WO2011007673A1 - Boîtier pour un appareil électronique portable - Google Patents

Boîtier pour un appareil électronique portable Download PDF

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Publication number
WO2011007673A1
WO2011007673A1 PCT/JP2010/061163 JP2010061163W WO2011007673A1 WO 2011007673 A1 WO2011007673 A1 WO 2011007673A1 JP 2010061163 W JP2010061163 W JP 2010061163W WO 2011007673 A1 WO2011007673 A1 WO 2011007673A1
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Prior art keywords
portable electronic
polycarbonate
mass
electronic device
general formula
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PCT/JP2010/061163
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English (en)
Japanese (ja)
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石川　康弘
隆義 田中
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出光興産株式会社
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Priority to CN2010800314615A priority Critical patent/CN102471567A/zh
Publication of WO2011007673A1 publication Critical patent/WO2011007673A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/18—Block or graft polymers
    • C08G64/186—Block or graft polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/18—Block or graft polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/445—Block-or graft-polymers containing polysiloxane sequences containing polyester sequences
    • C08G77/448—Block-or graft-polymers containing polysiloxane sequences containing polyester sequences containing polycarbonate sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3431—Telephones, Earphones
    • B29L2031/3437—Cellular phones

Definitions

  • the present invention relates to a housing for storing an electronic device or the like, and more specifically, a thin-walled, drop-resistant product formed by molding a polycarbonate resin composition containing a polycarbonate-polyorganosiloxane copolymer having a specific structure.
  • the present invention relates to a portable electronic device casing having excellent impact, fluidity and heat resistance.
  • Resin materials are often used for housings of portable electronic devices such as portable personal computers, personal digital assistants (PDAs), cellular phones, portable players, and battery cases. Assuming that an electronic device is accidentally dropped while being carried, in order to protect the internal electronic device, it is necessary to guarantee the shock resistance of the housing so as not to cause cracking or destruction of the housing. However, since the thermal properties such as impact strength and heat distortion temperature of resin materials are inferior to those of metal materials, the thickness of molded products such as housings is increased, or alloy materials that are blended with resin materials are used. Attempts have been made to improve mechanical characteristics and thermal characteristics by using or filling a plastic material with an inorganic filler or an organic filler to form a fiber-reinforced plastic.
  • a polycarbonate resin is known in which a rubber component is added for the purpose of improving impact strength (see, for example, Patent Document 1).
  • a polycarbonate-polydimethylsiloxane copolymer having a polydimethylsiloxane (PDMS) portion having a repeating number n of dimethylsiloxane units of 100 to 400, specifically, n of 150 to 350 is mixed with glass fiber, the impact resistance is improved.
  • PDMS polydimethylsiloxane
  • Patent Document 2 a polycarbonate-polydimethylsiloxane copolymer having a dimethylsiloxane unit repeating number n of 40 to 60, specifically n is 49, exhibits good low temperature impact characteristics (see, for example, Patent Document 3). ).
  • a method for obtaining a transparent polycarbonate-polydimethylsiloxane copolymer having a PDMS part having a dimethylsiloxane unit repeat number n of 50 see, for example, Patent Document 4
  • Transparent and flame-retardant polycarbonate-polydimethylsiloxane copolymer having a PDMS portion see, for example, Patent Document 5
  • a flame retardant resin composition comprising a polycarbonate-polydimethylsiloxane copolymer having a moiety is known (for example, see Patent Document 6).
  • a polycarbonate resin composition for a portable electronic device casing that can be thinned and has excellent drop impact resistance, fluidity, and heat resistance is not known.
  • JP 2006-176612 A Japanese Patent No. 2662310 Special Table 2006-523243 JP 2005-535761 A JP 2005-519177 A JP-A-8-81620
  • the present invention has been made in order to solve the above-described problems of the prior art, and is a thin wall formed by molding a polycarbonate resin composition containing a polycarbonate-polyorganosiloxane copolymer having a specific structure.
