WO2010109947A1 - 防湿フィルム、その製造方法、それを用いた太陽電池モジュール用バックシート及び太陽電池モジュール - Google Patents
防湿フィルム、その製造方法、それを用いた太陽電池モジュール用バックシート及び太陽電池モジュール Download PDFInfo
- Publication number
- WO2010109947A1 WO2010109947A1 PCT/JP2010/051338 JP2010051338W WO2010109947A1 WO 2010109947 A1 WO2010109947 A1 WO 2010109947A1 JP 2010051338 W JP2010051338 W JP 2010051338W WO 2010109947 A1 WO2010109947 A1 WO 2010109947A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- moisture
- proof
- resin
- inorganic oxide
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 83
- 230000008569 process Effects 0.000 title abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 80
- 239000011347 resin Substances 0.000 claims abstract description 80
- 229910052809 inorganic oxide Inorganic materials 0.000 claims abstract description 49
- 239000002245 particle Substances 0.000 claims abstract description 41
- 238000000576 coating method Methods 0.000 claims abstract description 30
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 35
- -1 polysiloxane structure Polymers 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 26
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 13
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- 239000006185 dispersion Substances 0.000 claims description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 8
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 5
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 abstract description 4
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 238
- 239000010410 layer Substances 0.000 description 60
- 239000000463 material Substances 0.000 description 56
- 230000004888 barrier function Effects 0.000 description 32
- 239000000178 monomer Substances 0.000 description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 26
- 238000005266 casting Methods 0.000 description 25
- 238000001816 cooling Methods 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 19
- 238000001035 drying Methods 0.000 description 17
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- 229920006267 polyester film Polymers 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 12
- 239000000377 silicon dioxide Substances 0.000 description 12
- 230000035699 permeability Effects 0.000 description 11
- 239000005020 polyethylene terephthalate Substances 0.000 description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 description 11
- 229920005992 thermoplastic resin Polymers 0.000 description 11
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 10
- 239000013557 residual solvent Substances 0.000 description 10
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 229920003002 synthetic resin Polymers 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 235000019441 ethanol Nutrition 0.000 description 8
- 239000011888 foil Substances 0.000 description 8
- 238000006460 hydrolysis reaction Methods 0.000 description 8
- 239000000057 synthetic resin Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- 230000007062 hydrolysis Effects 0.000 description 7
- 238000007142 ring opening reaction Methods 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229920002678 cellulose Polymers 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229920005749 polyurethane resin Polymers 0.000 description 6
- 239000003377 acid catalyst Substances 0.000 description 5
- 238000006757 chemical reactions by type Methods 0.000 description 5
- 239000011247 coating layer Substances 0.000 description 5
- 150000001925 cycloalkenes Chemical class 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 150000004678 hydrides Chemical class 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229920001643 poly(ether ketone) Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920005672 polyolefin resin Polymers 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910002808 Si–O–Si Inorganic materials 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 150000001993 dienes Chemical class 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 125000005842 heteroatom Chemical group 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920006289 polycarbonate film Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 238000003980 solgel method Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- 229920001747 Cellulose diacetate Polymers 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 229920010524 Syndiotactic polystyrene Polymers 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 238000011978 dissolution method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005453 pelletization Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001230 polyarylate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000002040 relaxant effect Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- LCSLWNXVIDKVGD-KQQUZDAGSA-N (3e,7e)-deca-3,7-diene Chemical compound CC\C=C\CC\C=C\CC LCSLWNXVIDKVGD-KQQUZDAGSA-N 0.000 description 1
- JBVMSEMQJGGOFR-FNORWQNLSA-N (4e)-4-methylhexa-1,4-diene Chemical compound C\C=C(/C)CC=C JBVMSEMQJGGOFR-FNORWQNLSA-N 0.000 description 1
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- WLTSXAIICPDFKI-FNORWQNLSA-N (E)-3-dodecene Chemical compound CCCCCCCC\C=C\CC WLTSXAIICPDFKI-FNORWQNLSA-N 0.000 description 1
- FQDXJYBXPOMIBX-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoro-2-methylpropan-2-ol Chemical compound FC(F)(F)C(O)(C)C(F)(F)F FQDXJYBXPOMIBX-UHFFFAOYSA-N 0.000 description 1
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 1
- PVDLUGWWIOGCNH-UHFFFAOYSA-N 1,3-difluoro-2-propanol Chemical compound FCC(O)CF PVDLUGWWIOGCNH-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- PSQZJKGXDGNDFP-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)(F)F PSQZJKGXDGNDFP-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- VSQLAQKFRFTMNS-UHFFFAOYSA-N 5-methylhexa-1,4-diene Chemical compound CC(C)=CCC=C VSQLAQKFRFTMNS-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- RHQDFWAXVIIEBN-UHFFFAOYSA-N Trifluoroethanol Chemical compound OCC(F)(F)F RHQDFWAXVIIEBN-UHFFFAOYSA-N 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 101150059062 apln gene Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- HKQOBOMRSSHSTC-UHFFFAOYSA-N cellulose acetate Chemical compound OC1C(O)C(O)C(CO)OC1OC1C(CO)OC(O)C(O)C1O.CC(=O)OCC1OC(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C1OC1C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C(COC(C)=O)O1.CCC(=O)OCC1OC(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C1OC1C(OC(=O)CC)C(OC(=O)CC)C(OC(=O)CC)C(COC(=O)CC)O1 HKQOBOMRSSHSTC-UHFFFAOYSA-N 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 229920006265 cellulose acetate-butyrate film Polymers 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- GVRWIAHBVAYKIZ-UHFFFAOYSA-N dec-3-ene Chemical compound CCCCCCC=CCC GVRWIAHBVAYKIZ-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- HZLIIKNXMLEWPA-UHFFFAOYSA-N diethoxy(dipropyl)silane Chemical compound CCC[Si](CCC)(OCC)OCC HZLIIKNXMLEWPA-UHFFFAOYSA-N 0.000 description 1
- VSYLGGHSEIWGJV-UHFFFAOYSA-N diethyl(dimethoxy)silane Chemical compound CC[Si](CC)(OC)OC VSYLGGHSEIWGJV-UHFFFAOYSA-N 0.000 description 1
- BZCJJERBERAQKQ-UHFFFAOYSA-N diethyl(dipropoxy)silane Chemical compound CCCO[Si](CC)(CC)OCCC BZCJJERBERAQKQ-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- ZIDTUTFKRRXWTK-UHFFFAOYSA-N dimethyl(dipropoxy)silane Chemical compound CCCO[Si](C)(C)OCCC ZIDTUTFKRRXWTK-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- BBLGAWHITBYJEU-UHFFFAOYSA-N dipropoxy(propyl)silane Chemical compound CCCO[SiH](CCC)OCCC BBLGAWHITBYJEU-UHFFFAOYSA-N 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- DFJDZTPFNSXNAX-UHFFFAOYSA-N ethoxy(triethyl)silane Chemical compound CCO[Si](CC)(CC)CC DFJDZTPFNSXNAX-UHFFFAOYSA-N 0.000 description 1
