventional separation and purification means other than water washing and filtration. Examples of the purification means include column chromatography, vacuum concentration, distillation, extraction and the like. These purification means may be performed singly or in combination.

When the reaction is performed using a solvent mixed with water as a reaction solvent, the reaction solvent mixed with water is removed from the system by distillation or vacuum concentration after quenching, and then washed with a solvent that can be separated from water. It is preferable.

After washing with water, the block siloxane compound (A1) can be obtained by removing the solvent by vacuum concentration or the like.

The appearance of the block-type siloxane compound (A1) thus obtained is usually colorless and transparent and is a liquid having fluidity at 25 ° C. The molecular weight is preferably 800 to 20,000, more preferably 1,000 to 10,000, and particularly preferably 1,500 to 6,000 as the weight average molecular weight measured by GPC. When the weight average molecular weight is less than 800, the heat resistance may be lowered. When the weight average molecular weight is more than 20,000, the viscosity is increased and the workability is adversely affected. The molecular weight is the equivalent ratio of the alkoxysilane (a) (and the alkoxysilane (c) used as necessary) and the silicone oil (b), the molecular weight of the silicone oil (b), the amount of water added during the reaction, The reaction time and reaction temperature can be adjusted.
The said weight average molecular weight is a weight average molecular weight (Mw) of polystyrene conversion measured under the following conditions using GPC (gel permeation chromatography).
Various conditions of GPC Manufacturer: Shimadzu Corporation Column: Guard column SHODEX GPC LF-G LF-804 (3)
Flow rate: 1.0 ml / min.
Column temperature: 40 ° C
Solvent: THF (tetrahydrofuran)
Detector: RI (differential refraction detector)

The epoxy equivalent (measured by the method described in JIS K-7236) of the block type siloxane compound (A1) is preferably 300 to 1,600 g / eq, more preferably 400 to 1,000 g / eq. Particularly preferred is 450 to 900 g / eq. When the epoxy equivalent is less than 300 g / eq, the cured product is hard and the elastic modulus tends to be too high, and when it exceeds 1,600 g / eq, the mechanical properties of the cured product tend to deteriorate.

The viscosity of the block-type siloxane compound (A1) (E-type viscometer, measured at 25 ° C.) is preferably 50 to 20,000 mPa · s, more preferably 500 to 10,000 mPa · s, particularly 800 to 5 1,000 mPa · s is preferred. If the viscosity is less than 50 mPa · s, the viscosity may be too low to be suitable for use as an optical semiconductor encapsulant, and if it exceeds 20,000 mPa · s, the viscosity may be too high and workability may be poor. is there.

The ratio of silicon atoms bonded to three oxygens derived from silsesquioxane in the block-type siloxane compound (A1) to the total silicon atoms is preferably 5 to 50 mol%, more preferably 8 to 30 mol%, 10 to 20 mol% is particularly preferable. When the ratio of silicon atoms bonded to three oxygens derived from silsesquioxane to the total silicon atoms is less than 5 mol%, the cured product tends to be too soft as a characteristic of the chain silicone segment, and surface tack There are concerns about injury. On the other hand, if it exceeds 50 mol%, the cured product becomes too hard as a feature of the silsesquioxane segment, which is not preferable.
The proportion of silicon atoms present can be determined by ¹ H NMR, ²⁹ Si NMR, elemental analysis, etc. of the block siloxane compound (A1).

The curable resin composition of the present invention contains a polyvalent carboxylic acid (B) as a preferred component.
The polyvalent carboxylic acid (B) is a compound having at least two or more carboxyl groups and having an aliphatic hydrocarbon group as a main skeleton. In the present invention, the polyvalent carboxylic acid is not only a polyvalent carboxylic acid having a single structure, but also a mixture of a plurality of compounds having different substituent positions or different substituents, that is, a polyvalent carboxylic acid composition. In the present invention, they are collectively referred to as a polyvalent carboxylic acid.

The polycarboxylic acid (B) is particularly preferably a bi- to hexa-functional carboxylic acid, and more preferably a compound obtained by reacting a bi- to hexa-functional polyhydric alcohol having 5 or more carbon atoms with an acid anhydride. Furthermore, the polycarboxylic acid whose said acid anhydride is a saturated aliphatic cyclic acid anhydride is preferable.
The bi- to hexafunctional polyhydric alcohol is not particularly limited as long as it is a compound having an alcoholic hydroxyl group, but ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,4-butane. Diol, 1,5-pentanediol, 1,6-hexanediol, cyclohexanedimethanol, 2,4-diethylpentanediol, 2-ethyl-2-butyl-1,3-propanediol, neopentyl glycol, tricyclode Diols such as candimethanol and norbornenediol, triols such as glycerin, trimethylolethane, trimethylolpropane, trimethylolbutane, 2-hydroxymethyl-1,4-butanediol, tetraerythritol, ditrimethylolpropane and the like Raoul acids, and the like hexa-ols, such as dipentaerythritol.

Particularly preferred polyhydric alcohols are alcohols having 5 or more carbon atoms, particularly 1,6-hexanediol, 1,4-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, 1,2-cyclohexanedimethanol, , 4-diethylpentanediol, 2-ethyl-2-butyl-1,3-propanediol, neopentyl glycol, tricyclodecane dimethanol, norbornene diol, etc. are preferred, among which 2-ethyl-2-butyl-1,3 -Polyhydric alcohols having a branched or cyclic structure such as propanediol, neopentyl glycol, 2,4-diethylpentanediol, 1,4-cyclohexanedimethanol, tricyclodecane dimethanol, norbornenediol are more preferred.

Examples of acid anhydrides include methyltetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane- 2,3-dicarboxylic acid anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride and the like are preferable, Of these, methylhexahydrophthalic anhydride and cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride are preferable.
Although there is no particular designation for the conditions for the addition reaction, one specific reaction condition is that the acid anhydride and polyhydric alcohol are reacted at 40 to 150 ° C. under non-catalytic and solvent-free conditions and heated. Although the method of taking out as it is after completion | finish is mentioned, It is not limited to this reaction conditions.

As the polycarboxylic acid thus obtained, the following formula (5)

(Wherein a plurality of Q's represent at least one of a hydrogen atom, a methyl group and a carboxyl group. P is a chain, branched or cyclic aliphatic group derived from the aforementioned polyhydric alcohol. The number of functional groups of polyhydric alcohol (the number of alcohol groups), preferably an integer of 2 to 6.)
The compound represented by these is preferable.

The curable resin composition of the present invention preferably contains an acid anhydride. Specific examples of acid anhydrides include phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, nadic anhydride, hexahydrophthalic anhydride Acid, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane-2,3-dicarboxylic anhydride, methylbicyclo [2,2,1] heptane-2,3- And acid anhydrides such as dicarboxylic acid anhydride and cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride.
In particular, methyltetrahydrophthalic anhydride, methylnadic anhydride, nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane-2,3-dicarboxylic acid An acid anhydride, methylbicyclo [2,2,1] heptane-2,3-dicarboxylic acid anhydride, and cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride are preferred.
Further, among the acid anhydrides, the following formula (6)

(In the formula, Z represents at least one of a hydrogen atom, a methyl group, and a carboxyl group.)
And preferably hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride represented by the formula: methylhexahydrophthalic anhydride, cyclohexane-1,3, 4-Tricarboxylic acid-3,4-anhydride is preferred.

When the curable resin composition of this invention contains an acid anhydride, the usage-amount is determined by the ratio with polyhydric carboxylic acid (B), and the range of a following formula is preferable.
W1 / (W1 + W2) = 0.05 to 0.65
(W1 represents a blended part by weight of the polyvalent carboxylic acid (B), and W2 represents a blended part by weight of the acid anhydride.)
In the above, the range of W1 / (W1 + W2) is more preferably 0.05 to 0.65, further preferably 0.10 to 0.65, and particularly preferably 0.3 to 0.6. If it is less than 0.05, there is a strong tendency of acid volatilization to increase during curing, which is not preferable. If it exceeds 0.65, the viscosity becomes high and handling becomes difficult. When the acid anhydride is not contained (except when it remains in a small amount), the polyvalent carboxylic acid (B) has no problem because the shape of the polyvalent carboxylic acid (B) is solid or nearly solid or crystal at room temperature.
When polyhydric carboxylic acid (B) and acid anhydride are used in combination, the polyhydric carboxylic acid (B) is produced in an excess of acid anhydride at the time of producing polyhydric carboxylic acid (B), and a mixture of polyvalent carboxylic acid (B) and acid anhydride The method of making is also preferable from the viewpoint of simplicity of operation.

