WO2011056026A2 - Unité de rétro-éclairage - Google Patents

Unité de rétro-éclairage Download PDF

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Publication number
WO2011056026A2
WO2011056026A2 PCT/KR2010/007819 KR2010007819W WO2011056026A2 WO 2011056026 A2 WO2011056026 A2 WO 2011056026A2 KR 2010007819 W KR2010007819 W KR 2010007819W WO 2011056026 A2 WO2011056026 A2 WO 2011056026A2
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WO
WIPO (PCT)
Prior art keywords
sensitive adhesive
pressure
backlight unit
monomer
meth
Prior art date
Application number
PCT/KR2010/007819
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English (en)
Korean (ko)
Other versions
WO2011056026A3 (fr
Inventor
양세우
김우하
장석기
배승춘
권순형
김성우
박상태
정법성
Original Assignee
(주)Lg화학
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)Lg화학, 엘지전자 주식회사 filed Critical (주)Lg화학
Priority to JP2012537822A priority Critical patent/JP5590582B2/ja
Priority to CN201080060754.6A priority patent/CN102754018B/zh
Priority claimed from KR1020100109521A external-priority patent/KR101302877B1/ko
Publication of WO2011056026A2 publication Critical patent/WO2011056026A2/fr
Priority to US13/162,403 priority patent/US20110242796A1/en
Publication of WO2011056026A3 publication Critical patent/WO2011056026A3/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Definitions

  • the present invention relates to a backlight unit.
  • the backlight unit is a light source device included in the display device.
  • the liquid crystal screen of a liquid crystal display does not emit light, so the light incident on the front side is reflected back to the mirror on the rear side of the liquid crystal, or the light is emitted from the back light unit. To display the screen.
  • the backlight unit is directly related to the brightness and power consumption of the display device. Accordingly, the design of a light guide plate, a diffuser sheet, or a diffuser plate, a cold cathode tube, a light emitting diode (LED), or the like, which can improve the performance of the unit, can be achieved. Research for designing the shape or arrangement of the light emitting body or inducing light emission at low power has been conducted. In addition, attempts have been made to improve luminance by placing optical elements such as diffuser plates or retroreflective plates on top of light sources or light guide plates.
  • An object of the present invention is to provide a backlight unit.
  • the light emitting body is located on the substrate; And a monomer or polymer component attached on top of the substrate; And an adhesive pad including a pressure-sensitive adhesive layer which is a cured product of the pressure-sensitive adhesive composition containing light scattering particles.
  • the backlight unit may be used as a light source device of a display device such as a liquid crystal display, and in one example, the backlight unit may be a direct backlight unit (Direct BLU).
  • a display device such as a liquid crystal display
  • the backlight unit may be a direct backlight unit (Direct BLU).
  • Direct BLU direct backlight unit
  • the backlight unit 1 is a cross-sectional view schematically showing the backlight unit 1 according to one example.
  • the backlight unit 1 may include a substrate 10 and a light emitter 20 disposed on the substrate 10.
  • the substrate may be a printed circuit board (PCB), and the light emitting body on the substrate may be a light emitting diode (LED).
  • LED light emitting diode
  • Such light emitting diodes may be arranged in a predetermined pattern on a printed circuit board.
  • the specific kind, design, and the like of the substrate and the light emitting body are not particularly limited.
  • various structures, designs, materials, and the like of substrates and light emitters that may be used in the backlight unit are known, and all of the above contents may be applied to the backlight unit.
  • the unit includes an adhesive pad including an adhesive layer attached to an upper portion of the substrate.
  • the pressure-sensitive adhesive pad may be composed of a single layer of the pressure-sensitive adhesive layer, and may be configured to include other optical films or release films formed on one or both sides of the pressure-sensitive adhesive layer as necessary.
  • the pressure-sensitive adhesive layer is preferably adhered to the upper portion of the substrate.
  • an adhesive layer is attached to the whole surface of the said board
  • FIG. 1 shows an example of a structure in which the adhesive pad 30 having the adhesive layer 31 including the light scattering particles 32 is adhered to the substrate 10 having the light emitting body 20 thereon. Indicates.
  • substrate in the above contains light-scattering particle
  • the light scattering particles mean particles having a refractive index different from that of the pressure-sensitive adhesive and scattering light emitted from the light emitter and incident on the pressure-sensitive adhesive layer.
  • a pressure sensitive adhesive is a type of adhesive material that exhibits viscoelastic properties while maintaining a semi-solid state, unlike an adhesive generally changing from liquid to solid after adhesion. By the above characteristics of the pressure-sensitive adhesive, the pressure-sensitive adhesive pad can be effectively attached to the substrate while effectively overcoming the step by the light emitter. In addition, the adhesive pad does not cause warping, lifting, peeling, or the like even under severe conditions such as high temperature or high temperature and high humidity.
  • the pressure-sensitive adhesive due to the introduction of the pressure-sensitive adhesive, it is effective also in the configuration of a flexible element.
