WO2010122728A1 - Ic chip, display panel and display module - Google Patents

Ic chip, display panel and display module Download PDF

Info

Publication number
WO2010122728A1
WO2010122728A1 PCT/JP2010/002623 JP2010002623W WO2010122728A1 WO 2010122728 A1 WO2010122728 A1 WO 2010122728A1 JP 2010002623 W JP2010002623 W JP 2010002623W WO 2010122728 A1 WO2010122728 A1 WO 2010122728A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
liquid crystal
chip
circuits
crystal driving
Prior art date
Application number
PCT/JP2010/002623
Other languages
French (fr)
Japanese (ja)
Inventor
湯浅実
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2010122728A1 publication Critical patent/WO2010122728A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • G02F2201/503—Arrangements improving the resistance to shock

Definitions

  • the present invention relates to an IC chip, a display panel on which the IC chip is mounted, and a display module on which the display panel is mounted.
  • FIGS. 7a to 7c are views showing a part of the conventional liquid crystal display module 100
  • FIG. 7a is a top view of the liquid crystal panel 101 on which the driver 102 for driving the conventional liquid crystal is mounted.
  • FIGS. 7c and 7c are diagrams schematically showing a cross section of the driver 102.
  • FIG. 7b shows the driver 102 before breaking
  • FIG. 7c shows the driver 102 after cracking.
  • FIG. 7c when a crack 124 occurs in the driver 102, the driver main body 121 of the driver 102 and the circuit 122 inside the driver main body 121 are also cracked. Therefore, if the driver 102 is cracked, the driver 102 will not be driven, and the liquid crystal display module will not light up, resulting in a defective product.
  • Patent Document 1 discloses an IC chip in which a passivation film is formed on both surfaces of a substrate for the purpose of preventing cracking of the liquid crystal driving IC chip.
  • FIG. 9a and 9b are cross-sectional views schematically showing the structure of the IC chip 200 described in Patent Document 1, respectively.
  • FIG. 9a in the IC chip 200 in which the passivation film 202 is formed only on one surface of the substrate 201, warpage occurs due to the difference in thermal expansion coefficient between the substrate 201 and the passivation film 202. As a result, the passivation film 202 is cracked or the IC chip 200 is cracked.
  • the passivation film 202 is formed on both surfaces of the substrate 201. Thereby, stress applied to the IC chip 200 during dicing and pressure bonding is reduced, and the occurrence of cracks or cracks in the IC chip 200 is reduced.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide an IC chip that does not affect the liquid crystal drive even if it is cracked.
  • an IC chip includes a plurality of circuits that are physically and electrically separated from each other inside the chip body, and a first circuit among the plurality of circuits.
  • Each of the second circuit and the second circuit has a first electrode and a second electrode on the surface of the chip body for electrically connecting each other through a wiring provided outside the chip body.
  • a brittle portion that induces cracking of the chip body is formed on the surface of the chip body in a region where no circuit is formed between the first circuit and the second circuit.
  • a plurality of circuits that are physically and electrically separated from each other are provided inside the IC chip.
  • the first circuit of the plurality of circuits has a first electrode on the surface of the chip body
  • the second circuit has a second electrode on the surface of the chip body.
  • These first electrode and second electrode are connected to wiring provided outside the IC chip, such as wiring on a substrate on which the IC chip is mounted.
  • the first circuit and the second circuit are electrically connected.
  • the weak part which induces the crack of a chip main body is formed in the main body of an IC chip. When an impact that causes cracking of the IC chip is applied to the IC chip, cracking occurs in the fragile portion of the IC chip body.
  • the fragile portion is formed on the surface of the chip body in a region where the circuit is not formed between the first circuit and the second circuit. Therefore, when a crack is caused from the fragile portion, the IC chip is cracked in a region where the circuit is not formed between the first circuit and the second circuit, so that the circuit itself can be prevented from being cracked. Furthermore, the first circuit and the second circuit are originally electrically separated inside the IC chip body. For this reason, even if a crack occurs between the circuits, the electrical connection in the circuit is not broken. At this time, the circuits can be maintained in an electrically connected state through wiring outside the IC chip body. Therefore, according to the IC chip according to the present invention, even if the IC chip is broken by an impact, the IC chip can continue to operate.
  • the display panel according to the present invention includes the above-described IC chip mounted on a substrate, and the substrate includes the first electrode and the second electrode via the first electrode. A wiring for electrically connecting the circuit and the second circuit is formed.
  • the first circuit and the second circuit when an impact that causes cracking of the IC chip mounted on the display panel due to dropping of the display panel or the like is applied to the IC chip, between the first circuit and the second circuit, Since a crack occurs in a region where no circuit is formed, the first circuit and the second circuit itself can be prevented from cracking. Further, since the first circuit and the second circuit are electrically connected to each other outside the IC chip by wiring formed on the substrate, the first circuit and the second circuit are connected to each other. Even if cracking occurs, the electrical connection between the first circuit and the second circuit is maintained. Thereby, even if the IC chip is broken, the IC chip can continue to operate, and the display panel can continue to function.
  • the display module according to the present invention has the above-described display panel in order to solve the above-described problems.
  • the display module can be continuously lit.
  • the weak part is formed in the chip body in the region where the circuit is not formed between the two circuits. Therefore, even when an impact is applied to the IC chip and the IC chip itself is cracked, the IC chip itself is cracked from the fragile portion, so that the IC chip is broken in a region where no circuit is formed. As a result, the circuit can be prevented from being broken and the operation can be continued.
  • FIG. 2 is a perspective view of the liquid crystal driving IC shown in FIG. 1 as viewed from above.
  • FIG. 2 is a perspective view of a liquid crystal driving IC different from the liquid crystal driving IC shown in FIG. 1 as viewed from above.
  • FIG. 2 is a top view of the liquid crystal panel part which shows a part of liquid crystal display module which concerns on one Embodiment of this invention.
  • FIGS. 1 to 6 An embodiment of the present invention will be described with reference to FIGS. 1 to 6 as follows.
  • FIG. 2 is a perspective view illustrating a schematic configuration of the liquid crystal display module 10.
  • a liquid crystal display module 10 includes a liquid crystal panel (display panel) 1 on which a liquid crystal driving IC (IC chip) 2 is mounted, a circuit board 3 that transmits signals to the liquid crystal panel 1, and a liquid crystal panel. 1 is provided with a surface light emitting device 4 for irradiating light from the back side. The surface light-emitting device 4 is equipped with one or more LEDs as light sources.
  • the liquid crystal display module 10 further includes a circuit board 5 for causing the LEDs to emit light. As the circuit board 5, a flexible printed circuit board (FPC) can be used.
  • FPC flexible printed circuit board
  • FIG. 1 is a cross-sectional view showing a schematic configuration of a liquid crystal driving IC 2 according to an embodiment of the present invention.
  • a plurality of circuits specifically, two circuits (first circuit and second circuit) 22a and 22b are formed inside the IC chip body 21. Yes.
  • the circuits 22 a and 22 b are physically and electrically separated inside the IC chip body 21.
  • the circuits 22 a and 22 b are electrically connected through wiring on the liquid crystal panel 1 outside the IC chip body 21.
  • the circuits 22a and 22b are formed so that no circuit exists at the center of the liquid crystal driving IC 2.
  • the side on which the circuit is formed is defined as a bottom surface portion 27, and the side surface portion 26 and the top surface portion 25 are defined with reference to the bottom surface portion 27.
  • FIG. 3A is a perspective view of the liquid crystal driving IC 2 as seen from above.
  • the groove 23 is formed in the upper surface portion 25 of the IC chip body 21 along a direction orthogonal to the longitudinal direction of the IC chip body 21 (the direction indicated by the arrow A in the drawing). And it is extended from the boundary with one side part 26 to the boundary with the opposite side part 26.
  • the “orthogonal direction” is a direction that is substantially orthogonal as long as an effect equivalent to the effect in the completely orthogonal direction can be obtained in addition to the completely orthogonal direction.
  • the groove 23 is for inducing a place where a crack occurs when an impact causing the crack is applied to the liquid crystal driving IC 2. That is, when an impact that causes cracking is applied to the liquid crystal driving IC 2, the crack can be caused at a location where the groove 23 is provided.
  • the wiring that electrically connects the circuit 22 a and the circuit 22 b is provided outside the liquid crystal driving IC 2, specifically, on the substrate of the liquid crystal panel 1. Therefore, even if the liquid crystal driving IC 2 breaks and a crack occurs between the circuit 22a and the circuit 22b, the electrical connection between the circuit 22a and the circuit 22b can be maintained.
  • the grooves 23 can be formed by half-cutting in the middle of the depth direction during the dicing step of cutting individual liquid crystal drive ICs 2 from the wafer during the manufacturing process of the liquid crystal drive ICs 2.
  • the groove 23 may be formed on the side surface portion 26 of the IC chip body 21 instead of the upper surface portion 25 of the IC chip body 21.
  • FIG. 3B is a perspective view of the liquid crystal driving IC 2 as viewed from above, and shows a case where the groove 23 is formed in the side surface portion 26 of the IC chip main body 21. In FIG. 3 b, the groove 23 is formed on both side portions 26, but it may be formed on either one. When the groove 23 is formed in any one of the side surface portions 26, it is preferable that the groove 23 is formed in the side surface portion 26 positioned on the display portion side of the liquid crystal panel 1.
  • FIG. 4 is a cross-sectional view of another embodiment of the liquid crystal driving IC 2. As shown in FIG. 4, the circuit portion of the liquid crystal driving IC 2 is divided into three circuits 22a, 22b and 22c, and a groove 23 is formed in the upper surface portion 25 of the IC chip body 21 between the circuits. May be. When the circuit portion is divided into three, the number of grooves 23 is two.
  • the liquid crystal driving IC has the maximum amount of deflection at the central portion thereof, in the liquid crystal driving IC in which the groove 23 is not formed, a crack is likely to occur at the central portion of the liquid crystal driving IC.
  • the groove 23 at a location other than the central portion of the liquid crystal driving IC 2, it is possible to intentionally guide the location where the crack occurs to a location other than the central portion of the liquid crystal driving IC 2.
  • FIG. 7A is a top view of a liquid crystal display module 100 on which a conventional driver (liquid crystal driving IC) 102 is mounted, and FIGS. 7B and 7C show cross sections of the driver 102 in FIG. 7A. Therefore, members other than the driver 102 are not shown.
  • the conventional driver 102 has a single circuit 122 formed inside the driver body 121.
  • FIG. 7c is a cross-sectional view showing a state where an impact is applied to the driver 102 and the driver 102 shown in FIG. 7b is cracked.
  • an impact is also applied to the driver 102.
  • the driver 102 is cracked from the vicinity of the center of the driver main body 121 as shown in FIG. 7c.
  • the circuit 122 is also broken at the same location. Therefore, the driver 102 is not driven due to a crack 124 in the circuit portion.
  • FIG. 10 is a cross-sectional view when the driver 102 in which a reinforcing layer 126 such as a passivation film is formed on a conventional liquid crystal driving IC is cracked. As shown in FIG. 10, even if the reinforcing layer 126 is provided, if a stronger impact is applied and a crack 124 occurs in the driver 102, the circuit portion is divided. As a result, the driver 102 is not driven.
  • a reinforcing layer 126 such as a passivation film
  • FIG. 5a is a view of the liquid crystal panel 1 on which the liquid crystal driving IC 2 is mounted as viewed from above
  • FIG. 5b is a diagram showing a cross section of the liquid crystal driving IC 2 in FIG. 5a. The other members are not shown.
  • the two circuits 22a and 22b are formed in the IC chip body 21 apart from each other. Further, a groove 23 is formed in the upper surface portion 25 of the IC chip body 21 in a region where the circuit between the circuits 22a and 22b is not formed.
  • FIG. 5C is a cross-sectional view showing a state where an impact is applied to the liquid crystal driving IC 2 and the liquid crystal driving IC 2 shown in FIG. 5B is cracked.
  • the impact is also applied to the liquid crystal driving IC 2, and a crack 24 is generated in the liquid crystal driving IC 2.
  • a crack 24 is generated at a location where the groove 23 is formed.
  • FIG. 5c even if a crack 24 occurs in the portion where the groove 23 is formed, no circuit is formed in this portion, so that no crack 24 occurs in the circuit itself in the liquid crystal driving IC 2. .
  • FIG. 6 is an enlarged perspective view showing a portion on which the liquid crystal driving IC 2 is mounted when the liquid crystal panel 1 on which the liquid crystal driving IC 2 is mounted is viewed from above.
  • three circuits 22 a, 22 b and 22 c are separately formed inside the IC chip body 21.
  • the three circuits 22a to 22c can be, for example, a booster circuit, a source circuit, and a gate circuit.
  • an input signal wiring 11 for transmitting an input signal from the circuit board 3 to the circuits 22a to 22c and an output signal wiring 12 for transmitting an output signal for driving the liquid crystal from the circuits 22a to 22c are provided. It has been.
  • the input signal wiring 11 and the output signal wiring 12 are electrically connected to the internal circuits 22a to 22c through the electrodes of the liquid crystal driving IC 2.
  • connection wirings 13a to 13d for electrically connecting the circuits 22a to 22c are further provided.
  • the connection wirings 13a to 13d are electrically connected to electrodes (first electrode and second electrode) (not shown) of the circuits 22a to 22c formed on the surface of the liquid crystal driving IC 2, such as bumps. .
  • the circuits 22a to 22c are electrically connected to each other.
  • Wiring 13c and communication wiring 13d for transmitting signals from circuits 22c to 22b are provided, and are connected to circuit 22a, circuit 22b, or circuit 22c, respectively.
  • the circuit 22a and the circuit 22c are not directly connected to each other via the connection wirings 13a to 13d, but are electrically connected via the circuit 22b.
  • Each wiring may use a transparent electrode such as ITO (Indium Tin Oxide).
  • connection wirings 13a to 13d are formed at a position protruding from the liquid crystal driving IC 2 when the liquid crystal panel 1 is viewed from the upper surface.
  • it may be formed so as to be completely hidden under the liquid crystal driving IC 2.
  • circuit 22a and the circuit 22b are connected by the connection wirings 13a and 13b, and if the circuit 22b and the circuit 22c are further connected by the connection wirings 13c and 13d, the circuit 22a and the circuit 22c are directly connected by the connection wiring. Even if not, the circuit 22a and the circuit 22c are electrically connected.
  • the liquid crystal panel 1 When an impact is applied to the liquid crystal panel 1 and the liquid crystal driving IC 2 is cracked, the liquid crystal panel 1 is cracked from the groove 23 provided between the circuit 22a and the circuit 22b or from the groove 23 provided between the circuit 22b and the circuit 22c. It will be. If a crack is generated from the groove 23 provided between the circuit 22a and the circuit 22b, the IC chip body 21 is cracked between the circuit 22a and the circuit 22b, and the circuit 22a itself and the circuit 22b itself are physically separated. Can be prevented from cracking. Further, the electrical connection between the circuit 22a and the circuit 22b is made through connection wirings 13a and 13b on the liquid crystal panel 1 which is outside the IC chip body 21. Therefore, even if the liquid crystal driving IC 2 is cracked, the electrical connection between the circuits can be maintained unless the liquid crystal panel 1 itself is cracked, and the liquid crystal driving IC 2 is maintained in an operable state.
  • FIG. 8 is a diagram showing wiring in the conventional liquid crystal panel 101.
  • the input signal wiring 111 and the output signal wiring 112 on the liquid crystal panel 101 are connected to a single circuit 122.
  • the wiring corresponding to the connection wirings 13a to 13d formed in the liquid crystal panel 1 according to the present invention is not provided.
  • the driver 102 is broken and the circuit 122 is divided into a plurality of parts, the divided circuits are also electrically separated. Therefore, it cannot function as a driver.
  • the circuit 22a and the circuit 22b are formed in separate liquid crystal driving ICs, and the center position of the liquid crystal display module is used by using the liquid crystal driving IC including the circuit 22a and the liquid crystal driving IC including the circuit 22b. It is also possible to suppress the frequency of occurrence of cracks by arranging the components while avoiding the above. However, in this case, the member cost increases, and the tact time during production increases. In addition, since the number of liquid crystal driving ICs to be bonded increases, the yield increases due to loss due to the bonding.
  • the liquid crystal driving IC 2 is a single liquid crystal driving IC
  • the liquid crystal driving IC 2 can be mounted on the liquid crystal panel 1 by a single press, and can be manufactured at the current member cost and production tact. In addition, an increase in yield due to loss due to crimping can be suppressed.
  • the liquid crystal driving IC 2 in which all the circuits in the IC chip main body 21 are electrically connected to each other via external wiring has been described.
  • the LED controller May have an electrically independent circuit having another function.
  • the fragile portion is a groove formed on the surface of the chip body from the viewpoint of easy manufacture.
  • the groove is formed on the upper surface portion of the chip body when the side on which the plurality of circuits are formed is the bottom surface portion of the chip body. It is preferable that
  • the crack when an impact that causes cracking of the IC chip is applied to the IC chip, the crack can be more reliably generated from the fragile portion.
  • the groove is formed along a direction orthogonal to the longitudinal direction of the chip body.
  • the “orthogonal direction” is a direction that is substantially orthogonal as long as an effect equivalent to the effect in the completely orthogonal direction can be obtained in addition to the completely orthogonal direction. Also included.
  • the crack when an impact that causes cracking of the IC chip is applied to the IC chip, the crack can be more reliably generated along the groove.
  • the present invention can be used for a small mobile device equipped with a display module having a liquid crystal driving IC such as a mobile phone.
  • Liquid crystal panel (display panel) 2 Liquid crystal drive IC (IC chip) 3 Circuit board 4 Surface light emitting device 5 Circuit board 10 Liquid crystal display module (display module) 11 Input signal wiring 12 Output signal wiring 13a to 13d Connection wiring (wiring) 21 IC chip body (chip body) Circuits 22a to 22c (first circuit, second circuit) 23 Groove (fragile part) 24 cracks 25 top surface 26 side surface 27 bottom surface

