WO2011041862A1 - Processo via extrusão para preparar uma composição polimérica híbrida, composição polimérica híbrida e artigo - Google Patents
Processo via extrusão para preparar uma composição polimérica híbrida, composição polimérica híbrida e artigo Download PDFInfo
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- WO2011041862A1 WO2011041862A1 PCT/BR2010/000326 BR2010000326W WO2011041862A1 WO 2011041862 A1 WO2011041862 A1 WO 2011041862A1 BR 2010000326 W BR2010000326 W BR 2010000326W WO 2011041862 A1 WO2011041862 A1 WO 2011041862A1
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- WIPO (PCT)
- Prior art keywords
- organometallic
- hybrid
- article
- extrusion process
- sealing
- Prior art date
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- 229920000642 polymer Polymers 0.000 title claims abstract description 59
- 239000000203 mixture Substances 0.000 title claims abstract description 31
- 238000001125 extrusion Methods 0.000 title claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 125000002524 organometallic group Chemical group 0.000 claims abstract description 20
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 20
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 20
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 17
- 229910052718 tin Inorganic materials 0.000 claims abstract description 17
- 239000000178 monomer Substances 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims description 83
- 229920000098 polyolefin Polymers 0.000 claims description 34
- -1 silane compound Chemical class 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 30
- 230000008569 process Effects 0.000 claims description 21
- 229910000077 silane Inorganic materials 0.000 claims description 15
- 150000002902 organometallic compounds Chemical class 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 11
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 10
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 6
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 230000010287 polarization Effects 0.000 claims description 5
- 238000011282 treatment Methods 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 239000005977 Ethylene Substances 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 claims description 2
- 238000003490 calendering Methods 0.000 claims description 2
- XGZNHFPFJRZBBT-UHFFFAOYSA-N ethanol;titanium Chemical compound [Ti].CCO.CCO.CCO.CCO XGZNHFPFJRZBBT-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 claims description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 2
- 125000005375 organosiloxane group Chemical group 0.000 claims 2
- FNLOVTVMVPHGDE-UHFFFAOYSA-N CCCC[Ti]OCC Chemical compound CCCC[Ti]OCC FNLOVTVMVPHGDE-UHFFFAOYSA-N 0.000 claims 1
- PQZRIHABPZTYJN-UHFFFAOYSA-N CCO[Ti](OCC)(OCC)C1=CC=CC=C1 Chemical compound CCO[Ti](OCC)(OCC)C1=CC=CC=C1 PQZRIHABPZTYJN-UHFFFAOYSA-N 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 13
- 150000001875 compounds Chemical class 0.000 abstract description 10
- 239000011159 matrix material Substances 0.000 abstract description 8
- 230000005012 migration Effects 0.000 abstract description 7
- 238000013508 migration Methods 0.000 abstract description 7
- 239000006185 dispersion Substances 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 2
- 239000002861 polymer material Substances 0.000 abstract 2
- 239000013256 coordination polymer Substances 0.000 description 47
- 239000000654 additive Substances 0.000 description 40
- 230000000996 additive effect Effects 0.000 description 37
- 229920005989 resin Polymers 0.000 description 29
- 239000011347 resin Substances 0.000 description 29
- 230000004048 modification Effects 0.000 description 18
- 238000012986 modification Methods 0.000 description 18
- 239000010936 titanium Substances 0.000 description 17
- 150000001282 organosilanes Chemical class 0.000 description 16
- 238000004381 surface treatment Methods 0.000 description 14
- 238000012360 testing method Methods 0.000 description 12
- 230000014759 maintenance of location Effects 0.000 description 11
- 230000008859 change Effects 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 6
- 238000003851 corona treatment Methods 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000004703 alkoxides Chemical group 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000000113 differential scanning calorimetry Methods 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 230000000051 modifying effect Effects 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 2
- 101000897906 Beet necrotic yellow vein virus (isolate Japan/S) Capsid readthrough protein Proteins 0.000 description 1
- 101000957637 Potato mop-top virus (isolate Potato/Sweden/Sw) 91 kDa readthrough protein Proteins 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 101000957638 Soil-borne wheat mosaic virus (strain United States/Nebraska/1981) 84 kDa readthrough protein Proteins 0.000 description 1
- 150000001336 alkenes Chemical group 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- UZJVTTLANRELSN-UHFFFAOYSA-N butyl(ethoxy)silane Chemical compound CCCC[SiH2]OCC UZJVTTLANRELSN-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013211 curve analysis Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- RWHPJDQRXPFAJG-UHFFFAOYSA-N ethoxy(octyl)silane Chemical compound CCCCCCCC[SiH2]OCC RWHPJDQRXPFAJG-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000010399 physical interaction Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920006112 polar polymer Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
- C08K5/057—Metal alcoholates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31913—Monoolefin polymer
Definitions
- the present invention relates to polymeric materials having hybrid characteristics prepared via extrusion which are composed of a dispersion of Si, Ti, Zr, Hf, Ge, V or Sn organometallic monomers or oligomers in a polymeric matrix.
