WO2010113341A1 - Current detection metal plate resistor and method of producing same - Google Patents
Current detection metal plate resistor and method of producing same Download PDFInfo
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- WO2010113341A1 WO2010113341A1 PCT/JP2009/067701 JP2009067701W WO2010113341A1 WO 2010113341 A1 WO2010113341 A1 WO 2010113341A1 JP 2009067701 W JP2009067701 W JP 2009067701W WO 2010113341 A1 WO2010113341 A1 WO 2010113341A1
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- metal plate
- plate resistor
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- resistant protective
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
- G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
Definitions
- the present invention is capable of detecting a current with high accuracy even when a large current flows in a specific wiring portion, and has excellent heat dissipation that can suppress damage to a circuit in an electronic device.
- the present invention relates to a metal plate resistor for current detection and a method for manufacturing the same.
- a current detection resistor using a metal plate resistor is used.
- the current detecting resistor is installed to detect a current of a specific wiring portion, and it is necessary to detect the current with a resistor having a very small resistance value of several m ⁇ to several tens m ⁇ with high accuracy.
- the resistor is designed to increase the rated power and lower the resistance value so that it can be detected even when the current supplied to the electronic device is a large current.
- the resistor having such a design has a problem that heat is generated by a large current and the wiring board is thermally damaged.
- a resistor in which a thick protective layer is formed using a transfer mold technique is known.
- a resistor having such a protective layer for example, as shown in FIG. 3, a metal plate resistor 31, a pair of electrode layers 32 provided at both ends of the resistor 31, and the electrode layer 32.
- a resistor 30 having an insulating protective layer 33 provided between the upper surface and the lower surface of the resistor 31 is known (see Patent Documents 1 and 2).
- Japanese Patent Laid-Open No. 2007-220859 (FIG. 7) Japanese Patent Laid-Open No. 6-20802
- An object of the present invention is to provide a metal plate resistor for current detection that has excellent heat dissipation and can detect current with high accuracy, capable of suppressing damage to a circuit due to overcurrent in an electronic device. And a manufacturing method thereof.
- the metal plate resistor, the heat-resistant protective layer provided at the center of at least one surface of the metal plate resistor, and the heat resistance provided at the center of one surface of the metal plate resistor A pair of base electrode layers provided on one surface of the metal plate resistor so as to cover both ends of the protective protective layer, and a pair provided on both ends of the metal plate resistor so as to cover the entire surface of the base electrode layer A metal plate resistor for current detection provided with an end face electrode layer is provided.
- the step (a) of screen-printing and curing a heat-resistant protective layer on the center of at least one surface of the strip-shaped metal plate resistor, and the center of one surface of the metal plate resistor A step (b) of screen-printing and curing a pair of base electrode layers on one surface of the metal plate resistor so as to cover both ends of the heat-resistant protective layer provided in the part, and covering the entire surface of the base electrode layer.
- a method of manufacturing a metal plate resistor for current detection which includes a step (c) of forming an end face electrode layer by a plating method and a step (d) of cutting a strip-shaped metal plate resistor at a predetermined interval.
- the heat-resistant protective layer can be provided on the center of one surface of the metal plate resistor and the entire surface of the other surface of the metal plate resistor, and provided on the center of both surfaces of the metal plate resistor. You can also.
- the end electrode layer is a portion of the surface of the metal plate resistor not provided with the base electrode layer that does not have the heat-resistant protective layer. By extending to the surface, the effective electrode area can be increased and the heat radiation efficiency can be further increased.
- the heat-resistant protective layer a known heat-resistant resin can be used, but it is particularly preferable to use a polyamide-imide resin that exhibits excellent heat resistance and insulation even in a thin film.
- the printing characteristic at the time of manufacture can be improved by making this heat resistant resin layer contain a silica powder.
- a silica powder by blending powders with different particle sizes on the micrometer order and nanometer order as silica powder, sagging and blurring during printing can be effectively prevented, and the width dimension of the heat-resistant protective layer The precision accuracy and the like can be improved, and variations in the appearance resistance value can be suppressed.
- the mixing ratio of the silica powder is usually 30 to 55% by mass, preferably 40 to 50% by mass, based on the total amount with the heat-resistant resin.
- the former is usually 18 to 40% by mass and the latter is 12 to 15% by mass with respect to the total amount with the heat resistant resin. It can be.
- black pigments such as CuO, Fe 2 O 3 , and Mn 2 O 3 can also be blended.
- the base electrode layer can be formed by a known electrode material such as a metal-containing conductive resin paste that can be screen-printed and thermoset.
- the base electrode layer is formed so as to cover both ends of the heat-resistant protective layer and so as to be entirely covered by the end face electrode layer.
- the use of silver powder can also improve the thermal conductivity and contribute to the heat dissipation action of the resistor itself.
- the end face electrode layer can be formed by a plating method, and can usually be formed by a known electrode material including a copper plating layer, a nickel plating layer, and a tin plating layer.
