WO2011031092A2 - Composition de solution de nettoyage pour substrat pour la préparation d'écran plat - Google Patents

Composition de solution de nettoyage pour substrat pour la préparation d'écran plat Download PDF

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Publication number
WO2011031092A2
WO2011031092A2 PCT/KR2010/006181 KR2010006181W WO2011031092A2 WO 2011031092 A2 WO2011031092 A2 WO 2011031092A2 KR 2010006181 W KR2010006181 W KR 2010006181W WO 2011031092 A2 WO2011031092 A2 WO 2011031092A2
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WO
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Prior art keywords
acid
cleaning liquid
liquid composition
aqueous cleaning
flat panel
Prior art date
Application number
PCT/KR2010/006181
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English (en)
Korean (ko)
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WO2011031092A3 (fr
Inventor
윤효중
방순홍
김성식
김병묵
Original Assignee
동우 화인켐 주식회사
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Priority claimed from KR1020100088419A external-priority patent/KR20110028239A/ko
Application filed by 동우 화인켐 주식회사 filed Critical 동우 화인켐 주식회사
Priority to CN201080040842.XA priority Critical patent/CN102575201B/zh
Publication of WO2011031092A2 publication Critical patent/WO2011031092A2/fr
Publication of WO2011031092A3 publication Critical patent/WO2011031092A3/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds

Definitions

  • a flat panel display device such as a liquid crystal display device, a plasma display device, an organic light emitting display device, a flexible display device, etc.
  • an aqueous cleaning liquid composition for cleaning a substrate surface used in a flat panel display device and the same The cleaning method of the used board
  • FPD which is represented as a liquid crystal display device
  • FPD is manufactured through processes such as film formation, exposure, and etching.
  • processes such as film formation, exposure, and etching.
  • very small particles having a size of 1 or less such as various organic or inorganic materials adhere to the substrate surface, causing contamination. do. Since contamination by these particles lowers the yield of the device, it is necessary to reduce as much as possible before entering the post-process.
  • Japanese Unexamined Patent Application Publication No. 2000-232063 discloses a phosphoric acid and an ammonium phosphate cleaning liquid
  • Japanese Unexamined Patent Application Publication Nos. 9-279189, 2001-26890 and the like also disclose aqueous solutions.
  • these techniques all relate to cleaning agents for semiconductor devices, and have a disadvantage in that both the removal of contaminants and the corrosiveness to aluminum wiring are insufficient.
  • Japanese Unexamined Patent Application Publication No. Hei 10-55993 discloses a release agent composition composed of a quaternary ammonium salt or organic ammonium carbonate and ammonium fluoride, a water-soluble organic solvent, an inorganic acid or an organic acid as a cleaning agent that does not corrode a metal film.
  • this composition is a composition for removing the remaining precipitate after ashing the resist of the semiconductor element, and ammonium fluoride among the components contained in the composition is not suitable as a cleaning liquid for the substrate because of its high corrosiveness to aluminum wiring.
  • the present invention provides an aqueous cleaning liquid composition that can effectively remove contamination caused by organic matter or particles generated on a substrate during the manufacturing process of a flat panel display device (FPD) without corrosion of metal wirings forming gate electrodes, source / drain electrodes, and the like. It aims to provide.
  • FPD flat panel display device
  • the present invention is a.
  • an aqueous cleaning liquid composition for manufacturing a flat panel display device comprising boric acid derivatives, organophosphoric acid and one or more compounds selected from salts thereof and water.
  • the aqueous cleaning liquid composition may include 0.01 to 20% by weight of the boric acid derivative, 0.01 to 20% by weight of one or more compounds selected from the organophosphoric acid and salts thereof, and a balance of water based on the total weight of the composition.
  • aqueous cleaning liquid composition may further include one or more selected from the group consisting of an organic alkali compound, a glycol ether compound and an alkanolamine compound.
  • a method for cleaning a substrate for manufacturing a flat panel display device wherein the substrate is cleaned by maintaining the aqueous cleaning liquid composition of the present invention at a temperature of 20 to 80 ° C.
  • a method of manufacturing a flat panel display device comprising the step of cleaning the substrate by maintaining the aqueous cleaning liquid composition of the present invention at a temperature of 20 to 80 °C.
  • the water-based cleaning liquid composition of the present invention is excellent in removing the contamination by organic matter and particles generated on the substrate during the manufacturing process of the flat panel display device (FPD), as well as aluminum, aluminum alloy, copper, copper alloy, etc.
  • the corrosion protection effect of the formed metal wiring is very good.
  • it contains a large amount of deionized water is easy to handle and environmentally beneficial.
  • the present invention relates to an aqueous cleaning liquid composition for manufacturing a flat panel display device comprising at least one compound selected from boric acid derivatives, organophosphoric acid and salts thereof, and water.
  • the aqueous cleaning liquid composition may include 0.01 to 20% by weight of the boric acid derivative, 0.01 to 20% by weight of one or more compounds selected from the organophosphoric acid and salts thereof, and a balance of water, based on the total weight of the composition.
  • Boric acid derivatives contained in the cleaning liquid composition of the present invention not only dissolve well in water but also dissolve in water to emulsify organic contaminants so as not to be reattached, and have an excellent anticorrosive effect on the metal of the flat panel display substrate.
  • the boric acid derivative is preferably included in an amount of 0.01 to 20% by weight, more preferably 0.1 to 10% by weight based on the total weight of the composition.
  • the boric acid derivative is contained in less than 0.01% by weight, the anticorrosive effect and the emulsifying effect on the contaminants are lowered, and when the boric acid derivative is more than 20% by weight, the viscosity increases, so that the rinse effect is lowered.
  • the boric acid derivatives are not particularly limited, and examples thereof include boric acid, salts thereof, oxides thereof, and dehydrates thereof, and specific examples thereof include ammonium tetraphenylborate ((C 6 H 5 ) 4 BNH 4 ) and phenylbore.
  • Alkyl substituted borate salts such as acids (C 6 H 5 B (OH) 2 ) and trimethylboroxine (C 3 H 9 B 3 O 3 ); Ammonium pentaborate octahydrate ((NH 4 ) 2 B 10 O 16 .8H 2 O), ammonium tetraborate tetrahydrate ((NH 4 ) 2 B 4 O 7 4H 2 O), potassium tetraborate tetrahydrate (K 2 Polyborates such as B 4 O 7 ⁇ 4H 2 O), sodium octaborate tetrahydrate (Na 2 B 8 O 13 ⁇ 4H 2 O); Fluoride substituted borate salts such as fluoroboric acid (HBF 4 ), ammonium tetrafluoroborate (NH 4 BF 4 ); Esters of boric acid such as trimethylborate ((CH 3 O) 3 B) and triethylborate ((C 2 H 5 O) 3 B); Oxidation and dehydration of boric acid,
  • boric acid derivatives examples include boric acid; Ammonium pentaborate octahydrate ((NH 4 ) 2 B 10 O 16 .8H 2 O), ammonium tetraborate tetrahydrate ((NH 4 ) 2 B 4 O 7 4H 2 O), potassium tetraborate tetrahydrate (K 2 Polyborates such as B 4 O 7 ⁇ 4H 2 O), sodium octaborate tetrahydrate (Na 2 B 8 O 13 ⁇ 4H 2 O) may be more preferably used.
  • Ammonium pentaborate octahydrate ((NH 4 ) 2 B 10 O 16 .8H 2 O)
  • ammonium tetraborate tetrahydrate (NH 4 ) 2 B 4 O 7 4H 2 O)
  • potassium tetraborate tetrahydrate K 2 Polyborates such as B 4 O 7 ⁇ 4H 2 O
  • sodium octaborate tetrahydrate Na 2 B 8 O 13 ⁇
  • the at least one compound selected from the organophosphoric acid and salts thereof included in the cleaning liquid composition of the present invention not only shows an excellent effect in preventing corrosion to aluminum or an aluminum alloy, but also is excellent in removing organic contaminants or particles on a glass substrate. Effect.
  • by controlling the pH of the entire cleaning agent plays an important role in both metal corrosion protection and cleaning effect.
  • the at least one compound selected from the organophosphoric acid and salts thereof may have a better effect on the removal of contaminants when used together with the organic alkali compound.
  • the at least one compound selected from the organophosphoric acid and salts thereof is preferably included in an amount of 0.01 to 20% by weight, more preferably 0.1 to 5% by weight based on the total weight of the composition.
  • the corrosion protection of the cleaning liquid composition against the metal is reduced, and the effect of removing organic contaminants or particles is also less than 20% by weight. If included, the pH of the cleaning liquid composition is reduced, thereby lowering the cleaning power for organic and inorganic contaminants, causing cost increase and environmental problems.
  • the organophosphoric acid and salts thereof include aminotri (methylenephosphonic acid), ethylidenediphosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, 1-hydroxypropylidene-1,1-dipo Sonic acid, 1-hydroxybutylidene-1,1-diphosphonic acid, ethylaminobis (methylenephosphonic acid), 1,2-propylenediaminetetra (methylenephosphonic acid), dodecylaminobis (methylenephosphonic acid) , Nitrotris (methylenephosphonic acid), ethylenediaminebis (methylenephosphonic acid), ethylenediaminetetra (methylenephosphonic acid), hexenediaminetetra (methylenephosphonic acid), diethylenetriaminepenta (methylenephosphonic acid), cyclohexanediamine Tetra (methylenephosphonic acid), hydroxyphosphonoacetic acid, 2-phosphinic acid butane-1,2,4-tricarboxylic acid, sodium salts or potassium salts
  • (1-hydroxyethylidene) -1,1-diphosphonic acid hydroxyphosphonoacetic acid, aminotrimethylene phosphonic acid, 2-phosphinic acid butane-1,2,4-tricarboxylic acid, these Sodium salts or potassium salts may be preferably used.
  • the water contained in the cleaning liquid composition of the present invention is preferably deionized water, and it is preferable that the sum of the components of the aqueous cleaning liquid composition for a flat panel display device of the present invention is 100% by weight.
  • the substrate cleaning liquid composition for manufacturing a flat panel display device of the present invention may further include one or more selected from the group consisting of an organic alkali compound, a glycol ether compound and an alkanolamine salt compound in addition to the above components.
  • the organic alkali compound exerts sufficient cleaning power against fine particles, organic contaminants and inorganic contaminants, and serves to prevent corrosion of aluminum or aluminum alloy wires.
  • the organic alkali compound is preferably contained in 0.05 to 10% by weight, more preferably in 0.1 to 5% by weight relative to the total weight of the composition. In the case where the organic alkali compound is included in the above-mentioned range, sufficient cleaning effect can be obtained for fine particles, organic contaminants and inorganic contaminants, and the pH can be so high that the corrosion of aluminum or aluminum alloy wiring can be avoided. have.
  • the organic alkali compound is a quaternary ammonium salt compound, such as ammonium hydroxide, tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH), tetrabutylammonium hydroxide Seeds (TBAH) and the like and primary amines such as organic base compounds such as methylamine, ethylamine, isopropylamine and monoisopropylamine; Secondary amines such as diethylamine, diisopropylamine and dibutylamine; Tertiary amines such as trimethylamine, triethylamine, triisopropylamine and tributylamine; Choline, monoethanolamine, diethanol amine, 2-aminoethanol, 2- (ethyl amino) ethanol, 2- (methyl amino) ethanol, N-methyl diethanolamine, dimethylaminoethanol, diethyla
