WO2011033406A3 - Lentille moulée comprenant un élément fenêtre - Google Patents

Lentille moulée comprenant un élément fenêtre Download PDF

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Publication number
WO2011033406A3
WO2011033406A3 PCT/IB2010/053771 IB2010053771W WO2011033406A3 WO 2011033406 A3 WO2011033406 A3 WO 2011033406A3 IB 2010053771 W IB2010053771 W IB 2010053771W WO 2011033406 A3 WO2011033406 A3 WO 2011033406A3
Authority
WO
WIPO (PCT)
Prior art keywords
window element
lens
window
molded lens
lens incorporating
Prior art date
Application number
PCT/IB2010/053771
Other languages
English (en)
Other versions
WO2011033406A2 (fr
Inventor
Michael D. Camras
Nanze Patrick Wang
Hendrik J.B. Jagt
Helena Ticha
Ladislav Tichy
Original Assignee
Koninklijke Philips Electronics N.V.
Philips Lumileds Lighting Company, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V., Philips Lumileds Lighting Company, Llc filed Critical Koninklijke Philips Electronics N.V.
Priority to CN2010800414191A priority Critical patent/CN102484193A/zh
Priority to CA2774404A priority patent/CA2774404A1/fr
Priority to JP2012529368A priority patent/JP2013505571A/ja
Priority to EP10754795A priority patent/EP2478574A2/fr
Publication of WO2011033406A2 publication Critical patent/WO2011033406A2/fr
Publication of WO2011033406A3 publication Critical patent/WO2011033406A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)

Abstract

L'invention concerne un émetteur lumineux qui comprend une puce à diode électroluminescente (DEL) et un élément optique sur la puce à DEL. L'élément optique comprend une lentille, un élément fenêtre, et une liaison au niveau d'une interface disposée entre la lentille et l'élément fenêtre. L'élément fenêtre peut être un élément de conversion de longueur d'ondes ou une plaque optiquement plane. L'élément fenêtre peut être directement lié ou fusionné à la lentille, ou peut être lié à la lentille par une ou plusieurs couches de liaison intermédiaires. La liaison entre l'élément fenêtre et la lentille peut présenter un indice de réfraction similaire à celui de l'élément fenêtre et/ou de la lentille.
PCT/IB2010/053771 2009-09-17 2010-08-20 Lentille moulée comprenant un élément fenêtre WO2011033406A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2010800414191A CN102484193A (zh) 2009-09-17 2010-08-20 结合窗口元件的模制透镜
CA2774404A CA2774404A1 (fr) 2009-09-17 2010-08-20 Lentille moulee comprenant un element fenetre
JP2012529368A JP2013505571A (ja) 2009-09-17 2010-08-20 ウィンドウ要素を組み込んだモールドレンズ
EP10754795A EP2478574A2 (fr) 2009-09-17 2010-08-20 Lentille moulée comprenant un élément fenêtre

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/561,342 2009-09-17
US12/561,342 US20110062469A1 (en) 2009-09-17 2009-09-17 Molded lens incorporating a window element

Publications (2)

Publication Number Publication Date
WO2011033406A2 WO2011033406A2 (fr) 2011-03-24
WO2011033406A3 true WO2011033406A3 (fr) 2011-06-16

Family

ID=43128208

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2010/053771 WO2011033406A2 (fr) 2009-09-17 2010-08-20 Lentille moulée comprenant un élément fenêtre

Country Status (8)

Country Link
US (1) US20110062469A1 (fr)
EP (1) EP2478574A2 (fr)
JP (1) JP2013505571A (fr)
KR (1) KR20120082898A (fr)
CN (1) CN102484193A (fr)
CA (1) CA2774404A1 (fr)
TW (1) TW201121105A (fr)
WO (1) WO2011033406A2 (fr)

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US20110062469A1 (en) 2011-03-17
TW201121105A (en) 2011-06-16
EP2478574A2 (fr) 2012-07-25
CN102484193A (zh) 2012-05-30
JP2013505571A (ja) 2013-02-14
WO2011033406A2 (fr) 2011-03-24
KR20120082898A (ko) 2012-07-24

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