  • An object of the present invention is to provide a portable electronic device casing having excellent drop impact resistance, fluidity, and heat resistance.
  • the present inventor can achieve the object by molding a polycarbonate resin composition containing a polycarbonate-polyorganosiloxane copolymer having a specific structure. I found. The present invention has been completed based on such findings.
  • the content of the polyorganosiloxane block part having the structural unit represented by the general formula (I) and the structural unit represented by the general formula (II) and including the structural unit represented by the general formula (II) is A polycarbonate-polyorganosiloxane copolymer (A-) having 1 to 30% by mass, an average number of repeating units of the structural unit of the general formula (II) of 70 to 1,000, and a viscosity average molecular weight of 13,000 to 26000 1) Molding a polycarbonate resin composition containing 10 to 100 parts by mass and 0 to 90 parts by mass of an aromatic polycarbonate (A-2) other than (A-1) so that the total amount becomes 100 parts by mass.
  • A- polycarbonate-polyorganosiloxane copolymer having 1 to 30% by mass, an average number of repeating units of the structural unit of the general formula (II) of 70 to 1,000, and a viscosity average molecular weight of 13,000 to 26000
  • R 1 and R 2 are each independently an alkyl group or alkoxy group having 1 to 6 carbon atoms
  • X is a single bond, an alkylene group having 1 to 8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, carbon A cycloalkylene group having 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms, —S—, —SO—, —SO 2 —, —O— or —CO—
  • R 3 and R 4 are each independently , A hydrogen atom, a halogen atom or an optionally substituted alkyl group or aryl group, and a and b each independently represent an integer of 0 to 4.
  • FIG. 1 is an explanatory diagram of dimensions of a cellular phone model type molded article (50 mm ⁇ 88 mm, depth 4.5 mm, thickness 1.2 mm) using the resin compositions of Examples 1 to 7 and Comparative Examples 1 and 2. It is.
  • the portable electronic device casing of the present invention has a structural unit represented by the general formula (I) and a structural unit represented by the general formula (II), and includes a structural unit represented by the general formula (II).
  • the content of the polyorganosiloxane block part is 1 to 30% by mass, the average number of repeating units of the structural unit of the general formula (II) is 70 to 1000, and the viscosity average molecular weight is 13000 to 26000.
  • the total amount of the polycarbonate-polyorganosiloxane copolymer (A-1) 10 to 100 parts by mass and the aromatic polycarbonate (A-2) other than (A-1) 0 to 90 parts by mass is 100 parts by mass.
  • the polycarbonate resin composition contained in is molded.
  • R 1 and R 2 are each independently an alkyl group or alkoxy group having 1 to 6 carbon atoms
  • X is a single bond, an alkylene group having 1 to 8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, carbon A cycloalkylene group having 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms, —S—, —SO—, —SO 2 —, —O— or —CO—
  • R 3 and R 4 are each independently , A hydrogen atom, a halogen atom or an optionally substituted alkyl group or aryl group, and a and b each independently represent an integer of 0 to 4.
  • the content of the polyorganosiloxane block part containing the structural unit represented by the general formula (II) is preferably 1 to 20% by mass, and if it is less than 1.0% by mass, the effect of improving the drop impact strength is improved. It is not sufficient, and when it exceeds 30% by mass, the heat resistance is greatly lowered.
  • the average number of repeating units of the structural unit of the general formula (II) is preferably 80 to 700, more preferably 80 to 500, and if it is less than 70, the effect of improving the drop impact strength is not sufficient. If it exceeds 1, the handleability in producing the polydimethylsiloxane-polycarbonate copolymer (A-1) becomes difficult, resulting in poor economic efficiency.
  • the viscosity-average molecular weight of the polycarbonate-polyorganosiloxane copolymer (A-1) is large in order to exhibit the drop impact resistance, but if the viscosity-average molecular weight is large, the portable electronic device housing It becomes difficult to form a thin member such as a body. It is possible to lower the viscosity of the resin composition by raising the molding temperature, but in that case, the molding cycle becomes longer and inferior in economic efficiency. Decreases. Therefore, the viscosity average molecular weight of the polycarbonate-polyorganosiloxane copolymer (A-1) is preferably 14000 to 23000, more preferably 15000 to 22000.