  • the light scattering particles may allow the pad to effectively scatter light from the light emitter so that a uniform and thin surface light source is realized.
  • the adhesive pad can alleviate the bright point of the light emitting body, and can prevent the loss of light due to the air layer, which has been a problem in the past.
  • the adhesive layer of an adhesive pad is a monomer or a polymer component; And it can be configured by curing the pressure-sensitive adhesive composition containing light scattering particles.
  • Curing of the pressure-sensitive adhesive composition means a process in which the pressure-sensitive adhesive composition is converted to the pressure-sensitive adhesive through a process such as crosslinking and / or polymerization by drying, heating, aging, and / or light irradiation.
  • the monomer or polymer in the above is a component that forms the base of the pressure-sensitive adhesive through the above curing process.
  • polymer means generically the compound of the form in which 2 or more monomers superposed
  • various monomers or polymer components used to form the pressure-sensitive adhesive composition are known, and these components can be used without limitation in the present invention.
  • the monomer or polymer component may include an acrylic polymer having a crosslinkable functional group.
  • the specific kind of polymer that can be used in this case is not particularly limited, and polymers commonly used as adhesive resins such as (meth) acrylic acid alkyl esters and air which can provide crosslinkable functional groups in the side chains or ends of the polymers Acrylic polymers comprising a synthetic monomer in a polymerized form can be used.
  • the (meth) acrylic acid alkyl esters include alkyl groups having 1 to 14 carbon atoms such as methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate or ethylhexyl (meth) acrylate.
  • An alkyl (meth) acrylate etc. which have a branch are mentioned.
  • the copolymerizable monomer a monomer having a copolymerizable functional group such as an ethylenic double bond and a crosslinkable functional group such as a hydroxyl group, a carboxyl group, an epoxy group, an isocyanate group, or an amide group in the molecule can be used. It is well known in the art.
  • the weight ratio of each monomer included in the acrylic polymer having a crosslinkable functional group as described above is not particularly limited, and may be adjusted in consideration of initial adhesive force, adhesive force and cohesion force of the desired adhesive.
  • various copolymerizable monomers other than those described above may also be included in a polymerized form.
  • the polymer may be prepared by conventional polymerization methods in the art, such as solution polymerization, photo polymerization, bulk polymerization, suspension polymerization or emulsion polymerization. It can be produced by such a method.
  • the thermosetting type pressure-sensitive adhesive composition may further include a polyfunctional crosslinking agent capable of crosslinking the polymer together with the acrylic polymer described above.
  • a polyfunctional crosslinking agent capable of crosslinking the polymer together with the acrylic polymer described above.
  • the kind of specific crosslinking agent which can be used is not specifically limited,
  • well-known crosslinking agents such as an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelate crosslinking agent, can be used.
  • the ratio of the crosslinking agent in the composition is not particularly limited, and may be appropriately adjusted in consideration of the desired cohesive force.
  • the pressure-sensitive adhesive composition may also be composed of a photocurable type.
  • photocurable pressure-sensitive adhesive composition means a composition in which a curing process is induced by light irradiation, that is, irradiation of electromagnetic waves, and is converted into an adhesive.
  • the electromagnetic wave may be microwave, infrared (IR), ultraviolet (UV), X-ray, city or -particle beam, proton beam, neutron beam, and electron beam. It is used to generically refer to a particle beam such as a beam.
  • the monomer or polymer component may include a photocurable oligomer and a monomer for reactive dilution.
  • the photocurable oligomer may include all oligomer components used in the manufacture of a photocurable pressure-sensitive adhesive composition such as UV curable in the art.
  • the oligomer may include urethane acrylate obtained by reacting a polyisocyanate having two or more isocyanate groups and a hydroxyalkyl (meth) acrylate in the molecule; Ester acrylates obtained by dehydration condensation of polyester polyols and (meth) acrylic acid; Ester urethane acrylate in which an ester urethane resin reacted with a polyester polyol and a polyisocyanate is reacted with hydroxyalkyl acrylate; Ether acrylates such as polyalkylene glycol di (meth) acrylate and the like; Ether-based urethane acrylates in which an ether-based urethane resin obtained by reacting a polyether polyol and a polyisocyanate with hydroxyalkyl (meth) acrylate is reacted; Or an epoxy acrylate to which an epoxy resin and (meth) acrylic acid are added and reacted, but is not limited thereto.
  • any monomer having a reactive functional group such as a (meth) acryloyl group in the molecular structure can be used without particular limitation.
  • Such monomers may serve to adjust the viscosity of the composition and to implement adhesion after curing.