- RSIHJDGMBDPTIM-UHFFFAOYSA-N ethoxy(trimethyl)silane Chemical compound CCO[Si](C)(C)C RSIHJDGMBDPTIM-UHFFFAOYSA-N 0.000 description 1
- STBFUFDKXHQVMJ-UHFFFAOYSA-N ethoxy(tripropyl)silane Chemical compound CCC[Si](CCC)(CCC)OCC STBFUFDKXHQVMJ-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- KUCGHDUQOVVQED-UHFFFAOYSA-N ethyl(tripropoxy)silane Chemical compound CCCO[Si](CC)(OCCC)OCCC KUCGHDUQOVVQED-UHFFFAOYSA-N 0.000 description 1
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 238000005227 gel permeation chromatography Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- RZXDTJIXPSCHCI-UHFFFAOYSA-N hexa-1,5-diene-2,5-diol Chemical compound OC(=C)CCC(O)=C RZXDTJIXPSCHCI-UHFFFAOYSA-N 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229960004592 isopropanol Drugs 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- BKXVGDZNDSIUAI-UHFFFAOYSA-N methoxy(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OC)C1=CC=CC=C1 BKXVGDZNDSIUAI-UHFFFAOYSA-N 0.000 description 1
- FUMSHFZKHQOOIX-UHFFFAOYSA-N methoxy(tripropyl)silane Chemical compound CCC[Si](CCC)(CCC)OC FUMSHFZKHQOOIX-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- RJMRIDVWCWSWFR-UHFFFAOYSA-N methyl(tripropoxy)silane Chemical compound CCCO[Si](C)(OCCC)OCCC RJMRIDVWCWSWFR-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 125000002950 monocyclic group Chemical group 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- MCSAJNNLRCFZED-UHFFFAOYSA-N nitroethane Chemical compound CC[N+]([O-])=O MCSAJNNLRCFZED-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000006864 oxidative decomposition reaction Methods 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- ILJSQTXMGCGYMG-UHFFFAOYSA-N triacetic acid Chemical compound CC(=O)CC(=O)CC(O)=O ILJSQTXMGCGYMG-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- HUZZQXYTKNNCOU-UHFFFAOYSA-N triethyl(methoxy)silane Chemical compound CC[Si](CC)(CC)OC HUZZQXYTKNNCOU-UHFFFAOYSA-N 0.000 description 1
- RXJWOBGGPLEFEE-UHFFFAOYSA-N triethyl(propoxy)silane Chemical compound CCCO[Si](CC)(CC)CC RXJWOBGGPLEFEE-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- PHPGKIATZDCVHL-UHFFFAOYSA-N trimethyl(propoxy)silane Chemical compound CCCO[Si](C)(C)C PHPGKIATZDCVHL-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10165—Functional features of the laminated safety glass or glazing
- B32B17/10293—Edge features, e.g. inserts or holes
- B32B17/10302—Edge sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10788—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/10807—Making laminated safety glass or glazing; Apparatus therefor
- B32B17/10816—Making laminated safety glass or glazing; Apparatus therefor by pressing
- B32B17/10871—Making laminated safety glass or glazing; Apparatus therefor by pressing in combination with particular heat treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/514—Oriented
- B32B2307/518—Oriented bi-axially
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7244—Oxygen barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/259—Silicic material
Definitions
- the present invention relates to a moisture-proof film having excellent productivity and moisture resistance, a method for producing the film, a back sheet for a solar cell module using the film, and a solar cell module.
- the formation of the deposited film is selected from any conventional method such as vacuum deposition (physical vapor deposition or chemical vapor deposition) or sputtering.
- the solar cell module has been a big problem that the cell deteriorates over time due to permeation of water vapor and the power generation efficiency is lowered.
- a resin moisture-proof sheet (back sheet) is generally used on the back side in terms of weight reduction and cost.
- the current resin moisture-proof sheet does not have sufficient water vapor permeability, and there has been a case in which the moisture-proof sheet deteriorates without waiting for 20 years, which is a durability standard required for a solar cell module.
- conventional resin moisture-proof sheets generally employ a technique of forming an inorganic oxide film such as silica by vapor deposition (see, for example, Patent Documents 3 and 4).
- the vapor deposition process has a problem that the manufacturing apparatus becomes large in size, such as requiring a vacuum apparatus, and is not suitable for continuous production, resulting in high costs.
- the sol-gel method is known as a method for forming an inorganic oxide layer by coating.
- the coating needs to be sintered at a high temperature to damage the resin base material. There was a problem that.
- the present invention has been made in view of the above problems and situations, and a solution to the problem is to form an inorganic oxide layer with high productivity by coating (coating) and to be moisture-proof against conventional vapor deposition and sputtering. It is to provide a moisture-proof film having excellent performance and a method for producing the same. Moreover, it is providing the solar cell module backsheet and solar cell module using the said moisture-proof film.
- a back sheet for a solar cell module wherein the moisture-proof film according to claim 1 or 2 is used.
- a solar cell module wherein the moisture-proof film according to claim 1 or 2 is used as a back sheet.
- an inorganic oxide layer is formed with high productivity by coating (coating), and a moisture-proof film having excellent moisture-proof performance with respect to conventional vapor deposition and sputtering is provided, and a manufacturing method thereof is provided. be able to.
- the solar cell module backsheet and solar cell module using the moisture-proof film can be provided.
- Schematic flow sheet showing one embodiment of an apparatus for producing a film-like resin substrate Sectional drawing which shows an example of the laminated constitution of the back seat
- the moisture-proof film of the present invention is a moisture-proof film in which a moisture-proof layer is provided on a resin substrate, and the moisture-proof layer is composed of an inorganic oxide film containing inorganic oxide particles having an average particle size of 1 nm to 1 ⁇ m. It is characterized by comprising a coating film.
- This feature is a technical feature common to the inventions according to claims 1 to 5.
- the inorganic oxide particles may contain at least one compound of silicon oxide, aluminum oxide, zinc oxide, titanium oxide and zirconium oxide. preferable.
- a step of applying a dispersion containing a compound having a polysiloxane structure and inorganic oxide particles on a resin base material to form a coating film It is preferable that it is a manufacturing method of the aspect which has the process of forming the inorganic oxide film containing an inorganic oxide particle by heat-processing at the heating temperature of 200 degreeC or more.
- the moisture-proof film of the present invention can be suitably used as a back sheet for a solar cell module. Therefore, a solar cell module using the moisture-proof film having excellent moisture resistance as a back sheet can be provided.
- resin base material As the resin base material according to the present invention, various publicly known resin films can be used.
- a polyester film or a cellulose ester film it is preferable to use a polyester film or a cellulose ester film, and it may be a film manufactured by melt casting or a film manufactured by solution casting.
- the thickness of the resin base material is preferably an appropriate thickness depending on the type and purpose of the resin. For example, it is generally in the range of 10 to 300 ⁇ m. The thickness is preferably 20 to 200 ⁇ m, more preferably 30 to 100 ⁇ m.