The curable resin composition of the present invention contains a zinc salt and / or a zinc complex (C) as an essential component. The zinc salt and / or zinc complex (C) contributes as a curing accelerator between the epoxy resin and the curing agent in the present invention.
The zinc salt and / or zinc complex (C) is not particularly limited as long as it is a salt and / or complex having a zinc ion as a central element, but an alkyl group having 1 to 30 carbon atoms as a counter ion and / or a ligand is used. What has at least 1 sort (s) of acid chosen from the carboxylic acid which has, phosphoric acid ester, and phosphoric acid is preferable. In the present invention, a zinc carboxylate and a phosphate ester zinc are particularly preferable, and a zinc carboxylate is particularly preferable in terms of compatibility.
Examples of the alkyl group include methyl, isopropyl, butyl, 2-ethylhexyl, octyl, isodecyl, isostearyl, decanyl, cetyl, and undecylene.

The zinc carboxylate is at least one selected from the group consisting of a zinc salt of a carboxylic acid having 1 to 30 carbon atoms and a zinc complex having the carboxylic acid having 1 to 30 carbon atoms and the zinc salt as a ligand. Can be used. As the zinc carboxylate, the carboxylic acid having 1 to 30 carbon atoms is preferably an alkyl group having a functional group such as alkyl or olefin having a chain branched structure, more preferably 3 to 30 carbon atoms. Among them, those having 5 to 20 carbon atoms are particularly preferable. These are preferable in terms of compatibility, and when the number of carbons is too large (over 30 carbons), or when they do not have a structure such as a branched structure or a functional group such as an olefin, the compatibility with the resin is poor and is not preferable. .
Specific examples include zinc 2-ethylhexylate, zinc isostearate and zinc undecylenate.

As the phosphate ester body, at least one selected from the group consisting of a zinc salt of a phosphate ester and a zinc complex having the phosphate ester and the zinc salt as a ligand can be used. The phosphoric acid ester may also contain phosphoric acid derived from a phosphoric acid ester as a counter ion and / or a ligand.
In the present invention, a particularly preferable phosphate ester body is preferably a zinc salt and / or zinc complex of a phosphate ester (monoalkyl ester body, dialkyl ester body, trialkyl ester body, or a mixture thereof). You may contain. Specifically, the molar ratio of monoalkyl ester, dialkyl ester, and trialkyl ester in the phosphoric acid ester contained in the phosphoric acid ester (substitute with the purity of gas chromatography. However, trimethylsilylation must be performed. Therefore, in the stage of trimethylsilylation treatment, it is preferable that the abundance of the monoalkyl ester is 50 area% or more.
Such a zinc salt and / or zinc complex of zinc phosphate ester can be obtained, for example, by reacting a phosphate ester with, for example, zinc carbonate, zinc hydroxide or the like (Patent Document EP 699708).
As the phosphoric acid ester, 2-ethylhexyl phosphoric acid, stearyl phosphoric acid and the like are preferable.

As for the details of the zinc salt and / or zinc complex of such phosphate ester, the ratio of phosphorus atom to zinc atom (P / Zn) is preferably 1.2 to 2.3, more preferably 1.3 to 2.0. . Particularly preferred is 1.4 to 1.9. That is, in a particularly preferred form, the amount of phosphate ester (or phosphate derived from phosphate ester) is 2.0 mol or less per mole of zinc ion, and not a simple ionic structure, but some molecules are ion-bonded (or arranged). Those having a structure related by coordinate bond) are preferred. Such a zinc salt and / or zinc complex can also be obtained, for example, by the technique described in Japanese Patent Publication No. 2003-51495.

As such compounds, as commercially available zinc carboxylates, Zn-St, Zn-St 602, Zn-St NZ, ZS-3, ZS-6, ZS-8, ZS-8, ZS-7, ZS-10, ZS-5, ZS-14, ZS-16 (manufactured by Nitto Kasei Kogyo), XK-614 (manufactured by King Industry), 18% octope Zn, 12% octope Zn, 8% octope Zn (manufactured by Hope Pharmaceutical) Examples of the phosphoric ester and / or zinc phosphate include LBT-2000B (manufactured by SC Organic Chemical) and XC-9206 (manufactured by King Industry).

In the curable resin composition of the present invention, the ratio of the organopolysiloxane (A) to the zinc salt and / or the zinc complex (C) is the same as the ratio of the zinc salt and / or the zinc complex to the organopolysiloxane (A). C) is 0.01 to 8% by weight, more preferably 0.05 to 5% by weight, and further 0.1 to 4% by weight. Further, it is particularly preferably 0.1 to 2% by weight.

When the curable resin composition of the present invention is used in an optical material, particularly an optical semiconductor encapsulant, it contains a hindered amine compound as a light stabilizer and a phosphorus compound as an antioxidant as particularly preferable components. That is preferred. In the present invention, it is particularly preferable to contain a hindered amine compound, and it is preferable to contain a phosphorus compound as required.
Examples of the amine compound include tetrakis (1,2,2,6,6-pentamethyl-4-piperidyl) = 1,2,3,4-butanetetracarboxylate, tetrakis (2,2,6,6- Totramethyl-4-piperidyl) = 1,2,3,4-butanetetracarboxylate, 1,2,3,4-butanetetracarboxylic acid and 1,2,2,6,6-pentamethyl-4-piperidinol and 3 , 9-bis (2-hydroxy-1,1-dimethylethyl) -2,4,8,10-tetraoxaspiro [5.5] undecane mixed ester, decanedioic acid bis (2,2,6 , 6-Tetramethyl-4-piperidyl) sebacate, bis (1-undecanoxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate, 2,2,6,6, -tetrame Ru-4-piperidyl methacrylate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, 4-benzoyloxy -2,2,6,6-tetramethylpiperidine, 1- [2- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] ethyl] -4- [3- (3 , 5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] -2,2,6,6-tetramethylpiperidine, 1,2,2,6,6-pentamethyl-4-piperidinyl-methacrylate, bis (1,2,2,6,6-pentamethyl-4-piperidinyl) [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] bu Lumalonate, decanedioic acid bis [2,2,6,6-tetramethyl-1 (octyloxy) -4-piperidinyl] ester, reaction product of 1,1-dimethylethyl hydroperoxide and octane, N, N ′, N ″, N ″ ′-tetrakis- [4,6-bis- [butyl- (N-methyl-2,2,6,6-tetramethylpiperidin-4-yl) amino] -triazin-2-yl]- 4,7-diazadecane-1,10-diamine, dibutylamine, 1,3,5-triazine, N, N'-bis (2,2,6,6-tetramethyl-4-piperidyl-1,6-hexa Polycondensate of methylenediamine and N- (2,2,6,6-tetramethyl-4-piperidyl) butylamine, poly [[6- (1,1,3,3-tetramethylbutyl) amino-1,3 , 5-Triazine -2,4-diyl] [(2,2,6,6-tetramethyl-4-piperidyl) imino] hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imino]], Polymer of dimethyl acid and 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol, 2,2,4,4-tetramethyl-20- (β-lauryloxycarbonyl) ethyl-7- Oxa-3,20-diazadispiro [5,1,11,2] heneicosan-21-one, β-alanine, N,-(2,2,6,6-tetramethyl-4-piperidinyl) -dodecyl ester / tetra Decyl ester, N-acetyl-3-dodecyl-1- (2,2,6,6-tetramethyl-4-piperidinyl) pyrrolidine-2,5-dione, 2,2,4,4-tetramethyl-7- Oki -3,20-diazadispiro [5,1,11,2] heneicosan-21-one, 2,2,4,4-tetramethyl-21-oxa-3,20-diazadicyclo- [5,1,11, 2] -Heneicosane-20-propanoic acid dodecyl ester / tetradecyl ester, propanedioic acid, [(4-methoxyphenyl) -methylene] -bis (1,2,2,6,6-pentamethyl-4-piperidinyl) Ester, higher fatty acid ester of 2,2,6,6-tetramethyl-4-piperidinol, 1,3-benzenedicarboxamide, N, N′-bis (2,2,6,6-tetramethyl-4- And hindered amine compounds such as piperidinyl).

The following commercially available products can be used as the amine compound that is the light stabilizer.
For example, as manufactured by Ciba Specialty Chemicals, TINUVIN 765, TINUVIN 770DF, TINUVIN 144, TINUVIN 123, TINUVIN 622LD, TINUVIN 152, CHIMASSORB 944, manufactured by ADEKA, LA-52, LA-57, LA-62, LA-63P, LA-77Y, LA-81, LA-82, LA-87 and the like can be mentioned.

In the curable resin composition of the present invention, the light stabilizer is used in an amount of 0.005 to 5% by weight, more preferably 0.01 to 4% by weight, based on the organopolysiloxane (A). .1 to 2% by weight.