  • Alkyl (meth) acrylate As such a monomer, Alkyl (meth) acrylate; Hydroxy group-containing monomers such as hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate or hydroxybutyl (meth) acrylate; Carboxyl group-containing monomers such as (meth) acrylic acid or ⁇ -carboxyethyl (meth) acrylate; Alkoxy group-containing monomers such as 2- (2-ethoxyethoxy) ethyl (meth) acrylate and the like; Aromatic group-containing monomers such as benzyl (meth) acrylate or phenoxyethyl (meth) acrylate; Heterocyclic moieties containing monomers such as tetrahydrofurfuryl (meth) acrylate or (meth) acryloyl morpholine; Or polyfunctional acrylate, and the like, but is not limited thereto.
  • Specific types and blending ratios of the oligomer and the reactive diluent monomer are not particularly limited and may be appropriately selected in consideration of the viscosity of the desired composition and the adhesive properties to be implemented after curing.
  • the pressure-sensitive adhesive composition may be composed of a thermosetting or photocuring type, preferably a photocuring type.
  • the monomer or polymer component may be a type including a photocurable oligomer and a diluent monomer, as described above, but may preferably be a photocurable syrup.
  • Alkyl (meth) acrylate Alkyl (meth) acrylate; And monomer mixtures comprising hydrophilic monomers or partial polymers thereof.
  • the kind of alkyl (meth) acrylate contained in the monomer mixture is not particularly limited.
  • a linear or branched alkyl group having 1 to 14 carbon atoms is included.
  • the branch can use alkyl (meth) acrylate.
  • Examples of such monomers include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, t-butyl ( Meta) acrylate, sec-butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, 2-ethylbutyl (meth) acrylate, n- Octyl (meth) acrylate, isooctyl (meth) acrylate, isononyl (meth) acrylate, lauryl (meth) acrylate, tetradecyl (meth) acrylate, and the like. Mixing can be used.
  • the hydrophilic monomer included in the monomer mixture can prevent whitening of the pressure-sensitive adhesive, so that the application to the optical use can be made more effectively.
  • hydrophilic monomer if it contains a polar functional group in a molecule
  • R represents hydrogen or an alkyl group
  • R 2 represents -A 4 -OH
  • R 3 represents an alkyl group
  • a 1 to A 4 each independently represent alkylene.
  • R may preferably be hydrogen or an alkyl group having 1 to 4 carbon atoms, and more preferably hydrogen or a methyl group.
  • alkyl may be linear having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms.
  • branched alkyl, and alkylene may be linear, branched, or cyclic alkylene having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. .
  • alkyl or alkylene in the above formulas (1) to (3) is optionally a general substituent known in the chemical field, for example, halogen atoms, hydroxy groups, carboxyl groups, thiol groups, alkoxy groups, alkyl groups, alkenyl groups or alkoxy It may be substituted by the nil group or the like.
  • R 1 may preferably represent hydrogen or — (CH 2 ) m —C ( ⁇ O) —OH (m is an integer of 1 to 4).
  • Specific examples of the compound of Formula 1 include (meth) acrylic acid or ⁇ -carboxyethyl (meth) acrylate, but are not limited thereto.
  • R 2 may preferably represent-(CH 2 ) n -OH (where n is an integer of 1 to 4).
  • Specific examples of the compound of Formula 2 include, but are not limited to, hydroxyethyl (meth) acrylate or hydroxybutyl (meth) acrylate.
  • R 3 may be alkyl having 1 to 4 carbon atoms, and A 1 and A 2 may be each independently alkylene having 1 to 4 carbon atoms.
  • Specific examples of such compounds include, but are not limited to, 2- (2-ethoxyethoxy) ethyl (meth) acrylate.
  • the monomer mixture in the photocurable syrup may include 50 parts by weight to 99.9 parts by weight of alkyl (meth) acrylate and 0.1 parts by weight to 50 parts by weight of hydrophilic monomer, preferably 60 parts by weight to alkyl (meth) acrylate. 95 parts by weight and 5 to 40 parts by weight of the hydrophilic monomer.
  • the weight ratio of the hydrophilic monomer in the monomer mixture may be adjusted in consideration of the anti-clouding effect of the pressure-sensitive adhesive, handling properties, process efficiency and storage stability.
  • a unit "weight part" means a weight ratio.
  • composition of the photocurable syrup may be further controlled to satisfy the required physical properties of the pressure-sensitive adhesive, to prevent cloudiness, and to ensure durability.
  • the syrup is alkyl (meth) acrylate; (Meth) acrylic acid or a monomer of the formula (4); And it may be a monomer mixture or a partial polymer thereof comprising a hydrophilic monomer represented by the following formula (5), (2) or (3).
  • R represents hydrogen or an alkyl group
  • R 4 represents a monovalent moiety derived from an aliphatic saturated hydrocarbon cyclic compound
  • a 5 represents alkylene.
  • R may preferably be hydrogen or an alkyl group having 1 to 4 carbon atoms, more preferably hydrogen or a methyl group.
  • a 5 may be linear, branched, or cyclic alkylene having 1 to 20 carbon atoms, 1 to 16 carbon atoms, 1 to 12 carbon atoms, 1 to 8 carbon atoms, or 1 to 4 carbon atoms. .