  • the polycarbonate resin composition of the present invention is a composition comprising the component (A-1) and the component (A-2) so that the total amount becomes 100 parts by mass, and is a polycarbonate-polyorganosiloxane copolymer.
  • the content of (A-1) is preferably 50 to 100 parts by mass, more preferably 60 to 95 parts by mass, and the content of aromatic polycarbonate (A-2) other than (A-1) is preferably Is 50 to 0 parts by mass, more preferably 40 to 5 parts by mass.
  • the content of the polycarbonate-polyorganosiloxane copolymer (A-1) is less than 10 parts by mass, the polyorganosiloxane containing the structural unit represented by the general formula (II) when the component (A-1) is produced It is necessary to make the content of the block part 30% by mass or more.
  • the uniformity of the reaction is lowered in the polymerization step at the time of producing the component (A-1), or the polymer is washed with the polymer washing step. Since the separability from water deteriorates, the productivity of the component (A-1) is greatly reduced.
  • the content of the aromatic polycarbonate (A-2) other than (A-1) exceeds 90 parts by mass, the content of the component (A-1) is less than 10 parts by mass, which is not preferable for the above reason.
  • the polycarbonate-polyorganosiloxane copolymer (A-1) includes a dihydric phenol represented by the general formula (1) and a polyorganosiloxane represented by the general formula (2).
  • X, R 1 to R 2 and a and b are the same as in general formula (I), and n represents an integer of 70 to 1,000 in terms of the average number of repeating units of the organosiloxane constituent unit.
  • R 3 , R 4 , R 5 and R 6 each independently represent a hydrogen atom or an optionally substituted alkyl group or aryl group
  • Y represents a halogen, —R 7 OH, —R 7 COOH, —R 7 NH 2 , —COOH or —SH, wherein R 7 may have a linear, branched or cyclic alkylidene group, an aryl-substituted alkylidene group, or an alkoxy group on the ring
  • An aryl-substituted alkylene group and an aryl group are represented, and m represents 0 or 1.
  • polycarbonate resin composition of the present invention there are various dihydric phenols represented by the general formula (1) used as a raw material for the polycarbonate-polyorganosiloxane copolymer (A-1).
  • 2,2-bis (4-hydroxyphenyl) propane (common name: bisphenol A) is preferred.
  • bisphenols other than bisphenol A include bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) butane, and 2,2-bis.
  • (4-hydroxyphenyl) octane bis (4-hydroxyphenyl) phenylmethane, bis (4-hydroxyphenyl) diphenylmethane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, bis (4-hydroxyphenyl) ) Naphthylmethane, 1,1-bis (4-hydroxy-t-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane, 2,2-bis (4-hydroxy-3, 5-tetramethylphenyl) propane, 2,2-bis (4-hydroxy-3-chlorofe) Bis (hydroxyaryl) alkanes such as propane, 2,2-bis (4-hydroxy-3,5-dichlorophenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 1,1-bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) -3,
  • R 3 , R 4 , R 5 and R 6 may each independently have a hydrogen atom, a halogen atom or a substituent, as in the general formula (1).
  • n represents an average number of repeating units of the organosiloxane constituent unit and represents an integer of 70 to 1,000
  • c represents a positive integer .
  • a phenol-modified polyorganosiloxane represented by the formula (3) is preferable from the viewpoint of ease of polymerization, and ⁇ , ⁇ -bis [3- (o-hydroxyphenyl), which is one of the compounds represented by the formula (4). ) Propyl] polydimethylsiloxane or ⁇ , ⁇ -bis [3- (4-hydroxy-3-methoxyphenyl) propyl] polydimethylsiloxane, which is one of the compounds represented by formula (5), is preferred because of its availability. .