The phosphorus compound is not particularly limited. For example, 1,1,3-tris (2-methyl-4-ditridecyl phosphite-5-tert-butylphenyl) butane, distearyl pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, Dicyclohexylpentaerythritol diphosphite, tris (diethylphenyl) phosphite, tris (di-isopropylphenyl) phosphite, tris (di-n-butylphenyl) phosphite, tris (2,4-di-tert-butylphenyl) Sphite, Tris (2,6-di-tert-butylphenyl) phosphite, Tris (2,6-di-tert-butylphenyl) phosphite, 2,2'-methylenebis (4,6-di-tert-butyl) Phenyl) (2,4-di-tert-butylphenyl) phosphite, 2,2′-methylenebis (4,6-di-tert-butylphenyl) (2-tert-butyl-4-methylphenyl) phosphite, 2,2′-methylenebis (4-methyl-6-tert-butylphenyl) (2-tert-butyl-4-methylphenyl) phosphite, 2,2′-ethylidenebis (4-methyl-6-tert-butyl) Phenyl) (2-tert-butyl-4-methylphenyl) phosphite, tetrakis (2,4-di-tert-butylphenyl)- , 4′-biphenylenediphosphonite, tetrakis (2,4-di-tert-butylphenyl) -4,3′-biphenylenediphosphonite, tetrakis (2,4-di-tert-butylphenyl) -3,3 '-Biphenylenediphosphonite, tetrakis (2,6-di-tert-butylphenyl) -4,4'-biphenylenediphosphonite, tetrakis (2,6-di-tert-butylphenyl) -4,3'- Biphenylene diphosphonite, tetrakis (2,6-di-tert-butylphenyl) -3,3'-biphenylene diphosphonite, bis (2,4-di-tert-butylphenyl) -4-phenyl-phenylphosphonite Bis (2,4-di-tert-butylphenyl) -3-phenyl-phenylphosphonite, bis (2,6-di-n- Tilphenyl) -3-phenyl-phenylphosphonite, bis (2,6-di-tert-butylphenyl) -4-phenyl-phenylphosphonite, bis (2,6-di-tert-butylphenyl) -3-phenyl -Phenylphosphonite, tetrakis (2,4-di-tert-butyl-5-methylphenyl) -4,4'-biphenylenediphosphonite, tributyl phosphate, trimethyl phosphate, tricresyl phosphate, triphenyl phosphate, trichlorophenyl Examples include phosphate, triethyl phosphate, diphenyl cresyl phosphate, diphenyl monoorthoxenyl phosphate, tributoxyethyl phosphate, dibutyl phosphate, dioctyl phosphate, diisopropyl phosphate, etc. .

A commercial item can also be used for the said phosphorus compound.
For example, ADK STAB PEP-4C, ADK STAB PEP-8, ADK STAB PEP-24G, ADK STAB PEP-36, ADK STAB HP-10, ADK STAB 2112, ADK STAB 260, ADK STAB 522A, ADK STAB 1178, ADK STAB 1500, ADK STAB C, and ADK STAB C 135A, ADK STAB 3010, and ADK STAB TPP.

In the curable resin composition of the present invention, the amount of the phosphorus compound used is 0.005 to 5% by weight, more preferably 0.01 to 4% by weight, 0% by weight based on the organopolysiloxane (A). .1 to 2% by weight.

The curable resin composition of the present invention contains an organopolysiloxane (A) as an epoxy resin, a zinc salt and / or a zinc complex (C) as essential components, and a polyvalent carboxylic acid (B as a curing agent). ), Acid anhydrides, and hindered amine light stabilizers and phosphorus-containing antioxidants as preferred optional components, but these can be used in combination with other epoxy resins, curing agents, and various additives. .

When the organopolysiloxane (A) is used in combination with another epoxy resin in the epoxy resin component, the proportion of the organopolysiloxane (A) in the total epoxy resin is preferably 60% by weight or more, particularly preferably 70% by weight or more.

Examples of other epoxy resins that can be used in combination with the organopolysiloxane (A) include novolac type epoxy resins, bisphenol A type epoxy resins, biphenyl type epoxy resins, triphenylmethane type epoxy resins, and phenol aralkyl type epoxy resins. Specifically, bisphenol A, bisphenol S, thiodiphenol, fluorene bisphenol, terpene diphenol, 4,4′-biphenol, 2,2′-biphenol, 3,3 ′, 5,5′-tetramethyl- [ 1,1′-biphenyl] -4,4′-diol, hydroquinone, resorcin, naphthalenediol, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol (Phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydroxybenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, o-hydroxybenzaldehyde, p-hydroxyacetofu Non, o-hydroxyacetophenone, dicyclopentadiene, furfural, 4,4′-bis (chloromethyl) -1,1′-biphenyl, 4,4′-bis (methoxymethyl) -1,1′-biphenyl, 1, Glycidyl ethers derived from polycondensates with 4-bis (chloromethyl) benzene, 1,4-bis (methoxymethyl) benzene and the like, modified products thereof, halogenated bisphenols such as tetrabromobisphenol A, and alcohols Solid or liquid epoxy resins such as chemical compounds, alicyclic epoxy resins, glycidyl amine epoxy resins, glycidyl ester epoxy resins and the like are not limited thereto. These may be used alone or in combination of two or more.

In particular, the curable resin composition of the present invention is mainly used for optical applications. When used for optical applications, combined use with an alicyclic epoxy resin is preferred. In the case of an alicyclic epoxy resin, a compound having an epoxycyclohexane structure in the skeleton is preferable, and an epoxy resin obtained by an oxidation reaction of a compound having a cyclohexene structure is particularly preferable.
These epoxy resins include esterification reaction of cyclohexene carboxylic acid and alcohols or esterification reaction of cyclohexene methanol and carboxylic acids (Tetrahedron vol.36 p.2409 (1980), Tetrahedron Letter p.4475 (1980), etc.) Described), or Tyschenko reaction of cyclohexene aldehyde (method described in Japanese Patent Application Laid-Open No. 2003-170059, Japanese Patent Application Laid-Open No. 2004-262871, etc.), and transesterification of cyclohexene carboxylic acid ester (Japan) And a compound obtained by oxidizing a compound that can be produced by a method described in Japanese Patent Laid-Open No. 2006-052187.
The alcohol is not particularly limited as long as it is a compound having an alcoholic hydroxyl group, but ethylene glycol, propylene glycol, 1,3-propanediol, 1,2-butanediol, 1,4-butanediol, 1,5-pentane. Diol, 1,6-hexanediol, cyclohexanedimethanol, 2,4-diethylpentanediol, 2-ethyl-2-butyl-1.3-propanediol, neopentyl glycol, tricyclodecane dimethanol, norbornenediol, etc. Diols, glycerol, trimethylolethane, trimethylolpropane, trimethylolbutane, triols such as 2-hydroxymethyl-1,4-butanediol, tetraols such as pentaerythritol, ditrimethylolpropane, etc. And the like. Examples of carboxylic acids include, but are not limited to, oxalic acid, maleic acid, fumaric acid, phthalic acid, isophthalic acid, adipic acid, and cyclohexanedicarboxylic acid.
Furthermore, as another epoxy resin, an epoxy resin obtained by epoxidizing an acetal compound obtained by an acetal reaction between a cyclohexene aldehyde derivative and an alcohol by an oxidation reaction can be given.

Specific examples of these epoxy resins include ERL-4221, UVR-6105, ERL-4299 (all trade names, all manufactured by Dow Chemical), Celoxide 2021P, Epolide GT401, EHPE3150, EHPE3150CE (all trade names, all Daicel) (Chemical Industry) and dicyclopentadiene diepoxide, and the like, but are not limited to these (Reference: Review Epoxy Resin Basic Edition I p76-85).
These may be used alone or in combination of two or more.