- the moisture-proof film of the present invention is characterized by having a moisture-proof layer on at least one surface of the resin substrate.
- the moisture-proof layer is formed of a coating film made of an inorganic oxide film containing inorganic oxide particles having a particle size of 1 nm or more and 1 ⁇ m or less.
- the moisture-proof layer according to the present invention is intended to prevent deterioration of humidity, particularly deterioration of a resin base material and various functional elements protected by the resin base material due to high humidity. As long as the above characteristics are maintained, various types of moisture-proof layers can be provided.
- the moisture resistance of the moisture-proof film of the present invention is 100 g / m 2 ⁇ 24 hr / ⁇ m or less, preferably 50 g / m 2 ⁇ 24 hr / ⁇ m or less, more preferably 20 g / m It is preferable to adjust the moisture-proof property of the moisture-proof layer so as to be m 2 ⁇ 24 hr / ⁇ m or less.
- the composition of the inorganic oxide particles according to the present invention is not particularly limited, but is preferably any of silicon oxide, aluminum oxide, zinc oxide, titanium oxide and zirconium oxide.
- the average particle size is 1 nm or more and 1 ⁇ m or less, preferably 3 nm or more and 300 nm or less, more preferably 5 nm or more and 100 nm or less.
- the inorganic oxide particles used are in the nm order.
- the reactivity is improved by increasing the specific surface area, and a strong inorganic oxide can be formed by heat treatment.
- inorganic oxide particles having a particle diameter of less than 1 nm are difficult to obtain themselves, and even if obtained, aggregation of particles proceeds in a short time, and is extremely unstable. It was difficult to apply to the present invention.
- the inorganic oxide film according to the present invention contains at least the above-described inorganic oxide particles and a compound having a polysiloxane structure for forming a silica-based film described later as its constituent elements.
- the content of the inorganic oxide particles is preferably 30 vol% or more and 99 vol% or less, more preferably 50 vol% or more and 80 vol% or less of the inorganic oxide film.
- the cross section of the film is observed with a transmission electron microscope, and the ratio of the total area of the inorganic fine particles contained in the total cross-sectional area of the inorganic oxide film Indicated. Since the original particle interface of the inorganic fine particles is observed in the film, the area where the inorganic fine particles are present can be quantified.
- Inorganic oxide films can be formed by vapor deposition, dry processes, and wet processes such as sol-gel methods, but they all have crystal grain interfaces, so they do not have sufficient barrier properties against gases and water vapor.
- the inclusion of inorganic oxide particles in the inorganic oxide film according to the present invention can minimize the occurrence of cracks that impair the barrier property, thereby improving the barrier property. Became possible.
- the siloxane polymer according to the present invention is not particularly limited, and is a polymer having a Si—O—Si bond.
- a hydrolytic condensate of alkoxysilane can be suitably used. Any kind of alkoxysilane can be used as the alkoxysilane. Examples of such alkoxysilanes include compounds represented by the following general formula (a).
- R 1 n —Si (OR 2 ) 4-n (Wherein R 1 is hydrogen, an alkyl group having 1 to 20 carbon atoms, or an aryl group, R 2 is a monovalent organic group, and n is an integer of 0 to 2)
- examples of the monovalent organic group include an alkyl group, an aryl group, an allyl group, and a glycidyl group. In these, an alkyl group and an aryl group are preferable.
- the alkyl group preferably has 1 to 5 carbon atoms, and examples thereof include a methyl group, an ethyl group, a propyl group, and a butyl group.
- the alkyl group may be linear or branched, and hydrogen may be substituted with fluorine.
- the aryl group preferably has 6 to 20 carbon atoms, and examples thereof include a phenyl group and a naphthyl group.
- n 2
- the weight average molecular weight of the siloxane polymer is preferably 200 or more and 50000 or less, and more preferably 1000 or more and 3000 or less. If it is this range, the applicability
- Alkoxysilane hydrolytic condensation is obtained by reacting an alkoxysilane serving as a polymerization monomer in an organic solvent in the presence of an acid catalyst or a base catalyst.
- the alkoxysilane used as the polymerization monomer may be used alone or may be condensed in combination of plural kinds.
- trialkylalkoxysilanes such as trimethylmethoxysilane, trimethylethoxysilane, trimethylpropoxysilane, triethylmethoxysilane, triethylethoxysilane, triethylpropoxysilane, tripropylmethoxysilane, tripropylethoxysilane, triphenylmethoxysilane, triphenylethoxy Triphenylalkoxysilane such as silane may be added during hydrolysis.
- the degree of hydrolysis of the alkoxysilane which is the premise of the condensation, can be adjusted by the amount of water to be added, but in general, with respect to the total number of moles of alkoxysilane represented by the general formula (a). 1.0 to 10.0 times mol, and more preferably 1.5 to 8.0 times mol.
- the degree of hydrolysis can be sufficiently increased, and the film formation can be improved.
- gelation can be prevented and the storage stability can be improved by making it 10.0 mol or less.
- the acid catalyst used is not particularly limited, and conventionally used organic acids are conventionally used. Any of inorganic acids can be used. Examples of the organic acid include organic carboxylic acids such as acetic acid, propionic acid, and butyric acid, and examples of the inorganic acid include hydrochloric acid, nitric acid, sulfuric acid, phosphoric acid, and the like.
- the acid catalyst may be added directly to the mixture of alkoxysilane and water, or may be added to the alkoxysilane as an acidic aqueous solution together with water.
- the hydrolysis reaction is usually completed in about 5 to 100 hours.
- the reaction can be performed in a short reaction time by reacting the acid catalyst aqueous solution dropwise with an organic solvent containing one or more alkoxysilanes represented by the general formula (a). It can also be completed.
- the hydrolyzed alkoxysilane then undergoes a condensation reaction, resulting in the formation of a Si—O—Si network.
- a composition for forming a silica-based coating is applied on a substrate.
- a method for applying the composition for forming a silica-based film on the substrate for example, any method such as a spray method, a spin coating method, a dip coating method, a roll coating method can be used. Used.
- the silica-based film forming composition applied on the substrate is heat-treated.
- the means, temperature, time, etc. of the heat treatment are not particularly limited, but in general, it may be heated for about 1 to 6 minutes on a hot plate at about 80 to 300 ° C.
- composition for forming a silica-based film of the present invention an acid or a base is generated by heating with a heat treatment. Since hydrolysis is promoted by the generated acid or base, the alkoxy group becomes a hydroxyl group and alcohol is generated. Thereafter, two molecules of alcohol are condensed to form a Si—O—Si network, so that a dense silica-based film can be obtained by heat treatment.
- the heat treatment is preferably performed in three or more steps in a stepwise manner. Specifically, after performing the first heat treatment for about 30 seconds to 2 minutes on a hot plate at about 60 to 150 ° C. in an air or an inert gas atmosphere such as nitrogen, the temperature is about 100 to 220 ° C. The second heat treatment is performed for about 30 seconds to 2 minutes, and the third heat treatment is performed at about 150 to 300 ° C. for about 30 seconds to 2 minutes.