Abstract

Provided is an IC chip which can operate even when the IC chip is divided. The IC chip is provided with a plurality of circuits which are physically and electrically separated from each other in a chip main body (21). Each of the circuit (22a) and the circuit (22b) among the circuits has a first electrode and a second electrode for electrically connecting the electrodes to each other via connecting wiring lines (13a, 13b) provided outside of the chip main body (21), and on the surface of the chip main body (21) in the region having no circuit formed thereon between the circuit (22a) and the circuit (22b), a groove (23) which leads the chip main body (21) to be divided is formed.

Description

ＩＣチップ、表示パネルおよび表示モジュールIC chip, display panel and display module
　本発明は、ＩＣチップ、当該ＩＣチップを搭載した表示パネル、および当該表示パネルを搭載した表示モジュールに関する。 The present invention relates to an IC chip, a display panel on which the IC chip is mounted, and a display module on which the display panel is mounted.
　携帯電話機および携帯パーソナルコンピュータなどの電子機器には、小型液晶モジュールが搭載されている。この液晶モジュールには、液晶モジュールを駆動するためのドライバが搭載されている。近年、コストダウンを目的として、ドライバのシュリンク化が進んでいる。しかしながらシュリンク化によって、ドライバ自体の機械的強度すなわち抗折強度も低下している。そのため、小型液晶モジュールが搭載された電子機器を落としたときに、落下時の衝撃によりドライバが割れてしまうといった現象が生じてきている。 Electronic devices such as mobile phones and mobile personal computers are equipped with small liquid crystal modules. A driver for driving the liquid crystal module is mounted on the liquid crystal module. In recent years, drivers are shrinking for the purpose of cost reduction. However, due to shrinking, the mechanical strength, that is, the bending strength of the driver itself is also lowered. For this reason, when an electronic device on which a small liquid crystal module is mounted is dropped, a phenomenon has occurred in which the driver is broken due to an impact at the time of dropping.
　図７ａ～図７ｃはそれぞれ、従来の液晶表示モジュール１００の一部を表した図であり、図７ａは従来の液晶駆動用のドライバ１０２が搭載された液晶パネル１０１の上面図であり、図７ｂおよび図７ｃはドライバ１０２の断面を模式的に表した図であり、図７ｂはドライバ１０２が割れる前、図７ｃはドライバ１０２が割れてしまった後を示している。図７ｃに示すように、ドライバ１０２に割れ１２４が生じると、ドライバ１０２のドライバ本体１２１およびドライバ本体１２１の内部にある回路１２２も割れてしまう。そのため、ドライバ１０２が割れるとドライバ１０２は駆動しなくなり、液晶表示モジュールが点灯せず、不良品となってしまう。 7a to 7c are views showing a part of the conventional liquid crystal display module 100, and FIG. 7a is a top view of the liquid crystal panel 101 on which the driver 102 for driving the conventional liquid crystal is mounted. FIGS. 7c and 7c are diagrams schematically showing a cross section of the driver 102. FIG. 7b shows the driver 102 before breaking, and FIG. 7c shows the driver 102 after cracking. As shown in FIG. 7c, when a crack 124 occurs in the driver 102, the driver main body 121 of the driver 102 and the circuit 122 inside the driver main body 121 are also cracked. Therefore, if the driver 102 is cracked, the driver 102 will not be driven, and the liquid crystal display module will not light up, resulting in a defective product.
　ところで、液晶駆動用ＩＣチップの割れを防止する目的とした、基板の両面にパッシベーション膜が形成されているＩＣチップが特許文献１に開示されている。 Incidentally, Patent Document 1 discloses an IC chip in which a passivation film is formed on both surfaces of a substrate for the purpose of preventing cracking of the liquid crystal driving IC chip.
　図９ａおよび図９ｂはそれぞれ、特許文献１に記載のＩＣチップ２００の構造を模式的に表す断面図である。図９ａに示すように、基板２０１の一方の面のみにパッシベーション膜２０２が形成されているＩＣチップ２００では、基板２０１とパッシベーション膜２０２との熱膨張係数の違いにより反りが生じてしまう。これにより、パッシベーション膜２０２に亀裂が生じたり、ＩＣチップ２００が割れてしまったりしていた。これに対し、図９ｂに示されるＩＣチップ２００では、基板２０１の両面にパッシベーション膜２０２が形成されている。これにより、ダイシングおよび圧着の際にＩＣチップ２００にかかるストレスが軽減され、ＩＣチップ２００に亀裂が生じたり、割れが生じたりすることを低減させている。 9a and 9b are cross-sectional views schematically showing the structure of the IC chip 200 described in Patent Document 1, respectively. As shown in FIG. 9a, in the IC chip 200 in which the passivation film 202 is formed only on one surface of the substrate 201, warpage occurs due to the difference in thermal expansion coefficient between the substrate 201 and the passivation film 202. As a result, the passivation film 202 is cracked or the IC chip 200 is cracked. On the other hand, in the IC chip 200 shown in FIG. 9B, the passivation film 202 is formed on both surfaces of the substrate 201. Thereby, stress applied to the IC chip 200 during dicing and pressure bonding is reduced, and the occurrence of cracks or cracks in the IC chip 200 is reduced.
日本国公開特許公報「特開２００３－２９５７８４号公報（２００３年１０月１５日公開）」Japanese Patent Publication “Japanese Patent Laid-Open No. 2003-295784 (published on Oct. 15, 2003)”
　しかしながら、ドライバのシュリンク化が進むにつれ、ドライバ自体の機械的強度はますます低下しており、パッシベーション膜による補強を施したとしても、ドライバ自体の強度の向上には限界がある。 However, as the driver shrinks, the mechanical strength of the driver itself is further reduced, and there is a limit to improving the strength of the driver itself even if reinforcement by a passivation film is applied.
　そこで、本発明は上記の問題点に鑑みてなされたものであり、その目的は、割れても液晶駆動に影響を及ぼさないＩＣチップを提供することにある。 Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide an IC chip that does not affect the liquid crystal drive even if it is cracked.
　本発明に係るＩＣチップは、上記課題を解決するために、チップ本体の内部において互いに物理的および電気的に分かれている複数の回路を備えており、上記複数の回路のうちの第１の回路および第２の回路はそれぞれ、上記チップ本体の外部に設けられる配線を介してお互いを電気的に接続するための第１電極および第２電極を上記チップ本体の表面に有しており、上記第１の回路と上記第２の回路との間の、回路が形成されていない領域における上記チップ本体の表面には、上記チップ本体の割れを誘導する脆弱部が形成されている構成である。 In order to solve the above problems, an IC chip according to the present invention includes a plurality of circuits that are physically and electrically separated from each other inside the chip body, and a first circuit among the plurality of circuits. Each of the second circuit and the second circuit has a first electrode and a second electrode on the surface of the chip body for electrically connecting each other through a wiring provided outside the chip body. A brittle portion that induces cracking of the chip body is formed on the surface of the chip body in a region where no circuit is formed between the first circuit and the second circuit.
　なお、「外部に設けられる配線を介して」は、外部に設けられる配線を介していればよいことを意図しており、外部に設けられる配線と、さらに別の回路とを介して電気的に接続する場合も含む。 Note that “through an externally provided wiring” is intended to be provided through an externally provided wiring and is electrically connected via an externally provided wiring and another circuit. Including the case of connection.
　上記構成によれば、ＩＣチップの内部には、互いに物理的および電気的に分かれている複数の回路が設けられている。複数の回路のうちの第１の回路はチップ本体の表面に第１電極を有しており、第２の回路はチップ本体の表面に第２電極を有している。これら第１電極および第２電極は、ＩＣチップが搭載される基板上の配線など、ＩＣチップの外部に設けられる配線と接続される。これにより、第１の回路と第２の回路とが電気的に接続される。さらに、ＩＣチップの本体には、チップ本体の割れを誘導する脆弱部が形成されている。ＩＣチップの割れを引き起こすような衝撃がＩＣチップに加わった場合には、ＩＣチップ本体の脆弱部において割れが生じるようになる。この脆弱部は、第１の回路と第２の回路との間の、回路が形成されていない領域におけるチップ本体の表面に形成されている。そのため、脆弱部から割れが引き起こされると、第１の回路と第２の回路との間の、回路が形成されていない領域においてＩＣチップが割れるため、回路そのものが割れることを防ぐことができる。さらに、第１の回路と第２の回路とは、ＩＣチップ本体内部ではもともと電気的に分かれている。そのため、回路間に割れが生じても、回路内部における電気的な接続が分断されるといった事態は生じない。なお、このとき回路どうしは、ＩＣチップ本体外部の配線を通じて電気的に接続された状態を維持できる。したがって、本発明に係るＩＣチップによれば、衝撃によりＩＣチップが割れたとしても、ＩＣチップは引き続き動作可能である。 According to the above configuration, a plurality of circuits that are physically and electrically separated from each other are provided inside the IC chip. The first circuit of the plurality of circuits has a first electrode on the surface of the chip body, and the second circuit has a second electrode on the surface of the chip body. These first electrode and second electrode are connected to wiring provided outside the IC chip, such as wiring on a substrate on which the IC chip is mounted. Thereby, the first circuit and the second circuit are electrically connected. Furthermore, the weak part which induces the crack of a chip main body is formed in the main body of an IC chip. When an impact that causes cracking of the IC chip is applied to the IC chip, cracking occurs in the fragile portion of the IC chip body. The fragile portion is formed on the surface of the chip body in a region where the circuit is not formed between the first circuit and the second circuit. Therefore, when a crack is caused from the fragile portion, the IC chip is cracked in a region where the circuit is not formed between the first circuit and the second circuit, so that the circuit itself can be prevented from being cracked. Furthermore, the first circuit and the second circuit are originally electrically separated inside the IC chip body. For this reason, even if a crack occurs between the circuits, the electrical connection in the circuit is not broken. At this time, the circuits can be maintained in an electrically connected state through wiring outside the IC chip body. Therefore, according to the IC chip according to the present invention, even if the IC chip is broken by an impact, the IC chip can continue to operate.
