WO2011025233A2 - Procédé de production d'un substrat à del et substrat à del - Google Patents

Procédé de production d'un substrat à del et substrat à del Download PDF

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Publication number
WO2011025233A2
WO2011025233A2 PCT/KR2010/005656 KR2010005656W WO2011025233A2 WO 2011025233 A2 WO2011025233 A2 WO 2011025233A2 KR 2010005656 W KR2010005656 W KR 2010005656W WO 2011025233 A2 WO2011025233 A2 WO 2011025233A2
Authority
WO
WIPO (PCT)
Prior art keywords
led
substrate body
substrate
led mounting
mounting grooves
Prior art date
Application number
PCT/KR2010/005656
Other languages
English (en)
Korean (ko)
Other versions
WO2011025233A3 (fr
Inventor
윤인숙
성정화
Original Assignee
Yoon In Suk
Sung Jung Hwa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yoon In Suk, Sung Jung Hwa filed Critical Yoon In Suk
Publication of WO2011025233A2 publication Critical patent/WO2011025233A2/fr
Publication of WO2011025233A3 publication Critical patent/WO2011025233A3/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present invention relates to an LED substrate manufacturing method and an LED substrate, and more particularly, to an LED substrate manufacturing method and an LED substrate that can be mounted by mounting a plurality of LEDs in the interior of the substrate through a ball grid array or wire bonding. .
  • the LED lighting device refers to a block unit of the smallest unit used for LED lighting, and in recent years, the LED lighting device is used for lighting, large display billboards, and decoration using luminance.
  • Korean Patent No. 10-0550400 as shown in FIG. 1, a plurality of LED block units 1A are configured to be connected to a power cable 5 so that welding is excluded and an array is attached using adhesive paper. Since the light emitting display is easily formed to improve the work productivity, the heat dissipation problem from the LED 2 is not properly solved, thereby reducing the LED performance and shortening the component life. ) Has a problem that causes short circuits and malfunctions if rainwater seeps into it.
  • an object of the present invention is an LED substrate manufacturing method and LED that can be mounted by mounting the LEDs used as a light source in the luminaire, such as LED bulbs and LED fluorescent lamps in the interior of the substrate In providing a substrate.
  • Another object of the present invention is to provide an LED substrate manufacturing method and an LED substrate that can reduce the size of the LED bulb and the LED fluorescent lamp by reducing the thickness of the entire substrate on which the LEDs are mounted below a certain level.
  • the present invention provides an LED substrate manufacturing method for solving the above problems.
  • the LED substrate manufacturing method has a disk-shaped substrate body, and has a predetermined depth by physically contacting at a plurality of positions of the first surface of the substrate body using a router (router), both side walls of the substrate body Forming a plurality of LED mounting grooves to form a continuous surface extending toward one surface, forming electrodes on the bottom surface of the LED mounting grooves to be exposed to the LED mounting groove, inserting the LEDs into the LED mounting grooves Filling the LED mounting groove with a filler that electrically connects with the electrodes and transmits light emitted from the LEDs to the outside, and from the center of the substrate body to a second surface opposite to the first surface of the substrate body.
  • a router router
  • Both sidewalls of each of the LED mounting grooves may be gradually narrowed along the second surface from the first surface of the substrate body, and the bottom surface connecting the lower ends of the both sidewalls to each other may be formed in the first body of the substrate body. Form parallel to the surface.
  • the substrate body is formed of any one of a metal, a clad metal, and FR4.
  • the filler is used by mixing a predetermined amount of silicon and a phosphor.
  • the LEDs are connected to the electrodes through any one of a ball grid array and wire bonding.
  • the plurality of annular protrusions are made of the same material as that of the substrate body.
  • the present invention provides an LED substrate for solving the above problems.