- stepwise heat treatment of three or more steps preferably about 3 to 6 steps, a silica-based film can be formed at a lower temperature.
- the moisture-proof film of the present invention is a moisture-proof film in which a moisture-proof layer is provided on a resin substrate, and the moisture-proof layer is formed by heat treatment of a coating film made of a dispersion containing the inorganic oxide particles. It is characterized by.
- the heat treatment of the peripheral substrate when the temperature of the heat treatment of the peripheral substrate is high, it is originally preferable that the heat treatment is performed at a high temperature from the viewpoint that the treatment time can be shortened. From the viewpoint of using a synthetic resin as the material, 50 ° C. or higher and 200 ° C. or lower is preferable. Furthermore, 70 degreeC or more and 150 degrees C or less are preferable.
- Any heating means generally used can be applied to the heating method, but a method of heating by intermittently repeating heating for a single hour is also preferably used.
- a heating method it is preferable to form a moisture-proof layer by locally heating a coating film (also referred to as “coating layer”) of a dispersion containing inorganic oxide particles.
- local heating of the coating film means that the coating layer is substantially heated to 10 ° C. or more, preferably 20 ° C. or more higher than the resin substrate without substantially deteriorating the resin substrate by heating.
- heating As a local heating method for this purpose, various conventionally known methods can be employed. For example, heating with an infrared heater, hot air, microwave, ultrasonic heating, induction heating, or the like can be selected as appropriate. Of these, methods using intermittent electromagnetic irradiation of infrared rays, electromagnetic waves such as microwaves and ultrasonic waves are preferable.
- an irradiation device such as an infrared lamp or an infrared heater can be used. If the inorganic oxide layer can be formed, the irradiation by the infrared irradiation device may be performed once. However, in order to locally heat the coating layer, there is a method of intermittently repeating the infrared irradiation for one hour. Preferably used.
- a method of intermittently repeating short-time infrared irradiation for example, a method of repeatedly turning on and off the infrared irradiation device in a short time, a shielding plate is provided between the infrared irradiation device and a non-irradiated object, and the shielding plate is moved
- a method of repeatedly irradiating infrared rays by providing an infrared irradiation device at a plurality of locations in the conveyance direction of the non-irradiated material (resin film) and conveying the non-irradiated material.
- a microwave is a general term for a UHF to EHF band with a frequency of 1 GHz to 3 THz and a wavelength of about 0.1 to 300 mm, and a microwave generator with a frequency of 2.45 GHz is common, but a microwave with a frequency of 1 to 100 GHz is common.
- a 2.45 GHz microwave irradiator ⁇ -reactor manufactured by Shikoku Keiki Kogyo Co., Ltd.
- a microwave generator electromagnetic that radiates a 2.45 GHz microwave, and the like can be given.
- ultrasonic wave refers to an elastic vibration wave (sound wave) having a frequency of 10 kHz or more.
- the frequency of the horn is a frequency in the range of 50 kHz or less, and heating for a single time is repeated repeatedly as in the case of infrared irradiation.
- the coating layer is heated using microwaves or ultrasonic waves, only the resin coating layer is locally applied without causing deterioration of the resin base material by intermittently repeating heating for a single hour as in the case of infrared irradiation.
- the method of heating is preferably used.
- the synthetic resin layer prevents the moisture-proof layer from functioning as a stress relaxation layer that prevents cracks due to bending of the moisture-proof film and the like, and prevents the moisture-proof layer from becoming dirty and damaging the original moisture resistance.
- the purpose is to obtain a function as an antifouling layer.
- polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane, cellulose diacetate, cellulose triacetate (TAC), cellulose acetate butyrate, cellulose acetate propionate (CAP), cellulose acetate
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- TAC cellulose triacetate
- CAP cellulose acetate propionate
- Cellulose esters such as phthalate and cellulose nitrate or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate, norbornene resin, polymethylpentene, polyetherketone, polyimide, polyethersulfone ( PES), polysulfones, polyether ketone imide, polyamide, fluororesin Nylon, polymethyl methacrylate, acrylic or polyarylates, and
- resins particularly preferred resins are cycloolefin resins.
- cycloolefin resins examples include norbornene resins, monocyclic cyclo (cyclic) olefin resins, cyclo (cyclic) conjugated diene resins, and vinyl alicyclic hydrocarbon resins. Examples thereof include resins and hydrides thereof. Among these, norbornene-based resins can be suitably used because of their good transparency and moldability.
- Examples of the norbornene-based resin include a ring-opening polymer of a monomer having a norbornene structure, a ring-opening copolymer of a monomer having a norbornene structure and another monomer, a hydride thereof, and a norbornene structure.
- a ring-opening (co) polymer hydride of a monomer having a norbornene structure is particularly suitable from the viewpoints of transparency, moldability, heat resistance, low hygroscopicity, dimensional stability, lightness, and the like. Can be used.
- Examples of the monomer having a norbornene structure include bicyclo [2.2.1] hept-2-ene (common name: norbornene), tricyclo [4.3.0.1 2,5 ] deca-3,7-diene. (Common name: dicyclopentadiene), 7,8-benzotricyclo [4.3.0.1 2,5 ] dec-3-ene (common name: methanotetrahydrofluorene), tetracyclo [4.4.0. 1 2,5 . 1 7,10 ] dodec-3-ene (common name: tetracyclododecene) and derivatives of these compounds (for example, those having a substituent in the ring).
- examples of the substituent include an alkyl group, an alkylene group, and a polar group.
- these substituents may be the same or different and a plurality may be bonded to the ring.
- Monomers having a norbornene structure can be used singly or in combination of two or more.
- Examples of the polar group include heteroatoms or atomic groups having heteroatoms.
- Examples of the hetero atom include an oxygen atom, a nitrogen atom, a sulfur atom, a silicon atom, and a halogen atom.
- Specific examples of the polar group include a carboxyl group, a carbonyloxycarbonyl group, an epoxy group, a hydroxyl group, an oxy group, an ester group, a silanol group, a silyl group, an amino group, a nitrile group, and a sulfone group.
- monomers capable of ring-opening copolymerization with monomers having a norbornene structure include monocyclo (cyclic) olefins such as cyclohexene, cycloheptene, and cyclooctene and derivatives thereof, and cyclo ( Cyclic) conjugated dienes and derivatives thereof.
- a ring-opening polymer of a monomer having a norbornene structure and a ring-opening copolymer of a monomer having a norbornene structure and another monomer copolymerizable with the monomer have a known ring-opening polymerization catalyst. It can be obtained by (co) polymerization in the presence.
- Examples of other monomers that can be addition-copolymerized with a monomer having a norbornene structure include, for example, ⁇ -olefins having 2 to 20 carbon atoms such as ethylene, propylene, and 1-butene, and derivatives thereof; cyclobutene, cyclopentene, Examples thereof include cycloolefins such as cyclohexene and derivatives thereof; non-conjugated dienes such as 1,4-hexadiene, 4-methyl-1,4-hexadiene, and 5-methyl-1,4-hexadiene. These monomers can be used alone or in combination of two or more. Among these, ⁇ -olefin is preferable, and ethylene is more preferable.