Although it does not specifically limit as a hardening | curing agent component in this invention, It is desirable to use a polyhydric carboxylic acid compound (B) individually or in combination with an acid anhydride, and these and other hardening | curing agents are used together. Can also be used. When used in combination, the proportion of the total weight of the polyvalent carboxylic acid compound (B) and the acid anhydride in the total curing agent is preferably 30% by weight or more, particularly preferably 40% by weight or more.
Examples of the curing agent that can be used in combination include amine compounds, acid anhydride compounds, amide compounds, phenol compounds, and carboxylic acid compounds. Specific examples of curing agents that can be used include amines and polyamide compounds (diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, dicyandiamide, polyamide resin synthesized from ethylenediamine and dimer of linolenic acid, etc.) , Reaction product of acid anhydride and silicone alcohol (phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, anhydrous Nadic acid, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butanetetracarboxylic anhydride, bicyclo [2,2,1] heptane-2,3-dicarboxylic anhydride, methylbicyclo [2,2,1] Hepta -Reaction products of acid anhydrides such as -2,3-dicarboxylic acid anhydride and cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride and silicone alcohols such as carbinol-modified silicone) Polyphenols (bisphenol A, bisphenol F, bisphenol S, fluorene bisphenol, terpene diphenol, 4,4′-biphenol, 2,2′-biphenol, 3,3 ′, 5,5′-tetramethyl- [ 1,1′-biphenyl] -4,4′-diol, hydroquinone, resorcin, naphthalenediol, tris- (4-hydroxyphenyl) methane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, phenol (Phenol, alkyl-substituted phenol, naphthol, alkyl-substituted naphthol, dihydro Sibenzene, dihydroxynaphthalene, etc.) and formaldehyde, acetaldehyde, benzaldehyde, p-hydroxybenzaldehyde, o-hydroxybenzaldehyde, p-hydroxyacetophenone, o-hydroxyacetophenone, dicyclopentadiene, furfural, 4,4'-bis (chloromethyl)- 1,1′-biphenyl, 4,4′-bis (methoxymethyl) -1,1′-biphenyl, 1,4′-bis (chloromethyl) benzene, 1,4′-bis (methoxymethyl) benzene, etc. Polycondensates and modified products thereof, halogenated bisphenols such as tetrabromobisphenol A, condensates of terpenes and phenols) and others (imidazole, trifluoroborane-amine complexes, guanidine derivatives, etc.) But this It is not limited to these. These may be used alone or in combination of two or more.

In the curable resin composition of the present invention, the blending ratio of the epoxy resin component and the curing agent component is 0.7 to 1.2 equivalents, particularly preferably 0, for the curing agent component to 1 equivalent of the epoxy group of the epoxy resin component. It is preferable to use a curing agent in a ratio of .75 to 1.1 equivalents.
When less than 0.7 equivalent or more than 1.2 equivalent with respect to 1 equivalent of epoxy group, curing may be incomplete and good cured properties may not be obtained.

In the curable resin composition of the present invention, the zinc salt and / or zinc complex (C), which is an essential component, exhibits the action as a curing catalyst as it is, and therefore it is not necessary to add a curing catalyst separately. Other curing catalysts can be used in combination. Examples of the curing accelerator that can be used include 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1- Benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6 (2′-methylimidazole (1 ')) Ethyl-s-triazine, 2,4-diamino-6 (2'-undecylimidazole (1')) ethyl-s-triazine, 2,4-diamino-6 (2'-ethyl, 4-methyl) Imidazole (1 ′)) ethyl-s-triazine, 2,4-diamino-6 (2′-methyl) Imidazole (1 ′)) ethyl-s-triazine isocyanuric acid adduct, 2-methylimidazole isocyanuric acid 2: 3 adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxymethylimidazole , 2-phenyl-4-hydroxymethyl-5-methylimidazole, various imidazoles of 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, and imidazoles and phthalic acid, isophthalic acid, terephthalic acid , Salts with polyvalent carboxylic acids such as trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, maleic acid and succinic acid, amides such as dicyandiamide, 1,8-diaza-bicyclo (5.4.0) undecene-7 Diaza compounds and their tetrapheni Salts such as borates and phenol novolaks, salts with the above polycarboxylic acids, or phosphinic acids, ammonium salts such as tetrabutylammonium bromide, cetyltrimethylammonium bromide, trioctylmethylammonium bromide, triphenylphosphine, tri (tolyl) phosphine Phosphines and phosphonium compounds such as tetraphenylphosphonium bromide and tetraphenylphosphonium tetraphenylborate, phenols such as 2,4,6-trisaminomethylphenol, metal compounds such as amine adducts and tin octylate, and curing thereof Examples thereof include a microcapsule-type curing accelerator having a microcapsule as an accelerator. Which of these curing accelerators is used is appropriately selected depending on characteristics required for the obtained transparent resin composition, such as transparency, curing speed, and working conditions. The curing accelerator is usually used in the range of 0.001 to 15 parts by weight with respect to 100 parts by weight of the epoxy resin component.

Various additives and auxiliary materials as described below can be added to the curable resin composition of the present invention.
The curable resin composition of the present invention may contain a phosphorus-containing compound as a flame retardant component. The phosphorus-containing compound may be a reactive type or an additive type. Specific examples of phosphorus-containing compounds include trimethyl phosphate, triethyl phosphate, tricresyl phosphate, trixylylenyl phosphate, cresyl diphenyl phosphate, cresyl-2,6-dixylylenyl phosphate, 1,3-phenylenebis ( Phosphoric esters such as dixylylenyl phosphate), 1,4-phenylenebis (dixylylenyl phosphate), 4,4′-biphenyl (dixylylenyl phosphate); 9,10-dihydro-9-oxa Phosphanes such as -10-phosphaphenanthrene-10-oxide, 10 (2,5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide; epoxy resin and active hydrogen of the phosphanes A phosphorus-containing product obtained by reacting with Poxy compounds, red phosphorus and the like can be mentioned. Phosphate esters, phosphanes or phosphorus-containing epoxy compounds are preferable, and 1,3-phenylenebis (dixylylenyl phosphate), 1,4-phenylenebis (dixylylene). Nyl phosphate), 4,4′-biphenyl (dixylylenyl phosphate) or phosphorus-containing epoxy compounds are particularly preferred. The phosphorus-containing compound content is preferably phosphorus-containing compound / epoxy resin = 0.1 to 0.6 (weight ratio). If it is less than 0.1, the flame retardancy is insufficient, and if it exceeds 0.6, there is a concern that it may adversely affect the hygroscopicity and dielectric properties of the cured product.

Furthermore, a binder resin can be blended with the curable resin composition of the present invention as required. Examples of the binder resin include butyral resins, acetal resins, acrylic resins, epoxy-nylon resins, NBR-phenol resins, epoxy-NBR resins, polyamide resins, polyimide resins, and silicone resins. However, it is not limited to these. The blending amount of the binder resin is preferably in a range that does not impair the flame retardancy and heat resistance of the cured product, and is usually 0.05 to 50 parts by weight, preferably 100 parts by weight of the epoxy resin component and the curing agent component. 0.05 to 20 parts by weight is used as necessary.

An inorganic filler can be added to the curable resin composition of the present invention as necessary. Examples of inorganic fillers include crystalline silica, fused silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, silicon nitride, boron nitride, zirconia, fosterite, steatite, spinel, titania, talc, and the like. However, the present invention is not limited to these. Moreover, these inorganic fillers may be used independently and may use 2 or more types. The content of these inorganic fillers is used in an amount of 0 to 95% by weight in the curable resin composition of the present invention. Furthermore, a silane coupling agent, a release agent such as stearic acid, palmitic acid, zinc stearate, and calcium stearate, various compounding agents such as pigments, and various thermosetting resins are added to the curable resin composition of the present invention. can do.

When the curable resin composition of the present invention is used for an optical material, particularly an optical semiconductor encapsulant, the particle size of the inorganic filler used is transparent by using a nano-order level filler. It is possible to supplement the mechanical strength and the like without hindering. As a standard for the nano-order level, it is preferable from the viewpoint of transparency to use a filler having an average particle size of 500 nm or less, particularly an average particle size of 200 nm or less.

When using the curable resin composition of this invention for an optical material, especially optical semiconductor sealing agent, a fluorescent substance can be added as needed. For example, the phosphor has a function of forming white light by absorbing part of blue light emitted from a blue LED element and emitting wavelength-converted yellow light. After the phosphor is dispersed in advance in the curable resin composition, the optical semiconductor is sealed. There is no restriction | limiting in particular as fluorescent substance, A conventionally well-known fluorescent substance can be used, For example, rare earth element aluminate, thio gallate, orthosilicate, etc. are illustrated. More specifically, phosphors such as a YAG phosphor, a TAG phosphor, an orthosilicate phosphor, a thiogallate phosphor, and a sulfide phosphor can be mentioned, and YAlO ₃ : Ce, Y ₃ Al ₅ O ₁₂ : Ce, Y ₄ Al ₂ O ₉ : Ce, Y ₂ O ₂ S: Eu, Sr ₅ (PO ₄ ) ₃ Cl: Eu, (SrEu) O.Al ₂ O _{3 and the} like are exemplified. As the particle size of the phosphor, those having a particle size known in this field are used, and the average particle size is preferably 1 to 250 μm, particularly preferably 2 to 50 μm. When these phosphors are used, the addition amount thereof is 1 to 80 parts by weight, preferably 5 to 60 parts by weight with respect to 100 parts by weight of the organic component such as organopolysiloxane (A). Is preferred.