  • the LED substrate is dug to a predetermined depth from a first surface, and a plurality of LED mounting grooves are formed to form a continuous surface with both side walls extending toward the first surface, and the LED mounting grooves are formed on the bottom surface of the LED mounting grooves.
  • a disk-shaped substrate body in which electrodes exposed to the electrodes are formed, the LEDs inserted into the LED mounting grooves and electrically connected to the electrodes and mounted to the LEDs, and transmit light emitted from the LEDs to the outside.
  • any one of the plurality of annular protrusions includes any one of the plurality of annular protrusions at a plurality of positions along any one of the plurality of annular protrusions.
  • a plurality of through holes penetrating the top and bottom of the substrate body in the vicinity of the projection of is formed.
  • Both sidewalls of each of the LED mounting grooves are formed to be gradually narrowed along the second surface from the first surface of the substrate body, and the bottom surface connecting the lower ends of the both sidewalls to each other is the first surface of the substrate body. It is formed to be parallel to the plane.
  • the substrate body is made of any one of metal, clad metal and FR4.
  • the filler is formed by mixing silicon and phosphor in a predetermined amount.
  • the LED is connected to the electrodes through one of a ball grid array and wire bonding.
  • the present invention has the effect that the LEDs used as light sources in the luminaires such as the LED bulb and the LED fluorescent lamp can be mounted in the interior of the substrate.
  • the present invention has the effect of reducing the size of the LED bulb and the LED fluorescent lamp by reducing the thickness of the entire substrate on which the LED is mounted below a certain level.
  • the present invention has an effect of preventing the LEDs themselves from being broken even when an impact is applied from the outside by incorporating the LEDs inside the substrate.
  • the present invention has the effect of increasing the amount of light emitted from the LEDs and the contamination of the LEDs from the outside by filling the space in which the LEDs are built using a filler mixed with silicon and phosphor.
  • FIG. 1 is an exploded perspective view showing an LED bulb to which the LED substrate of the present invention is adopted.
  • FIG. 2A through 2E are partial cross-sectional views illustrating the LED substrate of FIG. 1 and are cross-sectional views illustrating a mounting process of the LED.
  • FIG 3 is a partial cross-sectional view showing that the LED according to the present invention is mounted in the LED mounting groove by wire bonding.
  • FIG. 1 is an exploded perspective view showing an LED bulb to which the LED substrate of the present invention is adopted.
  • 2A through 2E are partial cross-sectional views illustrating the LED substrate of FIG. 1 and are cross-sectional views illustrating a mounting process of the LED.
  • 3 is a partial cross-sectional view showing that the LED according to the present invention is mounted in the LED mounting groove by wire bonding.
  • the substrate body 410 is prepared.
  • the substrate body 410 may be made of any one of metal, clad metal or FR4.
  • the substrate body 410 is preferably made of a clad metal.
  • the clad metal refers to a material in which two or more layers of metals or nonmetals are bonded together, that is, a heterojunction metal. This has the advantage that it can be adapted to the special needs by supplementing various properties which cannot be obtained with a single metal.
  • an area in which the LEDs 40 may be positioned on the first surface 423 of the substrate body 410 is set at a plurality of positions.
  • the LED mounting grooves 420 are formed to a predetermined depth by using a router at the set plurality of positions.
  • the LED mounting grooves 420 may be grooves that are physically dug by the router.
  • both sidewalls 421 of each of the LED mounting grooves 420 may be opposite sides of the first surface 423 of the substrate body 410 from the first surface 423 of the substrate body 410. It may be formed to gradually narrow along the second surface (424).
  • the first surface 423 and the second surface 424 of the substrate body 410 shown in FIG. 1 are the first surface 423 of the substrate body 410 shown in FIGS. 2A to 2E and 3. And it can be seen that the second surface 424 is upside down.