　本発明に係る表示パネルは、上記課題を解決するために、上述のＩＣチップが基板上に搭載されており、上記基板には、上記第１電極および上記第２電極を介して上記第１の回路と上記第２の回路とを電気的に接続する配線が形成されている構成である。 In order to solve the above-described problems, the display panel according to the present invention includes the above-described IC chip mounted on a substrate, and the substrate includes the first electrode and the second electrode via the first electrode. A wiring for electrically connecting the circuit and the second circuit is formed.
　上記構成によれば、表示パネルの落下などにより、表示パネルに搭載されているＩＣチップの割れを引き起こす衝撃がＩＣチップに加えられたとき、第１の回路と第２の回路との間の、回路が形成されていない領域において割れが生じるため、第１の回路および第２の回路自体が割れることを防ぐことができる。また、第１の回路と第２の回路とは、基板上に形成されている配線によりＩＣチップの外部で互いに電気的に接続されているため、第１の回路と第２の回路との間で割れが生じても、第１の回路と第２の回路との電気的接続が維持される。これにより、ＩＣチップが割れたとしても、ＩＣチップは引き続き動作可能であり、表示パネルも引き続き、機能し得る。 According to the above configuration, when an impact that causes cracking of the IC chip mounted on the display panel due to dropping of the display panel or the like is applied to the IC chip, between the first circuit and the second circuit, Since a crack occurs in a region where no circuit is formed, the first circuit and the second circuit itself can be prevented from cracking. Further, since the first circuit and the second circuit are electrically connected to each other outside the IC chip by wiring formed on the substrate, the first circuit and the second circuit are connected to each other. Even if cracking occurs, the electrical connection between the first circuit and the second circuit is maintained. Thereby, even if the IC chip is broken, the IC chip can continue to operate, and the display panel can continue to function.
　本発明に係る表示モジュールは、上記課題を解決するために、上述の表示パネルを備えている構成である。 The display module according to the present invention has the above-described display panel in order to solve the above-described problems.
　上記構成によれば、表示モジュールまたは表示モジュールを搭載した機器が落下して、ＩＣチップが割れたとしても、表示モジュールは引き続き点灯可能である。 According to the above configuration, even if the display module or the device on which the display module is mounted is dropped and the IC chip is broken, the display module can be continuously lit.
　以上のように、本発明に係るＩＣチップは、２つの回路の間の、回路が形成されていない領域においてチップ本体に脆弱部が形成されている。そのため、ＩＣチップに衝撃が加わりＩＣチップ自体が割れたときでも、脆弱部からＩＣチップ自体の割れが誘導されるため、回路が形成されていない領域においてＩＣチップが割れることとなる。そのため、回路の割れを防ぐことができ、引き続き動作できるという効果を奏する。 As described above, in the IC chip according to the present invention, the weak part is formed in the chip body in the region where the circuit is not formed between the two circuits. Therefore, even when an impact is applied to the IC chip and the IC chip itself is cracked, the IC chip itself is cracked from the fragile portion, so that the IC chip is broken in a region where no circuit is formed. As a result, the circuit can be prevented from being broken and the operation can be continued.
本発明の一実施形態に係る液晶駆動用ＩＣの概略構成を示す断面図である。It is sectional drawing which shows schematic structure of IC for liquid crystal drive which concerns on one Embodiment of this invention. 本発明の一実施形態に係る液晶表示モジュールの詳細構成を示す斜視図である。It is a perspective view which shows the detailed structure of the liquid crystal display module which concerns on one Embodiment of this invention. 図１に示す液晶駆動用ＩＣを上面から見た透視図である。FIG. 2 is a perspective view of the liquid crystal driving IC shown in FIG. 1 as viewed from above. 図１に示す液晶駆動用ＩＣとは別の液晶駆動用ＩＣを上面から見た透視図である。FIG. 2 is a perspective view of a liquid crystal driving IC different from the liquid crystal driving IC shown in FIG. 1 as viewed from above. さらに別の実施形態に係る液晶駆動用ＩＣの概略構成を示す断面図である。It is sectional drawing which shows schematic structure of IC for liquid crystal drive which concerns on another embodiment. 本発明の一実施形態に係る液晶表示モジュールの一部分を示す、液晶パネル部分の上面図である。It is a top view of the liquid crystal panel part which shows a part of liquid crystal display module which concerns on one Embodiment of this invention. 本発明の一実施形態に係る液晶表示モジュールの一部分を示す、液晶駆動用ＩＣ部分の断面図である。It is sectional drawing of the IC part for liquid crystal drive which shows a part of liquid crystal display module which concerns on one Embodiment of this invention. 本発明の一実施形態に係る液晶表示モジュールの一部分を示す、液晶駆動用ＩＣ部分の断面図である。It is sectional drawing of the IC part for liquid crystal drive which shows a part of liquid crystal display module which concerns on one Embodiment of this invention. 本発明の一実施形態に係る液晶パネルの配線を示す図である。It is a figure which shows the wiring of the liquid crystal panel which concerns on one Embodiment of this invention. 従来の液晶表示モジュールの一部分を示す、液晶パネル部分の上面図である。It is a top view of the liquid crystal panel part which shows a part of conventional liquid crystal display module. 従来の液晶表示モジュールの一部分を示す、液晶駆動用ＩＣ部分の断面図である。It is sectional drawing of the IC part for liquid crystal drive which shows a part of conventional liquid crystal display module. 従来の液晶表示モジュールの一部分を示す、液晶駆動用ＩＣ部分の断面図である。It is sectional drawing of the IC part for liquid crystal drive which shows a part of conventional liquid crystal display module. 従来の液晶パネルの配線を示す図である。It is a figure which shows the wiring of the conventional liquid crystal panel. 従来技術に係るＩＣチップの構成を示す概略断面図であって、基板の一方の面のみにパッシベーション膜が形成されている従来のＩＣチップを示す図である。It is a schematic sectional drawing which shows the structure of the IC chip based on a prior art, Comprising: It is a figure which shows the conventional IC chip in which the passivation film is formed only in one side of the board | substrate. 従来技術に係るＩＣチップの構成を示す概略断面図であって、基板の両方の面にパッシベーション膜が形成されている従来のＩＣチップを示す図である。It is a schematic sectional drawing which shows the structure of the IC chip based on a prior art, Comprising: It is a figure which shows the conventional IC chip in which the passivation film is formed in the both surfaces of a board | substrate. 従来技術に係るＩＣチップの割れた状態を示す断面図である。It is sectional drawing which shows the state which the IC chip based on a prior art broke.
　本発明の一実施形態について、図１～図６に基づいて説明すれば以下の通りである。 An embodiment of the present invention will be described with reference to FIGS. 1 to 6 as follows.