  • alkyl or alkylene in the general formula (4) and (5) is optionally a general substituent known in the chemical field, for example, a halogen atom, hydroxy group, carboxyl group, thiol group, alkoxy group, alkyl group, alkenyl group or alkoxy It may be substituted by the nil group or the like.
  • R 4 may preferably be a monovalent residue derived from an aliphatic saturated hydrocarbon cyclic compound having 3 to 20 carbon atoms, preferably 6 to 15 carbon atoms.
  • Examples of such a compound of Formula 4 include, but is not limited to, isobornyl (meth) acrylate.
  • Specific examples of the compound of Formula 5 include, but are not limited to, ⁇ -carboxyethyl (meth) acrylate.
  • the monomer mixture of the above examples may include 50 parts by weight to 99.9 parts by weight of alkyl (meth) acrylate; 5 to 40 parts by weight of (meth) acrylic acid or the monomer of Formula 4; 0.1 to 40 parts by weight of the hydrophilic monomer may be included, and preferably 60 to 95 parts by weight of alkyl (meth) acrylate; 10 to 30 parts by weight of (meth) acrylic acid or the monomer of Formula 4; 5 to 30 parts by weight of the hydrophilic monomer may be included.
  • (meth) acrylic acid or the monomer of the formula (4) mainly plays a role of securing the durability of the pressure-sensitive adhesive, if the weight ratio is too low, there is a fear that the effect of securing durability.
  • the polymerization rate of a monomer mixture or conversion rate of a monomer is not specifically limited.
  • the polymerization rate or the conversion rate can be controlled in consideration of process efficiency, desired adhesive properties, and the like.
  • the pressure-sensitive adhesive composition comprising the same, has a viscosity at 25 ° C. of about 1,000 cps to 8,000 cps, more preferably about 1,000 cps to 6,000 cps, more preferably 1,500 cps to 4,000 cps, more preferably 2,000 cps to 3,500 cps.
  • a viscosity at 25 ° C. of about 1,000 cps to 8,000 cps, more preferably about 1,000 cps to 6,000 cps, more preferably 1,500 cps to 4,000 cps, more preferably 2,000 cps to 3,500 cps.
  • the composition is a thermosetting type described above
  • a method of controlling the solid content of the polymer, the molecular weight or the dilution ratio with the solvent can be used, and in the case of containing a photocurable oligomer and a monomer for reactive dilution, the oligomer and / Or the kind of monomer and the method of controlling a compounding ratio can be used, and when using a monomer mixture or its partial polymerization product, the method of adjusting the weight ratio or polymerization rate between monomers can be used.
  • the said adhesive composition contains light scattering particle
  • the term "light-scattering particle” means a particle having a refractive index different from the pressure-sensitive adhesive as described above, and which can give the pressure-sensitive adhesive a property capable of diffusing or scattering light.
  • the adhesive in the relationship of the refractive index with the said light-scattering particle means the adhesive formed by hardening
  • the light scattering particles, the difference in refractive index with the pressure-sensitive adhesive may be 0.05 to 1.0, preferably, 0.05 to 0.6, more preferably 0.05 to 0.4.
  • the light scattering particles may have a relationship as described above, while having a higher refractive index than the pressure-sensitive adhesive.
  • the difference in refractive index is less than 0.05, the light scattering or light diffusion effect of the pressure-sensitive adhesive may be insignificant.
  • the refractive index difference is more than 0.6, the total light transmittance of the pressure-sensitive adhesive may be lowered, and application to optical applications may be difficult.
  • the light-scattering particles are not particularly limited as long as they have good compatibility and dispersibility with other components of the composition and can perform the same role as described above.
  • the shape of the particles is not limited, but may be any shape such as spherical, polyhedral or amorphous, but may preferably be spherical.
  • the sphere includes geometrically complete spheres as well as substantially or approximately spheres.
  • the light scattering particles include particles made of an organic material such as acrylic resin, styrene resin, urethane resin, melamine resin, benzoguanamine resin, epoxy resin or silicone resin; Or particles made of an inorganic material such as silica, titanium dioxide (TiO 2 ), magnesium fluoride (MgF 2 ), zirconium oxide (ZrO 2 ), aluminum oxide (Al 2 O 3 ), or glass, and the like. It is not limited to this.
  • the acrylic resin, the styrene resin, or the urethane resin may form particles in a crosslinked or non-crosslinked state.
  • the benzoguanamine formaldehyde condensate (Eposta M30: refractive index 1.66), the melamine formaldehyde condensate (EPOSTAR, refractive index 1.66), polypropylene made by Nippon SHOKUBAI, for example.
  • (Methyl methacrylate) crosslinked product (EPOSTAR MX, refractive index 1.49), crosslinked poly (methyl methacrylate) (MBX, refractive index 1.49) made by Sekisui Chemical Co., Ltd.