- the metal plate resistor is not particularly limited as long as it has a desired resistance value.
- a Cu—Mn metal plate, a Ni—Cr metal plate, or a Fe—Cr metal plate can be used.
- the metal plate resistor for current detection of the present invention has a heat-resistant protective layer in particular, and includes a base electrode layer so as to cover both ends of the heat-resistant protective layer, and an end face so as to cover the entire surface of the base electrode layer. Since the electrode layer is provided, the effective electrode area can be increased, and excellent heat dissipation can be ensured even when the rated power is set high. Therefore, the metal plate resistor of the present invention can suppress damage to the circuit due to overcurrent in the electronic device, can detect the current with high accuracy, and further downsize and thin the electronic device. Can also contribute.
- FIG. 1 is a cross-sectional view of a current detecting metal plate resistor 10 showing an embodiment of the present invention.
- reference numeral 11 denotes a metal plate resistor having a resistance function.
- the metal plate resistor 11 has a first central portion on the upper and lower surfaces of the metal plate resistor 11 over the entire width direction of the metal plate resistor 11.
- a heat resistant protective layer 12 and a second heat resistant protective layer 13 are provided.
- Both end portions of the first heat-resistant protective layer 12 are covered, and part of the first heat-resistant protective layer 12 is in contact with the upper surface of the metal plate resistor 11 to ensure conductivity.
- a pair of conductive base electrode layers 14 is provided so as to leave a part of the upper surface.
- the pair of base electrode layers 14 are covered with a pair of end face electrode layers 15 so that the entire surface is covered, and the pair of end face electrode layers 15 covers the end faces of the metal plate resistor 11 as shown in the figure.
- the metal plate low antibody 11 is formed so as to extend to both ends of the second heat-resistant protective layer 13 provided at the center of the lower surface of the metal plate low antibody 11.
- a third heat-resistant protective layer 16 is formed in the upper gap portion between the pair of end face electrode layers 15 as shown in the figure.
- the heat-resistant protective layer 16 can be formed of the same material as the first and second heat-resistant protective layers (12, 13), but is not an essential component in the present invention.
- the metal plate resistor 10 for current detection shown in FIG. 1 is of a type in which the end electrode layer 15 on the lower surface is mounted on a substrate by solder or the like.
- FIG. 2 is a sectional view of a metal plate resistor 20 for current detection showing another embodiment of the present invention.
- reference numeral 21 denotes a metal plate resistor having a resistance function.
- the first heat resistance is provided in the substantially central portion on the lower surface of the metal plate resistor 21 over the entire width direction of the metal plate resistor 21.
- a protective layer 22 is provided.
- a second heat-resistant protective layer 23 is provided on the entire upper surface of the metal plate resistor 21.
- Both end portions of the second heat-resistant protective layer 23 are covered, and part of the second heat-resistant protective layer 23 is in contact with the lower surface of the metal plate resistor 21 to ensure conductivity.
- a pair of conductive base electrode layers 24 are provided so as to cover the entire lower surface.
- the pair of base electrode layers 24 are covered with a pair of end face electrode layers 25 so that the entire surface is covered, and the pair of end face electrode layers 25 covers the end face of the metal plate resistor 21 as shown in the figure. Is formed.
- the metal plate resistor 20 for current detection shown in FIG. 2 is of a type in which the end electrode layer 25 on the lower surface is mounted on a substrate by solder or the like.
- the production method of the present invention includes a step (a) in which a heat-resistant protective layer is screen-printed and cured at a central portion of at least one surface of a strip-shaped metal plate resistor.
- a heat-resistant protective layer can be screen-printed on the other surface of the strip-shaped metal plate resistor and cured.
- the strip-shaped metal plate resistor is finally cut at a predetermined interval to obtain a desired metal plate resistor.
- the necessary heat-resistant protective layer, base electrode layer, and end face electrode layer For example, a Cu—Mn band metal, a Ni—Cr band metal, or a Fe—Cr band metal can be used.
- the strip-shaped metal plate resistor it is preferable to use a metal plate resistor that has not been annealed after the final rolling because the spring property of the metal plate resistor is not deteriorated.
- the heat-resistant protective layer can be formed, for example, by screen-printing a heat-resistant resin paste in which a polyamide-imide resin containing silica powder is dispersed in a solvent and heat-curing at about 80 to 300 ° C.
- a pair of base electrode layers is screen-printed on one surface of a metal plate resistor so as to cover both ends of the heat-resistant protective layer provided at the center of one surface of the metal plate resistor. And curing (b).
- the base electrode layer can be formed, for example, by screen-printing a heat-curable metal-containing conductive resin paste containing silver powder and a phenol epoxy resin, and heat-curing at about 80 to 300 ° C.
- the production method of the present invention includes a step (c) of forming an end face electrode layer by plating so as to cover the entire surface of the base electrode layer.