　まず、本実施の形態に係る液晶表示モジュール１０の概略構成について、図２を参照して説明する。図２は、液晶表示モジュール１０の概略構成を表す斜視図である。図２に示すように、液晶表示モジュール１０は、液晶駆動用ＩＣ（ＩＣチップ）２が搭載された液晶パネル（表示パネル）１と、液晶パネル１に信号を伝送する回路基板３と、液晶パネル１に対し背面より光を照射するための面発光装置４とを備えている。面発光装置４は光源となるＬＥＤを１個以上搭載している。液晶表示モジュール１０は、さらに、ＬＥＤを発光させるための回路基板５を備えている。回路基板５としては、フレキシブルプリント基板（ＦＰＣ）を用いることができる。 First, a schematic configuration of the liquid crystal display module 10 according to the present embodiment will be described with reference to FIG. FIG. 2 is a perspective view illustrating a schematic configuration of the liquid crystal display module 10. As shown in FIG. 2, a liquid crystal display module 10 includes a liquid crystal panel (display panel) 1 on which a liquid crystal driving IC (IC chip) 2 is mounted, a circuit board 3 that transmits signals to the liquid crystal panel 1, and a liquid crystal panel. 1 is provided with a surface light emitting device 4 for irradiating light from the back side. The surface light-emitting device 4 is equipped with one or more LEDs as light sources. The liquid crystal display module 10 further includes a circuit board 5 for causing the LEDs to emit light. As the circuit board 5, a flexible printed circuit board (FPC) can be used.
　次に、液晶駆動用ＩＣ２の構成について図１を参照して説明する。図１は本発明の一実施形態に係る液晶駆動用ＩＣ２の概略構成を示す断面図である。図１に示すように、液晶駆動用ＩＣ２には、ＩＣチップ本体２１の内部に複数の回路、具体的には２つの回路（第１の回路、第２の回路）２２ａ、２２ｂが形成されている。回路２２ａと２２ｂとは、ＩＣチップ本体２１の内部においては物理的および電気的に分かれている。ただし、後述するように、回路２２ａと２２ｂとは、ＩＣチップ本体２１の外部にある液晶パネル１上の配線を通じて電気的に接続されている。回路２２ａおよび２２ｂは、液晶駆動用ＩＣ２の中央部に回路が存在しないように形成されている。なお、本明細書では、ＩＣチップ本体２１において、回路が形成されている側を底面部２７とし、この底面部２７を基準として側面部２６および上面部２５を定義する。 Next, the configuration of the liquid crystal driving IC 2 will be described with reference to FIG. FIG. 1 is a cross-sectional view showing a schematic configuration of a liquid crystal driving IC 2 according to an embodiment of the present invention. As shown in FIG. 1, in the liquid crystal driving IC 2, a plurality of circuits, specifically, two circuits (first circuit and second circuit) 22a and 22b are formed inside the IC chip body 21. Yes. The circuits 22 a and 22 b are physically and electrically separated inside the IC chip body 21. However, as will be described later, the circuits 22 a and 22 b are electrically connected through wiring on the liquid crystal panel 1 outside the IC chip body 21. The circuits 22a and 22b are formed so that no circuit exists at the center of the liquid crystal driving IC 2. In this specification, in the IC chip main body 21, the side on which the circuit is formed is defined as a bottom surface portion 27, and the side surface portion 26 and the top surface portion 25 are defined with reference to the bottom surface portion 27.
　回路２２ａと２２ｂとの間の回路が形成されていない部分において、ＩＣチップ本体２１の上面部２５の表面には、その断面形状がＶ字状である溝（脆弱部）２３が設けられている。図３ａは、液晶駆動用ＩＣ２を上面から見た透視図である。図３ａに示すように、溝２３は、ＩＣチップ本体２１の上面部２５において、ＩＣチップ本体２１の長手方向（図中の矢印Ａが示す方向）と直交する方向に沿って形成されており、かつ一方の側面部２６との境界から反対の側面部２６との境界まで延設されている。なお、ここで「直交する方向」とは、完全に直交する方向のほかに、完全に直交する方向の場合に奏する効果と同等の効果を奏することができれば、実質的に直交する方向である場合も含むものである。溝２３は、割れを引き起こす衝撃が液晶駆動用ＩＣ２に加わった際に、割れが生じる場所を誘導するためのものである。すなわち、割れを引き起こす衝撃が液晶駆動用ＩＣ２に加わった際に、溝２３が設けられている場所において割れを引き起こさせることができる。後述のように、回路２２ａと回路２２ｂとを電気的に結ぶ配線は、液晶駆動用ＩＣ２の外部、具体的には液晶パネル１の基板上に設けられている。そのため、液晶駆動用ＩＣ２が割れ、回路２２ａと回路２２ｂとの間に割れが生じたとしても、回路２２ａと回路２２ｂとの間の電気的接続を維持できる。 In a portion where the circuit between the circuits 22a and 22b is not formed, a groove (fragile portion) 23 whose cross-sectional shape is V-shaped is provided on the surface of the upper surface portion 25 of the IC chip body 21. . FIG. 3A is a perspective view of the liquid crystal driving IC 2 as seen from above. As shown in FIG. 3a, the groove 23 is formed in the upper surface portion 25 of the IC chip body 21 along a direction orthogonal to the longitudinal direction of the IC chip body 21 (the direction indicated by the arrow A in the drawing). And it is extended from the boundary with one side part 26 to the boundary with the opposite side part 26. In this case, the “orthogonal direction” is a direction that is substantially orthogonal as long as an effect equivalent to the effect in the completely orthogonal direction can be obtained in addition to the completely orthogonal direction. Is also included. The groove 23 is for inducing a place where a crack occurs when an impact causing the crack is applied to the liquid crystal driving IC 2. That is, when an impact that causes cracking is applied to the liquid crystal driving IC 2, the crack can be caused at a location where the groove 23 is provided. As will be described later, the wiring that electrically connects the circuit 22 a and the circuit 22 b is provided outside the liquid crystal driving IC 2, specifically, on the substrate of the liquid crystal panel 1. Therefore, even if the liquid crystal driving IC 2 breaks and a crack occurs between the circuit 22a and the circuit 22b, the electrical connection between the circuit 22a and the circuit 22b can be maintained.
　溝２３は、液晶駆動用ＩＣ２の製造過程において、ウェハから個々の液晶駆動用ＩＣ２を切り出すダイシング工程の際に、深さ方向の途中まで切り込みを入れるハーフカットによって形成することができる。 The grooves 23 can be formed by half-cutting in the middle of the depth direction during the dicing step of cutting individual liquid crystal drive ICs 2 from the wafer during the manufacturing process of the liquid crystal drive ICs 2.
　なお、溝２３は、ＩＣチップ本体２１の上面部２５ではなく、ＩＣチップ本体２１の側面部２６に形成されているものであってもよい。図３ｂは、液晶駆動用ＩＣ２を上面から見た透視図であり、溝２３がＩＣチップ本体２１の側面部２６に形成されている場合を示している。図３ｂでは、溝２３は両方の側面部２６に形成されているが何れか一方に形成されているものであってもよい。何れか一方の側面部２６に溝２３が形成されている場合には、液晶パネル１の表示部側に位置する側面部２６に形成されることが好ましい。 The groove 23 may be formed on the side surface portion 26 of the IC chip body 21 instead of the upper surface portion 25 of the IC chip body 21. FIG. 3B is a perspective view of the liquid crystal driving IC 2 as viewed from above, and shows a case where the groove 23 is formed in the side surface portion 26 of the IC chip main body 21. In FIG. 3 b, the groove 23 is formed on both side portions 26, but it may be formed on either one. When the groove 23 is formed in any one of the side surface portions 26, it is preferable that the groove 23 is formed in the side surface portion 26 positioned on the display portion side of the liquid crystal panel 1.
　本実施の形態に示す液晶駆動用ＩＣ２では、回路部分が回路２２ａおよび２２ｂの２つに分かれており、溝２３が回路２２ａと２２ｂとの間の１箇所のみに形成されている。回路および溝の数はこれに限定されるものではない。図４は液晶駆動用ＩＣ２の別の実施形態における断面図である。図４に示すように、液晶駆動用ＩＣ２は、回路部分が回路２２ａ、２２ｂおよび２２ｃの３つに分かれており、各回路の間におけるＩＣチップ本体２１の上面部２５に溝２３が形成されていてもよい。回路部分が３つに分かれている場合には、溝２３の数は２つになる。なお、液晶駆動用ＩＣはその中央部においてたわみ量が最大となるため、溝２３が形成されていない液晶駆動用ＩＣでは、液晶駆動用ＩＣの中央部において割れが生じ易い。しかしながら、溝２３を液晶駆動用ＩＣ２の中央部以外の場所に設けることによって、割れが生じる場所を液晶駆動用ＩＣ２の中央部以外の場所に意図的に誘導できる。 In the liquid crystal driving IC 2 shown in the present embodiment, the circuit portion is divided into two circuits 22a and 22b, and the groove 23 is formed only at one location between the circuits 22a and 22b. The number of circuits and grooves is not limited to this. FIG. 4 is a cross-sectional view of another embodiment of the liquid crystal driving IC 2. As shown in FIG. 4, the circuit portion of the liquid crystal driving IC 2 is divided into three circuits 22a, 22b and 22c, and a groove 23 is formed in the upper surface portion 25 of the IC chip body 21 between the circuits. May be. When the circuit portion is divided into three, the number of grooves 23 is two. Since the liquid crystal driving IC has the maximum amount of deflection at the central portion thereof, in the liquid crystal driving IC in which the groove 23 is not formed, a crack is likely to occur at the central portion of the liquid crystal driving IC. However, by providing the groove 23 at a location other than the central portion of the liquid crystal driving IC 2, it is possible to intentionally guide the location where the crack occurs to a location other than the central portion of the liquid crystal driving IC 2.
　次に、液晶駆動用ＩＣ２の割れを引き起こす衝撃が液晶表示モジュール１０に加わったときの、液晶駆動用ＩＣ２の変化について説明する。まず従来の液晶駆動用ＩＣを用いた場合について図７ａ～図７ｃおよび図１０を参照して説明する。 Next, a change in the liquid crystal driving IC 2 when an impact that causes cracking of the liquid crystal driving IC 2 is applied to the liquid crystal display module 10 will be described. First, a case where a conventional liquid crystal driving IC is used will be described with reference to FIGS. 7a to 7c and FIG.