When the curable resin composition of the present invention is used for an optical material, particularly an optical semiconductor encapsulant, for the purpose of preventing sedimentation of various phosphors upon curing, silica fine powder (also called Aerosil or Aerosol) is used. A thixotropic agent can be added. Examples of such silica fine powder include Aerosil 50, Aerosil 90, Aerosil 130, Aerosil 200, Aerosil 300, Aerosil 380, Aerosil OX50, Aerosil TT600, Aerosil R972, Aerosil R974, AerosilR202, AerosilR202, AerosilR202 Aerosil R805, RY200, RX200 (made by Nippon Aerosil Co., Ltd.), etc. are mentioned.

The curable resin composition of the present invention can contain a phenolic compound as an antioxidant.
The phenol compound is not particularly limited, and examples thereof include 2,6-di-tert-butyl-4-methylphenol and n-octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate. Tetrakis [methylene-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] methane, 2,4-di-tert-butyl-6-methylphenol, 1,6-hexanediol-bis -[3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], tris (3,5-di-tert-butyl-4-hydroxybenzyl) -isocyanurate, 1,3,5 -Trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, pentaerythrine Lithyl-tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 3,9-bis- [2- [3- (3-tert-butyl-4-hydroxy-5- Methylphenyl) -propionyloxy] -1,1-dimethylethyl] -2,4,8,10-tetraoxaspiro [5,5] undecane, triethylene glycol-bis [3- (3-t-butyl-5 -Methyl-4-hydroxyphenyl) propionate], 2,2′-butylidenebis (4,6-di-tert-butylphenol), 4,4′-butylidenebis (3-methyl-6-tert-butylphenol), 2,2 '-Methylenebis (4-methyl-6-tert-butylphenol), 2,2'-methylenebis (4-ethyl-6-tert-butylphenol) 2-tert-butyl-6- (3-tert-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenol acrylate, 2- [1- (2-hydroxy-3,5-di-) tert-pentylphenyl) ethyl] -4,6-di-tert-pentylphenyl acrylate, 4,4′-thiobis (3-methyl-6-tert-butylphenol), 4,4′-butylidenebis (3-methyl-6) -Tert-butylphenol), 2-tert-butyl-4-methylphenol, 2,4-di-tert-butylphenol, 2,4-di-tert-pentylphenol, 4,4'-thiobis (3-methyl-6) -Tert-butylphenol), 4,4'-butylidenebis (3-methyl-6-tert-butylphenol), bis- [3 3-bis- (4′-hydroxy-3′-tert-butylphenyl) -butanoic acid] -glycol ester, 2,4-di-tert-butylphenol, 2,4-di-tert-pentylphenol, 2 -[1- (2-hydroxy-3,5-di-tert-pentylphenyl) ethyl] -4,6-di-tert-pentylphenyl acrylate, bis- [3,3-bis- (4′-hydroxy- 3'-tert-butylphenyl) -butanoic acid] -glycol ester and the like.

A commercial item can also be used for the said phenolic compound.
For example, IRGANOX 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1135, IRGANOX 245, IRGANOX 259, IRGANOX 295, IRGANOX 3114 IRGANOX 1098, IRGANOX 1520L, Adeka Tab AO-20A Adeka Stub AO-60, Adeka Stub AO-70, Adeka Stub AO-80, Adeka Stub AO-90, Adeka Stub AO-330, manufactured by Sumitomo Chemical Co., Ltd. r GS (F), and the like Sumilizer GP.

In addition, commercially available additives can be used as resin coloring inhibitors. For example, TINUVIN 328, TINUVIN 234, TINUVIN 326, TINUVIN 120, TINUVIN 477, TINUVIN 479, CHIMASSORB 2020FDL, CHIMASSORB 119FL, and the like are manufactured by Ciba Specialty Chemicals.

When the phenolic compound is added, the amount of the compound is not particularly limited, but it can be added in an amount of 0.005 to 5.0% by weight in the curable resin composition of the present invention.

The curable resin composition of this invention is obtained by mixing each component uniformly. Moreover, the curable resin composition of this invention can be easily made into the hardened | cured material by the method similar to the method known conventionally.
For example, the curable resin composition of the present invention comprises an epoxy resin component, a curing agent component, a zinc salt and / or a zinc complex (C), if necessary, using an extruder, a kneader, a roll, a planetary mixer, or the like. It can be obtained by thoroughly mixing until uniform. When the obtained curable resin composition is in a liquid state, it is cured by potting or casting, impregnating the base material, pouring the curable resin composition into a mold, casting, and curing by heating. It can be a thing. On the other hand, when the curable resin composition is solid, it can be made into a cured product by molding using a cast after casting or a transfer molding machine and further curing by heating.
In addition, what is necessary is just to add and mix the other hardening accelerator which is an arbitrary component, an amine compound, a phosphorus containing compound, a phenol compound, binder resin, an inorganic filler, etc. in the said mixing process. The curing temperature and time are 80 to 200 ° C. and 2 to 10 hours. As a curing method, curing can be performed at a high temperature at a stretch, but it is preferable to increase the temperature stepwise to advance the curing reaction. Specifically, initial curing is performed at 80 to 150 ° C., and post-curing is performed at 100 to 200 ° C. As the curing stage, the temperature is preferably increased in 2 to 8 stages, more preferably 2 to 4 stages.

In addition, the curable resin composition of the present invention is dissolved in a solvent such as toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, etc. to obtain a curable resin composition varnish, glass fiber, A prepreg obtained by impregnating a base material such as carbon fiber, polyester fiber, polyamide fiber, alumina fiber, paper, etc. and heat-dried is subjected to hot press molding to obtain a cured product of the curable resin composition of the present invention. can do. In this case, the solvent is used in an amount usually accounting for 10 to 70% by weight, preferably 15 to 70% by weight in the mixture of the curable resin composition of the present invention and the solvent. Moreover, the epoxy resin hardened | cured material containing a carbon fiber can also be obtained with a RTM (Resin * Transfer * Molding) system with a liquid composition.

Also, the curable resin composition of the present invention can be used as a film-type sealing composition. As a method for obtaining such a film-type sealing composition, first, the curable resin composition of the present invention is used as the curable resin composition varnish, which is applied onto a release film, and the solvent is removed under heating. Thus, there is a method of performing B-staging, whereby a film-type sealing composition can be obtained as a sheet-like adhesive. This sheet-like adhesive can be used as an interlayer insulating layer in a multilayer substrate or the like, and a batch film sealing of an optical semiconductor.

Next, the case where the epoxy resin composition of the present invention is used as an optical semiconductor sealing material or die bonding material will be described in detail.
When the curable resin composition of the present invention is used as a sealing material or die bond material for an optical semiconductor such as a high-intensity white LED, addition of an epoxy resin, a curing agent, a coupling agent, an antioxidant, a light stabilizer, etc. A curable resin composition is prepared by thoroughly mixing the product. As a mixing method, a kneader, a three-roll, a universal mixer, a planetary mixer, a homomixer, a homodisper, a bead mill, or the like may be used and mixed at room temperature or heated. The obtained curable resin composition can be used for a sealing material, or both a die-bonding material and a sealing material.

Optical semiconductor elements such as high-intensity white LEDs are generally GaAs, GaP, GaAlAs, GaAsP, AlGa, InP, GaN, InN, AlN, InGaN laminated on a substrate of sapphire, spinel, SiC, Si, ZnO or the like. Such a semiconductor chip is bonded to a lead frame, a heat sink, or a package using an adhesive (die bond material). There is also a type in which a wire such as a gold wire is connected to pass an electric current. On the other hand, the periphery of the semiconductor chip is sealed with a sealing material such as epoxy resin. The sealing material is used to protect the semiconductor chip from heat and moisture and to play a role of a lens function.
The curable resin composition of the present invention can be used as this sealing material or die bond material. From the viewpoint of the process, it is advantageous to use the curable resin composition of the present invention for both the die bond material and the sealing material.

As a method for adhering a semiconductor chip to a substrate using the curable resin composition of the present invention, the curable resin composition of the present invention is applied on the substrate by dispenser, potting or screen printing, and then the curable resin is used. There is a method in which a semiconductor chip is placed on the composition and heat-cured. By this method, the semiconductor chip can be bonded to the substrate. For the heating, methods such as hot air circulation, infrared rays and high frequency can be used.

The heating condition is preferably 80 to 230 ° C. for about 1 minute to 24 hours. For the purpose of reducing internal stress generated during heat-curing, for example, after pre-curing at 80 to 120 ° C. for 30 minutes to 5 hours, post-curing is performed at 120 to 180 ° C. for 30 minutes to 10 hours. it can.