- the end face electrode layer can be formed, for example, by subjecting copper (Cu), nickel (Ni), tin (Sn), other metals, or alloys thereof alone or in combination to plating.
- the manufacturing method of the present invention includes a step (d) of cutting the strip-shaped metal plate resistor at a predetermined interval.
- a desired metal plate resistor for detecting current can be obtained, and the heat-resistant resin layer, the base electrode layer and the end face electrode layer are not formed on individual metal plate resistors, but in a strip shape. Since it is performed in a metal plate resistor, it is excellent in manufacturing efficiency.
- Example 1 Production of the metal plate resistor 10 shown in FIG. 1 A polyamide-imide resin paste containing silica powder is screen-printed on the center of the upper and lower surfaces of the Cu-Mn band-shaped metal plate resistor that has not been annealed since the final rolling.
- the first heat-resistant protective layer 12 and the second heat-resistant protective layer 13 were formed by coating by the method and heating to cure at 100 ° C. for 10 minutes, 200 ° C. for 10 minutes, and 250 ° C. for 30 minutes.
- the resin paste used was a crystalline silica powder having an average particle diameter of 4 ⁇ m, 3.5 to 4.5 ⁇ m particle diameter, 36% by mass with respect to the total amount of polyamideimide resin and silica powder, and an average particle diameter of 20 nm.
- a polyamide-imide resin paste containing 10% by mass of the synthetic silica powder based on the total amount of the polyamide-imide resin and the silica powder was used.
- this resin paste is cured, about 4% by mass of the synthetic silica powder having an average particle diameter of 20 nm is converted into a silica powder having a particle diameter of 2 to 5 nm by a sol-gel reaction or the like. Can be uniformly dispersed.
- a third heat-resistant protective layer 16 was formed in the gap between the pair of end face electrode layers 15 in the same manner as the formation of the first heat-resistant protective layer 12 and the second heat-resistant protective layer 13. Finally, the strip-shaped metal plate resistor was cut at a predetermined interval to manufacture the metal plate resistor 10 for current detection.
- Example 2 Production of the metal plate resistor 20 shown in FIG. 2 A silica powder is contained in the central portion and the entire upper surface of the lower surface of the Cu—Mn-based strip-like metal plate resistor that has not been annealed since the final rolling, as in Example 1.
- the polyamide-imide resin paste to be applied was applied by screen printing and cured by heating to form the first heat-resistant protective layer 22 and the second heat-resistant protective layer 23.
- Example 1 is formed so as to overlap the left and right end portions of the second heat-resistant protective layer 23 on the lower surface of the strip-shaped metal plate resistor, and to partially contact the lower surface of the strip-shaped metal plate resistor.
- a silver powder-containing conductive resin paste obtained by kneading silver powder, a phenol epoxy resin, and a solvent was applied by a screen printing method and cured to form a pair of base electrode layers 24.
- copper plating, nickel plating, and tin plating were plated in this order so as to cover the pair of base electrode layers 24, thereby forming a pair of end face electrode layers 25.
- the strip-shaped metal plate resistor was cut at a predetermined interval to manufacture the metal plate resistor 20 for current detection.
- Test Example The following performance test was performed using two types of metal plate resistors having different resistance values manufactured in the same manner as in Example 1 and two types of metal plate resistors having different resistance values as shown in FIG. It was.
- a material which comprises each member of a conventional metal plate resistor it manufactured with the material similar to Example 1 except not including a base electrode layer.
- Each metal plate resistor is placed on a Cu foil 70 ⁇ m copper-clad glass epoxy substrate, and the substrate is surrounded so that there is no wind.
- Each metal plate resistor having a resistance value of 5.1 m ⁇ has 19.8 A and resistance
- Each metal plate resistor having a value of 4.84 m ⁇ was supplied with a current of 20.3 A for 15 minutes.
- the surface temperature of the upper surface center part and the end face electrode layer of the metal plate resistor before and after energization was measured by installing a thermometer at a position 1 cm above the center part of the metal plate resistor and the end face electrode layer.
- Table 1 The results using each metal plate resistor having a resistance value of 5.1 m ⁇ are shown in Table 1, and the results using each metal plate resistor having a resistance value of 4.84 m ⁇ are shown in Table 2.
- the base electrode layer of Example 1 type of the present invention was provided in comparison with the conventional metal plate resistor, and the area of the end face electrode layer was increased. It was found that the temperature rise on the electrode layer surface was small and the heat dissipation action was excellent.
