WO2010145945A1 - Utilisation de bandes adhésives activables à chaud pour le collage de cartes de circuit imprimé flexibles - Google Patents

Utilisation de bandes adhésives activables à chaud pour le collage de cartes de circuit imprimé flexibles Download PDF

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Publication number
WO2010145945A1
WO2010145945A1 PCT/EP2010/057755 EP2010057755W WO2010145945A1 WO 2010145945 A1 WO2010145945 A1 WO 2010145945A1 EP 2010057755 W EP2010057755 W EP 2010057755W WO 2010145945 A1 WO2010145945 A1 WO 2010145945A1
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Prior art keywords
adhesive tape
heat
tape according
adhesive
activatable adhesive
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PCT/EP2010/057755
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German (de)
English (en)
Inventor
Markus Brodbeck
Hans Karl Engeldinger
Thorsten Krawinkel
Frank Hannemann
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Tesa Se
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Publication of WO2010145945A1 publication Critical patent/WO2010145945A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/02—Copolymers with acrylonitrile
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
    • C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/16—Addition or condensation polymers of aldehydes or ketones according to C08L59/00 - C08L61/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Definitions

  • the invention relates to a heat-activatable adhesive tape with low flowability at high temperatures and high crosslinking rate for bonding flexible printed circuit boards, in particular for the production of electronic components.
  • Flexible Printed Circuit Boards are also used today in a variety of electronic devices such as cell phones, radios, computers, printers, and many others, and are composed of multiple electrical circuits (in particular, etched) flexible copper clad laminates (FCCL, also referred to as copper-clad laminates) which are glued together. FCCLs are also commonly used in electronic devices. Flexible Copper Clad laminates consist of layers of copper and a refractory, hard-wearing thermoplastic, mostly polyimide, more rarely polyester such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) or liquid crystalline polymers (LCPs), and in part an adhesive layer in between.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • LCPs liquid crystalline polymers
  • FCCLs Flexible Copper Clad Laminates
  • FCCLs Flexible Copper Clad Laminates
  • individual FCCLs of the FPCBs are glued together, in this case usually a bonding of polyimide to polyimide or polyimide Polyimide on copper instead.
  • FCCLs or finished FPCBs on other substrates stiffening materials, so-called "Stiffener" to partial stiffening of the laminates glued.
  • reinforcing materials for example, rigid glass fiber epoxy plates (FR-4), polyimide, polyester, steel and aluminum are used. This is of particular interest, for example, if the flexible circuit board is to be provided with electronic components such as chips or the like and / or stabilized for use.
  • the adhesive tapes used for these bonds are subject to very high demands. Since very high bonding performance, heat and media resistance must be achieved, generally heat-activatable adhesive tapes are used, which are processed at high temperatures. These tapes may during this high temperature load during the bonding of FPCB, which takes place frequently at 180 0 C at temperatures that emit no volatile constituents. In order to achieve a high cohesion, the adhesive tapes should crosslink during this temperature load. For good wetting high pressures are used during the bonding process, the bonding usually takes place with hot pressing. Here it is necessary that the adhesive tapes have only a low flowability at high temperatures in order not to be squeezed out of the bond line. This is achieved by high viscosity of the uncrosslinked adhesive tape or by rapid cross-linking. In addition, the tapes must then be solder bath resistant, that is, for a short time a very high temperature load, such as 288 0 C survive. In this case, no bubbles may arise in the bonded component.
  • thermoplastics do not make sense, although they melt very easily and ensure good wetting of the substrates to be bonded and lead to a very fast bonding within a few seconds.
  • epoxy resins or phenolic resins are used for crosslinkable adhesive tapes, which react with certain hardeners to polymeric networks.
  • Adhesive compositions based on elastomers and epoxy resins often react quite slowly, so that the bonding process takes a long time and the costs go up to be driven. To circumvent this, different accelerators are added, which allow the reaction of crosslinking to proceed much faster.
  • the disadvantage here is that the epoxy-crosslinked adhesive tapes, in particular the accelerated systems, also begin to crosslink at room temperature or slightly elevated temperatures.