- Articles prepared with these polymeric materials are characterized by the migration of these compounds to their surface, conferring differentiated weldability and surface properties compared to those existing in the state of the art.
- Properties that can be modified include: sealing temperature, initial sealing temperature (SIT), gas and water vapor barrier, printability, adhesion, and scratch resistance, as well as retaining surface polarization of parts and movies. These properties are achieved without modifying the mechanical properties of the material.
- Polymeric materials such as films and parts, with improved sealing and surface properties, have been studied and obtained by different techniques described in the state of the art.
- BR patent application PI0516432-0 discloses an improved process of the already known commercial chemical vapor deposition (CVD) process also referred to as brilliant discharge chemical vapor.
- This patent relates to the deposition of a plasma polymerized layer of silicon oxide, siloxane or organosilane on the surface of an organic polymeric substrate by brilliantly depositing a gas mixture comprising a silicon-containing compound and an oxidant. .
- the silane layer deposition process is made by mixing the silane with the oxidizing gas (N 2 O) in the chemical vapor deposition process.
- Such application uses the gases of generation of chemical vapor deposition as carrier gas for silane, differing from the present one. invention where the silane compound is added by additive in the polymeric mass and whose subsequent migration occurs by difference of polarity of the silane additive with the resin, which is a simplified process with fewer steps.
- EP 2072575 A1 describes the mixture of polypropylene with silane-grafted polypropylene with molecular chain and a mineral filler, silane being specifically grafted on the polymer chain to act as a compatibilizer between polymer and mineral cargo.
- the application has the clear objective of using silane as a compatibilizing agent, and no improvements in surface properties of the resulting compound are reported.
- silane is not grafted to the polymer chain, having the possibility of mobility and / or migration to the surface of the polymeric matrix.
- US Patent 5,973,070 reports a polyolefin blend with improved surface hardness and scratch resistance.
- the polyolefin blend consists of a polypropylene, a grafted polypropylene, a mineral and an amorphous silica and optionally an ethylene / propylene / polydiene terpolymer.
- the silane compound is in the polymer chain and is used as an amorphous silica filler, unlike the present invention, where the silane compound is dispersed and able to migrate to the surface.
- prior art comprises mixing organosilane compounds with polymers and using a peroxide compound to obtain a chemical bond of organosilane to the polymer chains.
- Another common procedure is the deposition of organosilanes or silicon compounds in the form of chemical or physical vapors on the surface of the films. This is done to increase the gas barrier of the polymers. Both methodologies differ totally from the proposed in the present invention.
- the present invention relates to a process for preparing a polymeric composition comprising the following steps:
- the present invention also relates to a polymer composition obtained by the above process, as well as to an article comprising said composition.
- Figure 1 Hot-tack graph using TxT film surfaces of TEOS and HTEOS additive CP resin.
- NTxNT of CP resin added with TEOS and HTEOS.
- Figure 3 Ultimate graphic using TxT film surfaces of TEOS and HTEOS additive CP resin.
- Figure 4 Ultimate graph using NTxNT film surfaces of TEOS and HTEOS additive CP resin.
- Figure 5 Ultimate graph using NTxNT film surfaces of CP-00 resin additive with different organosilane compounds.
- Figure 6 Hot-tack graph using NTxNT film surfaces of CP resin additive with different organometallic compounds.
- Figure 7 Schematic representation of the multilayer and bi-oriented film as well as its composition.
- the present invention relates to polymers, especially polyolefins, organic-inorganic hybrids with differentiated properties compared to traditional polyolefins, such as initial sealing temperature, sealing window, sealing temperature, as well as surface properties such as gas and water vapor barrier, printability, adhesion and scratch resistance.
- the hybrid material obtained according to the invention may be used in the food, pharmaceutical, petrochemical, automotive, household appliances, agribusiness, general packaging, construction, aerospace industries, as well as adhesion to other materials such as metals and polar polymers, among others. .