Abstract
Description
しかし、このような設計による抵抗器は、大電流によって熱が発生し、配線基板に熱的ダメージを与えるという問題がある。
そこで、このような熱的ダメージを回避する等のために、トランスファーモールド技術を利用して厚い保護層を形成した抵抗器が知られている。
このような保護層を備えた抵抗器としては、例えば、図3に示すように、金属板抵抗体31と、該抵抗体31の両端部に設けた一対の電極層32と、該電極層32間であって、抵抗体31の上面及び下面に設けた絶縁性の保護層33を具備する抵抗器30が知られている(特許文献1及び2参照)。
しかしながら、このような構造の抵抗器においても大電流による熱的ダメージの回避が十分とは言えず、更なる放熱作用に優れた電流検出用抵抗器の開発が望まれている。 In order to provide a circuit protection function against an overcurrent in an electronic device, a current detection resistor using a metal plate resistor is used. The current detecting resistor is installed to detect a current of a specific wiring portion, and it is necessary to detect the current with a resistor having a very small resistance value of several mΩ to several tens mΩ with high accuracy. In addition, the resistor is designed to increase the rated power and lower the resistance value so that it can be detected even when the current supplied to the electronic device is a large current.
However, the resistor having such a design has a problem that heat is generated by a large current and the wiring board is thermally damaged.
Therefore, in order to avoid such thermal damage, a resistor in which a thick protective layer is formed using a transfer mold technique is known.
As a resistor having such a protective layer, for example, as shown in FIG. 3, a
However, even with a resistor having such a structure, it cannot be said that avoiding thermal damage due to a large current is sufficient, and development of a resistor for detecting current that is further excellent in heat dissipation is desired.
また本発明によれば、帯状の金属板抵抗体の少なくとも一方の面の中央部に耐熱性保護層をスクリーン印刷し、硬化させる工程(a)と、該金属板抵抗体の一方の面の中央部に設けた耐熱性保護層の両端部を覆うように、金属板抵抗体の一方の面に一対の下地電極層をスクリーン印刷し、硬化させる工程(b)と、該下地電極層全面を覆うように、端面電極層をめっき法により形成する工程(c)と、帯状の金属板抵抗体を所定間隔に切断する工程(d)とを含む電流検出用金属板抵抗器の製造方法が提供される。 According to the present invention, the metal plate resistor, the heat-resistant protective layer provided at the center of at least one surface of the metal plate resistor, and the heat resistance provided at the center of one surface of the metal plate resistor A pair of base electrode layers provided on one surface of the metal plate resistor so as to cover both ends of the protective protective layer, and a pair provided on both ends of the metal plate resistor so as to cover the entire surface of the base electrode layer A metal plate resistor for current detection provided with an end face electrode layer is provided.
According to the present invention, the step (a) of screen-printing and curing a heat-resistant protective layer on the center of at least one surface of the strip-shaped metal plate resistor, and the center of one surface of the metal plate resistor A step (b) of screen-printing and curing a pair of base electrode layers on one surface of the metal plate resistor so as to cover both ends of the heat-resistant protective layer provided in the part, and covering the entire surface of the base electrode layer Thus, there is provided a method of manufacturing a metal plate resistor for current detection, which includes a step (c) of forming an end face electrode layer by a plating method and a step (d) of cutting a strip-shaped metal plate resistor at a predetermined interval. The
シリカ粉の配合割合は、耐熱性樹脂との合計量に対して、通常、30~55質量%、好ましくは40~50質量%である。また、マイクロメートルオーダー及びナノメートルオーダーの異なる粒径を有する粉末を配合する場合には、耐熱性樹脂との合計量に対して、前者を通常18~40質量%、後者を12~15質量%とすることができる。
また、シリカ粉の他に、CuO、Fe2O3、Mn2O3等の黒色の顔料を配合することもできる。 As the heat-resistant protective layer, a known heat-resistant resin can be used, but it is particularly preferable to use a polyamide-imide resin that exhibits excellent heat resistance and insulation even in a thin film. Moreover, the printing characteristic at the time of manufacture can be improved by making this heat resistant resin layer contain a silica powder. In particular, by blending powders with different particle sizes on the micrometer order and nanometer order as silica powder, sagging and blurring during printing can be effectively prevented, and the width dimension of the heat-resistant protective layer The precision accuracy and the like can be improved, and variations in the appearance resistance value can be suppressed.
The mixing ratio of the silica powder is usually 30 to 55% by mass, preferably 40 to 50% by mass, based on the total amount with the heat-resistant resin. In addition, when blending powders having different particle sizes of micrometer order and nanometer order, the former is usually 18 to 40% by mass and the latter is 12 to 15% by mass with respect to the total amount with the heat resistant resin. It can be.
In addition to silica powder, black pigments such as CuO, Fe 2 O 3 , and Mn 2 O 3 can also be blended.
本発明においては、下地電極層を、耐熱性保護層の両端部を覆うように、また、端面電極層により全体が覆われるように形成するので、耐熱性保護層等への接着性や印刷特性等を改善するために、下地電極層を、銀粉とフェノールエポキシ樹脂とを含むペーストにより形成することが好ましい。銀粉の使用により、熱伝導性も改善でき、抵抗器自体の放熱作用にも寄与する。 The base electrode layer can be formed by a known electrode material such as a metal-containing conductive resin paste that can be screen-printed and thermoset.