  • the phenolic resins can be divided into two groups, one being the resoles that are formed when excess formaldehyde is produced, and the other are the novolacs that are formed by a deficit of formaldehyde.
  • the resoles spontaneously cross-link with themselves in the heat or by the addition of acid, with release of water, while the novolaks only react with one another when a formaldehyde splitter acts as crosslinker. In their networking, no water is split off.
  • crosslinker resins are mainly used in the construction bonding and give after curing very brittle adhesives that achieve high bond strengths, but are hardly flexible.
  • nitrile rubbers which are soluble in certain solvents, or can be transferred by a kneading process in a spreadable suspension, but only limited flow at high temperatures.
  • Adhesive tapes of nitrile rubbers and phenolic resins are e.g. from DE 44 27 802 A known. These tapes are used for the bonding of chip modules in smart cards.
  • Adhesive tapes for Smard Cards are also described in EP 1 615 978 A. Here are also called novolak resins.
  • the application of the bonding of chip modules in smart cards makes completely different demands on the adhesive tapes than the bonding of flexible printed circuit boards. So the smart cards do not have to pass a solder bath test, moreover, a few bubbles in the bond no problem, as long as they do not affect the adhesive performance, since they are not visible.
  • a transfer of the teaching of EP 1 615 978 A on bonding in the field of flexible printed circuit boards is therefore not close.
  • the object of the invention is thus to provide an adhesive tape for the bonding of flexible printed circuit boards or for the bonding in the manufacture of flexible printed circuit boards, by its use, the disadvantages of the prior art can be completely or at least partially avoided.
  • the squeezing of the adhesive film from the bondline during hot pressing should be minimized.
  • it should advantageously not come to blistering during the hot pressing or the subsequent processes more advantageously, a shelf life should be guaranteed over 1 year at room temperature. Despite the long shelf life, the fastest possible reaction is required to speed up the processes.
  • the invention relates to the use of a heat-activatable adhesive tape for the bonding of electronic components and printed circuit boards, comprising an adhesive consisting of at least a. at least one acrylonitrile-butadiene copolymer, b. at least one novolak resin, and c. a formaldehyde donor as a hardener.
  • the ratio of the acrylonitrile-butadiene copolymers to the novolak resins is advantageously in the range of 3: 7 to 8: 2, so that preferably the acrylonitrile-butadiene copolymers having a weight fraction of 30 to 80 wt .-% and the novolac resins with a weight fraction of 20 to 70 wt .-%, wherein the components a. and b. add to 100 wt .-%.
  • the novolak resin is in particular able to chemically crosslink at high temperatures with the aid of the hardener.
  • the crosslinking according to the present invention is carried out in particular solely by chemical reaction of the novolak resins with the curing agents in the heat and / or by reaction of the curing agents with the novolak resins and the polymer matrix in the heat.
  • Heat-activatable adhesive is accordingly understood to mean a polymer composition which is crosslinked when thermal energy is introduced, thereby building up a bonding strength sufficient for the bond (sufficient adhesion, sufficient cohesion).
  • the polymer composition can not be at room temperature, weak or even strong touch sticky (tacky, tacky).
  • the activation temperatures for thermal crosslinking are well above room temperature, usually at least 100 0 C or more.
  • Preferred activation temperatures for thermal crosslinking, in particular to guarantee the required bond strength, are at least 120 ° C., in particular between 140 ° C. and 220 ° C.
  • the adhesive used for the adhesive tape used according to the invention can be applied to the abovementioned components a. to c. but optionally also contain other ingredients.
  • adheresive tape encompasses all flat structures such as films or film sections which are expanded in two dimensions, tapes of extended length and limited width, strip sections, diecuts and the like.
  • the novolak resins and the curing agents are used in a ratio of 50: 1 to 5: 1 wt.% (Novolak resins: hardeners), preferably 20: 1 to 7: 1 wt.