  • the light scattering particles may have an average particle diameter of about 1,000 nm to 30,000 nm, preferably about 1,000 nm to 20,000 nm, more preferably about 1,000 nm to 10,000 nm, and more preferably about 1,000 nm to 6,000 nm. have. If the size of the light scattering particles is too small, the light scattering or light diffusion effect may be lowered. If the size of the light scattering particles is too large, the adhesiveness may be reduced.
  • the weight ratio of the light scattering particles in the pressure-sensitive adhesive composition can be changed in consideration of the desired light scattering property or light diffusibility, and the like, and is not particularly limited.
  • the particles may be 0.01 to 50 parts by weight, 0.05 to 50 parts by weight, 0.05 to 20 parts by weight or 0.05 to 10 parts by weight based on 100 parts by weight of the monomer or polymer component. If the weight ratio of the light scattering particles is too small, the light scattering or light diffusion effect may be lowered. If the weight ratio of the light scattering particles is too high, the adhesiveness may be degraded. Therefore, the weight ratio may be controlled in consideration of this.
  • the pressure-sensitive adhesive composition may further include a dye.
  • the dye may be suitably included in the pressure-sensitive adhesive to control the color of the pressure-sensitive adhesive and effectively suppress the occurrence of whitening and yellowing.
  • the specific kind of the dye is not particularly limited, and for example, a conventional organic dye used for coloring a plastic material may be used.
  • nitroso-based dyes, nitro-based dyes, azo-based dyes, triphenylmethane-based dyes, phthalic anhydride-based dyes, indigo (indigo) -based dyes or anthraquinone-based dyes and the like may be used, and preferably anthraquinone-based dyes may be used as blue dyes.
  • the dye that can be suitably used in the present invention include, but are not limited to, the Macrox series manufactured by Lanxess.
  • the addition amount of the dye in the above is not particularly limited, and may be appropriately selected in consideration of, for example, the color tone of the adhesive pad.
  • the dye component may be included in the composition in an amount of 0.001 ppm to 10 ppm, preferably 0.05 ppm to 6 ppm, thereby effectively controlling the color tone of the pressure-sensitive adhesive, while preventing a decrease in luminance and the like. .
  • the pressure-sensitive adhesive composition may include a polyfunctional acrylate with the above-described components.
  • the multifunctional acrylate may be preferably included, but is not limited thereto, especially when the monomer or polymer component is the photocurable syrup described above.
  • polyfunctional acrylate 1, 4- butanediol di (meth) acrylate, 1, 6- hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, polyethyleneglycol, for example Di (meth) acrylate, neopentylglycol adipate di (meth) acrylate, hydroxyl promisvalic acid neopentylglycol di (meth) acrylate, dicyclopentanyl di ( Meta) acrylate, caprolactone modified dicyclopentenyl di (meth) acrylate, ethylene oxide modified di (meth) acrylate, di (meth) acryloxy ethyl isocyanurate, allylated cyclohexyl di (Meth) acrylate, tricyclodecane dimethanol (meth) acrylate, dimethylol dicyclopentane di (meth) acrylate,
  • the polyfunctional acrylate may be included in an amount of 0.05 to 50 parts by weight based on 100 parts by weight of the monomer or polymer component, but this may be changed in consideration of process efficiency or physical properties of the adhesive pad.
  • the composition may further include a photoinitiator, and may control the degree of polymerization according to the amount of the component used.
  • a photoinitiator as long as it can start a polymerization reaction through light irradiation etc., any can be used.
  • alpha-hydroxy ketone type compounds (ex. IRGACURE 184, IRGACURE 500, IRGACURE 2959, DAROCUR 1173; Ciba Specialty Chemicals); Phenylglyoxylate compounds (ex. IRGACURE 754, DAROCUR MBF; Ciba Specialty Chemicals); Benzyl dimethyl ketal compounds (ex.
  • DAROCUR 4265 IRGACURE 2022, IRGACURE 1300, IRGACURE 2005, IRGACURE 2010, IRGACURE 2020; Ciba Specialty Chemicals, etc.
  • the present invention is not limited thereto.
  • the photoinitiator may be included in an amount of 0.05 to 20 parts by weight based on 100 parts by weight of the monomer or polymer component described above, but this may be changed in consideration of process efficiency or physical properties of the cured product.
  • the pressure-sensitive adhesive composition may further include an antioxidant.
  • Antioxidant can be mix
  • the specific kind of antioxidant that can be used is not particularly limited, and conventional ingredients known in the field of pressure-sensitive adhesive production can be used, and the content thereof can also be appropriately adjusted in consideration of the desired physical properties. Examples of antioxidants that may be used include, but are not limited to, compounds distributed under the trade names of the Songnox series (Songwon Industrial Co., Songnox 1076, Songnox 1035, Songnox 1135, Songnox 1010, etc.).
  • the pressure-sensitive adhesive composition may further include a re-workability improver.