　図７ａは従来のドライバ（液晶駆動用ＩＣ）１０２を搭載している液晶表示モジュール１００を上面から見た図であり、図７ｂおよび図７ｃは図７ａにおけるドライバ１０２の断面を表しており、説明のためにドライバ１０２以外の部材の図示を省略して示している。図７ｂに示すように、従来のドライバ１０２には、ドライバ本体１２１の内部に単一の回路１２２が形成されている。図７ｃは、ドライバ１０２に衝撃が加わって、図７ｂに示すドライバ１０２が割れたときの状態を示す断面図である。液晶表示モジュール１００に衝撃が加わると、ドライバ１０２にも衝撃が加わる。衝撃が加わると、ドライバ１０２は、図７ｃに示すように、ドライバ本体１２１の中央付近から割れてしまう。このとき回路１２２も同じ箇所で割れることになる。したがって、ドライバ１０２は回路部分で割れ１２４が生じ、駆動しなくなってしまう。 7A is a top view of a liquid crystal display module 100 on which a conventional driver (liquid crystal driving IC) 102 is mounted, and FIGS. 7B and 7C show cross sections of the driver 102 in FIG. 7A. Therefore, members other than the driver 102 are not shown. As shown in FIG. 7 b, the conventional driver 102 has a single circuit 122 formed inside the driver body 121. FIG. 7c is a cross-sectional view showing a state where an impact is applied to the driver 102 and the driver 102 shown in FIG. 7b is cracked. When an impact is applied to the liquid crystal display module 100, an impact is also applied to the driver 102. When an impact is applied, the driver 102 is cracked from the vicinity of the center of the driver main body 121 as shown in FIG. 7c. At this time, the circuit 122 is also broken at the same location. Therefore, the driver 102 is not driven due to a crack 124 in the circuit portion.
　図１０は、従来の液晶駆動用ＩＣにパッシベーション膜などの補強層１２６を形成したドライバ１０２が割れたときの断面図である。図１０に示すように、補強層１２６を設けたとしても、より強い衝撃が加わりドライバ１０２に割れ１２４が生じると、回路部分が分断されることになる。その結果、ドライバ１０２は駆動しなくなってしまう。 FIG. 10 is a cross-sectional view when the driver 102 in which a reinforcing layer 126 such as a passivation film is formed on a conventional liquid crystal driving IC is cracked. As shown in FIG. 10, even if the reinforcing layer 126 is provided, if a stronger impact is applied and a crack 124 occurs in the driver 102, the circuit portion is divided. As a result, the driver 102 is not driven.
　次に、本発明の一実施形態に係る液晶駆動用ＩＣ２に衝撃が加わった場合について図５ａ～図５ｃを参照して説明する。図５ａは液晶駆動用ＩＣ２を搭載している液晶パネル１を上面から見た図であり、図５ｂは図５ａにおける液晶駆動用ＩＣ２の断面を表す図であり、説明のために液晶駆動用ＩＣ２以外の部材の図示を省略して示している。上述のように、また図５ｂに示すように、液晶駆動用ＩＣ２には、ＩＣチップ本体２１の内部において２つの回路２２ａおよび２２ｂが互いに離れて形成されている。さらにＩＣチップ本体２１の上面部２５には、回路２２ａと２２ｂとの間の回路が形成されていない領域において、溝２３が形成されている。図５ｃは、液晶駆動用ＩＣ２に衝撃が加わって、図５ｂに示す液晶駆動用ＩＣ２が割れたときの状態を示す断面図である。液晶表示モジュール１０に衝撃が加わると、液晶駆動用ＩＣ２にも衝撃が加わり、液晶駆動用ＩＣ２に割れ２４が生じる。このとき、溝２３が形成されている箇所で割れ２４が生じることになる。図５ｃに示されるように、溝２３が形成されている箇所で割れ２４が生じても、この部分には回路が形成されていないため、液晶駆動用ＩＣ２においては回路自体に割れ２４が生じない。 Next, a case where an impact is applied to the liquid crystal driving IC 2 according to an embodiment of the present invention will be described with reference to FIGS. 5a to 5c. FIG. 5a is a view of the liquid crystal panel 1 on which the liquid crystal driving IC 2 is mounted as viewed from above, and FIG. 5b is a diagram showing a cross section of the liquid crystal driving IC 2 in FIG. 5a. The other members are not shown. As described above and as shown in FIG. 5b, in the liquid crystal driving IC 2, the two circuits 22a and 22b are formed in the IC chip body 21 apart from each other. Further, a groove 23 is formed in the upper surface portion 25 of the IC chip body 21 in a region where the circuit between the circuits 22a and 22b is not formed. FIG. 5C is a cross-sectional view showing a state where an impact is applied to the liquid crystal driving IC 2 and the liquid crystal driving IC 2 shown in FIG. 5B is cracked. When an impact is applied to the liquid crystal display module 10, the impact is also applied to the liquid crystal driving IC 2, and a crack 24 is generated in the liquid crystal driving IC 2. At this time, a crack 24 is generated at a location where the groove 23 is formed. As shown in FIG. 5c, even if a crack 24 occurs in the portion where the groove 23 is formed, no circuit is formed in this portion, so that no crack 24 occurs in the circuit itself in the liquid crystal driving IC 2. .
　次に、液晶駆動用ＩＣ２を液晶パネル１上に搭載したときの、液晶パネル１上の配線について図６を参照して説明する。図６は、液晶駆動用ＩＣ２が搭載されている液晶パネル１を上面から見たときの、液晶駆動用ＩＣ２が搭載されている部分を拡大して示す透視図である。図６に示される液晶駆動用ＩＣ２には、ＩＣチップ本体２１の内部に３つの回路２２ａ、２２ｂおよび２２ｃが互いに分かれて形成されている。３つの回路２２ａ～２２ｃとしては、例えば、昇圧回路、ソース回路およびゲート回路などであり得る。 Next, wiring on the liquid crystal panel 1 when the liquid crystal driving IC 2 is mounted on the liquid crystal panel 1 will be described with reference to FIG. FIG. 6 is an enlarged perspective view showing a portion on which the liquid crystal driving IC 2 is mounted when the liquid crystal panel 1 on which the liquid crystal driving IC 2 is mounted is viewed from above. In the liquid crystal driving IC 2 shown in FIG. 6, three circuits 22 a, 22 b and 22 c are separately formed inside the IC chip body 21. The three circuits 22a to 22c can be, for example, a booster circuit, a source circuit, and a gate circuit.
　液晶パネル１上には、回路基板３からの入力信号を回路２２ａ～２２ｃに伝送する入力信号配線１１、および液晶を駆動させるための出力信号を回路２２ａ～２２ｃから伝送する出力信号配線１２が設けられている。入力信号配線１１および出力信号配線１２は液晶駆動用ＩＣ２の電極を通じて、内部の回路２２ａ～２２ｃと電気的に接続されている。液晶パネル１上には、さらに各回路２２ａ～２２ｃどうしを電気的に接続するための連絡配線１３ａ～１３ｄが設けられている。連絡配線１３ａ～１３ｄは、バンプなどの、液晶駆動用ＩＣ２の表面に形成されている、回路２２ａ～２２ｃの電極（第１電極、第２電極）（不図示）と電気的に接続されている。これにより、回路２２ａ～回路２２ｃは互いに電気的に接続されている。図６における液晶パネル１では、回路２２ａから２２ｂに信号を伝送するための連絡配線１３ａ、回路２２ｂから２２ａに信号を伝送するための連絡配線１３ｂ、回路２２ｂから２２ｃに信号を伝送するための連絡配線１３ｃ、および回路２２ｃから２２ｂに信号を伝送するための連絡配線１３ｄが設けられており、それぞれ、回路２２ａ、回路２２ｂまたは回路２２ｃにつながっている。回路２２ａと回路２２ｃとは、連絡配線１３ａ～１３ｄによって直接的には互いに接続していないが、回路２２ｂを介して電気的には接続されている。各配線は、ＩＴＯ（Ｉｎｄｉｕｍ　Ｔｉｎ　Ｏｘｉｄｅ）などの透明電極を使用し得る。 On the liquid crystal panel 1, an input signal wiring 11 for transmitting an input signal from the circuit board 3 to the circuits 22a to 22c and an output signal wiring 12 for transmitting an output signal for driving the liquid crystal from the circuits 22a to 22c are provided. It has been. The input signal wiring 11 and the output signal wiring 12 are electrically connected to the internal circuits 22a to 22c through the electrodes of the liquid crystal driving IC 2. On the liquid crystal panel 1, connection wirings 13a to 13d for electrically connecting the circuits 22a to 22c are further provided. The connection wirings 13a to 13d are electrically connected to electrodes (first electrode and second electrode) (not shown) of the circuits 22a to 22c formed on the surface of the liquid crystal driving IC 2, such as bumps. . As a result, the circuits 22a to 22c are electrically connected to each other. In the liquid crystal panel 1 in FIG. 6, the communication wiring 13a for transmitting signals from the circuits 22a to 22b, the communication wiring 13b for transmitting signals from the circuits 22b to 22a, and the communication for transmitting signals to the circuits 22b to 22c. Wiring 13c and communication wiring 13d for transmitting signals from circuits 22c to 22b are provided, and are connected to circuit 22a, circuit 22b, or circuit 22c, respectively. The circuit 22a and the circuit 22c are not directly connected to each other via the connection wirings 13a to 13d, but are electrically connected via the circuit 22b. Each wiring may use a transparent electrode such as ITO (Indium Tin Oxide).
　本実施の形態において、各連絡配線１３ａ～１３ｄは、その一部が、液晶パネル１を上面から見たときに液晶駆動用ＩＣ２からはみ出した位置に形成されているが、各回路どうしを接続できればよく、液晶駆動用ＩＣ２の下に完全に隠れるように形成されていてもよい。 In the present embodiment, a part of each of the connection wirings 13a to 13d is formed at a position protruding from the liquid crystal driving IC 2 when the liquid crystal panel 1 is viewed from the upper surface. Alternatively, it may be formed so as to be completely hidden under the liquid crystal driving IC 2.