  • the adhesive used according to the invention is heat-activated, crosslinked in the heat and flows well on the substrate to be bonded in the heat, shows a good adhesion to polyimide, short-term temperature stable to at least 288 0 C and in the uncrosslinked state soluble or Suspendable in organic
  • the adhesive used according to the invention is therefore outstandingly suitable for
  • Acrylonitrile-butadiene copolymers in the context of this document also referred to as acrylonitrile-butadiene rubbers, nitrile-butadiene rubbers or, for short, as nitrile rubbers, can in particular be used according to the invention in particular all acrylonitrile-butadiene rubbers having an acrylonitrile content of 15 to 55% by weight.
  • copolymers of acrylonitrile-butadiene and isoprene can be used.
  • the proportion of 1, 2-linked butadiene is variable.
  • the aforementioned polymers may be hydrogenated to a different degree; Fully hydrogenated polymers with a double bond content of less than 1% can also be used.
  • Nitrile butadiene rubbers are polymerized either hot or cold.
  • Commercially, such systems are available, for example, under the names Europrene TM from Eni Chem, Krynac TM and Perbunan TM from Bayer or Nipol and Breon from Zeon; hydrogenated systems are available under the name Zetpol from Zeon or Therban commercially available from Lanxess in varying degrees.
  • the abovementioned products are examples of systems which can be used advantageously according to the invention.
  • nitrile rubbers with higher acrylonitrile contents give better adhesion. Also advantageous for a strong bond is a high molecular weight, care must be taken that the polymer can still be brought into solution or suspension.
  • the nitrile rubbers can be in short-chain alcohols and ketones such as ethanol or
  • Butanone solve or suspend. Butanone is preferred because the remaining
  • Novolacs are soluble, meltable, non-self-curing and storage-stable phenolic resins.
  • thermoset moldings Their crosslinking to thermoset moldings is achieved by means of a hardener which splits off formaldehyde, e.g. Hexamethylenetetramine (urotropin).
  • formaldehyde e.g. Hexamethylenetetramine (urotropin).
  • novolak resins which contain ortho-linked phenol units.
  • novolak resins that can advantageously be used according to the invention are, for example, the products Durez from Sumitomo Bakelite and / or the products Plenco from the Plastics Engineering Company.
  • Suitable hardeners are different formaldehyde donors, e.g. Hexmethylenetetramine (hexa, HMTA, urotropin) and / or different methylolamine derivatives such as trimethylolmelamine or hexamethylolmelamine.
  • formaldehyde donors e.g. Hexmethylenetetramine (hexa, HMTA, urotropin) and / or different methylolamine derivatives such as trimethylolmelamine or hexamethylolmelamine.
  • the chemical crosslinking of the hardener with the novolak resins achieves very high strengths within the adhesive film. But the bond strength to the polyimide are very high.
  • tackifiers elastomers compatible with the adhesive resins
  • tackifiers in the heat-activatable adhesives for example, non-hydrogenated, partially or completely hydrogenated resins based on rosin and Kolophoniumderivaten, hydrogenated polymers of dicyclopentadiene, non-hydrogenated, partially, selectively or fully hydrogenated hydrocarbon resins based on C 5 -, C 5 / C 9 or Cg monomer streams, polyterpene resins based on ⁇ -pinene and / or ⁇ -pinene and / or ⁇ -limonene, hydrogenated polymers of preferably pure C 8 - and Cg-aromatics are used.
  • the aforementioned adhesive resins can be used both alone and in admixture.
  • Tackifiers may advantageously be added up to 20% by weight, based on the blended adhesive.
  • the amount of epoxy resin should preferably not exceed 10% by weight.
  • Epoxy resins are understood as meaning both monomeric and oligomeric compounds having more than one epoxide group per molecule. These may be reaction products of glycidic esters or epichlorohydrin with bisphenol A or bisphenol F or mixtures of these two. It is also possible to use epoxy novolak resins obtained by reaction of epichlorohydrin with the reaction product of phenols and formaldehyde. Also, monomeric compounds having multiple epoxide end groups used as thinners for epoxy resins are useful. Also elastically modified epoxy resins can be used.
