WO2010117159A3 - 베이스블록을 구비한 히트파이프 및 이를 제조하는 방법 - Google Patents

베이스블록을 구비한 히트파이프 및 이를 제조하는 방법 Download PDF

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Publication number
WO2010117159A3
WO2010117159A3 PCT/KR2010/002004 KR2010002004W WO2010117159A3 WO 2010117159 A3 WO2010117159 A3 WO 2010117159A3 KR 2010002004 W KR2010002004 W KR 2010002004W WO 2010117159 A3 WO2010117159 A3 WO 2010117159A3
Authority
WO
WIPO (PCT)
Prior art keywords
base block
heat pipe
hole
tubular member
manufacturing same
Prior art date
Application number
PCT/KR2010/002004
Other languages
English (en)
French (fr)
Other versions
WO2010117159A2 (ko
Inventor
박상웅
서민환
Original Assignee
잘만테크㈜
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 잘만테크㈜ filed Critical 잘만테크㈜
Publication of WO2010117159A2 publication Critical patent/WO2010117159A2/ko
Publication of WO2010117159A3 publication Critical patent/WO2010117159A3/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 발명은 베이스블록을 구비한 히트파이프에 관한 것이다. 베이스블록을 구비한 히트파이프는, 발열부품에 접하도록 장착되는 베이스블록; 상기 베이스블록에 형성되되, 단면이 일정하게 연장 형성된 적어도 하나의 구멍; 및 상기 구멍의 입구에 그 일측단부가 결합되고 그 타측단부는 밀봉된 관형부재를 포함하여 구성되되, 상기 베이스블록의 구멍의 내측면에는 금속분말이 소결되어 형성된 소결윅이 구비되고, 상기 관형부재의 내측면에는 길이방향으로 형성된 다수의 그루브로 이루어진 그루브윅(groove wick)이 형성된 것을 특징으로 한다.
PCT/KR2010/002004 2009-04-06 2010-04-01 베이스블록을 구비한 히트파이프 및 이를 제조하는 방법 WO2010117159A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090029493A KR20100111101A (ko) 2009-04-06 2009-04-06 베이스블록을 구비한 히트파이프 및 이를 제조하는 방법
KR10-2009-0029493 2009-04-06

Publications (2)

Publication Number Publication Date
WO2010117159A2 WO2010117159A2 (ko) 2010-10-14
WO2010117159A3 true WO2010117159A3 (ko) 2010-12-16

Family

ID=42936683

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/002004 WO2010117159A2 (ko) 2009-04-06 2010-04-01 베이스블록을 구비한 히트파이프 및 이를 제조하는 방법

Country Status (3)

Country Link
KR (1) KR20100111101A (ko)
TW (1) TW201040482A (ko)
WO (1) WO2010117159A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101372728B1 (ko) * 2012-02-20 2014-03-11 티티엠주식회사 하이브리드 쿨러
TWI449875B (zh) * 2012-02-29 2014-08-21 Acer Inc 散熱裝置
CN103313574B (zh) * 2012-03-06 2016-03-30 宏碁股份有限公司 散热装置
CN104253097B (zh) 2013-06-27 2017-02-01 纬创资通股份有限公司 散热装置及通过注塑体接合形成的散热装置的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000130972A (ja) * 1998-10-21 2000-05-12 Furukawa Electric Co Ltd:The 板型ヒートパイプとその製造方法
KR200319218Y1 (ko) * 2003-04-19 2003-07-07 (주)프라임테크 진동세관 히트파이프형 냉각장치
KR20030065686A (ko) * 2002-01-30 2003-08-09 삼성전기주식회사 히트 파이프 및 그 제조 방법
KR100468323B1 (ko) * 2002-08-28 2005-01-27 주식회사 한국에치피티 히트파이프를 이용한 컴퓨터에 장착된 반도체소자 냉각장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000130972A (ja) * 1998-10-21 2000-05-12 Furukawa Electric Co Ltd:The 板型ヒートパイプとその製造方法
KR20030065686A (ko) * 2002-01-30 2003-08-09 삼성전기주식회사 히트 파이프 및 그 제조 방법
KR100468323B1 (ko) * 2002-08-28 2005-01-27 주식회사 한국에치피티 히트파이프를 이용한 컴퓨터에 장착된 반도체소자 냉각장치
KR200319218Y1 (ko) * 2003-04-19 2003-07-07 (주)프라임테크 진동세관 히트파이프형 냉각장치

Also Published As

Publication number Publication date
KR20100111101A (ko) 2010-10-14
WO2010117159A2 (ko) 2010-10-14
TW201040482A (en) 2010-11-16

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