  • organic alkali compounds in particular, ammonium hydroxide, tetramethylammonium hydroxide and monoethanolamine can be preferably used.
  • the glycol ether compound serves as a solvent for dissolving organic contaminants.
  • the surface tension of the cleaning liquid is lowered to increase the wettability to the glass substrate, thereby improving the cleaning power of the cleaning liquid composition.
  • the glycol ether compound is included in an amount of 0.05 to 40% by weight, and more preferably 0.5 to 20% by weight, based on the total weight of the composition.
  • the content of the glycol ether compound is included in the above-described range, it is possible to improve the dissolving power of the cleaning liquid composition to organic contaminants, and the effect by the increase in wettability can be sufficiently obtained.
  • the glycol ether compound may be ethylene glycol monobutyl ether (BG), diethylene glycol monomethyl ether (MDG), diethylene glycol monoethyl ether (carbitol), diethylene glycol monobutyl ether (BDG), dipropylene glycol monomethyl Ether (DPM), dipropylene glycol monoethyl ether (MFDG), triethylene glycol monobutyl ether (BTG), triethylene glycol monoethyl ether (MTG), propylene glycol monomethyl ether (MFG), and the like.
  • BG ethylene glycol monobutyl ether
  • MDG diethylene glycol monomethyl ether
  • BDG diethylene glycol monoethyl ether
  • DPM dipropylene glycol monoethyl ether
  • MFDG dipropylene glycol monoethyl ether
  • BGG triethylene glycol monobutyl ether
  • MMG propylene glycol monomethyl ether
  • the alkanolamine salt compound prevents corrosion of the metal and overetching of the oxide film during the cleaning process of the substrate having the metal pattern and the oxide film, and serves to suppress the pH change of the cleaning solution.
  • the temperature of the salt formation reaction for obtaining the alkanolamine salt compound is preferably kept as low as possible, preferably at 90 ° C. or lower.
  • the alkyl portion of the alkanolamine salt compound is usually selected from alkanolamines which are lower alkyl, ie C1 to C5 alkyl. Since at least one alkanol group bonded to the amine group may be present, an alkanolamine salt compound in which another substituent is present in the amine group, such as dimethyl methanolamine salt, may also be used.
  • alkanolamine salt compound examples include alkanolamine salts such as monoethanolamine salt, diethanolamine salt, triethanolamine salt, monoisopropanolamine salt, diisopropanolamine salt and triisopropanolamine salt.
  • a commercially available product can be used as the alkanolamine salt compound.
  • AB RUST CM product of LABEMA Co.
  • AB RUST A4 product of LABEMA Co.
  • EMADOX-NA product of LABEMA Co.
  • EMADOX-NB product of LABEMA Co.
  • EMADOX-NCAL LABEMA Co. Products
  • EMADOX-102 product of LABEMA Co.
  • EMADOX-103 product of LABEMA Co.
  • EMADOX-D520 product of LABEMA Co.
  • AB Rust at product of LABEMA Co.
  • the alkanolamine salt compound may be included in an amount of 0.001 to 1.0% by weight, more preferably 0.01 to 0.5% by weight based on the total weight of the composition.
  • a desirable corrosion inhibitory effect is obtained by the coating effect of protecting the metal surface.
  • the cleaning liquid composition of the present invention may further include a water-soluble nonionic surfactant in addition to the above components.
  • the nonionic surfactants include polyoxyethylene alkyl ether type, polyoxyethylene alkylphenyl ether type, polyoxyethylene polyoxypropylene alkyl ether type, polyoxyethylene polyoxybutylene alkyl ether type, polyoxyethylene alkylamino ether type , Polyoxyethylene alkylamide ether type, polyethylene glycol fatty acid ester type, sorbitan fatty acid ester type, glycerin fatty acid ester type, alkrolamide type and glycerin ester type and the like, and these may be used alone or in combination of two or more. Can be used together.
  • the nonionic surfactant has, in particular, an oxyethylene group (EO group) as a hydrophilic group in the structure of the surfactant molecule, an oxypropylene group (PO group) and / or an oxy butylene group (BO group) as a hydrophobic group, and a polyoxy It is more preferable that it is an ethylene polyoxybutylene alkyl ether type copolymer.
  • EO group oxyethylene group
  • PO group oxypropylene group
  • BO group oxy butylene group
  • the EO group is represented by -CH 2 -CH 2 -O-
  • the oxypropylene group is -CH (CH 3 ) -CH 2 -O- or -CH 2 -CH (CH 3 ) -O-
  • the oxy butylene group -CH 2 -CH 2 -CH 2 -CH 2 -O-, -CH (CH 3 ) -CH 2 -CH 2 -O-, -CH 2 -CH (CH 3 ) -CH 2 -O- or -CH 2 -CH 2 -CH (CH 3 ) 2 -O-.
  • the copolymerization portion of the EO group, the PO group, and the BO group may be a block copolymer, a random copolymer, or a random polypolymer having block properties.
  • the copolymer molecule may be a copolymer of EO group and PO group, a copolymer of EO group and BO group, or a copolymer of EO group and PO group and BO group.
  • the ratio of the EO group of the hydrophilic group and the PO group or the BO group of the hydrophobic group is X / (X + Y) when the total mole number of the EO group is Y, and the total mole number of the PO group or BO group is Y.
  • the terminal of the said surfactant may be only hydrogen or a hydroxyl group, and may be an alkyl group or an alkenyl group. Moreover, you may make it the structure which added ethylene diamine and glycerol.