  • Examples of advantageous epoxy resins include Araldite TM 6010, CY-281 TM, ECN TM 1273, ECN TM 1280, MY 720, RD-2 from Ciba Geigy, DER TM 331, 732, 736, DEN TM 432 from Dow Chemicals, Epon TM 812, 825, 826, 828, 830 etc. from Shell Chemicals, HPT TM 1071, 1079 also from Shell Chemicals, Bakelite TM EPR 161, 166, 172, 191, 194 etc. from Bakelite AG.
  • Advantageously useful commercial aliphatic epoxy resins are, for example, vinylcyclohexanedioxides such as ERL-4206, 4221, 4201, 4289 or 0400 from Union Carbide Corp.
  • EpoxidverCOLner monomeric compounds with multiple epoxy groups are, for example Bakelite TM EPD KR, EPD Z8, EPD HD, EPD WF, etc. Bakelite AG or Polypox TM R 9, R 12, R 15, R 19, R 20, etc. the Company UCCP.
  • additives include: primary antioxidants such as hindered phenols secondary antioxidants such as phosphites or thioethers - other anti-aging agents such as sterically hindered amines
  • C-radical scavengers such as C-radical scavengers light stabilizers such as UV absorbers processing aids fillers such as silica, glass (ground or in the form of spheres), aluminum oxides, zinc oxides, titanium dioxides, carbon blacks, metal powder, etc.
  • processing aids fillers such as silica, glass (ground or in the form of spheres), aluminum oxides, zinc oxides, titanium dioxides, carbon blacks, metal powder, etc.
  • Color pigments and dyes and optical brighteners optionally other polymers of preferably elastomeric nature.
  • plasticizers By using plasticizers, the elasticity of the crosslinked adhesive can be increased.
  • plasticizers for example low molecular weight polyisoprenes, polybutadienes, polyisobutylenes or polyethylene glycols and polypropylene glycols can be used.
  • the adhesive does not escape from the adhesive joint during bonding and hot pressing. During this process, the novolak resins and possibly the polymer matrix crosslink with the hardeners, resulting in a three-dimensional network.
  • the constituents of the adhesive in particular in a suitable solvent, for example butanone, are dissolved or suspended, coated on a flexible substrate provided with a release layer (for example a release paper or release film) and dried, so that the mass of the substrate can be easily removed again.
  • a release layer for example a release paper or release film
  • Corresponding shaped bodies are then preferably adhered to the substrate to be bonded, for example polyimide, at elevated temperature.
  • the adhesive tapes used according to the invention may be provided with a cover material (release liners; liner) for better handling, for example with siliconized paper, siliconized polymer film (such as siliconized PET film) or the like.
  • the adhesive tape can first be tacked by laminating in the (moderate) heat.
  • the actual hot glue process with the second substrate the novolak resins cure completely or partially and the adhesive film reaches the high bond strength.
  • the novolak resins and the hardeners should preferably not undergo a chemical reaction at the laminating temperature, but only react with one another during the heat-bonding.
  • the adhesive tapes according to the invention exhibit in the so-called QuickPressprocessing- method (QPP, state of the art: hot pressing for example for 2 min, 180 C, 15 bar, subsequent furnace storage, for example, 30 min to 1 h at 150 0 C) and in the heat press process (HP; Hot pressing for example 30 min at 180 0 C, 15 bar) significant advantages, by at least equal quality bonding products at significantly improved conditions (shorter process times) can be achieved, so can be omitted in the Quickpressprocessing method for comparable results on the subsequent furnace storage step or alternatively the pressing time reduced to 1 min in the hot pressing step (with remaining subsequent furnace storage); In the heat-press process, the hot-pressing step can likewise be reduced to one minute for comparable results (in each case while maintaining the other parameters to the example values given above).
  • QPP QuickPressprocessing- method
  • HP Hot pressing for example 30 min at 180 0 C, 15 bar
  • the hot-pressing step can likewise be reduced to one minute for comparable results (in each case while maintaining the other parameters to the example
  • the bonds are made in particular in Hei ßverpressungs- method, preferably by Quickpressprocessing and / or Heatpress-processing (see above).