  • the polyorganosiloxane represented by the general formula (2) is a phenol having an olefinically unsaturated carbon-carbon bond, preferably vinylphenol, allylphenol, eugenol, isopropenylphenol or the like having a predetermined polymerization degree n. It can be easily produced by hydrosilation reaction at the end of the polyorganosiloxane chain.
  • the aromatic polycarbonate (A-2) other than (A-1) is reacted with a dihydric phenol compound and phosgene in the presence of an organic solvent inert to the reaction and an alkaline aqueous solution.
  • an interfacial polymerization method in which a polymerization catalyst such as a tertiary amine or a quaternary ammonium salt is added for polymerization, or a dihydric phenol compound is dissolved in pyridine or a mixed solution of pyridine and an inert solvent, and phosgene is dissolved.
  • a polymerization catalyst such as a tertiary amine or a quaternary ammonium salt
  • Bis (hydroxyaryl) cycloalkanes 4,4′-dihydroxyphenyl ether, 4,4 Dihydroxyaryl ethers such as'-dihydroxy-3,3'-dimethylphenyl ether, dihydroxydiaryl sulfides such as 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide, Dihydroxydiaryl sulfoxides such as 4,4′-dihydroxydiphenyl sulfoxide, 4,4′-dihydroxy-3,3′-dimethyldiphenyl sulfoxide, 4,4′-dihydroxydiphenyl sulfone, 4,4′-dihydroxy-3,3 Dihydroxy diaryl sulfones such as' -dimethyldiphenyl sulfone, dihydroxy diphenyls such as 4,4'-dihydroxydiphenyl, 9,9-bis (4-hydroxyphenyl) flu
  • a terminal terminator or a molecular weight modifier is usually used.
  • the molecular weight regulator various types can be used as long as they are usually used for polymerization of polycarbonate resin.
  • monohydric phenol for example, phenol, on-butylphenol, mn-butylphenol, pn-butylphenol, o-isobutylphenol, m-isobutylphenol, p-isobutylphenol, ot -Butylphenol, mt-butylphenol, pt-butylphenol, on-pentylphenol, mn-pentylphenol, pn-pentylphenol, on-hexylphenol, mn-hexylphenol, pn-hexylphenol, pt-octylphenol, o-cyclohexylphenol, m-cyclohexylphenol, p-cyclohexylphenol, p-cyclohexylphenol,
  • pt-butylphenol p-cumylphenol, p-phenylphenol and the like are preferably used.
  • two or more compounds may be used in combination.
  • a branching polycarbonate can be obtained by using a branching agent in combination in the range of 0.01 to 3 mol%, particularly 0.1 to 1.0 mol% with respect to the dihydric phenol compound.
  • branching agent examples include 1,1,1-tris (4-hydroxyphenyl) ethane, 4,4 ′-[1- [4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl] ethylidene ] Bisphenol, ⁇ , ⁇ ′, ⁇ ′′ -tris (4-hydroxyphenyl) -1,3,5-triisopropylbenzene, 1- [ ⁇ -methyl- ⁇ - (4′-hydroxyphenyl) ethyl] -4-
  • a compound having three or more functional groups such as [ ⁇ ′, ⁇ ′-bis (4 ′′ -hydroxyphenyl) ethyl] benzene, phloroglysin, trimellitic acid, and isatin bis (o-cresol) can be used.
  • various known additives can be blended in the polycarbonate resin composition as desired, and these include reinforcing materials, fillers, stabilizers, antioxidants. UV absorbers, antistatic agents, lubricants, mold release agents, dyes, pigments, other flame retardants, and elastomers for improving impact resistance.
  • the polycarbonate resin composition used in the present invention can be obtained by blending and kneading the components (A-1) and (A-2) and, if necessary, known additives.
  • the blending and kneading are usually performed using a method such as a ribbon blender, a Henschel mixer, a Banbury mixer, a drum tumbler, a single screw extruder, a twin screw extruder, a kneader, or a multi screw extruder. It can be done by a method.
  • the heating temperature at the time of kneading is usually selected in the range of 250 to 320 ° C.