  • nonionic surfactants satisfying the above conditions include polyoxyethylene / polyoxypropylene condensates, polyoxyethylene / polyoxybutylene condensates, polyoxyethylene / polyoxypropylene dicanyl ether condensates, polyoxy Ethylene / polyoxypropylene decanyl ether condensate, polyoxyethylene / polyoxypropylene undecanyl ether condensate, polyoxyethylene / polyoxypropylene dodecanyl ether condensate, polyoxyethylene / polyoxypropylene tetradecanyl ether condensate , Polyoxyethylene / polyoxybutylene decanyl ether condensate, polyoxyethylene / polyoxybutylene undecanyl ether condensate, polyoxyethylene / polyoxybutylene dodecanyl ether condensate, polyoxyethylene / polyoxybutyl Ethylene tetradecanyl ether condensate, polyoxyethyl
  • the nonionic surfactants include polyoxyethylene / polyoxypropylene condensates, polyoxyethylene / polyoxybutylene condensates, glycerin added polyoxyethylene / polyoxypropylene condensates and ethylenediamine added polyoxyethylene polyoxypropylene condensates This is preferable, and polyoxyethylene / polyoxypropylene condensate or ethylenediamine addition type polyoxyethylene / polyoxypropylene condensate is more preferable.
  • the surfactant may be included in an amount of 0.001 to 1.0% by weight based on the total weight of the composition.
  • the temperature of the cleaning liquid composition in which the substrate cleaning liquid for manufacturing a flat panel display device of the present invention can exhibit the most excellent cleaning effect is 20 to 80 ° C, preferably 20 to 50 ° C.
  • the present invention provides a method for cleaning a flat panel display device, wherein the flat panel display device is cleaned by maintaining the substrate cleaning liquid composition for manufacturing the flat panel display device at a temperature of 20 to 80 ° C.
  • the flat panel display means a liquid crystal display, a plasma display, an organic light emitting display, a flexible display, or the like.
  • aqueous cleaning composition by mixing the organic alkali compound, polar protic organic solvent, corrosion inhibitor, multifunctional additive (alkanolamine salt), boric acid derivative, and water-soluble surfactant shown in Table 1 to the content shown in Table 1 It was.
  • A-2 tetraethylammonium hydroxide
  • A-3 monoethanol amine
  • B-2 diethylene glycol monobutyl ether (BDG)
  • E-2 ammonium tetraborate tetrahydrate ((NH 4 ) 2 B 4 O 7 4H 2 O)
  • a glass substrate having an aluminum thickness of 2000 kPa and a copper thickness of 2500 kPa was deposited on the cleaning liquid compositions of Examples 1 to 17 and Comparative Examples 1 to 3 for 30 minutes.
  • the temperature of the cleaning liquid composition was 40 °C
  • the thickness of the metal film was measured before and after deposition to calculate the dissolution rate of the metal film from the thickness change of the metal film. The evaluation results are shown in Table 2 below.
  • the cleaning liquid compositions of Examples 1 to 17 of the present invention includes a boric acid component and at least one compound selected from organophosphoric acid and salts thereof, so that the anticorrosive effect as well as It also showed an excellent effect on the removal of inorganic contaminants.
  • the cleaning liquid composition of Comparative Example 1 which does not contain boric acid derivatives and organophosphoric acid and salts thereof, was found to have a great decrease in contact angle, resulting in excellent cleaning power. It is judged that the surface roughness of the substrate is changed by the corrosion of the metal rather than the result of the removal, and the anticorrosive effect on the metal wiring is very poor.
  • the cleaning liquid composition of Comparative Example 2 containing no one or more compounds selected from boric acid derivatives and organophosphoric acid and salts thereof was insufficient in cleaning power and poor in corrosion protection effect.
  • the cleaning solution composition of Comparative Example 3, which does not contain a boric acid derivative was found to have insufficient cleaning power, and was good in corrosion resistance for aluminum but poor in corrosion resistance for copper. Therefore, it can be seen that at least one compound selected from boric acid derivatives and organophosphoric acid and salts thereof plays a very important role in terms of corrosion resistance to metal wiring and cleaning ability against organic and inorganic contaminants.
  • Glass substrates for flat panel displays have an appropriate contact angle for surface roughness and post-processing for film deposition.
  • organic contaminants when organic contaminants are present on the glass substrate, they become hydrophobic, like fingerprints or oil films. Therefore, when the contact angle of the contaminated glass substrate is measured, the wettability of the hydrophobic surface is inferior, thereby increasing the contact angle due to the surface tension of water.
  • the hydrophobic contaminants are removed from the glass substrate through cleaning, only the characteristics of the glass substrate itself are obtained, and the contact angle is reduced to an initial clean state.
  • the surface of the substrate is made hydrophilic through surface modification or the like, the contact angle is further reduced than the initial stage.
  • the cleaning liquid compositions of the present invention containing a boric acid component and an organophosphate compound have excellent corrosion protection against aluminum and copper.