As a molding method of the sealing material, as described above, an injection method in which the sealing material is injected into the mold frame in which the substrate on which the semiconductor chip is fixed is inserted and then heat-cured and then molded, and the sealing material on the mold A compression molding method is used in which a semiconductor chip fixed on a substrate is immersed therein and heat-cured and then released from the mold.
Examples of the injection method include dispenser, transfer molding, injection molding and the like.
For the heating, methods such as hot air circulation, infrared rays and high frequency can be used.
For example, the heating conditions are preferably 80 to 230 ° C. for about 1 minute to 24 hours. For the purpose of reducing internal stress generated during heat-curing, for example, after pre-curing at 80 to 120 ° C. for 30 minutes to 5 hours, post-curing is performed at 120 to 180 ° C. for 30 minutes to 10 hours. it can.

The application of the curable resin composition of the present invention is not limited to the above application, and can be applied to general applications in which a curable resin such as an epoxy resin is used. For example, adhesives, paints, coating agents, molding materials (including sheets, films, FRP, etc.), insulating materials (including printed circuit boards, wire coatings, etc.), sealing materials, sealing materials, cyanates for substrates Examples of resin compositions and resist curing agents include additives to other resins such as acrylic ester resins.

Examples of adhesives include civil engineering, architectural, automotive, general office, and medical adhesives, as well as electronic material adhesives. Among these, adhesives for electronic materials include interlayer adhesives for multilayer substrates such as build-up substrates, die bonding agents, semiconductor adhesives such as underfills, BGA reinforcing underfills, anisotropic conductive films ( ACF) and an adhesive for mounting such as anisotropic conductive paste (ACP).

As sealing agents, potting, dipping, transfer mold sealing for capacitors, transistors, diodes, light-emitting diodes, ICs, LSIs, potting sealings for ICs, LSIs such as COB, COF, TAB, flip chip For example, underfill for QFP, BGA, CSP, etc., and sealing (including reinforcing underfill) can be used.

The cured product obtained in the present invention can be used for various applications including optical component materials. The optical material refers to general materials used for applications that allow light such as visible light, infrared light, ultraviolet light, X-rays, and lasers to pass through the material. More specifically, in addition to LED sealing materials such as lamp type and SMD type, the following may be mentioned. It is a peripheral material for liquid crystal display devices such as a substrate material, a light guide plate, a prism sheet, a deflection plate, a retardation plate, a viewing angle correction film, an adhesive, and a film for a liquid crystal such as a polarizer protective film in the liquid crystal display field. In addition, color PDP (plasma display) sealing materials, antireflection films, optical correction films, housing materials, front glass protective films, front glass replacement materials, adhesives, and LED displays that are expected as next-generation flat panel displays LED molding materials, LED sealing materials, front glass protective films, front glass substitute materials, adhesives, and substrate materials for plasma addressed liquid crystal (PALC) displays, light guide plates, prism sheets, deflection plates , Phase difference plate, viewing angle correction film, adhesive, polarizer protective film, front glass protective film in organic EL (electroluminescence) display, front glass substitute material, adhesive, and various in field emission display (FED) Film substrate Front glass protective films, front glass substitute material, an adhesive. In the field of optical recording, VD (video disc), CD / CD-ROM, CD-R / RW, DVD-R / DVD-RAM, MO / MD, PD (phase change disc), disc substrate materials for optical cards, Pickup lenses, protective films, sealing materials, adhesives and the like.

In the optical equipment field, they are still camera lens materials, finder prisms, target prisms, finder covers, and light receiving sensor parts. It is also a photographic lens and viewfinder for video cameras. Projection lenses for projection televisions, protective films, sealing materials, adhesives, and the like. These include lens materials, sealing materials, adhesives, and films for optical sensing devices. In the field of optical components, they are fiber materials, lenses, waveguides, element sealing materials, adhesives and the like around optical switches in optical communication systems. Optical fiber material, ferrule, sealing material, adhesive, etc. around the optical connector. For optical passive components and optical circuit components, there are lenses, waveguides, LED sealing materials, CCD sealing materials, adhesives, and the like. These are substrate materials, fiber materials, device sealing materials, adhesives, etc. around an optoelectronic integrated circuit (OEIC). In the field of optical fiber, it is an optical fiber for lighting, light guides for decorative displays, sensors for industrial use, displays / signs, etc., and for communication infrastructure and home digital equipment connection. As the semiconductor integrated circuit peripheral material, it is a resist material for microlithography for LSI and VLSI material. In the field of automobiles and transport equipment, automotive lamp reflectors, bearing retainers, gear parts, anti-corrosion coatings, switch parts, headlamps, engine internal parts, electrical parts, various interior and exterior parts, drive engines, brake oil tanks, and automotive defenses Rusted steel plate, interior panel, interior material, wire harness for protection / bundling, fuel hose, automobile lamp, glass substitute. In addition, it is a multilayer glass for railway vehicles. Further, they are toughness imparting agents for aircraft structural materials, engine peripheral members, protective / bundling wire harnesses, and corrosion-resistant coatings. In the construction field, it is interior / processing materials, electrical covers, sheets, glass interlayers, glass substitutes, and solar cell peripheral materials. For agriculture, it is a house covering film. The next generation of optical / electronic functional organic materials include organic EL element peripheral materials, organic photorefractive elements, optical amplification elements that are light-to-light conversion devices, optical arithmetic elements, substrate materials around organic solar cells, fiber materials, elements Sealing material, adhesive and the like.

Other uses of optical materials include general uses in which curable resin compositions are used, such as adhesives, paints, coating agents, molding materials (including sheets, films, FRP, etc.), insulation. In addition to materials (including printed circuit boards, wire coatings, etc.), sealants, additives to other resins, and the like.

Hereinafter, the present invention will be described in more detail with reference to synthesis examples and examples. The present invention is not limited to these synthesis examples and examples. In the following synthesis examples and examples, “part” means part by weight, and “%” means weight%. In addition, each physical property value in an Example was measured with the following method.
(1) Molecular weight: Polystyrene conversion and weight average molecular weight measured under the following conditions were calculated by gel permeation chromatography (GPC) method.
GPC conditions
Manufacturer: Shimadzu Corporation Column: Guard column SHODEX GPC LF-G LF-804 (3)
Flow rate: 1.0 ml / min.
Column temperature: 40 ° C
Solvent: THF (tetrahydrofuran)
Detector: RI (differential refraction detector)
(2) Epoxy equivalent: Measured by the method described in JIS K-7236.
(3) Viscosity: Measured at 25 ° C. using an E-type viscometer (TV-20) manufactured by Toki Sangyo Co., Ltd.

Synthesis example 1
As the production step (i), 106 parts of β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 234 parts of silanol-terminated methylphenyl silicone oil having a weight average molecular weight of 1700 (measured by GPC) (silanol equivalent 850, using GPC) It was calculated as half the measured weight average molecular weight.), 18 parts of 0.5% potassium hydroxide (KOH) methanol solution (0.09 parts as KOH parts) was charged into the reaction vessel, and the bath temperature was 75 ° C. Set and warm. After raising the temperature, the reaction was carried out under reflux for 8 hours.
As a manufacturing process (ii), after adding 305 parts of methanol, 86.4 parts of 50% distilled water methanol solution was added dropwise over 60 minutes, and reacted at 75 ° C. under reflux for 8 hours. After completion of the reaction, the reaction mixture was neutralized with 5% aqueous sodium dihydrogen phosphate solution, and methanol was recovered by distillation at 80 ° C. 380 parts of methyl isobutyl ketone (MIBK) was added, and washing with water was repeated three times. Next, the organic phase was removed under reduced pressure at 100 ° C. to obtain 300 parts of an organopolysiloxane compound (A-1) having a reactive functional group. The epoxy equivalent of the obtained compound was 718 g / eq, the weight average molecular weight was 2200, and the appearance was colorless and transparent.

Synthesis example 2
A flask equipped with a stirrer, a reflux condenser, and a stirrer is purged with nitrogen while 20 parts of tricyclodecane dimethanol, methylhexahydrophthalic anhydride (manufactured by Shin Nippon Rika Co., Ltd., Ricacid MH or less, acid anhydride) 100 parts of product (referred to as product (H-1)) was added, reacted at 40 ° C for 3 hours, and then heated and stirred at 70 ° C for 1 hour (disappearance of tricyclodecane dimethanol (1 area% or less) by GPC) 120 parts of a curing agent composition (T-1) containing the polyvalent carboxylic acid (B-1) and the acid anhydride (H-1) was obtained. The obtained curing agent composition (T-1) is a colorless liquid resin, and the purity by GPC is 55 area% of polyvalent carboxylic acid (B-1; the following formula (7)), acid anhydride (H -1) was 45 area%. The functional group equivalent was 201 g / eq. Met. The viscosity at 25 ° C. was 18900 mPa · s (E-type viscometer).