- Dispersion of the monomers or oligomers of Si, Ti, Zr, Hf, Ge, V or Sn organometallic compounds into polymers such as polyolefins, and subsequent surface migration of films or parts causes changes in physical and chemical characteristics.
- chemical changes of the polyolefin structure these changes being perceived mainly in the surface properties, such as printability, adhesion and scratch resistance of the final article.
- the chemical and physical interaction of organometallic monomers or oligomers with resin exhibits changes in properties such as sealing temperature, sealing window and initial sealing temperature when films are made with the obtained hybrid materials.
- organometallic element when it does not migrate into the polymer matrix, it is considered to be only a compatibilizing or filler agent, so it would not be commonly used to add organometallic compounds to polyolefins to effect surface properties modification, for if these compounds did not migrate to the surface, they could interact detrimentally with the mechanical properties of the polymer.
- the hybrid polyolefin polymer object of the present invention is obtained by the addition of Si, Ti, Zr, Hf, Ge, V or Sn organo-metallic monomeric or oligomeric compounds having groups substituted or not by an alkyl chain of 1 to 2 25 carbons, or by mixing them in any proportions, to a polymeric matrix by extrusion procedures.
- organometallic additives migrate to the surface when films or parts with the additive resin are produced. This surface migration can be accelerated through surface treatments commonly used in the plastics processing industry, such as corona, plasma or flame treatment.
- Addition of the organosilane additive does not change the properties of the hybrid polyolefin compared to the polymer. Such properties are: rheological (flow rate), thermal (crystallization temperature, melting temperature, crystallinity) and mechanical (yield stress, tensile stress, elongation at break, elongation at flow).
- the non-modification of the described properties has the advantage of using hybrid polymers under the same processing conditions as traditional resin and with the differential in properties provided by the present invention.
- a polymeric matrix such as a polyolefin
- hybrid additive with monomeric or oligomeric organometallic compounds of Si, Ti, Zr is disclosed.
- Hf, Ge, V or Sn for purposes of modifying properties such as initial sealing temperature, sealing window, sealing temperature, surface properties such as gas and water vapor barrier, printability, adhesion and scratch resistance. .
- the hybrid polyolefin according to the present invention particularly comprises the following components:
- polystyrene resins preferably using propylene or ethylene monomers or propylene or ethylene copolymers
- the present invention relates to hybrid polyolefins where the interaction of Si, Ti, Zr, Hf, Ge, V or Sn organometallics with polyolefin exhibits different properties compared to polyolefin without addition of said compounds.
- the present invention relates to a process for preparing said polymeric composition comprising the following steps:
- the organometallic used may or may not be substituted with alkyl groups. Alkyl groups are responsible for hybrid characteristics of the material obtained;
- c) optionally biasing the surface of the part obtained in (b) through, for example, corona treatment, plasma treatment, flame treatment or chemical treatment.
- This step aims to modify (increase) the polarity of the article surface, generating a preferential migration of organometallic to the polarized surface.
- the organosilanes used are preferably tetraethylorthosycate (TEOS), ethyltrimethoxysilane, ethyltriethoxysilane, methyltriethoxysilane, phenyltriethoxysilane, n-octylethoxysilane, vinyltrimethoxysilane, n-butylethoxysilane.
- TEOS tetraethylorthosycate
- ethyltrimethoxysilane ethyltriethoxysilane
- methyltriethoxysilane methyltriethoxysilane
- phenyltriethoxysilane n-octylethoxysilane
- vinyltrimethoxysilane n-butylethoxysilane.
- the organotitanates used are preferably tetraethoxytitanium, ethyltriethoxytanium, methyltriethoxytanium, phenyltriethoxytanium, n-octylethoxytanium, n-butylethoxytanium.
- the organozirconates used are preferably tetraethylzirconate, tetrapropylzirconate, tetrabutylzirconate, n-octylzirconate.
- the polymers used are preferably ethylene or propylene polyolefins or copolymers formed by these monomers.
- composition of the invention In order to obtain bioriented multilayer film with the composition of the invention, there is a decrease in the initial welding temperature and an increase in the retention time of the surface treatment (corona treatment, flame, plasma, among others).
- the composition described and claimed in the present invention is used as a modifier of sealing characteristics and polymer surfaces and may be preferable for some surface because the Si, Ti, Zr, Hf, Ge, V or Sn organometallic when dispersed. in polyolefin, it can migrate by the polarity difference with the matrix.