  • various conventionally known molding methods such as injection molding, injection compression molding, extrusion molding, blow molding, press molding, vacuum molding, foam molding, etc.
  • injection molding at a mold temperature of 60 ° C. or higher, preferably 80 to 120 ° C.
  • the resin temperature in the injection molding is usually about 280 to 360 ° C., preferably 280 to 330 ° C.
  • gas injection molding can be employed for preventing the appearance of sink marks or reducing the weight.
  • the wall thickness of the portable electronic device casing obtained by molding the polycarbonate resin composition containing the polycarbonate-polyorganosiloxane copolymer having a specific structure of the present invention is 0.5 to 1.5 mm, preferably 0. .6 to 1.4 mm, more preferably 0.6 to 1.3 mm.
  • the portable electronic device casing of the present invention can be used for portable electronic devices such as a portable personal computer, a personal digital assistant (PDA), a cellular phone, a portable player, and a battery case. preferable.
  • Phosgene was continuously passed through a tubular reactor having an inner diameter of 6 mm and a tube length of 30 m at a flow rate of 4.0 kg / hr at a flow rate of 40 liter / hr of sodium hydroxide aqueous solution of BPA and 15 liter / hr of methylene chloride.
  • the tubular reactor had a jacket portion, and the temperature of the reaction solution was kept at 40 ° C. or lower by passing cooling water through the jacket.
  • the reaction liquid exiting the tubular reactor was continuously introduced into a baffled tank reactor having an internal volume of 40 liters equipped with a receding blade, and further 2.8 liters / hr of sodium hydroxide aqueous solution of BPA, 25
  • the reaction was carried out by adding 0.07 liter / hr of a mass% aqueous sodium hydroxide solution, 17 liter / hr of water, and 0.64 liter / hr of a 1 mass% triethylamine aqueous solution.
  • the reaction liquid overflowing from the tank reactor was continuously extracted and allowed to stand to separate and remove the aqueous phase, and the methylene chloride phase was collected.
  • the polycarbonate oligomer thus obtained had a concentration of 329 g / L and a chloroformate group concentration of 0.74 mol / L.
  • Polycarbonate-polydimethylsiloxane copolymer production 15 L polycarbonate resin solution produced above, 9.0 L methylene chloride, repeating dimethylsiloxane units in a 50 L tank reactor equipped with baffle plates, paddle type stirring blades and cooling jacket Charge 343 g of allylphenol-terminated polydimethylsiloxane (PDMS) having a number of 90 and 8.8 mL of triethylamine, add 1389 g of 6.4% by weight aqueous sodium hydroxide solution with stirring, and add polycarbonate oligomer and allylphenol end for 10 minutes. A modified PDMS reaction was performed.
  • PDMS allylphenol-terminated polydimethylsiloxane
  • methylene chloride solution of pt-butylphenol (PTBP) 126 g of PTBP dissolved in 2.0 L of methylene chloride
  • sodium hydroxide aqueous solution of BPA 577 g of NaOH and 2.0 g of sodium dithionite
  • a solution obtained by dissolving 1012 g of BPA in an aqueous solution dissolved in 8.4 L) was added, and a polymerization reaction was carried out for 50 minutes.
  • 10 L of methylene chloride was added and stirred for 10 minutes.
  • the organic phase was separated into an organic phase containing a polycarbonate-polydimethylsiloxane copolymer and an aqueous phase containing excess BPA and NaOH, and the organic phase was isolated.
  • the methylene chloride solution of the polycarbonate-polydimethylsiloxane copolymer thus obtained was sequentially washed with 15% by volume of 0.03 mol / L NaOH aqueous solution and 0.2 mol / L hydrochloric acid with respect to the solution. Washing with pure water was repeated until the electrical conductivity in the aqueous phase became 0.01 ⁇ S / m or less.
  • the methylene chloride solution of the polycarbonate-polydimethylsiloxane copolymer obtained by washing was concentrated and pulverized, and the obtained flakes were dried at 120 ° C. under reduced pressure.