  • the invention is therefore further an adhesive composite of at least two bonded flexible printed circuit boards with an inventive adhesive tape described; in particular with a heat-activatable adhesive tape, as is for use according to one of the claims is described; further glued in particular as shown above.
  • the invention further provides an adhesive composite of at least one flexible printed circuit board or an adhesive composite of at least two flexible printed circuit boards on a reinforcing material with an inventive adhesive tape as described for use according to one of the claims; further glued in particular as shown above.
  • Example 1 100 parts of Breon N41 H80 (nitrile rubber from Zeon with 41% acrylonitrile) and 100 parts Durez 12687 (novolak resin from Sumitomo Bakelite, already containing 7.4% hexamethylenetetramine) were added as a 30% suspension in butanone made in a kneader. The kneading time was 20 h. The heat-activatable mass was then spread out of solution onto a siliconized PET film ("liner”) and dried at 100 ° C., resulting in a 25 ⁇ m thick adhesive layer.
  • liner siliconized PET film
  • An adhesive was prepared according to the same procedure as in Example 1 with the composition 100 parts Breon N41 H80, 50 parts (based on solids) of the resin Durez 37087 (a 55% solution of Durez 12687 in butanone without hardener) and 7 parts hexamethylenetetramine.
  • Example 2 a hydrogenated nitrile rubber Therban 4369 (partially hydrogenated nitrile rubber with 43% acrylonitrile) from Lanxess was used.
  • V6 Sony 341 O from Sony (nitrile rubber (70% butadiene / 30% acrylonitrile) -
  • V7 Sony 3450 from Sony (poly-n-butyl acrylate, polyacrylonitrile, polyethyl acrylate, epoxy, 2: 1: 4: 2, on liner)
  • V8 Pyralux LF 100 from DuPont (modified acrylate adhesive on liner;
  • Elastomer component 82% n-butyl acrylate, 12% acrylonitrile, 6% acrylic acid; Resin component: phenol-formaldehyde resin (novolak))
  • FCCL Flexible Copper Clad Laminate Pyralux LF91 1 OR [layer sequence (Cu 305 g / m 2 ) + (25 ⁇ m acrylate adhesive) + (25 ⁇ m poliimide layer; Kapton®) is applied in each case with the adhesive tapes prepared according to Examples 1 to V5 a reinforcement plate made of FR-4 ( "stiffener"; 10 cm x 2.5 cm). pasted by the adhesive tape is laminated onto the polyimide FCCL laminate of polyimide / copper foil at 100 0 C and the liner removed to give the adhesive strips is slightly shorter than the bonded FCCL to later have a handle.
  • this composite of FCCL and tape to the stiffener from FR-4 is laminated at 100 0 C, and the whole assembly in a heatable Burkle at 180 0 C pressed at a pressure of 1, 3 MPa for 20 min ("hot pressing").
  • the FCCL and FR-4 Stiffener composites prepared by the above-described method and the commercially available Comparative Examples V6 to V8 have the FCCL at 90 ° from the Stiffener at a speed of 50 mm / min deducted and the required force measured in N / cm.
  • the prepared examples and Comparative Examples 1 to 3 and V4, V5 the measurements are taken directly after bonding at 23 0 C and 50% rel. Humidity carried out. Each reading is determined in triplicate.
  • the squeezing behavior was determined as follows.
  • This perforated composite was again laminated to the FR-4 material and then pressed (hot pressing, heatable Bürklepresse at 180 0 C at a pressure of 4 MPa for 20 min). After a pressing time of 20 minutes, it was measured how far the adhesive was squeezed into the holes. In each case, the average of the maximum range in the individual holes was determined.
  • FCCL stiffener composites are placed for 10 seconds with the FCCL-site in a 288 0 C solder bath.
  • the bond is considered to be solder bath resistant if no bubbles form in the bondline which cause the polyimide film of the FCCL to swell or simply optically can be detected.