  • a reworkability improving agent By further including a reworkability improving agent, it is possible to improve workability and re-peelability, etc. in the process of applying the adhesive pad.
  • the specific kind of reworkability improving agent that can be used is not particularly limited, and various materials known in the art, for example, a fluorine-based compound, a silicon compound, or a low molecular weight, may be appropriately used in consideration of the desired physical properties. .
  • the content of the reworkability improving agent is also not particularly limited, and may be appropriately selected in consideration of the desired physical properties and the composition of the composition.
  • composition may further contain additives such as thermosetting agents, catalysts, UV curing agents, silane coupling agents, scatterers, UV stabilizers, colorants, reinforcing agents, fillers, antifoaming agents, surfactants, and plasticizers. It may further comprise.
  • additives such as thermosetting agents, catalysts, UV curing agents, silane coupling agents, scatterers, UV stabilizers, colorants, reinforcing agents, fillers, antifoaming agents, surfactants, and plasticizers. It may further comprise.
  • the pressure-sensitive adhesive formed by curing the composition as described above may have a thickness of about 0.1 mm to 10 mm, preferably about 0.1 mm to 5 mm, more preferably about 0.1 mm to 2 mm.
  • a thickness By controlling the thickness in the above range, it is possible to provide a thinner and more uniform surface light source. However, the thickness can be changed depending on the specific application.
  • the backlight unit 2 may further include a diffuser plate 40 attached to the adhesive pad 30 as shown in FIG. 2. After attaching the adhesive pad to the substrate, a unit is formed by attaching a diffusion plate on the upper portion thereof, thereby substantially removing the air layer between the substrate 10 and the diffusion plate 40, thereby improving luminance characteristics and the like. can do.
  • the specific kind of the diffusion plate 40 is not particularly limited, and a general material known in the art may be adopted.
  • an appropriate pattern P may be formed in the diffusion plate 40 to reduce the bright point in consideration of the pattern of the light emitting body 20.
  • the backlight unit 3 may further include a reflective layer 50 formed on the substrate 10, as shown in FIG. 3. By forming the reflective layer 50, the light emitted from the light emitting body 20 can be effectively refracted.
  • the specific kind of the reflective layer 50 is not particularly limited, and may be configured using a general material in this field.
  • the invention also relates to monomer or polymer components; And preparing a pressure-sensitive adhesive pad using a pressure-sensitive adhesive composition comprising light scattering particles; And laminating and attaching the adhesive pad to a substrate including a light emitter thereon.
  • the method for producing the pressure-sensitive adhesive pad using the pressure-sensitive adhesive composition is not particularly limited.
  • the pressure-sensitive adhesive composition may be prepared by coating in a pad shape and semi-curing or curing the coated pressure-sensitive adhesive composition.
  • the method of coating the pressure-sensitive adhesive composition in the above is not particularly limited, and for example, a known method such as bar coating or roll coating may be applied.
  • the method of curing or semi-curing the coated composition subsequent to coating is also not particularly limited, and an appropriate photocuring method or thermosetting method may be employed in consideration of the composition of the composition used.
  • the coated composition may be cured or semi-cured by applying to an appropriate drying, heating or aging process, and in the case of the photocuring type, a photoinitiator or the like contained in the composition. It can be cured or semi-cured by irradiating electromagnetic waves, such as UV, which can affect and cause a polymerization or curing reaction.
  • the conditions such as the temperature or time at the time of drying, heating or aging, the amount of light or illuminance at the time of irradiation of electromagnetic waves are not particularly limited, and may be appropriately selected in consideration of the composition of the composition and the desired degree of curing.
  • the present invention also provides a monomer or polymer component; And coating the pressure-sensitive adhesive composition comprising light scattering particles on top of the substrate on which the light emitter is located. And curing or semi-curing the pressure-sensitive adhesive composition.
  • the pressure-sensitive adhesive composition is directly coated on a substrate and cured or semi-cured to form an adhesive pad.
  • the degree of freedom in the process can be further improved through a method of directly coating the substrate, rather than separately manufacturing and laminating the adhesive pad.
  • the method of coating the pressure-sensitive adhesive composition on the substrate in the present invention is not particularly limited, for example, a known method such as bar coating can be applied.
  • the thickness of the coating layer in the coating process is not particularly limited and may be changed according to a specific application of the backlight unit.
  • a step of curing or semi-curing the coated pressure-sensitive adhesive composition is performed, and through this process, for example, a pressure-sensitive adhesive pad having a pressure-sensitive adhesive layer attached to the substrate is formed.
  • the method for curing or semicuring the coated composition is not particularly limited, and considering the composition of the composition used, an appropriate photocuring method or thermosetting method may be employed.
  • the coated composition may be cured or semi-cured by applying to an appropriate drying, heating or aging process, and in the case of the photocuring type, a photoinitiator or the like contained in the composition. It can be cured or semi-cured by irradiating electromagnetic waves, such as UV, which can affect and cause a polymerization or curing reaction.
