WO2011058945A1 - Composant électronique en céramique multicouche - Google Patents

Composant électronique en céramique multicouche Download PDF

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Publication number
WO2011058945A1
WO2011058945A1 PCT/JP2010/069825 JP2010069825W WO2011058945A1 WO 2011058945 A1 WO2011058945 A1 WO 2011058945A1 JP 2010069825 W JP2010069825 W JP 2010069825W WO 2011058945 A1 WO2011058945 A1 WO 2011058945A1
Authority
WO
WIPO (PCT)
Prior art keywords
base material
material layer
electronic component
ceramic electronic
multilayer ceramic
Prior art date
Application number
PCT/JP2010/069825
Other languages
English (en)
Japanese (ja)
Inventor
純一 南條
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to CN2010800504893A priority Critical patent/CN102598165A/zh
Priority to JP2011540495A priority patent/JPWO2011058945A1/ja
Publication of WO2011058945A1 publication Critical patent/WO2011058945A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Abstract

L'invention concerne un composant électronique en céramique multicouche permettant de réduire le bruit produit à l'intérieur d'électrodes de trou d'interconnexion situées dans une couche de matériau de base. Le composant électronique en céramique multicouche de l'invention est caractéristique en ce qu'il est équipé : d'une couche de matériau de base (2); d'un motif de bobine (9) disposé dans la partie interne de la couche de matériau de base (2), et générant un champ magnétique à l'intérieur de la couche de matériau de base (2); et de trous d'interconnexion (8) disposés pour une partie d'entre eux au moins dans la partie interne de la couche de matériau de base (2). D'autre part, les parties périphériques des trous d'interconnexion (8) en contact avec la couche de matériau de base (2), sont revêtues de couches de faible magnétisme (14) présentant une perméabilité magnétique plus faible que celle de la couche de matériau de base (2).
PCT/JP2010/069825 2009-11-11 2010-11-08 Composant électronique en céramique multicouche WO2011058945A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010800504893A CN102598165A (zh) 2009-11-11 2010-11-08 层叠陶瓷电子部件
JP2011540495A JPWO2011058945A1 (ja) 2009-11-11 2010-11-08 積層セラミック電子部品

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-257900 2009-11-11
JP2009257900 2009-11-11

Publications (1)

Publication Number Publication Date
WO2011058945A1 true WO2011058945A1 (fr) 2011-05-19

Family

ID=43991604

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/069825 WO2011058945A1 (fr) 2009-11-11 2010-11-08 Composant électronique en céramique multicouche

Country Status (3)

Country Link
JP (1) JPWO2011058945A1 (fr)
CN (1) CN102598165A (fr)
WO (1) WO2011058945A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025152A (ja) * 2014-07-17 2016-02-08 日立金属株式会社 積層部品及びその製造方法
JP2017216401A (ja) * 2016-06-01 2017-12-07 株式会社村田製作所 電子部品
WO2018079142A1 (fr) * 2016-10-24 2018-05-03 株式会社村田製作所 Substrat multicouche à bobine intégrée et module d'alimentation électrique
JP2019009320A (ja) * 2017-06-26 2019-01-17 新光電気工業株式会社 配線基板
WO2024024027A1 (fr) * 2022-07-28 2024-02-01 日本碍子株式会社 Substrat central, et interposeur
WO2024024069A1 (fr) * 2022-07-29 2024-02-01 日本碍子株式会社 Interposeur, et procédé de fabrication de celui-ci

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0267609U (fr) * 1988-11-08 1990-05-22
JPH05315139A (ja) * 1992-05-07 1993-11-26 Murata Mfg Co Ltd Ｌｃ複合電子部品
JPH06112047A (ja) * 1992-09-26 1994-04-22 Taiyo Yuden Co Ltd 積層セラミックインダクタとその製造方法
JPH06283882A (ja) * 1993-03-26 1994-10-07 Cmk Corp 磁界・電磁波シールド層を有するプリント配線板 とその製造方法
JPH10215044A (ja) * 1997-01-28 1998-08-11 Kyocera Corp 配線基板及びその製造方法
JPH11224817A (ja) * 1998-02-06 1999-08-17 Murata Mfg Co Ltd 積層型インダクタアレイ
WO2007148556A1 (fr) * 2006-06-23 2007-12-27 Murata Manufacturing Co., Ltd. Composant électronique en céramique multicouche

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6387809A (ja) * 1986-09-30 1988-04-19 Citizen Watch Co Ltd 演算増幅器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0267609U (fr) * 1988-11-08 1990-05-22
JPH05315139A (ja) * 1992-05-07 1993-11-26 Murata Mfg Co Ltd Ｌｃ複合電子部品
JPH06112047A (ja) * 1992-09-26 1994-04-22 Taiyo Yuden Co Ltd 積層セラミックインダクタとその製造方法
JPH06283882A (ja) * 1993-03-26 1994-10-07 Cmk Corp 磁界・電磁波シールド層を有するプリント配線板 とその製造方法
JPH10215044A (ja) * 1997-01-28 1998-08-11 Kyocera Corp 配線基板及びその製造方法
JPH11224817A (ja) * 1998-02-06 1999-08-17 Murata Mfg Co Ltd 積層型インダクタアレイ
WO2007148556A1 (fr) * 2006-06-23 2007-12-27 Murata Manufacturing Co., Ltd. Composant électronique en céramique multicouche

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025152A (ja) * 2014-07-17 2016-02-08 日立金属株式会社 積層部品及びその製造方法
JP2017216401A (ja) * 2016-06-01 2017-12-07 株式会社村田製作所 電子部品
US10497510B2 (en) 2016-06-01 2019-12-03 Murata Manufacturing Co., Ltd. Electronic component
WO2018079142A1 (fr) * 2016-10-24 2018-05-03 株式会社村田製作所 Substrat multicouche à bobine intégrée et module d'alimentation électrique
JPWO2018079142A1 (ja) * 2016-10-24 2019-04-11 株式会社村田製作所 コイル内蔵多層基板、電源モジュール
US11024571B2 (en) 2016-10-24 2021-06-01 Murata Manufacturing Co., Ltd. Coil built-in multilayer substrate and power supply module
JP2019009320A (ja) * 2017-06-26 2019-01-17 新光電気工業株式会社 配線基板
WO2024024027A1 (fr) * 2022-07-28 2024-02-01 日本碍子株式会社 Substrat central, et interposeur
WO2024024069A1 (fr) * 2022-07-29 2024-02-01 日本碍子株式会社 Interposeur, et procédé de fabrication de celui-ci

Also Published As

Publication number Publication date
JPWO2011058945A1 (ja) 2013-03-28
CN102598165A (zh) 2012-07-18

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