　なお、回路２２ａと回路２２ｂとを連絡配線１３ａおよび１３ｂで接続し、さらに回路２２ｂと回路２２ｃとを連絡配線１３ｃおよび１３ｄで接続すれば、回路２２ａと回路２２ｃとを連絡配線で直接的に接続しなくても、回路２２ａと回路２２ｃとは電気的に接続されることになる。 If the circuit 22a and the circuit 22b are connected by the connection wirings 13a and 13b, and if the circuit 22b and the circuit 22c are further connected by the connection wirings 13c and 13d, the circuit 22a and the circuit 22c are directly connected by the connection wiring. Even if not, the circuit 22a and the circuit 22c are electrically connected.
　この液晶パネル１に衝撃が加わり、液晶駆動用ＩＣ２が割れる際には、回路２２ａと回路２２ｂとの間に設けられた溝２３または回路２２ｂと回路２２ｃとの間に設けられた溝２３から割れることになる。仮に回路２２ａと回路２２ｂとの間に設けられた溝２３から割れが生じると、ＩＣチップ本体２１は回路２２ａと回路２２ｂとの間で割れることになり、回路２２ａ自体および回路２２ｂ自体が物理的に割れることを防ぐことができる。また、回路２２ａと回路２２ｂとの間の電気的接続は、ＩＣチップ本体２１の外部である液晶パネル１上の連絡配線１３ａおよび１３ｂを通じておこなっている。そのため、液晶駆動用ＩＣ２が割れても、液晶パネル１自体が割れない限り回路間の電気的接続が維持でき、液晶駆動用ＩＣ２は作動可能な状態が維持される。 When an impact is applied to the liquid crystal panel 1 and the liquid crystal driving IC 2 is cracked, the liquid crystal panel 1 is cracked from the groove 23 provided between the circuit 22a and the circuit 22b or from the groove 23 provided between the circuit 22b and the circuit 22c. It will be. If a crack is generated from the groove 23 provided between the circuit 22a and the circuit 22b, the IC chip body 21 is cracked between the circuit 22a and the circuit 22b, and the circuit 22a itself and the circuit 22b itself are physically separated. Can be prevented from cracking. Further, the electrical connection between the circuit 22a and the circuit 22b is made through connection wirings 13a and 13b on the liquid crystal panel 1 which is outside the IC chip body 21. Therefore, even if the liquid crystal driving IC 2 is cracked, the electrical connection between the circuits can be maintained unless the liquid crystal panel 1 itself is cracked, and the liquid crystal driving IC 2 is maintained in an operable state.
　これに対し従来のドライバでは、ドライバが割れると回路が割れることとなり、ドライバは作動不可能となる。図８は、従来の液晶パネル１０１における配線を表した図である。図８に示すように、液晶パネル１０１上の入力信号配線１１１および出力信号配線１１２が単一の回路１２２に接続されている。本発明に係る液晶パネル１に形成されている連絡配線１３ａ～１３ｄの相当する配線は設けられていない。ドライバ１０２が割れて、回路１２２が複数に分断されると、分断された回路間は電気的にも分断されることになる。よって、ドライバとしては機能し得なくなる。 On the other hand, in the conventional driver, if the driver is cracked, the circuit is broken and the driver becomes inoperable. FIG. 8 is a diagram showing wiring in the conventional liquid crystal panel 101. As shown in FIG. 8, the input signal wiring 111 and the output signal wiring 112 on the liquid crystal panel 101 are connected to a single circuit 122. The wiring corresponding to the connection wirings 13a to 13d formed in the liquid crystal panel 1 according to the present invention is not provided. When the driver 102 is broken and the circuit 122 is divided into a plurality of parts, the divided circuits are also electrically separated. Therefore, it cannot function as a driver.
　なお、回路２２ａおよび回路２２ｂをそれぞれ別々の液晶駆動用ＩＣに形成し、回路２２ａを含む液晶駆動用ＩＣおよび回路２２ｂを含む液晶駆動用ＩＣの２つを使用して、液晶表示モジュールの中心位置を避けて配置することにより、割れが生じる頻度を抑えることも可能である。しかしながらこの場合には、部材コストが上がり、生産時のタクトが増加する。また、圧着する液晶駆動用ＩＣが増加するため、圧着の為損ないによる歩留まりの増加を生じさせる。これに対して液晶駆動用ＩＣ２は、単一の液晶駆動用ＩＣなので、一度の圧着で液晶パネル１に実装でき、現状の部材コストおよび生産タクトで製造することができる。また、圧着の為損ないによる歩留まりの増加を抑えることができる。 The circuit 22a and the circuit 22b are formed in separate liquid crystal driving ICs, and the center position of the liquid crystal display module is used by using the liquid crystal driving IC including the circuit 22a and the liquid crystal driving IC including the circuit 22b. It is also possible to suppress the frequency of occurrence of cracks by arranging the components while avoiding the above. However, in this case, the member cost increases, and the tact time during production increases. In addition, since the number of liquid crystal driving ICs to be bonded increases, the yield increases due to loss due to the bonding. On the other hand, since the liquid crystal driving IC 2 is a single liquid crystal driving IC, the liquid crystal driving IC 2 can be mounted on the liquid crystal panel 1 by a single press, and can be manufactured at the current member cost and production tact. In addition, an increase in yield due to loss due to crimping can be suppressed.
　上述の実施形態では、ＩＣチップ本体２１内のすべての回路が、外部の配線を介して互いに電気的に接続されている液晶駆動用ＩＣ２について説明したが、ＬＥＤコントローラのように、他の回路とは電気的に独立した、別の機能を有する回路を有するものであってもよい。 In the above-described embodiment, the liquid crystal driving IC 2 in which all the circuits in the IC chip main body 21 are electrically connected to each other via external wiring has been described. However, like the LED controller, May have an electrically independent circuit having another function.
　本発明は上述した実施形態に限定されるものではなく、請求項に示した範囲で種々の変更が可能である。すなわち、請求項に示した範囲で適宜変更した技術的手段を組み合わせて得られる実施形態についても本発明の技術的範囲に含まれる。 The present invention is not limited to the above-described embodiment, and various modifications can be made within the scope indicated in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.
　なお、本発明に係るＩＣチップにおいて、製造が容易であるという観点から、上記脆弱部は、上記チップ本体の表面に形成されている溝であることが好ましい。 In the IC chip according to the present invention, it is preferable that the fragile portion is a groove formed on the surface of the chip body from the viewpoint of easy manufacture.
　また、本発明に係るＩＣチップにおいて、上記溝は、上記チップ本体の内部において上記複数の回路が形成されている側を上記チップ本体の底面部としたときの、上記チップ本体の上面部に形成されていることが好ましい。 Further, in the IC chip according to the present invention, the groove is formed on the upper surface portion of the chip body when the side on which the plurality of circuits are formed is the bottom surface portion of the chip body. It is preferable that
　上記構成によれば、ＩＣチップの割れを引き起こす衝撃がＩＣチップに加えられたときに、より確実に脆弱部から割れを生じさせることができる。 According to the above configuration, when an impact that causes cracking of the IC chip is applied to the IC chip, the crack can be more reliably generated from the fragile portion.
　また、本発明に係るＩＣチップにおいて、上記溝は、上記チップ本体の長手方向と直交する方向に沿って形成されていることが好ましい。 In the IC chip according to the present invention, it is preferable that the groove is formed along a direction orthogonal to the longitudinal direction of the chip body.
　なお、ここで「直交する方向」とは、完全に直交する方向のほかに、完全に直交する方向の場合に奏する効果と同等の効果を奏することができれば、実質的に直交する方向である場合も含むこととする。 In this case, the “orthogonal direction” is a direction that is substantially orthogonal as long as an effect equivalent to the effect in the completely orthogonal direction can be obtained in addition to the completely orthogonal direction. Also included.
　上記構成によれば、ＩＣチップの割れを引き起こす衝撃がＩＣチップに加えられたときに、より確実に溝に沿って割れを生じさせることができる。 According to the above configuration, when an impact that causes cracking of the IC chip is applied to the IC chip, the crack can be more reliably generated along the groove.
　本発明は、携帯電話機など、液晶駆動用ＩＣを有する表示モジュールを搭載した小型モバイル機器に利用することができる。 The present invention can be used for a small mobile device equipped with a display module having a liquid crystal driving IC such as a mobile phone.
　　１　　液晶パネル（表示パネル）
　　２　　液晶駆動用ＩＣ（ＩＣチップ）
　　３　　回路基板
　　４　　面発光装置
　　５　　回路基板
　１０　　液晶表示モジュール（表示モジュール）
　１１　　入力信号配線
　１２　　出力信号配線
　１３ａ～１３ｄ　　連絡配線（配線）
　２１　　ＩＣチップ本体（チップ本体）
　２２ａ～２２ｃ　　回路（第１の回路、第２の回路）
　２３　　溝（脆弱部）
　２４　　割れ
　２５　　上面部
　２６　　側面部
　２７　　底面部 1 Liquid crystal panel (display panel)
2 Liquid crystal drive IC (IC chip)
3 Circuit board 4 Surface light emitting device 5 Circuit board 10 Liquid crystal display module (display module)
11 Input signal wiring 12 Output signal wiring 13a to 13d Connection wiring (wiring)
21 IC chip body (chip body)
Circuits 22a to 22c (first circuit, second circuit)
23 Groove (fragile part)
24 cracks 25 top surface 26 side surface 27 bottom surface