- Hybrid compound with organic and inorganic characteristics
- initial sealing temperature - in the ultimate chart is the temperature at which the sealing force is greater than 0.5N
- - Organo-metal Metallic element (Si, Ti, Zr. Hf, Ge, V, Sn) chemically bonded to an alkoxide group (-OR)
- Example 1 Process for obtaining hybrid polymers with improved sealing and surface properties using TEOS as an additive
- the following examples are related to obtaining hybrid polymers and their effect on sealing and surface properties of polyolefins.
- organosilane into the polymer matrix was done using standard extrusion procedures such as temperature profile, screw type and extruder type normally used in the additive process.
- films were made in a balloon film extruder, not limited to this type of equipment, and the injected parts were made in an injector.
- the thickness of the films was 10 to 80 m and the injected pieces were between 1 and 4 mm thick.
- the surface was modified by 40 dynas level corona treatment.
- the film sealing analysis was performed on samples obtained from the same sample, but with different following characteristics:
- Sample T Surface Modified Sample (Corona)
- CP propylene copolymer
- Hot-Tack (ASTM F-1921) and Ultimate (ASTM F-2029) tests are performed. The results as well as the analyzes are presented below.
- NT-NT Sealing analysis using an untreated film surface (NT) in contact with another untreated film surface (NT);
- T-T Sealing analysis using a corona treated (T) film surface in contact with another corona (T) treated film surface.
- Graph 1 shows the variation of the sealing window for CP resin additive with different organosol compounds.
- the following captions and conventions are adopted in the chart:
- ⁇ CP HTEOS TEOS additive CP (modified in acid medium)
- Hot-tack testing consists of determining the heat-sealing force of film surfaces at a specific temperature. With the data obtained in this test the heat sealing window graph is constructed.
- a sealing temperature decrease of 5 ° C was observed as can be seen for CP-TEOS-T (- D) and CP-HTEOS-T (--—) samples compared to CP samples.
- a large decrease in the sealing window initial temperature (considered when a force of 0.5N is reached) was observed from 95 ° C for CP sample to 75 ° C for CP-HTEOS-T and CP-TEOS-T sample .
- Ultimate testing consists of determining the sealing force after cooling the film surfaces to a specific sealing temperature. With the data obtained in this test, the sealing window graph after cooling is constructed.
- a decrease in sealing temperature (120 ° C) (identified as one (A) in the sealing window graph) was obtained to 115 ° C with CP-TEOS (- ⁇ -), CP-HTEOS (-), CP-HTEOS-T (- ..).
- One of the most important determinations is the initial sealing temperature (SIT) which, as stated above, is observed on the Ultimate graph at 0.5N force.
- Figure 3 shows a decrease from 95 ° C to 90 ° C corresponding to the CP and CP-HTEOS-T samples.
- Figure 4 shows the sealing window graph after cooling for CP resin additive with different organosilane compounds and where NTxNT surfaces are in contact with the test.
- CP resin additive with different organosilane compounds
- NTxNT surfaces are in contact with the test.
- a similar behavior to that of figure 3 is observed, demonstrating that both sides of the film made with additive CP resin with different organosilins show significant change in the proof of non-modification of the rheological, thermal and mechanical properties of hybrid polymers. compared to non-hybrid polymers.
- Table 1 presents the flowability index (IF) values for the different materials obtained. It can be observed that the melt index does not show significant variation indicating that the CP resin did not undergo molecular chain degradation processes.
- Tm2 Melting temperature of second heating
- the hybrid polymer can be processed under the same conditions as the non-hybrid polymer.
- Table 3 shows the yield stress, yield strength, yield strength, yield strength of the mechanical parameters obtained from tensile strength analysis for the materials generated from the additive of different organosilanes in CP resin. Table 3. Parameter values obtained on DSC plot on CP resin additive with 0.3% of different organosilanes
- Example 2 Process of obtaining hybrid polymers with improved sealing and surface properties using different silanes as additive
- ⁇ CP Film made with propylene copolymer resin
- PC OT PC with surface modification, and additive with octyl trimethoxysilane
- ⁇ CP RT CP with surface modification and additive with acid homopolymerized octyl trimethoxysilane.
- PDD MT CP with surface modification and methyl trimethoxysilane additive
- test graph is shown in figure 5, where changes in the sealing window can be observed for the other organosilane compounds used.
- This change in the sealing window makes it possible to identify increases from 4.7 N for CP 00 sample to 8.2 N for sealing temperature 120 ° C, normal sealing temperature for CP 00 resin, showing an increment at 75% sealing strength.