- An addition polymer of a monomer having a norbornene structure and an addition copolymer of another monomer copolymerizable with a monomer having a norbornene structure can be used in the presence of a known addition polymerization catalyst. It can be obtained by polymerization.
- a known hydrogenation catalyst containing a transition metal such as nickel or palladium is added to the polymer solution, and the carbon-carbon unsaturated bond is preferably hydrogenated by 90% or more.
- X bicyclo [3.3.0] octane-2,4-diyl-ethylene structure and Y: tricyclo [4.3.0.1 2,5 ] decane-7 are used as repeating units.
- 9-diyl-ethylene structure the content of these repeating units is 90% by mass or more based on the entire repeating units of the norbornene resin, and the X content ratio and the Y content ratio are The ratio of X: Y is preferably 100: 0 to 40:60.
- the molecular weight of the cyclo (cyclic) olefin resin used in the present invention is appropriately selected according to the purpose of use.
- Polyisoprene or polystyrene-equivalent weight average molecular weight (Mw) measured by gel permeation chromatography using cyclohexane (toluene if the polymer resin does not dissolve) as a solvent usually 20,000 to 150,000. . It is preferably 25,000 to 100,000, more preferably 30,000 to 80,000.
- Mw weight average molecular weight
- the glass transition temperature of the cyclo (cyclic) olefin resin may be appropriately selected according to the purpose of use.
- the range is preferably from 130 to 160 ° C, more preferably from 135 to 150 ° C.
- cycloolefin resin used in the present invention include, for example, JSR Corporation trade name: ARTON; Nippon Zeon Corporation trade name: Zeonoa; Sekisui Chemical Co., Ltd. trade name: Essina. be able to.
- a filler, an antioxidant, an ultraviolet absorber, a heat stabilizer, a lubricant, an antistatic agent, and an antibacterial agent are added to each layer as needed, particularly to the substrate.
- Pigments and the like can be added.
- the solution casting method and the melt casting method by casting are preferable from the viewpoints of suppression of coloring, suppression of defects of foreign matters, suppression of optical defects such as die lines, and the like.
- an organic solvent useful for forming the dope can be used without limitation as long as it dissolves a thermoplastic resin such as a cellulose ester resin. .
- methylene chloride as a non-chlorinated organic solvent, methyl acetate, ethyl acetate, amyl acetate, acetone, tetrahydrofuran, 1,3-dioxolane, 1,4-dioxane, cyclohexanone, ethyl formate, 2,2,2-trifluoroethanol, 2,2,3,3-hexafluoro-1-propanol, 1,3-difluoro-2-propanol, 1,1,1,3,3,3-hexafluoro- 2-methyl-2-propanol, 1,1,1,3,3,3-hexafluoro-2-propanol, 2,2,3,3,3-pentafluoro-1-propanol, nitroethane, ethyl lactate, lactic acid , Diacetone alcohol, etc., preferably methylene chloride, methyl acetate, ethyl acetate,
- the dope may contain 1 to 40% by mass of a linear or branched aliphatic alcohol having 1 to 4 carbon atoms.
- a linear or branched aliphatic alcohol having 1 to 4 carbon atoms.
- thermoplastic resin should be a dope composition in which at least 10 to 45% by mass of the thermoplastic resin is dissolved in a solvent containing methylene chloride and a linear or branched aliphatic alcohol having 1 to 4 carbon atoms. preferable.
- linear or branched aliphatic alcohol having 1 to 4 carbon atoms examples include methanol, ethanol, n-propanol, iso-propanol, n-butanol, sec-butanol, and tert-butanol. Ethanol is preferred because of the stability of these dopes, the relatively low boiling point, and good drying properties.
- film a film-like resin substrate (hereinafter also simply referred to as “film”) according to the present invention.
- thermoplastic resin and other additives are dissolved in an organic solvent mainly composed of a good solvent for the thermoplastic resin while stirring to form a dope.
- thermoplastic resin For the dissolution of the thermoplastic resin, a method carried out at normal pressure, a method carried out below the boiling point of the main solvent, a method carried out under pressure above the boiling point of the main solvent, JP-A-9-95544, JP-A-9-95557 Alternatively, various dissolution methods such as a method using a cooling dissolution method as described in JP-A-9-95538 and a method using a high pressure as described in JP-A-11-21379 can be used. The method of pressurizing at a boiling point or higher is preferred.
- Recycled material is a finely pulverized film, which is generated when the film is formed, cut off on both sides of the film, or the original film that has been speculated out due to scratches, etc. Reused.
- An endless metal belt such as a stainless steel belt or a rotating metal drum, which supports the dope is fed to a pressure die through a liquid feed pump (for example, a pressurized metering gear pump) and supported infinitely. This is a step of casting a dope from a pressure die slit to a casting position on the body.
- a liquid feed pump for example, a pressurized metering gear pump
- ⁇ Pressure dies that can adjust the slit shape of the die base and make the film thickness uniform are preferred.
- the pressure die include a coat hanger die and a T die, and any of them is preferably used.
- the surface of the metal support is a mirror surface.
- two or more pressure dies may be provided on the metal support, and the dope amount may be divided and stacked. Or it is also preferable to obtain the film of a laminated structure by the co-casting method which casts several dope simultaneously.
- Solvent evaporation step In this step, the web (the dope is cast on the casting support and the formed dope film is called a web) is heated on the casting support to evaporate the solvent.
- the web on the support after casting is preferably dried on the support in an atmosphere of 40 to 100 ° C. In order to maintain the atmosphere at 40 to 100 ° C., it is preferable to apply hot air at this temperature to the upper surface of the web or heat by means such as infrared rays.
- Peeling process It is the process of peeling the web which the solvent evaporated on the metal support body in a peeling position. The peeled web is sent to the next process.
- the temperature at the peeling position on the metal support is preferably 10 to 40 ° C, more preferably 11 to 30 ° C.
- the amount of residual solvent at the time of peeling of the web on the metal support at the time of peeling is preferably 50 to 120% by mass depending on the strength of drying conditions, the length of the metal support, and the like. If the web is peeled off at a time when the amount of residual solvent is larger, if the web is too soft, the flatness at the time of peeling will be lost, and slippage and vertical stripes are likely to occur due to the peeling tension. The amount of solvent is determined.
- the amount of residual solvent in the web is defined by the following formula.
- Residual solvent amount (%) (mass before web heat treatment ⁇ mass after web heat treatment) / (mass after web heat treatment) ⁇ 100 Note that the heat treatment for measuring the residual solvent amount represents performing heat treatment at 115 ° C. for 1 hour.
- the peeling tension at the time of peeling the metal support and the film is usually 196 to 245 N / m. However, if wrinkles easily occur at the time of peeling, it is preferable to peel with a tension of 190 N / m or less. It is preferable to peel at a minimum tension of ⁇ 166.6 N / m, and then peel at a minimum tension of ⁇ 137.2 N / m, and particularly preferable to peel at a minimum tension of ⁇ 100 N / m.