  • the conditions such as the temperature or time at the time of drying, heating or aging, the amount of light or illuminance at the time of irradiation of electromagnetic waves are not particularly limited, and may be appropriately selected in consideration of the composition of the composition and the desired degree of curing.
  • the method it is also possible to further carry out the step of attaching the diffuser plate on the coated pressure-sensitive adhesive composition, wherein the attaching step of the diffuser plate may be performed before or after the above-described curing or semi-curing process.
  • the present invention also relates to a display device including the backlight unit as a light source.
  • the display device may be, for example, a liquid crystal display device.
  • the device may further include a liquid crystal panel installed on the backlight unit.
  • the display device may further include an optical film such as a brightness enhancement film (BEF) or a dual brightness enhancement film (DBEF).
  • BEF brightness enhancement film
  • DBEF dual brightness enhancement film
  • grains is made to adhere to the board
  • the pressure-sensitive adhesive does not cause lifting, peeling, or warping even under severe conditions such as high temperature or high temperature and high humidity, and does not cause yellowing or cloudiness. Accordingly, in the present invention, it is possible to provide a unit having a thin thickness while overcoming the step caused by the light emitting body while having high luminance and excellent luminance uniformity, and is also advantageous for application to a flexible element.
  • 1 to 3 are cross-sectional views showing various examples of the backlight unit.
  • a monomer mixture was prepared by combining 92 parts by weight of ethylhexyl acrylate (EHA) and 8 parts by weight of acrylic acid (AA). Thereafter, an appropriate amount of di (2-ethylhexyl) peroxydicarbonate (EHPDC, di (2-ethylhexyl) peroxydicarbonate) was added to the monomer mixture as a initiator, and the viscosity at 25 ° C. after polymerization in a bulk polymerization manner was about 3,000 cps. Photopolymerization syrup was prepared by partially polymerizing to.
  • EHA ethylhexyl acrylate
  • AA acrylic acid
  • EHPDC di (2-ethylhexyl) peroxydicarbonate
  • a pressure-sensitive adhesive composition 0.5 parts by weight of photoinitiator (2,4,6-trimethylbenzoyl diphenyl phosphoine (TPO)), 0.1 part by weight of 1,6-hexanediol diacrylate (HDDA) and light scattering particles (refractive index: 1.59, average diameter: 4,000 nm, polystyrene beads, HR-59-40, 0.25 parts by weight of advanced chemical (manufactured)) were added to prepare a pressure-sensitive adhesive composition. Subsequently, the pressure-sensitive adhesive composition was coated on a release film to have a thickness of 1.7 mm after curing, and a black light light source was used for about 6 minutes while maintaining the distance between the light source and the applied coating layer at 15 cm.
  • photoinitiator 2,4,6-trimethylbenzoyl diphenyl phosphoine (TPO)
  • HDDA 1,6-hexanediol diacrylate
  • light scattering particles reffractive index: 1.59, average diameter
  • the adhesive pad While irradiating with ultraviolet rays to prepare an adhesive pad.
  • the adhesive pad is then used to manufacture a direct type backlight unit, and the adhesive pad is placed on the LED array surface of a printed circuit board (PCB, PCB for 47-inch BLU, thickness of about 500 ⁇ m) in which LEDs are arranged in a predetermined pattern. It was attached to prepare a backlight unit having a total thickness of 3 mm.
  • PCB printed circuit board
  • a printed circuit board 47-inch BLU PCB, a thickness about 47 LEDs
  • a pressure-sensitive adhesive composition was prepared in the same manner as in Example 1, except that the content of 1,6-hexanediol diacrylate was changed to 0.5 parts by weight, which was printed on an LED having a thickness of about 1.2 mm.
  • the backlight unit was manufactured by directly coating on a circuit board (PCB) and ultraviolet curing in the same manner as in Example 1.
  • thermosetting acrylic polymer containing a hydroxyl group (manufactured by Soken, product name: UT-3001, viscosity (25 ° C): about 3,500 cps to 4,500 cps) isocyanate curing agent (manufacturer: Nippon Polyurethane Industry Co, product name: Coronate L- 55E), a catalyst and light-scattering particles (refractive index: 1.59, average diameter: 4,000 nm, polystyrene beads, HR-59-40, Advanced Chemical Co., Ltd.) were suitably blended to prepare an adhesive composition. Thereafter, the composition was directly coated on a printed circuit board (PCB) having an LED having a thickness of about 1.2 mm, and cured in an oven at 80 ° C. for 20 minutes.
  • PCB printed circuit board
  • a monomer mixture was prepared by combining 75 parts by weight of ethylhexyl acrylate, 15 parts by weight of acrylic acid and 10 parts by weight of hydroxyethyl acrylate. Thereafter, the bulk polymerization was carried out in the same manner as in Example 1, but the photocuring syrup was prepared by partial polymerization such that the viscosity at 25 ° C. was within the range of about 2,000 cps to 2,500 cps by controlling the reaction time. .