In the present invention, the base electrode layer is formed so as to cover both ends of the heat-resistant protective layer and so as to be entirely covered by the end face electrode layer. In order to improve the above, it is preferable to form the base electrode layer with a paste containing silver powder and a phenol epoxy resin. The use of silver powder can also improve the thermal conductivity and contribute to the heat dissipation action of the resistor itself.
金属板抵抗体は、所望の抵抗値を有する金属板であれば特に限定されず、例えば、Cu-Mn系金属板、Ni-Cr系金属板、Fe-Cr系金属板を用いることができる。 The end face electrode layer can be formed by a plating method, and can usually be formed by a known electrode material including a copper plating layer, a nickel plating layer, and a tin plating layer.
The metal plate resistor is not particularly limited as long as it has a desired resistance value. For example, a Cu—Mn metal plate, a Ni—Cr metal plate, or a Fe—Cr metal plate can be used.
図1は本発明の一実施形態を示す電流検出用金属板抵抗器10の断面図である。図1において11は、抵抗機能を有する金属板抵抗体であり、該金属板抵抗体11の上下の面上の略中央部分には、金属板抵抗体11の幅方向全面に渡り、第1の耐熱性保護層12及び第2の耐熱性保護層13が設けられている。 Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a cross-sectional view of a current detecting
該一対の下地電極層14は、全面が覆われるように一対の端面電極層15により被覆され、該一対の端面電極層15は、図示するように、金属板抵抗体11の端面を被覆し、該金属板低抗体11の下面の中央部に設けられたた第2の耐熱性保護層13の両端までそれぞれ延長して形成されている。 Both end portions of the first heat-resistant
The pair of
図1に示す電流検出用金属板抵抗器10は、下面の端面電極層15の部分が、基板にハンダ等により実装されるタイプのものである。 A third heat-resistant
The
該一対の下地電極層24は、全面が覆われるように一対の端面電極層25により被覆され、該一対の端面電極層25は、図示するように、金属板抵抗体21の端面を被覆して形成されている。 Both end portions of the second heat-resistant
The pair of
帯状の金属板抵抗体は、最終的に所定間隔で切断することにより、所望の金属板抵抗器とすることができ、該切断前に、必要な耐熱性保護層、下地電極層及び端面電極層をまとめて形成するためのものであって、例えば、Cu-Mn系帯状金属、Ni-Cr系帯状金属、Fe-Cr系帯状金属を用いることができる。
ここで、帯状の金属板抵抗体としては、最終圧延以降焼鈍処理していないものを用いることが、金属板抵抗体のバネ性を低下させない点で好ましい。帯状の金属板抵抗体のバネ性が低下すると、抵抗器の製造工程において、帯状の金属板抵抗体が曲がった場合に、復元できず、不良品となる虞が生じる。
耐熱性保護層は、例えば、シリカ粉を含むポリアミドイミド樹脂を溶剤に分散させた耐熱性樹脂ペーストを、スクリーン印刷し、80~300℃程度で加熱硬化させることにより形成することができる。 The production method of the present invention includes a step (a) in which a heat-resistant protective layer is screen-printed and cured at a central portion of at least one surface of a strip-shaped metal plate resistor. In the production method of the present invention, as shown in FIGS. 1 and 2, a heat-resistant protective layer can be screen-printed on the other surface of the strip-shaped metal plate resistor and cured.
The strip-shaped metal plate resistor is finally cut at a predetermined interval to obtain a desired metal plate resistor. Before the cutting, the necessary heat-resistant protective layer, base electrode layer, and end face electrode layer For example, a Cu—Mn band metal, a Ni—Cr band metal, or a Fe—Cr band metal can be used.
Here, as the strip-shaped metal plate resistor, it is preferable to use a metal plate resistor that has not been annealed after the final rolling because the spring property of the metal plate resistor is not deteriorated. When the spring property of the strip-shaped metal plate resistor is lowered, in the resistor manufacturing process, when the strip-shaped metal plate resistor is bent, it cannot be restored and may become a defective product.
The heat-resistant protective layer can be formed, for example, by screen-printing a heat-resistant resin paste in which a polyamide-imide resin containing silica powder is dispersed in a solvent and heat-curing at about 80 to 300 ° C.
下地電極層は、例えば、銀粉とフェノールエポキシ樹脂とを含む熱硬化可能な金属含有導電性樹脂ペーストを、スクリーン印刷し、80~300℃程度で加熱硬化させることにより形成することができる。 In the manufacturing method of the present invention, a pair of base electrode layers is screen-printed on one surface of a metal plate resistor so as to cover both ends of the heat-resistant protective layer provided at the center of one surface of the metal plate resistor. And curing (b).
The base electrode layer can be formed, for example, by screen-printing a heat-curable metal-containing conductive resin paste containing silver powder and a phenol epoxy resin, and heat-curing at about 80 to 300 ° C.