  • the bottom surface 422 connecting the lower ends of the sidewalls 421 to each other is formed to be parallel to the first surface 423 of the substrate body 410.
  • a pair of electrodes 30 are formed on the bottom surfaces of the LED mounting grooves 420.
  • the electrode 30 may be previously formed in the substrate body 410.
  • the LEDs 40 are inserted into and mounted in the LED mounting grooves 420.
  • the LEDs 40 may be electrically connected to the electrode 30.
  • the LEDs 40 may be mounted on the electrodes 30 using the ball grid array 42.
  • the LEDs 40 may be mounted on the electrodes 30 using wire bonding 43.
  • the LED mounting grooves 420 mounted with the LEDs 40 are filled using the filler 430.
  • the filler 430 is manufactured by mixing silicon and phosphor at a predetermined ratio, and fills the LED mounting grooves 420 by using the prepared filler 430.
  • the upper surface of the filler 430 is formed to be substantially colinear with the first surface 423 of the substrate body 410.
  • a plurality of LEDs 40 may be inserted and mounted in the substrate body 410 through the above method.
  • the material of the substrate body 410 and the radially formed from the center of the substrate body 410 on the second surface 424 of the substrate body 410 A plurality of annular protrusions 411 made of the same material may be further formed.
  • the LED substrate may be a metal core substrate used in the LED bulb.
  • the LED substrate 400 includes a substrate body 410 and a plurality of LED mounting grooves 420 formed on the first surface 423 of the substrate body 410. It consists of the LEDs 40 mounted in the LED mounting grooves 420, and the filler 430 is filled in the LED mounting grooves (420).
  • each of the LED mounting grooves 420 is formed by digging to a predetermined depth at a plurality of positions of the substrate body 410, the LED 40 is seated and electrically connects the LEDs 40 to the bottom surface Has electrodes 30.
  • Both side walls 421 of each of the LED mounting grooves 420 are formed to be gradually narrowed along the second surface 424 on the first surface 423 of the substrate body 410, the both side walls 421 A bottom surface 422 connecting the lower ends of the substrates to each other is formed to be parallel to the first surface 423 of the substrate body 410.
  • the substrate body 410 may be made of any one of metal, clad metal, and FR4.
  • the filler 430 may transmit the light emitted from the LEDs 40 to the outside and fill the LED mounting groove 420.
  • the filler 430 is preferably made of a predetermined amount of silicon and the phosphor is mixed with each other.
  • the LED 40 may be connected to the electrodes 30 through any one of a ball grid array 42 and a wire bonding 43.
  • the second surface 424 of the substrate body 410 has a plurality of annular protrusions 411 made of the same material as the material of the substrate body 410 formed radially from the center of the substrate body 410. ) May be further formed. This serves to dissipate heat generated by the LEDs 40 mounted on the substrate body 410 to the outside easily.
  • reference numeral 100 denotes a socket fitting body
  • 500 denotes a diffusion cap that diffuses light emitted from the LEDs installed on the metal core substrate to the outside
  • '411a' denotes a through hole.
  • the LED substrate of the present invention is adopted as an LED bulb has been described as a representative example.
  • the LED substrate of the present invention can be easily adopted in an illumination luminaire such as an LED fluorescent lamp using the LED light source of the present invention.
  • the present invention by inserting the LEDs into the inside of the substrate, it is possible to reduce the size of the LED bulb and the LED fluorescent lamp by reducing the thickness of the entire substrate to be mounted below a certain level.
  • the LEDs are incorporated into the substrate, it is possible to prevent the LEDs from being damaged even when an external impact is applied, and by filling the space in which the LEDs are embedded by using a filler mixed with silicon and a phosphor, In addition to increasing the amount of light emitted from the LEDs and the contamination of the LEDs from the LEDs, the rainwater may not be directly contacted with the LEDs when rainwater is infiltrated from the outside.
  • the present invention can be used in the field of manufacturing LED substrates.