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  • General Physics & Mathematics (AREA)
  • Detergent Compositions (AREA)

Abstract

La présente invention concerne une composition de solution aqueuse de nettoyage comprenant un ou plusieurs types de composés choisis parmi un dérivé d'acide borique, un acide phosphorique organique et leurs sels, utilisée pour nettoyer la surface d'un substrat pendant un procédé de fabrication d'un écran plat. La composition de solution aqueuse de nettoyage de la présente invention est dotée d'une excellente capacité d'élimination de la contamination due aux matières ou particules organiques produite sur un substrat pendant un procédé de fabrication d'un écran plat, et est dotée d'une excellente capacité de prévention de la corrosion d'une interconnexion métallique formée sur un substrat. En outre, la composition de solution aqueuse de nettoyage de la présente invention contient une grande quantité d'eau désionisée et peut donc être facilement manipulée et est avantageuse sur le plan environnemental.
PCT/KR2010/006181 2009-09-11 2010-09-10 Composition de solution de nettoyage pour substrat pour la préparation d'écran plat WO2011031092A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201080040842.XA CN102575201B (zh) 2009-09-11 2010-09-10 用于制造平面显示器的基板的清洗液组合物

Applications Claiming Priority (4)

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KR10-2009-0086045 2009-09-11
KR20090086045 2009-09-11
KR1020100088419A KR20110028239A (ko) 2009-09-11 2010-09-09 평판표시장치 제조용 기판의 세정액 조성물
KR10-2010-0088419 2010-09-09

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WO2011031092A2 true WO2011031092A2 (fr) 2011-03-17
WO2011031092A3 WO2011031092A3 (fr) 2011-08-04

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107346095A (zh) * 2017-09-14 2017-11-14 江阴江化微电子材料股份有限公司 一种半导体制程正性光刻胶去胶液及应用
KR20180082967A (ko) * 2017-01-11 2018-07-19 주식회사 다이셀 레지스트 제거용 조성물
KR20180097900A (ko) * 2017-02-24 2018-09-03 동우 화인켐 주식회사 레지스트 박리액 조성물

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100437922C (zh) * 2002-11-08 2008-11-26 和光纯药工业株式会社 洗涤液及使用该洗涤液的洗涤方法
KR100664403B1 (ko) * 2005-01-31 2007-01-03 테크노세미켐 주식회사 에칭 잔류물 세정용 조성물 및 이를 이용한 세정방법
KR20080111268A (ko) * 2007-06-18 2008-12-23 동우 화인켐 주식회사 세정액 조성물 및 이를 이용한 세정방법
WO2009078123A1 (fr) * 2007-12-17 2009-06-25 Sanyo Chemical Industries, Ltd. Agent de nettoyage et procédé de nettoyage pour matériau électronique

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180082967A (ko) * 2017-01-11 2018-07-19 주식회사 다이셀 레지스트 제거용 조성물
KR102483186B1 (ko) 2017-01-11 2023-01-02 주식회사 다이셀 레지스트 제거용 조성물
KR20180097900A (ko) * 2017-02-24 2018-09-03 동우 화인켐 주식회사 레지스트 박리액 조성물
KR102675757B1 (ko) 2017-02-24 2024-06-18 동우 화인켐 주식회사 레지스트 박리액 조성물
CN107346095A (zh) * 2017-09-14 2017-11-14 江阴江化微电子材料股份有限公司 一种半导体制程正性光刻胶去胶液及应用

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