端面電極層は、例えば、銅(Cu)、ニッケル(Ni)、スズ(Sn)、その他の金属或いはそれらの合金を単独又は複合的にめっき処理することにより形成することができる。 The production method of the present invention includes a step (c) of forming an end face electrode layer by plating so as to cover the entire surface of the base electrode layer.
The end face electrode layer can be formed, for example, by subjecting copper (Cu), nickel (Ni), tin (Sn), other metals, or alloys thereof alone or in combination to plating.
工程(d)により、所望の電流検出用金属板抵抗器を得ることができ、耐熱性樹脂層、下地電極層及び端面電極層を、個々の金属板抵抗体に形成するのではなく、帯状の金属板抵抗体にまとめて行うので、製造効率に優れる。 The manufacturing method of the present invention includes a step (d) of cutting the strip-shaped metal plate resistor at a predetermined interval.
Through the step (d), a desired metal plate resistor for detecting current can be obtained, and the heat-resistant resin layer, the base electrode layer and the end face electrode layer are not formed on individual metal plate resistors, but in a strip shape. Since it is performed in a metal plate resistor, it is excellent in manufacturing efficiency.
実施例1
図1に示す金属板抵抗器10の製造
最終圧延以降焼鈍処理してないCu-Mn系の帯状の金属板抵抗体の上下面の中央部に、シリカ粉を含有するポリアミドイミド樹脂ペーストをスクリーン印刷法により塗布し、100℃で10分間、200℃で10分間、及び250℃で30分間加熱して硬化させ、第1の耐熱性保護層12及び第2の耐熱性保護層13を形成した。
ここで、使用した樹脂ペーストは、平均粒径4μmの3.5~4.5μm粒径の結晶シリカ粉を、ポリアミドイミド樹脂とシリカ粉の合計量に対して36質量%、並びに平均粒径20nmの合成シリカ粉を、ポリアミドイミド樹脂とシリカ粉の合計量に対して10質量%含有するポリアミドイミド樹脂ペーストを用いた。この樹脂ペーストは、硬化により、含有される平均粒径20nmの合成シリカ粉の約4質量%程度がゾルゲル反応等により、2~5nm粒径のシリカ粉となり、得られる耐熱性樹脂層に粒径の異なるシリカ粉を均一分散させることができる。 Next, examples of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.
Example 1
Production of the
Here, the resin paste used was a crystalline silica powder having an average particle diameter of 4 μm, 3.5 to 4.5 μm particle diameter, 36% by mass with respect to the total amount of polyamideimide resin and silica powder, and an average particle diameter of 20 nm. A polyamide-imide resin paste containing 10% by mass of the synthetic silica powder based on the total amount of the polyamide-imide resin and the silica powder was used. When this resin paste is cured, about 4% by mass of the synthetic silica powder having an average particle diameter of 20 nm is converted into a silica powder having a particle diameter of 2 to 5 nm by a sol-gel reaction or the like. Can be uniformly dispersed.
続いて、一対の下地電極層14を覆うように、図1に示すように、電気めっき法により銅めっき、ニッケルめっき、スズめっきをこの順でめっきし、一対の端面電極層15を形成した。
次に、一対の端面電極層15の間隙に、第1の耐熱性保護層12及び第2の耐熱性保護層13の形成と同様に、第3の耐熱性保護層16を形成した。
最終に、帯状の金属板抵抗体を所定の間隔で切断し、電流検知用金属板抵抗器10を製造した。 Next, silver powder and phenol so as to overlap the left and right end portions of the first heat-resistant
Subsequently, as shown in FIG. 1, copper plating, nickel plating, and tin plating were plated in this order so as to cover the pair of base electrode layers 14, thereby forming a pair of end face electrode layers 15.
Next, a third heat-resistant
Finally, the strip-shaped metal plate resistor was cut at a predetermined interval to manufacture the
図2に示す金属板抵抗器20の製造
最終圧延以降焼鈍処理してないCu-Mn系の帯状の金属板抵抗体の下面の中央部及び上全面に、実施例1と同様にシリカ粉を含有するポリアミドイミド樹脂ペーストをスクリーン印刷法により塗布し、加熱硬化させ、第1の耐熱性保護層22及び第2の耐熱性保護層23を形成した。
次いで、帯状の金属板抵抗体の下面の第2の耐熱性保護層23の左右両端部上に重なるように、また、一部が帯状の金属板抵抗体の下面に接するように、実施例1と同様に、銀粉とフェノールエポキシ樹脂と溶剤とを混練してなる銀粉含有導電性樹脂ペーストをスクリーン印刷法により塗布し、硬化させ、一対の下地電極層24を形成した。
続いて、一対の下地電極層24を覆うように、図2に示すように、電気めっき法により銅めっき、ニッケルめっき、スズめっきをこの順でめっきし、一対の端面電極層25を形成した。
最終に、帯状の金属板抵抗体を所定の間隔で切断し、電流検知用金属板抵抗器20を製造した。 Example 2
Production of the
Next, Example 1 is formed so as to overlap the left and right end portions of the second heat-resistant
Subsequently, as shown in FIG. 2, copper plating, nickel plating, and tin plating were plated in this order so as to cover the pair of base electrode layers 24, thereby forming a pair of end face electrode layers 25.