- a decrease in sealing temperature from 120 ° C from CP 00 to 115 ° C can also be observed for organosilane additive samples, with a decrease in sealing temperature of 5 ° C.
- Example 3 Process of obtaining hybrid polymers with improved sealing and surface properties using different alkoxides such as zirconates and titanates as additive
- PC Si-T PC with surface modification and additive with silicon alkoxide (methyltrimethoxysilane)
- ⁇ CP Zr-T CP with surface modification and additive with zirconium alkoxide (n-butylzirconate)
- ⁇ CP Ti-T CP with surface modification and additive with titanium alkoxide (n-propyltitanate)
- the test graph is shown in figure 6, where changes in the sealing window can be observed when using titanium and zirconium alkoxide compounds, in addition to the aforementioned silicon alkoxide.
- This change in the sealing window makes it possible to identify the decrease in sealing temperature from 120 ° C from CP sample to 115 ° C for samples additive with different silicon, titanium and zirconium alkoxides, with a decrease in sealing temperature of 5 ° C. ⁇ .
- Example 4 Process of obtaining multi-layer and bioriented film with improved sealing and surface properties using hybrid polyolefins.
- layer A is defined as the layer that will have surface modification to improve printability
- layer B is the structuring layer
- mechanical film and layer C is the layer responsible for the sealability of the film when it is necessary to make sealed bags or packaging.
- Each of the layers may be made with each of the different polymers used in the present patent application.
- the polymers used were:
- Polymer A Polyolefin used to provide the film with surface treatment retention properties.
- Polymer B Polymer used to give structure and mechanical properties to the film.
- Polymer C Polyolefin with 0.3% Addition of Tetraethoxysilane Additive (Hybrid Polyolefin)
- Polymer D Polyolefin with 0.3% addition of vinyltrimoxysilane additive (Hybrid polyolefin)
- hybrid polyolefin imparts to the multilayer and bi-oriented film are: decrease of the initial weld temperature, increase of retention time of surface treatment (corona treatment, flame, plasma, among others), barrier increase to gases and increased scratch resistance.
- Initial Sealing Temperature Defined as the temperature at which the sealing force is greater than 2 Newton (N). For the purposes of this patent application analyzes have been made by maintaining the sealing temperature at 110 ° C and verifying that the force is greater than 2.0 N. If the sample shows strength greater than 2.0N, it will be considered as improvement. at initial sealing temperature. This is because in industrial applications of multilayer and bi-oriented films the definition of the technical parameter for the initial sealing temperature is made at the fixed temperature condition of 110 ° C and strength evaluation as mentioned above.
- Surface treatment retention is defined as a time greater than two months in which the film that has been exposed to surface treatment (corona, flame, plasma, etc.) others) shows no decay of at least 20% in surface treatment.
- Table 5 shows the comparative properties of the initial sealing force and the corona treatment.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Silicon Polymers (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR112012007997A BR112012007997A2 (pt) | 2009-10-07 | 2010-08-07 | processo via extrusão para preparar uma composição polimérica híbrida,composição polimérica híbrida e artigo |
US13/500,822 US20130040152A1 (en) | 2009-10-07 | 2010-08-07 | Process via extrusion for preparing a hybrid polymer composition, hybrid polymer composition and article |
MX2012004034A MX2012004034A (es) | 2009-10-07 | 2010-10-07 | Proceso de extrusion para preparar una composicion de polimero hibrido, composicion de polimero hibrido y articulo. |
CA 2776940 CA2776940A1 (en) | 2009-10-07 | 2010-10-07 | Process via extrusion for preparing a hybrid polymer composition, hybrid polymer composition and article |
EP20100781802 EP2487200A1 (en) | 2009-10-07 | 2010-10-07 | Extrusion method for producing a hybrid polymer composition, hybrid polymer composition and article |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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BRP10904397-7 | 2009-10-07 | ||