Claims (6)

  1. 　チップ本体の内部において互いに物理的および電気的に分かれている複数の回路を備えており、
    　上記複数の回路のうちの第１の回路および第２の回路はそれぞれ、上記チップ本体の外部に設けられる配線を介してお互いを電気的に接続するための第１電極および第２電極を上記チップ本体の表面に有しており、
    　上記第１の回路と上記第２の回路との間の、回路が形成されていない領域における上記チップ本体の表面には、上記チップ本体の割れを誘導する脆弱部が形成されていることを特徴とするＩＣチップ。     It has a plurality of circuits that are physically and electrically separated from each other inside the chip body,
    The first circuit and the second circuit of the plurality of circuits each have a first electrode and a second electrode for electrically connecting each other via a wiring provided outside the chip body. Has on the surface of the body,
    A weak portion that induces cracking of the chip body is formed on a surface of the chip body in a region where no circuit is formed between the first circuit and the second circuit. IC chip.
  2. 　上記脆弱部は、上記チップ本体の表面に形成されている溝であることを特徴とする請求項１に記載のＩＣチップ。 2. The IC chip according to claim 1, wherein the fragile portion is a groove formed on a surface of the chip body.
  3. 　上記溝は、上記チップ本体の内部において上記複数の回路が形成されている側を上記チップ本体の底面部としたときの、上記チップ本体の上面部に形成されていることを特徴とする請求項２に記載のＩＣチップ。 The groove is formed in an upper surface portion of the chip body when the side on which the plurality of circuits are formed inside the chip body is a bottom surface portion of the chip body. 2. The IC chip according to 2.
  4. 　上記溝は、上記チップ本体の長手方向と直交する方向に沿って形成されていることを特徴とする請求項２または３に記載のＩＣチップ。 4. The IC chip according to claim 2, wherein the groove is formed along a direction orthogonal to a longitudinal direction of the chip body.
  5. 　請求項１から４までの何れか１項に記載のＩＣチップが基板上に搭載されており、
    　上記基板には、上記第１電極および上記第２電極を介して上記第１の回路と上記第２の回路とを電気的に接続する配線が形成されていることを特徴とする表示パネル。     The IC chip according to any one of claims 1 to 4 is mounted on a substrate,
    A display panel, wherein wiring for electrically connecting the first circuit and the second circuit through the first electrode and the second electrode is formed on the substrate.
  6. 　請求項５に記載の表示パネルを備えていることを特徴とする表示モジュール。 A display module comprising the display panel according to claim 5.
PCT/JP2010/002623 2009-04-22 2010-04-09 Ic chip, display panel and display module WO2010122728A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-104410 2009-04-22
JP2009104410 2009-04-22