Finally, the strip-shaped metal plate resistor was cut at a predetermined interval to manufacture the
また、耐熱性保護層には、粒径の異なるシリカ粉が含まれ、下地電極層には銀粉が含まれるので、耐熱性保護層、下地電極層及び端面電極層の各接触面は、強固に密着していた。 None of the heat-resistant protective layers in the metal plate resistors obtained in Examples 1 and 2 had any variation in width dimension, and there was no edge sagging.
Further, since the heat-resistant protective layer contains silica powders having different particle diameters, and the base electrode layer contains silver powder, the contact surfaces of the heat-resistant protective layer, the base electrode layer, and the end face electrode layer are firmly It was in close contact.
実施例1と同様に製造した抵抗値の異なる2種類の金属板抵抗器と、図3に示す従来型の抵抗値の異なる2種類の金属板抵抗器を用いて以下の性能試験を行った。なお、従来型の金属板抵抗器の各部材を構成する材料としては、下地電極層を含まない以外、実施例1と同様な材料により製造した。
各金属板抵抗器を、Cu箔70μm銅張りガラスエポキシ基板に設置し、該基板が無風状態となるように周囲を囲い、抵抗値5.1mΩの各金属板抵抗器には19.8A及び抵抗値4.84mΩの各金属板抵抗器には20.3Aの電流をそれぞれ15分間通電した。通電前後における金属板抵抗器の上面中央部及び端面電極層の表面温度を、金属板抵抗器の中央部及び端面電極層の上方1cmの位置に温度計を設置して測定した。抵抗値5.1mΩの各金属板抵抗器を用いた結果を表1に、抵抗値4.84mΩの各金属板抵抗器を用いた結果を表2に示す。 Test Example The following performance test was performed using two types of metal plate resistors having different resistance values manufactured in the same manner as in Example 1 and two types of metal plate resistors having different resistance values as shown in FIG. It was. In addition, as a material which comprises each member of a conventional metal plate resistor, it manufactured with the material similar to Example 1 except not including a base electrode layer.
Each metal plate resistor is placed on a Cu foil 70 μm copper-clad glass epoxy substrate, and the substrate is surrounded so that there is no wind. Each metal plate resistor having a resistance value of 5.1 mΩ has 19.8 A and resistance Each metal plate resistor having a value of 4.84 mΩ was supplied with a current of 20.3 A for 15 minutes. The surface temperature of the upper surface center part and the end face electrode layer of the metal plate resistor before and after energization was measured by installing a thermometer at a position 1 cm above the center part of the metal plate resistor and the end face electrode layer. The results using each metal plate resistor having a resistance value of 5.1 mΩ are shown in Table 1, and the results using each metal plate resistor having a resistance value of 4.84 mΩ are shown in Table 2.
11、21 金属板抵抗体
12、22 第1の耐熱性保護層
13、23 第2の耐熱性保護層
14、24 下地電極層
15、25 端面電極層
16 第3の耐熱性保護層 10, 20 Current detection
Claims (11)
- 金属板抵抗体と、該金属板抵抗体の少なくとも一方の面の中央部に設けた耐熱性保護層と、該金属板抵抗体の一方の面の中央部に設けた耐熱性保護層の両端部を覆うように、金属板抵抗体の一方の面に設けた一対の下地電極層と、該下地電極層全面を覆うように、金属板抵抗体の両端部に設けた一対の端面電極層とを備えた電流検出用金属板抵抗器。 Metal plate resistor, heat-resistant protective layer provided at the center of at least one surface of the metal plate resistor, and both ends of the heat-resistant protective layer provided at the center of one surface of the metal plate resistor A pair of base electrode layers provided on one surface of the metal plate resistor, and a pair of end surface electrode layers provided on both ends of the metal plate resistor so as to cover the entire surface of the base electrode layer. Metal plate resistor for current detection provided.
- 耐熱性保護層を、金属板抵抗体の一方の面の中央部と、金属板抵抗体の他方の面の全面に設けた請求項1記載の電流検出用金属板抵抗器。 2. The metal plate resistor for current detection according to claim 1, wherein the heat-resistant protective layer is provided on the central portion of one surface of the metal plate resistor and the entire surface of the other surface of the metal plate resistor.
- 耐熱性保護層を、金属板抵抗体の両面の中央部に設け、端面電極層を、下地電極層を設けていない金属板抵抗体の面の耐熱性保護層を有していない部分面上まで延長した請求項1記載の電流検出用金属板抵抗器。 A heat-resistant protective layer is provided at the center of both sides of the metal plate resistor, and the end face electrode layer is on the surface of the metal plate resistor that is not provided with the base electrode layer, on the surface that does not have the heat-resistant protective layer. The metal plate resistor for current detection according to claim 1 extended.