  • the amount of PDMS residue (PDMS copolymerization amount) determined by nuclear magnetic resonance (NMR) of the obtained polycarbonate-polydimethylsiloxane copolymer was 5.6% by mass, measured according to ISO 1628-4 (1999).
  • Table 1 shows the types of terminal-modified PDMS (allylphenol-terminated PDMS or eugenol-terminated PDMS), the number of repeating dimethylsiloxane units, the amount of terminal-modified PDMS used, and the amount of PTBP used. A copolymer was produced. Table 1 shows the PDMS residue amount (PDMS copolymerization amount), viscosity number, and viscosity average molecular weight Mv of the obtained polycarbonate-polydimethylsiloxane copolymer.
  • Molding conditions Injection molding machine: Nissei Plastic Co., Ltd. Electric injection molding machine ES-1000 80 tons Molding machine cylinder temperature: 300-320 ° C Molding cycle: 30 seconds / cycle Mold temperature: 130 ° C (Drop impact resistance evaluation)
  • the obtained molded product was placed in a thermostatic bath and cooled to a predetermined temperature (0 ° C., ⁇ 10 ° C., ⁇ 20 ° C.). Two hours later, the molded article was taken out from the thermostatic chamber, and immediately after dropping a weight of 1280 g onto the molded article from a height of 1.85 m, the drop impact resistance was evaluated.
  • Table 2 shows the presence or absence of cracks, the presence or absence of cracks, and the types of cracks (ductile cracks and brittle cracks).
  • the case where the crack surface (fracture surface) was ductile was evaluated as ductile cracking, and the case where the crack surface was brittle was evaluated as brittle cracking.
  • a numerical value shows the presence or absence of the crack in five tests, the presence or absence of crack generation, and the number of types of cracks, and the total is 5.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention porte sur un boîtier pour un appareil électronique portable, le boîtier étant obtenu par moulage d'une composition de résine de polycarbonate comprenant : 10-100 parties en masse d'un copolymère polycarbonate/polyorganosiloxane (A-1) qui a des unités structurales de la formule générale (I) et des unités structurales de la formule générale (II) et a une teneur d'un bloc de polyorganosiloxane comprenant les unités structurales de formule générale (II) de 1-30 % en masse, dans laquelle le nombre moyen d'unités structurales répétées de formule générale (II) est de 70-1 000, et qui a une masse moléculaire moyenne en viscosité de 13 000-26 000 ; et 0-90 parties en masse d'un polycarbonate aromatique (A-2) qui est différent de (A-1), la quantité totale de (A-1) et (A-2) étant de 100 parties en masse. Le boîtier a une faible épaisseur de paroi et a une excellente résistance à l'impact de chute, une excellente aptitude à l'écoulement et une excellente résistance à la chaleur.
PCT/JP2010/061163 2009-07-16 2010-06-30 Boîtier pour un appareil électronique portable WO2011007673A1 (fr)

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CN2010800314615A CN102471567A (zh) 2009-07-16 2010-06-30 便携型电子设备壳体

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JP2009168185A JP5619384B2 (ja) 2009-07-16 2009-07-16 携帯型電子機器筐体
JP2009-168185 2009-07-16

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JP (1) JP5619384B2 (fr)
KR (1) KR20120050964A (fr)
CN (2) CN105111709A (fr)
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103562312A (zh) * 2011-05-30 2014-02-05 出光兴产株式会社 电池组用聚碳酸酯树脂组合物及电池组
EP3081584A4 (fr) * 2013-12-10 2017-07-12 Idemitsu Kosan Co., Ltd Copolymère de polycarbonate-polyorganosiloxane et son procédé de production
EP3127940A4 (fr) * 2014-03-31 2017-08-30 Idemitsu Kosan Co., Ltd Polyorganosiloxane, copolymère de polycarbonate-polyorganosiloxane et son procédé de production
EP3312240A4 (fr) * 2015-06-17 2019-01-16 Idemitsu Kosan Co.,Ltd. Procédé de préparation de composition de résine de polycarbonate
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