WO2011025299A3 - 실리콘 카바이드를 포함한 방열판 및 그 제조방법 - Google Patents
실리콘 카바이드를 포함한 방열판 및 그 제조방법 Download PDFInfo
- Publication number
- WO2011025299A3 WO2011025299A3 PCT/KR2010/005784 KR2010005784W WO2011025299A3 WO 2011025299 A3 WO2011025299 A3 WO 2011025299A3 KR 2010005784 W KR2010005784 W KR 2010005784W WO 2011025299 A3 WO2011025299 A3 WO 2011025299A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- manufacturing
- silicon carbide
- heat sink
- sink including
- including silicon
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title abstract 4
- 229910010271 silicon carbide Inorganic materials 0.000 title abstract 3
- 239000000843 powder Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- 238000001746 injection moulding Methods 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 238000005245 sintering Methods 0.000 abstract 1
- 238000010345 tape casting Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3731—Ceramic materials or glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
본 발명의 목적은 기계적 강도, 기공률 및 비표면적 특성 등이 모두 양호한 실리콘 카바이드를 포함한 방열판을 제조방법에 관한 것이다. 본 발명에 따른 실리콘 카바이드를 포함한 방열판의 제조방법은 입경이 0.1㎛ ~ 300㎛인 실리콘 카바이드 파우더를 포함하는 조립분을 제조하는 단계와, 제조된 조립분을 프레스(Press), 테이프 캐스팅(Tape Casting) 및 사출 성형 중 어느 하나의 방법으로 성형하는 단계와, 성형된 조립분을 산화분위기에서 소성하는 단계를 포함한다.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2009-0080911 | 2009-08-31 | ||
KR20090080911 | 2009-08-31 | ||
KR10-2010-0046953 | 2010-05-19 | ||
KR20100046953 | 2010-05-19 | ||
KR10-2010-0060199 | 2010-06-24 | ||
KR20100060199 | 2010-06-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011025299A2 WO2011025299A2 (ko) | 2011-03-03 |
WO2011025299A3 true WO2011025299A3 (ko) | 2011-07-07 |
Family
ID=43628625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2010/005784 WO2011025299A2 (ko) | 2009-08-31 | 2010-08-27 | 실리콘 카바이드를 포함한 방열판 및 그 제조방법 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20110023799A (ko) |
TW (1) | TW201120394A (ko) |
WO (1) | WO2011025299A2 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012119671A (ja) * | 2010-11-11 | 2012-06-21 | Kitagawa Ind Co Ltd | 電子回路及びヒートシンク |
TWI491085B (zh) * | 2012-06-06 | 2015-07-01 | Pin Siang Wang | 複合散熱體及其製造方法 |
KR101457181B1 (ko) * | 2013-01-28 | 2014-11-03 | 김정석 | 열전도율과 방사율이 향상된 세라믹 방열부재 및 그 제조방법 |
KR101430677B1 (ko) * | 2013-02-18 | 2014-08-18 | 주식회사 코센테크 | 히트싱크용 복합재료 |
KR101524728B1 (ko) * | 2013-12-16 | 2015-06-01 | 부산대학교 산학협력단 | 고방열 세라믹 복합체, 이의 제조방법, 및 이의 용도 |
CN104103741A (zh) * | 2014-07-02 | 2014-10-15 | 柳钊 | 一种以碳化硅陶瓷为散热器一体封装的led光源器件及其制备方法 |
CN111592275A (zh) * | 2020-06-29 | 2020-08-28 | 广州视源电子科技股份有限公司 | 散热器及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1030148A (ja) * | 1996-07-17 | 1998-02-03 | Injietsukusu:Kk | ヒートシンクおよびその製造方法 |
JP2004363309A (ja) * | 2003-06-04 | 2004-12-24 | Ceramission Kk | 放熱性に優れた半導体部品 |
KR20050029130A (ko) * | 2002-06-28 | 2005-03-24 | 어드밴스드 에너지 테크놀로지 인코포레이티드 | 금속 베이스 및 흑연 휜을 구비한 합성 히트 싱크 |
KR20050120727A (ko) * | 2002-06-28 | 2005-12-23 | 어드밴스드 에너지 테크놀로지 인코포레이티드 | 긴 흑연 시트들과 짧은 흑연 시트들로 구성된 히트 싱크 |
JP2007238906A (ja) * | 2006-03-06 | 2007-09-20 | Tomoaki Nakamura | 放熱材料並びに放熱材料塗料 |
-
2010
- 2010-08-27 WO PCT/KR2010/005784 patent/WO2011025299A2/ko active Application Filing
- 2010-08-27 KR KR1020100083309A patent/KR20110023799A/ko not_active Application Discontinuation
- 2010-08-30 TW TW99129115A patent/TW201120394A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1030148A (ja) * | 1996-07-17 | 1998-02-03 | Injietsukusu:Kk | ヒートシンクおよびその製造方法 |
KR20050029130A (ko) * | 2002-06-28 | 2005-03-24 | 어드밴스드 에너지 테크놀로지 인코포레이티드 | 금속 베이스 및 흑연 휜을 구비한 합성 히트 싱크 |
KR20050120727A (ko) * | 2002-06-28 | 2005-12-23 | 어드밴스드 에너지 테크놀로지 인코포레이티드 | 긴 흑연 시트들과 짧은 흑연 시트들로 구성된 히트 싱크 |
JP2004363309A (ja) * | 2003-06-04 | 2004-12-24 | Ceramission Kk | 放熱性に優れた半導体部品 |
JP2007238906A (ja) * | 2006-03-06 | 2007-09-20 | Tomoaki Nakamura | 放熱材料並びに放熱材料塗料 |
Also Published As
Publication number | Publication date |
---|---|
WO2011025299A2 (ko) | 2011-03-03 |
TW201120394A (en) | 2011-06-16 |
KR20110023799A (ko) | 2011-03-08 |
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