Publications (1)

Publication Number Publication Date
WO2010122728A1 true WO2010122728A1 (en) 2010-10-28

Family

ID=43010857

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/002623 WO2010122728A1 (en) 2009-04-22 2010-04-09 Ic chip, display panel and display module

Country Status (1)

Country Link
WO (1) WO2010122728A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0229541U (en) * 1988-08-15 1990-02-26
JP2005292505A (en) * 2004-03-31 2005-10-20 Sharp Corp Display panel, ic chip, and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0229541U (en) * 1988-08-15 1990-02-26
JP2005292505A (en) * 2004-03-31 2005-10-20 Sharp Corp Display panel, ic chip, and manufacturing method thereof

Similar Documents

Publication Publication Date Title
JP7231265B2 (en) Display device
CN109545828B (en) Display panel for splicing and manufacturing method thereof
US10867971B2 (en) Light emitting diode panel
KR102241248B1 (en) Curved display device
KR102588626B1 (en) Flexible printed circuit and stretchable display device comprising the same
CN110018597B (en) Display panel and display device
KR102325221B1 (en) Display device
KR102371358B1 (en) Semiconductor packages and package modules using the same
EP3667404B1 (en) Display panel module and electronic device
CN111524908A (en) Display panel and display device
CN114545696B (en) Array substrate, mother board thereof, display panel and display device
KR20160017413A (en) Organic light emitting display device and method for manufacturing the same
US20210005675A1 (en) Display panel and manufacturing method thereof
KR102515399B1 (en) Wiring film and display device including the same
CN113471240A (en) Light-emitting module, preparation method thereof and display device
KR20190079086A (en) Flexible display device
US11133432B2 (en) Display panel and manufacturing method thereof, and display device
US10468470B2 (en) OLED display module and method of forming the same
KR102433358B1 (en) Display device
KR101028341B1 (en) Heat radiating printed circuit board unified bracket and chassis structure having the same and processes for producing them
WO2008050582A1 (en) Semiconductor device, display device and electronic device
CN109950272B (en) Flexible display panel and terminal
WO2010122728A1 (en) Ic chip, display panel and display module
KR20170081058A (en) Pad and display panel and flat display device therewith
KR102150839B1 (en) Display device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10766791

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10766791

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP