WO2011017197A3 - Surveillance d'additifs de dépôt électrolytique - Google Patents

Surveillance d'additifs de dépôt électrolytique Download PDF

Info

Publication number
WO2011017197A3
WO2011017197A3 PCT/US2010/043764 US2010043764W WO2011017197A3 WO 2011017197 A3 WO2011017197 A3 WO 2011017197A3 US 2010043764 W US2010043764 W US 2010043764W WO 2011017197 A3 WO2011017197 A3 WO 2011017197A3
Authority
WO
WIPO (PCT)
Prior art keywords
solution
flow
preconditioning
target
flow channel
Prior art date
Application number
PCT/US2010/043764
Other languages
English (en)
Other versions
WO2011017197A2 (fr
Inventor
Mark J. Willey
Lian GUO
Steven T. Mayer
Original Assignee
Novellus Systems, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems, Inc. filed Critical Novellus Systems, Inc.
Priority to CN201080034658.4A priority Critical patent/CN102471919B/zh
Priority to KR1020127004328A priority patent/KR101778810B1/ko
Publication of WO2011017197A2 publication Critical patent/WO2011017197A2/fr
Publication of WO2011017197A3 publication Critical patent/WO2011017197A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/42—Measuring deposition or liberation of materials from an electrolyte; Coulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Molecular Biology (AREA)
  • Immunology (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

La présente invention concerne une électrode de travail dans le canal d'écoulement d'une cellule de détection électrolytique à flux continu qui est préconditionnée en faisant circuler une solution de dépôt électrolytique de préconditionnement avec une espèce de préconditionneur dans le canal d'écoulement tout en appliquant un potentiel négatif. Le flux de liquide dans le canal d'écoulement est rapidement détourné de la solution de préconditionnement vers une solution cible contenant un soluté cible organique à mesurer. La réponse transitoire du système résultant de l'exposition de l'électrode de travail au soluté cible organique est détectée par une mesure de la densité du courant pendant une période de temps transitoire initiale. Une concentration inconnue de soluté cible est déterminée par comparaison de la réponse transitoire avec une ou plusieurs réponse(s) transitoire(s) caractéristique(s) de concentrations connues. Un système de mesure préféré fonctionne pour détourner le flux d'une solution de préconditionnement vers une solution cible en 200 millisecondes environ ou moins.
PCT/US2010/043764 2009-08-03 2010-07-29 Surveillance d’additifs de dépôt électrolytique WO2011017197A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201080034658.4A CN102471919B (zh) 2009-08-03 2010-07-29 对电镀添加剂的监视
KR1020127004328A KR101778810B1 (ko) 2009-08-03 2010-07-29 전기도금 첨가제 모니터링 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/462,354 2009-08-03
US12/462,354 US8372258B2 (en) 2009-08-03 2009-08-03 Monitoring of electroplating additives

Publications (2)

Publication Number Publication Date
WO2011017197A2 WO2011017197A2 (fr) 2011-02-10
WO2011017197A3 true WO2011017197A3 (fr) 2011-06-16

Family

ID=43526385

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/043764 WO2011017197A2 (fr) 2009-08-03 2010-07-29 Surveillance d’additifs de dépôt électrolytique

Country Status (5)

Country Link
US (1) US8372258B2 (fr)
KR (1) KR101778810B1 (fr)
CN (1) CN102471919B (fr)
TW (1) TWI428594B (fr)
WO (1) WO2011017197A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104233451A (zh) * 2013-06-14 2014-12-24 朗姆研究公司 利用场与特征对比的tsv 浴评估

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201605902RA (en) 2011-12-12 2016-09-29 Novellus Systems Inc Monitoring leveler concentrations in electroplating solutions
WO2014066313A1 (fr) * 2012-10-23 2014-05-01 Moses Lake Industries, Inc. Améliorations dans une métrologie de bain galvanoplastique
CN103225101B (zh) * 2013-05-10 2015-05-13 华进半导体封装先导技术研发中心有限公司 一种整平剂抑制铜沉积所得效果的判定方法及其应用
US9469913B2 (en) 2013-12-05 2016-10-18 Applied Materials, Inc. Closed loop electrolyte analyzer
JP5826952B2 (ja) 2014-01-17 2015-12-02 株式会社荏原製作所 めっき方法およびめっき装置
WO2016070083A2 (fr) * 2014-10-31 2016-05-06 Zansors, Llc Système et procédés d'analyseur de potentiostat à canaux multiples
US9964518B2 (en) * 2014-11-21 2018-05-08 Hioki Denki Kabushiki Kaisha Electroplating solution analyzing apparatus
US9763325B2 (en) * 2015-04-07 2017-09-12 Oregon State University Microreactor-assisted printing of conductive traces with in-situ reactive inks
US10094038B2 (en) 2015-04-13 2018-10-09 Lam Research Corporation Monitoring electrolytes during electroplating
KR101729685B1 (ko) * 2015-05-21 2017-05-11 한국기계연구원 이온 농도 검출 방법 및 장치
US11761090B2 (en) 2015-12-03 2023-09-19 Atotech Deutschland GmbH & Co. KG Method for monitoring the total amount of sulphur containing compounds in a metal plating bath
US10329683B2 (en) 2016-11-03 2019-06-25 Lam Research Corporation Process for optimizing cobalt electrofill using sacrificial oxidants
US10590560B1 (en) 2018-08-22 2020-03-17 Eci Technology, Inc. Control of additive turnover in an electrodeposition solution
WO2021066412A1 (fr) * 2019-09-30 2021-04-08 한국재료연구원 Procédé de mesure de la concentration de produits de décomposition d'additif présents dans une solution de placage
KR102445228B1 (ko) * 2019-09-30 2022-09-21 한국재료연구원 도금액에 포함된 첨가제 분해 산물 농도 측정방법
KR102223889B1 (ko) * 2019-09-30 2021-03-09 한국재료연구원 도금액에 포함된 첨가제 분해 산물 농도 측정 장치
KR102239458B1 (ko) * 2020-09-04 2021-04-14 대원이노베이션 주식회사 전기동 도금액의 유기물 함량 측정방법
CN113913913A (zh) * 2021-10-29 2022-01-11 矽磐微电子(重庆)有限公司 电镀锡液中整平剂浓度的测试方法及电镀空白溶液
CN117574296B (zh) * 2023-11-23 2024-04-23 清远市信和实业有限公司 电镀槽液流分布的检测系统及其方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020060716A (ko) * 1999-10-20 2002-07-18 바누치 유진 지. 금속 도금욕 중의 첨가제 측정 방법 및 장치
JP2005504965A (ja) * 2001-10-01 2005-02-17 チャーリット，ジーン 酸性銅めっき浴中の３種類の有機添加剤を分析するための改良された方法
US20050183958A1 (en) * 2002-07-19 2005-08-25 Wikiel Kazimierz J. Method and apparatus for real time monitoring of industrial electrolytes
US7186326B2 (en) * 2004-05-27 2007-03-06 Eci Technology, Inc. Efficient analysis of organic additives in an acid copper plating bath

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA988879A (en) * 1972-11-06 1976-05-11 George Shaw Electrolytic lead refining
US4324621A (en) * 1979-12-26 1982-04-13 Cominco Ltd. Method and apparatus for controlling the quality of electrolytes
US6458262B1 (en) 2001-03-09 2002-10-01 Novellus Systems, Inc. Electroplating chemistry on-line monitoring and control system
US7232513B1 (en) * 2004-06-29 2007-06-19 Novellus Systems, Inc. Electroplating bath containing wetting agent for defect reduction
WO2006110437A1 (fr) * 2005-04-08 2006-10-19 The Trustees Of Columbia University In The City Of New York Systèmes et procédés de surveillance de bains de placage et d’attaque chimique
CN2828067Y (zh) * 2005-06-09 2006-10-18 福州大学 电镀液中添加剂浓度的实时监测装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020060716A (ko) * 1999-10-20 2002-07-18 바누치 유진 지. 금속 도금욕 중의 첨가제 측정 방법 및 장치
JP2005504965A (ja) * 2001-10-01 2005-02-17 チャーリット，ジーン 酸性銅めっき浴中の３種類の有機添加剤を分析するための改良された方法
US20050183958A1 (en) * 2002-07-19 2005-08-25 Wikiel Kazimierz J. Method and apparatus for real time monitoring of industrial electrolytes
US7186326B2 (en) * 2004-05-27 2007-03-06 Eci Technology, Inc. Efficient analysis of organic additives in an acid copper plating bath

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104233451A (zh) * 2013-06-14 2014-12-24 朗姆研究公司 利用场与特征对比的tsv 浴评估

Also Published As

Publication number Publication date
CN102471919A (zh) 2012-05-23
US8372258B2 (en) 2013-02-12
US20110025338A1 (en) 2011-02-03
KR20120063473A (ko) 2012-06-15
KR101778810B1 (ko) 2017-09-26
CN102471919B (zh) 2014-11-05
WO2011017197A2 (fr) 2011-02-10
TWI428594B (zh) 2014-03-01
TW201129798A (en) 2011-09-01

Similar Documents

Publication Publication Date Title
WO2011017197A3 (fr) Surveillance d'additifs de dépôt électrolytique
WO2009031375A1 (fr) Dispositif de détection électrochimique et procédé de mesure électrochimique l'utilisant
CN103278551A (zh) 一种基于活性炭两电极体系的重金属电化学传感器及其检测方法
WO2008108124A1 (fr) Procédé d'analyse électrochimique utilisant une électrode de diamant électro-conductrice dopée au bore
Baś et al. New electrochemical sensor with the renewable silver annular band working electrode: Fabrication and application for determination of selenium (IV) by cathodic stripping voltammetry
CN101105472A (zh) 一种电化学测量水体化学需氧量的方法
KR20140060868A (ko) 휴대용 중금속 검출용 센서
WO2010068653A3 (fr) Appareil couplé à une résistance optique et procédé
CN103674936B (zh) 一种基于电化学发光cod快速检测方法及装置
CN103402327B (zh) 一种用于便携式重金属检测的印刷电极的制作方法
CN206684096U (zh) 一种可实时在线监测多种重金属离子的检测系统
CN103512929A (zh) 一种快速检测铅离子或者亚铁离子的电增强显色方法及其装置
CN102305815B (zh) 一种用于土柱试验的电导率测量装置及测量方法
CN101377473A (zh) 一种快速的定量电分析方法
CN103543188B (zh) 一种高灵敏度测定邻苯二胺的电化学传感器及其测定方法
AT516154B1 (de) Verfahren zum Bestimmen des Korrosionsrisikos von Anlagen
MX350176B (es) Metodo y aparato para medir y controlar la concentracion de especies electroliticamente activas en soluciones acuosas.
CN201837609U (zh) 一种氧化还原电位检测瓶
CN204116265U (zh) 一种便携式水质检测仪
CN205538799U (zh) 一种新型余氯水质检测仪
CN106770593A (zh) 一种带有清洗系统的基于两极体系水质检测系统
KR20150106051A (ko) 도료의 도막 내구성 평가방법
CN203606314U (zh) 一种离子电极结构
JP2017133935A5 (fr)
JP2008216008A5 (fr)

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080034658.4

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10806949

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20127004328

Country of ref document: KR

Kind code of ref document: A

122 Ep: pct application non-entry in european phase

Ref document number: 10806949

Country of ref document: EP

Kind code of ref document: A2