Abstract

La présente invention concerne un procédé de production d'un substrat à DEL. Le procédé de production d'un substrat à DEL comprend les étapes qui consistent à: préparer un corps formant substrat; former une pluralité d'évidements d'installation de DEL à une profondeur prédéfinie dans une pluralité d'emplacements sur le corps formant substrat au moyen d'un évideur; former des électrodes sur les surfaces inférieures des évidements d'installation des DEL; le montage par insertion dans les évidements d'installation de DEL; et l'envoi à l'extérieur de la lumière diffusée par les DEL ainsi que le remplissage des évidements d'installation des DEL avec une matière de charge. En outre, l'invention concerne également un substrat à DEL produit au moyen du procédé de production. Par conséquent, cette invention permet d'installer une pluralité de DEL sur la partie interne du substrat au moyen d'un boîtier matriciel à billes ou d'une connexion par fil soudé.
PCT/KR2010/005656 2009-08-27 2010-08-24 Procédé de production d'un substrat à del et substrat à del WO2011025233A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0080055 2009-08-27
KR1020090080055A KR100980576B1 (ko) 2009-08-27 2009-08-27 엘이디 기판 제조 방법 및 엘이디 기판

Publications (2)

Publication Number Publication Date
WO2011025233A2 true WO2011025233A2 (fr) 2011-03-03
WO2011025233A3 WO2011025233A3 (fr) 2011-04-28

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PCT/KR2010/005656 WO2011025233A2 (fr) 2009-08-27 2010-08-24 Procédé de production d'un substrat à del et substrat à del

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Country Link
KR (1) KR100980576B1 (fr)
WO (1) WO2011025233A2 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102330903A (zh) * 2011-09-08 2012-01-25 宁波福泰电器有限公司 Led灯
CN102588800A (zh) * 2012-03-13 2012-07-18 苏州东亚欣业节能照明有限公司 纳米复合塑料制成的led球泡灯

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039691A (ja) * 2002-06-28 2004-02-05 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置用の熱伝導配線基板およびそれを用いたｌｅｄ照明装置、並びにそれらの製造方法
JP2005251660A (ja) * 2004-03-08 2005-09-15 Toshiba Lighting & Technology Corp 光源および照明装置
KR20060104432A (ko) * 2005-03-30 2006-10-09 알티전자 주식회사 고휘도 박형 플래시 장치
JP2006351351A (ja) * 2005-06-16 2006-12-28 Nichicon Corp 光源装置
KR20080000726A (ko) * 2006-06-28 2008-01-03 서울반도체 주식회사 발광 모듈 및 이를 포함하는 발광 패키지
KR20090079155A (ko) * 2008-01-16 2009-07-21 (주)웨이브닉스이에스피 금속 기판을 이용한 광소자 패키지 플랫폼 및 그 제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004039691A (ja) * 2002-06-28 2004-02-05 Matsushita Electric Ind Co Ltd Ｌｅｄ照明装置用の熱伝導配線基板およびそれを用いたｌｅｄ照明装置、並びにそれらの製造方法
JP2005251660A (ja) * 2004-03-08 2005-09-15 Toshiba Lighting & Technology Corp 光源および照明装置
KR20060104432A (ko) * 2005-03-30 2006-10-09 알티전자 주식회사 고휘도 박형 플래시 장치
JP2006351351A (ja) * 2005-06-16 2006-12-28 Nichicon Corp 光源装置
KR20080000726A (ko) * 2006-06-28 2008-01-03 서울반도체 주식회사 발광 모듈 및 이를 포함하는 발광 패키지
KR20090079155A (ko) * 2008-01-16 2009-07-21 (주)웨이브닉스이에스피 금속 기판을 이용한 광소자 패키지 플랫폼 및 그 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102330903A (zh) * 2011-09-08 2012-01-25 宁波福泰电器有限公司 Led灯
CN102588800A (zh) * 2012-03-13 2012-07-18 苏州东亚欣业节能照明有限公司 纳米复合塑料制成的led球泡灯

Also Published As

Publication number Publication date
WO2011025233A3 (fr) 2011-04-28
KR100980576B1 (ko) 2010-09-06

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