Synthesis example 3
To a flask equipped with a stirrer, reflux condenser and stirrer, 20 parts of 2,4-diethylpentanediol and 100 parts of acid anhydride (H-1) were added while purging with nitrogen, and reacted at 40 ° C. for 3 hours. By heating and stirring at 70 ° C. for 1 hour (disappearance of 2,4-diethylpentanediol (1 area% or less) was confirmed by GPC), polycarboxylic acid (B-2) and acid anhydride (H 120 parts of a curing agent composition (T-2) containing -1) was obtained. The obtained curing agent composition (T-2) is a colorless liquid resin, and the purity by GPC is 50 area% of polyvalent carboxylic acid (B-2; the following formula 8), and acid anhydride (H-1). ) Was 50 area%. The functional group equivalent was 201 g / eq. Met. The viscosity at 25 ° C. was 16,200 mPa · s (E-type viscometer).

Synthesis example 4
As the production step (i), 296 parts of β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, 505 parts of silanol-terminated methylphenyl silicone oil having a weight average molecular weight of 1700 (measured GPC value) (silanol equivalent 850, using GPC) It was calculated as half of the measured weight average molecular weight.), 40 parts of 0.5% potassium hydroxide (KOH) methanol solution (0.2 parts as KOH parts) was charged into the reaction vessel, and the bath temperature was 75 ° C. Set and warm. After raising the temperature, the reaction was carried out under reflux for 8 hours.
As a manufacturing process (ii), after adding 510 parts of methanol, 130 parts of 50% distilled water methanol solution was added dropwise over 60 minutes, and reacted at 75 ° C. for 8 hours under reflux. After completion of the reaction, the reaction mixture was neutralized with 5% aqueous sodium dihydrogen phosphate solution, and methanol was recovered by distillation at 80 ° C. 704 parts of methyl isobutyl ketone (MIBK) was added, and washing with water was repeated three times. Subsequently, the organic phase was removed at 100 ° C. under reduced pressure to obtain 697 parts of an organopolysiloxane compound (A-2) having a reactive functional group. The epoxy equivalent of the obtained compound was 598 g / eq, the weight average molecular weight was 2370, and the appearance was colorless and transparent.

Synthesis example 5
A flask equipped with a stirrer, reflux condenser, and stirrer is purged with nitrogen, 12 parts of tricyclodecane dimethanol, 18 parts of 2,4-diethyl-1,5-pentanediol, methylhexahydrophthalic anhydride (New Nippon Rika Co., Ltd., Licacid MH (corresponding to acid anhydride (H-1)) 155 parts, 1,3,4-cyclohexanetricarboxylic acid-3,4-anhydride (Mitsubishi Gas Chemical Co., Ltd.) H-TMAn, hereinafter referred to as acid anhydride (H-2)) was added, and reacted at 40 ° C. for 3 hours, followed by heating and stirring at 70 ° C. for 1 hour (disappearance of raw alcohol by GPC ( 1 area% or less))), a curing agent composition (T-3) containing polyvalent carboxylic acid (B-1) (B-2) and acid anhydride (H-1) (H-2) ) Was obtained in 200 parts, and the resulting curing agent composition (T-3) was It was a colorless liquid resin, and the purity by GPC was 52 area% for polycarboxylic acids (B-1, B-2) and 48 area% for acid anhydrides (H-1, H-2). The functional group equivalent was 190 g / eq, and the viscosity at 25 ° C. was 15500 mPa · s (E-type viscometer).

Synthesis Example 6
As the production step (i), 44 parts of β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 153 parts of silanol-terminated methylphenyl silicone oil having a weight average molecular weight of 1700 (measured by GPC) (silanol equivalent 850, using GPC) Calculated as half of the measured weight average molecular weight.), 11.2 parts of 0.5% potassium hydroxide (KOH) methanol solution (0.056 parts as KOH parts) was charged into the reaction vessel, and the bath temperature was 75. The temperature was set at ° C and the temperature was raised. After raising the temperature, the reaction was carried out under reflux for 8 hours.
As a manufacturing process (ii), after adding 157 parts of methanol, 19.3 parts of 50% distilled water methanol solution was added dropwise over 60 minutes, and reacted at 75 ° C. under reflux for 8 hours. After completion of the reaction, the reaction mixture was neutralized with 5% aqueous sodium dihydrogen phosphate solution, and methanol was recovered by distillation at 80 ° C. 177 parts of methyl isobutyl ketone (MIBK) was added, and washing with water was repeated three times. Next, the organic phase was removed at 100 ° C. under reduced pressure to obtain 178 parts of an organopolysiloxane compound (A-3) having a reactive functional group. The epoxy equivalent of the obtained compound was 1020 g / eq, the weight average molecular weight was 2100, and the appearance was colorless and transparent.

Examples 1, 2, 3, 4 and Comparative Examples 1, 2, 3
Organopolysiloxane compound (A-1) obtained in Synthesis Example 1 as an epoxy resin, and curing agent compositions (T-1) and (T-2) (organo) obtained in Synthesis Examples 2 and 3 as curing agents The ratio of polysiloxane (A) to curing agent composition (T-1), (T-2) is 1: 1 in terms of functional group equivalent, 2-ethylhexane ester of phosphoric acid (phosphorus) as zinc salt and / or zinc complex Acid: Monoester body: Diester body: Triester body 3.5: 68.2: 26.5: 1.8 However, since the trimethylsilylation treatment is performed, the sensitivity is different and the weight ratio is not accurate; Hereinafter, zinc complex of zinc salt and / or zinc complex (C-1) (phosphorus: zinc = 1.7: 1 measured by ICP emission spectroscopic analysis, conforming to JIS K 0166) propylene glycol solution (Japan) Special 2003 Manufactured according to Japanese Patent No. -51495, hereinafter referred to as (C-1)), a quaternary phosphonium salt (Hishicolin PX4MP, hereinafter referred to as catalyst (I-1) manufactured by Nippon Kagaku Kogyo) as a curing accelerator, additive As bis (2,2,6,6-tetramethyl-4-piperidyl) separate (TINUVIN770DF manufactured by Ciba Japan, hereinafter referred to as (L-1)) and 4,4′-butylidenebis (3-methyl- 6-tert-butylphenyl-di-tridecyl phosphite) (Adeka Adeka Stub 260, hereinafter referred to as (M-1)) was blended at the blending ratio (parts by weight) shown in Table 1 below and removed for 20 minutes. Foaming was performed to obtain a curable resin composition of the present invention or for comparison.

The obtained curable resin composition was gently poured into a test piece mold, and the cast was cured under conditions of 150 ° C. × 1 hour after pre-curing at 120 ° C. × 3 hours for various tests. A cured product was obtained. The obtained cured product was evaluated for the following hardness and thermal durability transmittance test under the conditions described below. The results are also shown in Table 1 below.

(hardness)
Shore A
It was measured according to JIS K 7215 “Plastic Durometer Hardness Test Method”.

(Thermal durability transmission test)
Heat test condition: left in a 150 ° C. oven for 96 hours Test piece size: 1 mm thickness
Evaluation conditions: The transmittance at 400 nm was measured with a spectrophotometer, and the rate of change (retention rate) was calculated.

(LED lighting test)
Furthermore, after carrying out vacuum defoaming for 20 minutes with the curable resin compositions obtained in the examples and comparative examples, the syringe was filled and a surface discharge type equipped with a light emitting element having an emission wavelength of 465 nm using a precision discharge device. Cast into LED. Then, the LED for lighting tests is obtained by making it harden | cure on predetermined hardening conditions (110 degreeC for 2 hours, and also 150 degreeC for 3 hours). In the lighting test, the initial illuminance was measured by performing a lighting test at 60 mA (constant current drive, specified current 30 mA) which is twice the specified current.

Examples 5 and 6, Comparative Example 4
Organopolysiloxane compound (A-2) obtained in Synthesis Example 2 as an epoxy resin, and curing agent composition (T-1) obtained in Synthesis Example 2 (an organopolysiloxane (A) and a curing agent) as a curing agent The ratio of the composition (T-1) is 1: 0.8 in terms of functional group equivalent. As a curing accelerator, zinc salt and / or zinc complex (C-1), catalyst (I-1), additive (L -1) (M-1) was used and blended at the blending ratio (parts by weight) shown in Table 2 below, and defoamed for 20 minutes to obtain a curable resin composition of the present invention or for comparison.