- 耐熱性保護層が、シリカ粉を含有するポリアミドイミド樹脂層である請求項1~3のいずれかに記載の電流検出用金属板抵抗器。 The metal plate resistor for current detection according to any one of claims 1 to 3, wherein the heat-resistant protective layer is a polyamide-imide resin layer containing silica powder.
- シリカ粉が、マイクロメートルオーダー及びナノメートルオーダーの異なる粒径を有する粉末である請求項4記載の電流検出用金属板抵抗器。 The metal plate resistor for current detection according to claim 4, wherein the silica powder is a powder having different particle sizes on the order of micrometers and nanometers.
- 下地電極層が、銀粉とフェノールエポキシ樹脂とを含む請求項1~5のいずれかに記載の電流検出用金属板抵抗器。 The metal plate resistor for current detection according to any one of claims 1 to 5, wherein the base electrode layer contains silver powder and phenol epoxy resin.
- 端面電極層が、銅めっき層、ニッケルめっき層及び錫めっき層を含む請求項1~6のいずれかに記載の電流検出用金属板抵抗器。 7. The metal plate resistor for current detection according to claim 1, wherein the end face electrode layer includes a copper plating layer, a nickel plating layer, and a tin plating layer.
- 帯状の金属板抵抗体の少なくとも一方の面の中央部に耐熱性保護層をスクリーン印刷し、硬化させる工程(a)と、
該金属板抵抗体の一方の面の中央部に設けた耐熱性保護層の両端部を覆うように、金属板抵抗体の一方の面に一対の下地電極層をスクリーン印刷し、硬化させる工程(b)と、
該下地電極層全面を覆うように、端面電極層をめっき法により形成する工程(c)と、
帯状の金属板抵抗体を所定間隔に切断する工程(d)とを含む電流検出用金属板抵抗器の製造方法。 A step (a) of screen-printing and curing a heat-resistant protective layer on the central portion of at least one surface of the strip-shaped metal plate resistor; and
A step of screen-printing and curing a pair of base electrode layers on one surface of the metal plate resistor so as to cover both ends of the heat-resistant protective layer provided at the center of one surface of the metal plate resistor ( b) and
A step (c) of forming an end face electrode layer by plating so as to cover the entire surface of the base electrode layer;
A method of manufacturing a metal plate resistor for current detection, including a step (d) of cutting a strip-shaped metal plate resistor at a predetermined interval. - 工程(a)において、耐熱性保護層を、シリカ粉を含有するポリアミドイミド樹脂ペーストをスクリーン印刷し、硬化させて形成する請求項8に記載の電流検出用金属板抵抗器の製造方法。 The method for producing a metal plate resistor for current detection according to claim 8, wherein in step (a), the heat-resistant protective layer is formed by screen-printing and curing a polyamide-imide resin paste containing silica powder.
- シリカ粉が、マイクロメートルオーダー及びナノメートルオーダーの異なる粒径を有する粉末である請求項9記載の電流検出用金属板抵抗器の製造方法。 The method for producing a metal plate resistor for current detection according to claim 9, wherein the silica powder is a powder having different particle sizes on the order of micrometers and nanometers.
- 工程(b)において、下地電極層を、銀粉とフェノールエポキシ樹脂とを含むペーストをスクリーン印刷し、硬化させて形成する請求項8~10のいずれかに記載の電流検出用金属板抵抗器の製造方法。 The metal plate resistor for current detection according to any one of claims 8 to 10, wherein in step (b), the base electrode layer is formed by screen-printing and curing a paste containing silver powder and a phenol epoxy resin. Method.
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TWI634568B (en) * | 2017-03-15 | 2018-09-01 | 大毅科技股份有限公司 | Current sensing element and method of manufacturing the same |
WO2020045258A1 (en) * | 2018-08-29 | 2020-03-05 | パナソニックIpマネジメント株式会社 | Chip resistor and method for producing same |
JP7407132B2 (en) | 2019-02-07 | 2023-12-28 | ローム株式会社 | Resistor |
WO2022091643A1 (en) * | 2020-11-02 | 2022-05-05 | ローム株式会社 | Chip resistor and method for manufacturing same |
CN115512914A (en) * | 2022-09-27 | 2022-12-23 | 江苏华达电子有限公司 | Antistatic thick film chip resistor for automobile |
CN115512914B (en) * | 2022-09-27 | 2023-08-08 | 江苏华达电子有限公司 | Antistatic thick film chip resistor for automobile |
Also Published As
Publication number | Publication date |
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KR20120007001A (en) | 2012-01-19 |
TWI449059B (en) | 2014-08-11 |
TW201037736A (en) | 2010-10-16 |
JPWO2010113341A1 (en) | 2012-10-04 |
CN102379012A (en) | 2012-03-14 |
CN102379012B (en) | 2014-05-07 |
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