BRPI0904397-7A BRPI0904397A2 (pt) | 2009-10-07 | 2009-10-07 | processo via extrusço para preparar uma composiÇço polimÉrica hÍbrida, composiÇço polimÉrica hÍbrida e artigo |
Publications (2)
Publication Number | Publication Date |
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WO2011041862A1 true WO2011041862A1 (pt) | 2011-04-14 |
WO2011041862A8 WO2011041862A8 (pt) | 2011-06-30 |
Family
ID=43558488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/BR2010/000326 WO2011041862A1 (pt) | 2009-10-07 | 2010-10-07 | Processo via extrusão para preparar uma composição polimérica híbrida, composição polimérica híbrida e artigo |
Country Status (8)
Country | Link |
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US (1) | US20130040152A1 (pt) |
EP (1) | EP2487200A1 (pt) |
BR (2) | BRPI0904397A2 (pt) |
CA (1) | CA2776940A1 (pt) |
CL (1) | CL2012000857A1 (pt) |
MX (1) | MX2012004034A (pt) |
PE (1) | PE20130565A1 (pt) |
WO (1) | WO2011041862A1 (pt) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63249627A (ja) * | 1987-04-06 | 1988-10-17 | Showa Denko Kk | 剥離性材料の製造方法 |
US5973070A (en) | 1995-01-16 | 1999-10-26 | Borealis A/S | Polyolefin alloy with improved surface hardness and scratch resistance |
EP0982359A2 (en) * | 1998-08-28 | 2000-03-01 | Dow Corning Corporation | Polyolefin compositions containing organosilicon compounds as adhesion additives |
US20020039610A1 (en) * | 2000-05-02 | 2002-04-04 | Curwood, Inc. | Anti-transfer film and package |
WO2008080447A1 (en) | 2006-12-29 | 2008-07-10 | Borealis Technology Oy | Polyolefin composition comprising silicon-containing filler |
BRPI0516432A (pt) | 2004-10-29 | 2008-09-02 | Dow Global Tecnologies Inc | processo para depositar uma camada de organossiloxano |
EP2072575A1 (en) | 2007-12-21 | 2009-06-24 | Borealis Technology OY | Polypropylene composition comprising a cross-linkable dispersed phase comprising silanol groups containing nanofillers |
-
2009
- 2009-10-07 BR BRPI0904397-7A patent/BRPI0904397A2/pt not_active Application Discontinuation
-
2010
- 2010-08-07 BR BR112012007997A patent/BR112012007997A2/pt not_active IP Right Cessation
- 2010-08-07 US US13/500,822 patent/US20130040152A1/en not_active Abandoned
- 2010-10-07 CA CA 2776940 patent/CA2776940A1/en not_active Abandoned
- 2010-10-07 PE PE2012000443A patent/PE20130565A1/es not_active Application Discontinuation
- 2010-10-07 WO PCT/BR2010/000326 patent/WO2011041862A1/pt active Application Filing
- 2010-10-07 EP EP20100781802 patent/EP2487200A1/en not_active Withdrawn
- 2010-10-07 MX MX2012004034A patent/MX2012004034A/es not_active Application Discontinuation
-
2012
- 2012-04-03 CL CL2012000857A patent/CL2012000857A1/es unknown
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63249627A (ja) * | 1987-04-06 | 1988-10-17 | Showa Denko Kk | 剥離性材料の製造方法 |
US5973070A (en) | 1995-01-16 | 1999-10-26 | Borealis A/S | Polyolefin alloy with improved surface hardness and scratch resistance |
EP0982359A2 (en) * | 1998-08-28 | 2000-03-01 | Dow Corning Corporation | Polyolefin compositions containing organosilicon compounds as adhesion additives |
US20020039610A1 (en) * | 2000-05-02 | 2002-04-04 | Curwood, Inc. | Anti-transfer film and package |
BRPI0516432A (pt) | 2004-10-29 | 2008-09-02 | Dow Global Tecnologies Inc | processo para depositar uma camada de organossiloxano |
WO2008080447A1 (en) | 2006-12-29 | 2008-07-10 | Borealis Technology Oy | Polyolefin composition comprising silicon-containing filler |
EP2072575A1 (en) | 2007-12-21 | 2009-06-24 | Borealis Technology OY | Polypropylene composition comprising a cross-linkable dispersed phase comprising silanol groups containing nanofillers |
Non-Patent Citations (1)
Title |
---|
DATABASE WPI Week 198847, Derwent World Patents Index; AN 1988-335249, XP002623477 * |
Also Published As
Publication number | Publication date |
---|---|
US20130040152A1 (en) | 2013-02-14 |
MX2012004034A (es) | 2012-05-08 |
BR112012007997A2 (pt) | 2016-03-29 |
WO2011041862A8 (pt) | 2011-06-30 |
CL2012000857A1 (es) | 2012-09-07 |
BRPI0904397A2 (pt) | 2011-06-14 |
EP2487200A1 (en) | 2012-08-15 |
PE20130565A1 (es) | 2013-05-14 |
CA2776940A1 (en) | 2011-04-14 |
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