The obtained curable resin composition was gently poured into a test piece mold, and the cast was cured under conditions of 150 ° C. × 1 hour after pre-curing at 120 ° C. × 3 hours for various tests. A cured product was obtained. The obtained cured product was evaluated for the following heat resistance characteristic test, hardness, and transmittance test under the conditions described below. The results are also shown in Table 2 below.

(Heat resistance test)
Measurement condition
Dynamic viscoelasticity measuring instrument: manufactured by TA-instruments, DMA-2980
Measurement temperature range: -30 ° C to 280 ° C
Temperature increase rate: 2 ° C./min Test piece size: A material cut into 5 mm × 50 mm was used (thickness is about 800 μm).
Analysis conditions Tg: The peak point of Tan-δ in DMA measurement was defined as Tg.
Elastic modulus at 30 ° C .: The elastic modulus at 30 ° C. was measured.

(Hardness test)
Shore A
It was measured according to JIS K 7215 “Plastic Durometer Hardness Test Method”.

(Transmissivity test)
Test piece size: 1mm thickness
Evaluation conditions: The transmittance at 400 nm was measured with a spectrophotometer.

Furthermore, the obtained curable resin composition was filled into a syringe and a precision discharge device was used to mount a 5 mm outer diameter LED package (inner diameter 4.4 mm, outer wall height) on which a chip with a central emission wave of 465 nm was mounted. To 1.25 mm). The casting was put into a heating furnace and cured at 120 ° C. for 1 hour and further at 150 ° C. for 3 hours to produce an LED package. The LED package was left in a corrosive gas under the following conditions, and the change in color of the silver-plated lead frame inside the seal was observed (corrosive gas permeability test). The results are also shown in Table 2.

(Corrosion gas permeability test)
Measurement conditions Corrosion gas: 20% aqueous solution of ammonium sulfide (discolors black when sulfur component reacts with silver)
Contacting method: A container of an ammonium sulfide aqueous solution and the LED package were mixed in a wide-mouth glass bottle, and the wide-mouthed glass bottle was covered and the volatilized ammonium sulfide gas and the LED package were contacted and exposed in a sealed state.
Determination of corrosion: The time when the lead frame inside the LED package was discolored black (referred to as blackening) was observed, and it was determined that the longer the discoloration time, the better the corrosion resistance. Observation is taken after 1 hour, 2 hours, 3 hours, and 4 hours to confirm, and evaluation is ○ for undiscolored products, × for brown-brown materials, and XX for completely blackened materials. It was.

According to Examples 1 to 4 and Comparative Examples 1 to 3, the curable resin composition of the present invention gives a cured product having excellent heat resistance coloring property (heat resistance transmittance test) and good light extraction efficiency (LED lighting test). It can be seen that the optical properties are excellent.
From Examples 5 and 6 and Comparative Example 4, the curable resin composition of the present invention gives a cured product excellent in gas permeability resistance (corrosion gas permeability test), and is optically resistant to an external environment such as a semiconductor chip or LED. It has become clear that it is useful in fields where characteristics are required.

Examples 7-12, Comparative Examples 5-9
Organopolysiloxane compounds (A-1), (A-2) and (A-3) obtained in Synthesis Examples 1, 4 and 6 as epoxy resins, and curing obtained in Synthesis Examples 2 and 3 as curing agents Agent composition (T-1), (T-2) (The ratio of organopolysiloxane (A) to curing agent composition (T-1) or (T-2) is 1: 0.8 in terms of functional group equivalent. ), Acid anhydride (H-1) (the ratio of organopolysiloxane (A) to acid anhydride (H-1) is 1: 0.8 in terms of functional group equivalent), 2 as zinc salt and / or zinc complex -Zinc ethylhexanoate (C-2), zinc undecylenate (C-3), zinc 2-ethylhexanoate (imidazole compound-containing King Industry XK-614, hereinafter referred to as (C-4)), Quaternary phosphonium salt (Hishikorin PX- manufactured by Nippon Chemical Industry Co., Ltd.) 4ET or less, hereinafter referred to as catalyst (I-2)), imidazole compound (manufactured by Shikoku Kasei 2E4MZ, hereinafter referred to as catalyst (I-3)), bis (2,2,6,6-tetramethyl-4- Piperidyl) Sepacate (TINUVIN 770DF manufactured by Ciba Japan, hereinafter referred to as (L-1)) was blended at the blending ratio (parts by weight) shown in Tables 3 and 4 below, defoamed for 20 minutes, and the present invention or A comparative curable resin composition was obtained.

The obtained curable resin composition was gently cast into a test piece mold, and the cast was cured at 110 ° C. for 3 hours and then at 140 ° C. for 5 hours for various tests. A cured product was obtained. Corrosion gas permeability test on the resulting cured product (same as described above except that the test method was observed after 1 hour, 2 hours, 3 hours, 6 hours, and 10 hours). went. The results are shown in Tables 3 and 4 below.

Examples 13 and 14
Organopolysiloxane compound (A-3) obtained in Synthesis Example 6 as an epoxy resin, and curing agent composition (T-3) obtained in Synthesis Example 5 (organopolysiloxane (A) and curing agent as a curing agent The ratio of composition (T-3) is 1: 0.8 in terms of functional group equivalent, zinc salt and / or zinc complex (C-1), (C-2), hindered amine compound (manufactured by Adeka) as an additive LA-81, hereinafter referred to as (L-2)), phosphorus compound (Adeka 260 manufactured by Adeka, hereinafter referred to as (L-3)) and blended at the blending ratio (parts by weight) shown in Table 5 below. And defoaming for 20 minutes to obtain a curable resin composition of the present invention.

(Corrosion gas permeability test)
The obtained curable resin composition was gently poured into a test piece mold, and the cast was cured under conditions of 150 ° C. × 3 hours after pre-curing at 120 ° C. × 1 hour for various tests. A cured product was obtained. The obtained cured product was subjected to a corrosive gas permeability test (the test method and the like are the same as described above). The results are also shown in Table 5 below.

(LED lighting test)
The obtained curable resin composition was filled into a syringe and cast into a surface-mounted LED (SMD type 5 mmφ, specified current 20 mA) equipped with a light emitting element having an emission wavelength of 465 nm using a precision discharge device. Then, the LED for lighting tests is obtained by making it harden | cure on predetermined hardening conditions (1 hour at 120 degreeC, and also 3 hours at 150 degreeC). In the lighting test, a lighting test was performed at a current of 230 mA, which greatly exceeds the specified current of 20 mA. Detailed conditions are shown below. As a measurement item, the illuminance before and after lighting for 40 hours was measured using an integrating sphere, and the illuminance retention rate of the test LED was calculated. The results are shown in Table 5.
Detailed lighting conditions Emission wavelength: Center emission wavelength, 465nm
Driving method: Constant current method, 230 mA (light emitting element stipulated current is 20 mA) 3 lights in series Driving environment: Lighting in 25%, 65% wet heat machine Evaluation: Illuminance after 20 hours and 40 hours and its illuminance retention rate Was measured respectively.

Although the invention has been described in detail with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on a Japanese patent application filed on November 30, 2009 (Japanese Patent Application No. 2009-271469), which is incorporated by reference in its entirety. Also, all references cited herein are incorporated as a whole.

Claims

A curable resin composition comprising an organopolysiloxane (A) and a zinc salt and / or a zinc complex (C) as essential components;
However, organopolysiloxane (A) satisfies the following conditions.
Organopolysiloxane (A):
An epoxy resin having at least a glycidyl group and / or an epoxycyclohexyl group in the molecule.
The zinc salt and / or zinc complex (C) is selected from the group consisting of a zinc salt of one or more acids selected from phosphoric acid esters and phosphoric acid, and a zinc complex having the acid and the zinc salt as a ligand. The curable resin composition according to claim 1, which is at least one kind.
The zinc salt and / or zinc complex (C) is at least one selected from the group consisting of a zinc salt of a carboxylic acid having 1 to 30 carbon atoms and a zinc complex having the acid and zinc salt as a ligand. The curable resin composition according to claim 1.
The curable resin composition according to any one of claims 1 to 3, comprising a polyvalent carboxylic acid (B) having two or more carboxyl groups and having an aliphatic hydrocarbon group as a main skeleton.
The curable resin composition according to claim 4, wherein the polyvalent carboxylic acid (B) is a compound obtained by a reaction of a bi- to hexafunctional polyhydric alcohol having 5 or more carbon atoms and a saturated aliphatic cyclic acid anhydride. object.
The curable resin composition according to any one of claims 1 to 5, comprising an acid anhydride.
The curable resin composition according to any one of claims 1 to 6, comprising a hindered amine light stabilizer and / or a phosphorus-containing antioxidant.
A cured product obtained by curing the curable resin composition according to any one of claims 1 to 7.