  • the test is considered failed if a slight blistering already occurs.
  • test FCCL-Stiffener composite L-Peel test as described above.
  • the example V5 was not easy to laminate because of its stiffness and wetted the surface of the bonding partners only insufficient, which is why it came to lower bond strengths.
  • Example 1 Example 2 Example V6 Example V7 Example V8
  • Examples V7 and V8 show a significantly stronger squeezing than Examples 1 and 2 according to the invention. storage stability
  • Examples V6 and V7 must be stored at 5 ° C. to maintain their properties, while Examples 1 and 2 are stable for at least 1 year at room temperature.
  • Comparative Examples V4 and V5 show no sufficient resistance in the solder bath test. Moreover, Comparative Example C5 can not be laminated sufficiently well. Comparative Examples V6 and V8 react very slowly in terms of the crosslinking reaction between novolak resin and hardener, while Comparative Example V7 tends to form an intolerable blistering during compression. Moreover, Examples V6 and V7 are not storable at room temperature.
  • the adhesive tapes described in this document are outstandingly suitable for the use according to the invention, and in particular to fulfill the object according to the invention.
  • the special feature of the adhesives according to the invention is the balance of the products.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Une bande adhésive activable à chaud est utilisée pour le collage de cartes de circuit imprimé flexibles. La bande adhésive présente une couche d'une matière adhésive comprenant au moins a) un copolymère d'acrylnitrile–butadiène, b) une résine novolac et c) un donneur formaldéhyde comme durcisseur.
PCT/EP2010/057755 2009-06-17 2010-06-03 Utilisation de bandes adhésives activables à chaud pour le collage de cartes de circuit imprimé flexibles WO2010145945A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009025641.5 2009-06-17
DE102009025641A DE102009025641A1 (de) 2009-06-17 2009-06-17 Verwendung von hitzeaktivierbaren Klebebändern für die Verklebung von flexiblen Leiterplatten

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WO2010145945A1 true WO2010145945A1 (fr) 2010-12-23

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TW (1) TW201105766A (fr)
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KR20180039644A (ko) * 2015-08-11 2018-04-18 테사 소시에타스 유로파에아 아크릴로니트릴 부타디엔 고무를 기반으로 한 감압 접착제
DE102022105185A1 (de) 2022-03-04 2023-09-07 Tesa Se Lösbares Laminat und Verfahren zum Lösen dauerhafter struktureller Verklebungen
EP4276155A1 (fr) 2022-05-11 2023-11-15 tesa SE Bande multicouche et procédé de décollage de la bande multicouche

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DE202012004946U1 (de) * 2012-05-21 2013-08-26 Tesa Se Lichtabsorbierende hitzeaktivierbare Klebemasse und Klebeband enthaltend solche Klebemasse
TWI475089B (zh) * 2012-05-23 2015-03-01 Symbio Inc 一種應用於黏貼可攜式電子產品之熱貼合膠帶
DE102017221072A1 (de) 2017-11-24 2019-05-29 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder
DE102019207550A1 (de) 2019-05-23 2020-11-26 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder

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US20090011166A1 (en) * 2004-10-22 2009-01-08 Toray Saehan, Inc. Adhesive tape composition for electronic components
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180039644A (ko) * 2015-08-11 2018-04-18 테사 소시에타스 유로파에아 아크릴로니트릴 부타디엔 고무를 기반으로 한 감압 접착제
KR102128459B1 (ko) 2015-08-11 2020-06-30 테사 소시에타스 유로파에아 아크릴로니트릴 부타디엔 고무를 기반으로 한 감압 접착제
DE102022105185A1 (de) 2022-03-04 2023-09-07 Tesa Se Lösbares Laminat und Verfahren zum Lösen dauerhafter struktureller Verklebungen
EP4276155A1 (fr) 2022-05-11 2023-11-15 tesa SE Bande multicouche et procédé de décollage de la bande multicouche

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DE102009025641A1 (de) 2010-12-23
TW201105766A (en) 2011-02-16

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