- the temperature at the peeling position on the metal support is preferably ⁇ 50 to 40 ° C., more preferably 10 to 40 ° C., and most preferably 15 to 30 ° C.
- a drying device 35 that transports the web alternately through rolls arranged in the drying device and / or a tenter stretching device 34 that clips and transports both ends of the web with clips. And dry the web.
- the drying means is generally to blow hot air on both sides of the web, but there is also a means to heat by applying microwaves instead of wind. Too rapid drying tends to impair the flatness of the finished film. Drying at a high temperature is preferably performed from about 8% by mass or less of residual solvent. Throughout, drying is generally performed at 40-250 ° C. In particular, drying at 40 to 160 ° C. is preferable.
- tenter stretching apparatus When using a tenter stretching apparatus, it is preferable to use an apparatus that can independently control the film gripping length (distance from the start of gripping to the end of gripping) left and right by the left and right gripping means of the tenter. In the tenter process, it is also preferable to intentionally create sections having different temperatures in order to improve planarity.
- the stretching operation may be performed in multiple stages, and it is also preferable to perform biaxial stretching in the casting direction and the width direction.
- biaxial stretching When biaxial stretching is performed, simultaneous biaxial stretching may be performed or may be performed stepwise.
- stepwise means that, for example, stretching in different stretching directions can be sequentially performed, stretching in the same direction is divided into multiple stages, and stretching in different directions is added to any one of the stages. Is also possible. That is, for example, the following stretching steps are possible.
- Simultaneous biaxial stretching includes stretching in one direction and contracting the other while relaxing the tension.
- the preferred draw ratio for simultaneous biaxial stretching can be in the range of x1.01 to x1.5 in both the width direction and the longitudinal direction.
- the amount of residual solvent in the web is preferably 20 to 100% by mass at the start of the tenter, and drying is preferably performed while the tenter is applied until the amount of residual solvent in the web is 10% by mass or less. More preferably, it is 5% by mass or less.
- the drying temperature is preferably 30 to 160 ° C., more preferably 50 to 150 ° C., and most preferably 70 to 140 ° C.
- the temperature distribution in the width direction of the atmosphere is small from the viewpoint of improving the uniformity of the film.
- the temperature distribution in the width direction in the tenter process is preferably within ⁇ 5 ° C, and within ⁇ 2 ° C. Is more preferable, and within ⁇ 1 ° C. is most preferable.
- Winding process This is a process in which the amount of residual solvent in the web becomes 2% by mass or less, and is taken up by the winder 37 as a film, and the dimensional stability is achieved by setting the residual solvent amount to 0.4% by mass or less. Can be obtained. It is particularly preferable to wind up at 0.00 to 0.10% by mass.
- a generally used one may be used, and there are a constant torque method, a constant tension method, a taper tension method, a program tension control method with a constant internal stress, etc., and these may be used properly.
- the film according to the present invention is preferably a long film, specifically a film having a thickness of about 100 m to 5000 m, and usually in a form provided in a roll shape.
- the film width is preferably 1.3 to 4 m, more preferably 1.4 to 2 m.
- the film thickness of the film according to the present invention is not particularly limited, but is preferably 20 to 200 ⁇ m, more preferably 25 to 150 ⁇ m, and particularly preferably 30 to 120 ⁇ m.
- composition constituting the film made of a thermoplastic resin used for melt extrusion is usually preferably kneaded in advance and pelletized.
- Pelletization may be a known method, for example, a composition comprising a dried thermoplastic resin and various additives is fed to an extruder with a feeder and kneaded using a uniaxial or biaxial extruder, and then from a die. It can be obtained by extruding into a strand, water cooling or air cooling and cutting.
- cellulose ester easily absorbs moisture, it is preferable to dry it at 70 to 140 ° C. for 3 hours or more with a dehumidifying hot air dryer or a vacuum dryer so that the moisture content is 200 ppm or less, and further 100 ppm or less.
- Additives may be fed into the extruder and fed into the extruder, or may be fed through individual feeders. In order to mix a small amount of additives such as an antioxidant uniformly, it is preferable to mix them in advance.
- the antioxidant may be mixed with each other, and if necessary, the antioxidant may be dissolved in a solvent, impregnated with a thermoplastic resin and mixed, or mixed by spraying. May be.
- a vacuum nauter mixer or the like is preferable because drying and mixing can be performed simultaneously. Further, if the contact with air, such as the exit from the feeder unit or die, it is preferable that the atmosphere such as dehumidified air and dehumidified N 2 gas.
- the extruder is preferably processed at as low a temperature as possible so as to be able to be pelletized so that the shear force is suppressed and the resin does not deteriorate (molecular weight reduction, coloring, gel formation, etc.).
- a twin screw extruder it is preferable to rotate in the same direction using a deep groove type screw. From the uniformity of kneading, the meshing type is preferable.
- Film formation is performed using the pellets obtained as described above. It is also possible to feed the raw material powder directly to the extruder with a feeder and form a film as it is without pelletization.
- the melt temperature Tm when extruding the pellets is about 200-300 ° C, filtered through a leaf disk type filter, etc. to remove foreign matter, Coextruded into a film, solidified on a cooling roll, and cast while pressing with an elastic touch roll.
- Tm is the temperature of the die exit portion of the extruder.
- defects are also referred to as die lines, but in order to reduce surface defects such as die lines, it is preferable to have a structure in which the resin retention portion is minimized in the piping from the extruder to the die. . It is preferable to use a die that has as few scratches as possible inside the lip.
- the inner surface that comes into contact with the molten resin is preferably subjected to surface treatment that makes it difficult for the molten resin to adhere to the surface by reducing the surface roughness or using a material with low surface energy.
- a hard chrome plated or ceramic sprayed material is polished so that the surface roughness is 0.2 S or less.
- the cooling roll is not particularly limited, but it is a roll having a structure in which a heat medium or a coolant that can be controlled in temperature flows with a highly rigid metal roll, and the size is not limited.
- the size of the cooling roll is usually about 100 mm to 1 m.
- the surface material of the cooling roll includes carbon steel, stainless steel, aluminum, titanium and the like. Further, in order to increase the hardness of the surface or improve the releasability from the resin, it is preferable to perform a surface treatment such as hard chrome plating, nickel plating, amorphous chrome plating, or ceramic spraying.
- the surface roughness of the cooling roll surface is preferably 0.1 ⁇ m or less in terms of Ra, and more preferably 0.05 ⁇ m or less.
- the smoother the roll surface the smoother the surface of the resulting film.
- the surface processed is further polished to have the above-described surface roughness.
- the film obtained as described above can be further stretched 1.01 to 3.0 times in at least one direction after passing through the step of contacting the cooling roll.
- the film is stretched 1.1 to 2.0 times in both the longitudinal (film transport direction) and lateral (width direction) directions.
- the stretching method a known roll stretching machine or tenter can be preferably used.
- the moisture-proof film also serves as a polarizing plate protective film, it is preferable to make the stretching direction the width direction because lamination with the polarizing film can be performed in a roll form.
- the slow axis of the film becomes the width direction by stretching in the width direction.
- the draw ratio is 1.1 to 3.0 times, preferably 1.2 to 1.5 times
- the drawing temperature is usually Tg to Tg + 50 ° C. of the resin constituting the film, preferably Tg to Tg + 50 ° C. In the temperature range.
- the stretching is preferably performed under a uniform temperature distribution controlled in the longitudinal direction or the width direction.
- the temperature is preferably within ⁇ 2 ° C, more preferably within ⁇ 1 ° C, and particularly preferably within ⁇ 0.5 ° C.
- the film When the film-like resin base material produced by the above method is used as an optical film, the film may be contracted in the longitudinal direction or the width direction for the purpose of adjusting the retardation of the optical film and reducing the dimensional change rate.
- Uniformity in the slow axis direction is also important, and the angle is preferably ⁇ 5 to + 5 ° with respect to the film width direction, more preferably in the range of ⁇ 1 to + 1 °, particularly ⁇ 0.
- a range of 5 to + 0.5 ° is preferable, and a range of ⁇ 0.1 to + 0.1 ° is particularly preferable.
- the film-like resin base material according to the present invention is preferably a long film, specifically, a film having a thickness of about 100 m to 5000 m, usually in a form provided in a roll shape.
- the film width is preferably 1.3 to 4 m, more preferably 1.4 to 2 m.
- the film thickness of the film-like resin substrate according to the present invention is not particularly limited, and is preferably changed according to the purpose.
- the thickness is preferably 20 to 200 ⁇ m, more preferably 25 to 150 ⁇ m, and particularly preferably 30 to 120 ⁇ m.
- FIG. 1 is a schematic flow sheet showing an overall configuration of an example of a resin base material manufacturing apparatus according to the present invention.
- the resin base material is manufactured by mixing a film material such as a thermoplastic resin and then using the extruder 1 to melt and extrude from a casting die 4 onto a first cooling roll 5. 5, and is further circumscribed in order by a total of three cooling rolls of the second cooling roll 7 and the third cooling roll 8, and is cooled and solidified to form a film 10.
- the film 10 peeled off by the peeling roll 9 is then stretched in the width direction by holding both ends of the film by the stretching device 12 and then wound by the winding device 16.
- a touch roll 6 is provided that clamps the molten film on the surface of the first cooling roll 5 in order to correct the flatness.
- the touch roll 6 has an elastic surface and forms a nip with the first cooling roll 5.
- a device for automatically cleaning the belt and the roll it is preferable to add a device for automatically cleaning the belt and the roll to the manufacturing apparatus.
- the cleaning device there is no particular limitation on the cleaning device, but for example, a method of niping a brush roll, a water absorbing roll, an adhesive roll, a wiping roll, etc., an air blowing method for spraying clean air, a laser incinerator, or a combination thereof. is there.
- the solar cell module backsheet of various aspects can be produced using the moisture-proof film of this invention mentioned above.
- the back sheet (10A) for a solar cell module shown in FIG. 2 is formed by laminating an inner surface base material (11A) and an outer surface base material (13A) via a barrier layer (12A).
- the barrier layer (12A) includes a first barrier layer (12Aa) made of an aluminum foil disposed on the inner surface base material (11A) side, and a resin film having a barrier property disposed on the outer surface base material (13A) side.
- the second barrier layer (12Ab) made of, for example, is laminated with a two-component reaction type polyurethane resin adhesive (12Ac) interposed therebetween.
- the aluminum foil constituting the first barrier layer (12Aa) can preferably be used with a thickness of about 5 to 50 ⁇ m.
- prevention of deterioration and extension of the life of the aluminum foil layer means prevention of water vapor from entering the solar cell module as it is.
- the resin film constituting the second barrier layer (12Ab) has a barrier property such as a polyester film having a thickness of about 5 to 50 ⁇ m and an ethylene / vinyl alcohol copolymer (EVOH) film having a thickness of about 10 to 50 ⁇ m.
- the resin base material (film) which has can be used preferably.
- silicon oxide, aluminum oxide, magnesium oxide, or a mixture thereof can be preferably used as the inorganic compound constituting the moisture-proof layer provided on the surface of the second barrier layer (12Ab).
- the thickness of the moisture-proof layer is preferably in the range of 5 to 100 nm.
- the first barrier layer (12Aa) and the second barrier layer (12Ab) are bonded together by a dry lamination method using a two-component reaction type polyurethane resin adhesive (12Ac) to form a barrier layer (12A).
- a polyester resin-based or polyether acrylic resin-based adhesive can also be used.
- the barrier layer (12A) By configuring the barrier layer (12A) in this way, the aluminum foil of the first barrier layer (12Aa) has the highest level of oxygen and water vapor barrier properties, and the second barrier layer (12Ab) works. Since oxygen and water vapor that touch the aluminum foil in the back sheet are blocked, deterioration due to oxidation and hydrolysis is prevented even after a long time, and the barrier property of the aluminum foil can be maintained for a long time.
- plastic films are extremely superior to oxidation resistance and hydrolysis resistance compared to aluminum foil, it is very preferable to use them in such a configuration.
- the above resin base materials can be preferably used.
- a material of about 20 to 50 ⁇ m and a polyester base material of about 50 to 250 ⁇ m can be suitably used.
- the inner surface base material (11A) and the outer surface base material (13A) may be made of the same material or different materials.
- the barrier layer (12A) and the outer surface base material (13A) makes the inner surface base material (11A) and the first barrier layer (12Aa) face each other,
- the second barrier layer (12Ab) and the outer surface base material (13A) are opposed to each other, and the first barrier layer (12Aa) and the second barrier layer (12Ab) are made of a two-component reaction type polyurethane resin adhesive (12Ac).
- it can be performed by the dry laminating method using the two-component reaction type polyurethane resin adhesive (12Ac).
- the moisture-proof film of the present invention can be applied to various types of solar cell modules.
- FIG. 3 schematically shows a solar cell module produced using the moisture-proof film of the present invention as a back sheet (10A), in which 20A is a filler (EVA), 30A is a solar cell element, and 40A.
- 20A is a filler (EVA)
- 30A is a solar cell element
- 40A Is a front glass
- 50A is an aluminum frame
- 60A is a lead wire
- 70A is a terminal
- 80A is a terminal box
- 90A is a sealing material (butyl rubber).
- the solar cell element various types of elements can be used.
- a light-transmitting conductive film having a texture structure, a photoelectric conversion film, and a back electrode film are sequentially stacked on a light-transmitting insulating substrate as disclosed in JP-A-2004-2261, and
- a solar cell element or the like having an aspect in which the photoelectric conversion film and the back electrode film are missing and a light-reflective insulating film is provided in the lacking part can be used.