  • Example 5 Using the same pressure-sensitive adhesive composition prepared in Example 5, the composition was directly coated on the substrate and cured in the same manner as in Example 2 to prepare a backlight unit.
  • a monomer mixture was prepared by combining 70 parts by weight of ethylhexyl acrylate, 10 parts by weight of acrylic acid, 10 parts by weight of hydroxyethyl acrylate and 10 parts by weight of 2- (2-ethoxyethoxy) ethyl acrylate. Thereafter, the bulk polymerization was carried out in the same manner as in Example 1, but the photocuring syrup was prepared by partial polymerization such that the viscosity at 25 ° C. was within the range of about 3,000 cps to 3,500 cps by controlling the reaction time. .
  • Example 7 The same pressure-sensitive adhesive composition as prepared in Example 7 was used, but the composition was directly coated on the substrate and cured in the same manner as in Example 2 to prepare a backlight unit.
  • a pressure-sensitive adhesive composition was prepared by combining 12.5 parts by weight of a system bead, GS-0459S-6, Ganz (manufactured), and 1 ppm of a dye (Blue dye, MACROLEX Blue RR Gran manufactured by Lanxess). Thereafter, an adhesive pad having a thickness of 0.8 mm was manufactured in the same manner as in Example 1 using the pressure-sensitive adhesive composition, and a light source was prepared using the same.
  • Example 9 Using the same pressure-sensitive adhesive composition prepared in Example 9, the composition was directly coated on the substrate and cured in the same manner as in Example 2 to prepare a backlight unit.
  • Heat resistance and moisture resistance were evaluated for the light sources (horizontal and vertical lengths of 10 cm and 30 cm, respectively) (samples) prepared in Examples. Heat resistance was evaluated by visually observing whether the sample was left at 80 ° C. for 240 hours, and then whether bubbles were generated, lifting and peeling occurred. Moisture and heat resistance were measured at 60 ° C. and 90% relative humidity. After standing for 240 hours, the same was observed by visually observing whether bubbles, lifting and peeling occurred. Each evaluation criterion is as follows.
  • Test Example 1 The same sample as in Test Example 1 was left to stand in heat-resistant conditions, and the presence or absence of curvature was evaluated. Specifically, the sample was placed in a vertical direction and left at 80 ° C. for 240 hours in a high state, then taken out and slowly cooled at room temperature for about 30 minutes. Thereafter, the samples in the longitudinal direction were placed in contact with each other in a state of facing the flat glass substrate, and the distance farthest from the reference glass substrate to the sample was measured with a tape measure to evaluate whether warpage occurred. .

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Planar Illumination Modules (AREA)

Abstract

La présente invention concerne une unité de rétro-éclairage. L'unité de rétro-éclairage de la présente invention est formée en fixant un adhésif mélangé à des particules de diffusion de lumière sur un substrat sur lequel se trouve un corps émetteur de lumière. L'adhésif ne crée aucun inconvénient du type soulèvement, décollement ou gondolement même dans des conditions de températures élevées extrêmes et/ou de température élevée/humidité élevée, et n'entraîne également pas de phénomènes tels que le jaunissement, l'opacité blanche et analogue. Selon la présente invention, il est possible d'obtenir une unité de rétro-éclairage fine possédant une meilleure luminance et une meilleure uniformité de luminance, et permettant d'éviter les problèmes de degrés causés par les corps émetteurs de lumière. L'unité de rétro-éclairage de la présente invention peut être avantageusement appliquée à un dispositif flexible.
PCT/KR2010/007819 2009-11-05 2010-11-05 Unité de rétro-éclairage WO2011056026A2 (fr)

Priority Applications (3)

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JP2012537822A JP5590582B2 (ja) 2009-11-05 2010-11-05 バックライトユニット
CN201080060754.6A CN102754018B (zh) 2009-11-05 2010-11-05 背光单元
US13/162,403 US20110242796A1 (en) 2009-11-05 2011-06-16 Backlight unit

Applications Claiming Priority (8)

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KR20090106683 2009-11-05
KR10-2009-0106684 2009-11-05
KR10-2009-0106683 2009-11-05
KR20090106684 2009-11-05
KR10-2010-0109521 2010-11-05
KR1020100109521A KR101302877B1 (ko) 2009-11-05 2010-11-05 백라이트 유닛
KR1020100109523A KR101302783B1 (ko) 2009-11-05 2010-11-05 백라이트 유닛의 제조 방법
KR10-2010-0109523 2010-11-05

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JP2013187198A (ja) * 2012-03-07 2013-09-19 Lg Innotek Co Ltd 照明装置
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JP2014531708A (ja) * 2011-09-09 2014-11-27 エルジー イノテック カンパニー リミテッド 大面積基板の厚膜製造方法及びこれによる厚膜構造、照明装置及びこれを含む液晶表示装置
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