- Light-reflective insulating film means an insulating film having the property of reflecting incident light and guiding it to a photoelectric conversion film, and is not particularly limited as long as it has such a property, regardless of whether it is organic or inorganic. Can be used without Use of a film having a reflection spectrum that reflects all or part of the wavelength within a range in which the photoelectric conversion film has sensitivity as the light-reflective insulating film is preferable from the viewpoint of improving the utilization efficiency of incident light. It is.
- the photoelectric conversion film when silicon is used as the photoelectric conversion film, it is preferable to use a light-reflective insulating film that reflects all or part of light having a wavelength of 1000 nm or less, which is a light absorption region of silicon.
- a light-reflective insulating film that reflects all or part of light having a wavelength of 1000 nm or less, which is a light absorption region of silicon.
- sunlight when sunlight is used as the light source, since sunlight has a large emission spectrum in the visible light region of 400 to 700 nm, a colored film having a reflection spectrum having a wavelength in such a region is preferable.
- the white film is more preferable from the viewpoint of reflecting most of the light in the visible light region wavelength.
- the method for forming the light-reflective insulating film is not particularly limited.
- the light-reflective insulating film is formed by adhering a thin-film organic substance or organic substance to a necessary part, or by applying an organic paint or an inorganic paint to the necessary part. be able to.
- the film thickness of the light-reflective insulating film is not particularly limited, but is preferably from 0.01 to 100 ⁇ m from the viewpoints of light reflection intensity and prevention of film peeling.
- the “photoelectric conversion film” refers to a film having a property of converting light energy into electrical energy, and any film having such properties can be used without any limitation, regardless of whether it is an organic material or an inorganic material.
- photoelectric conversion thin films for solar cells amorphous silicon, polycrystalline silicon, or the like is generally used.
- the film thickness of the photoelectric conversion film is not particularly limited, but is preferably 0.2 to 10 ⁇ m from the viewpoint of photoelectric conversion efficiency.
- the “light transmissive conductive film” means a light transmissive electrode provided on the light incident side of the photoelectric conversion film in order to take out the current generated in the photoelectric conversion film.
- ITO indium tin oxide
- SnO 2 tin oxide
- the thickness of the light transmissive conductive film is not particularly limited, but is preferably 0.1 to 2 ⁇ m from the viewpoint of photoelectric conversion efficiency.
- Back-side electrode film means an electrode provided on the back side of the photoelectric conversion film (on the opposite side of the light incidence) for taking out the current generated in the photoelectric conversion film, and it is not necessary to transmit light.
- a metal electrode is used.
- silver, aluminum or the like of about 0.1 to 1 ⁇ m is usually used.
- the “light-transmitting insulating film” is an insulating film having a property of transmitting incident light and needs to have a refractive index lower than that of the light-transmitting conductive film. This is because incident light leaks from the light transmissive insulating film at a refractive index higher than that of the light transmissive conductive film. Even if it is a light-transmitting insulating film, if its refractive index is lower than that of the light-transmitting insulating film, incident light is transmitted through the texture structure formed at the interface between the light-transmitting conductive film and the light-transmitting insulating film. This is because the conductive film and the light-transmissive insulating substrate are sealed. Any material having such properties can be used without particular limitation regardless of whether it is organic or inorganic. Includes transparent and translucent films.
- a reflection film may be further provided on the surface of the light-transmitting insulating film to further reduce the leakage of incident light.
- the reflective film may be a film having a property of reflecting incident light and guiding it to the photoelectric conversion film, and includes not only a light reflective insulating film but also a light reflective conductive film.
- a reflective film is necessary to prevent leakage of incident light.
- the “texture structure” refers to a structure in which the surface shapes of the light-transmitting conductive film, the photoelectric conversion film, and the back electrode film are a collection of a large number of minute pyramids of about 0.1 ⁇ m to 10 ⁇ m. It means being. Because it resembles the structure of a fabric, it is called a texture structure.
- the light incident surface has a texture structure
- the reflected light is reduced
- the light output surface has a texture structure
- reflection between the light incident surface and the surface of the light-transmissive insulating substrate is caused by reflection on the texture surface.
- the incident light is confined in the light-transmitting conductive film and the photoelectric conversion film.
- the above-mentioned sol solution-1 is bar-coated so that the thickness of the dried film becomes 2 ⁇ m, and 150 ° C. in a dry oven.
- the sample of Comparative Example 2 was prepared by heating and drying for 30 minutes.
- the dispersion-A was bar-coated so that the thickness of the dried film was 2 ⁇ m, and 150 ° C., 30 ° C. in a dry oven.
- the sample of Comparative Example 3 was prepared by heat drying for a few minutes.
- Example 1 400 g of pure water was put into a 1 L stainless steel pot, and 600 g of silicon oxide (trade name: SFP-30M average particle diameter 700 nm, manufactured by Denki Kagaku Kogyo Co., Ltd.) was used at 6000 rpm using an Ultra Turrax T25 Digital (IKA). It was added over a period of time and then dispersed for 30 minutes. Thereafter, 1000 g of MEK was added, and the operation of removing the solvent with an evaporator until the residual mass reached 800 g under a reduced pressure of bath temperature of 40 ° C.
- silicon oxide trade name: SFP-30M average particle diameter 700 nm, manufactured by Denki Kagaku Kogyo Co., Ltd.
- a resin solution-1 having a resin non-volatile content concentration of 60% and a viscosity of 400 mPa ⁇ s.
- 30 g of Dispersion-1 and 70 g of Resin Solution-1 were mixed, and this mixed dispersion was placed on one side of a biaxially stretched polyester film (polyethylene terephthalate film, thickness 100 ⁇ m), and the thickness of the dried film was 2 ⁇ m.
- the sample was bar-coated and dried by heating in a dry oven at 150 ° C. for 30 minutes to prepare the sample of Example 1.
- Example 2 Dispersion-2 was obtained in the same manner as dispersion-1, except that silicon oxide was changed to trade name: SFP-20M (particle size: 300 nm) manufactured by Denki Kagaku Kogyo Co., Ltd. Furthermore, the sample of Example 2 was produced in the same manner as in Example 1.
- Example 3 Dispersion-3 was obtained in the same manner as dispersion-1, except that silicon oxide was changed to a product name: Sicastar (particle size 70 nm) manufactured by Corefront Corporation. Further, a sample of Example 3 was produced in the same manner as in Example 1.
- Example 4 An aqueous dispersion of aluminum oxide (trade name: NANOBYK-3600, average particle size: 40 nm, manufactured by Tetsutani Co., Ltd.) and 1000 g of MEK were added to a 1 L stainless steel pot, and a bath temperature of 40 ° C., 2.0 ⁇ 10 2 torr (2. The operation of removing the solvent with an evaporator was repeated three times under a reduced pressure of 7 ⁇ 10 4 Pa) until the residual mass reached 800 g. Finally, 200 g of MEK was added to make the total mass 1000 g, thereby obtaining Dispersion-4.
- aluminum oxide trade name: NANOBYK-3600, average particle size: 40 nm, manufactured by Tetsutani Co., Ltd.
- Dispersion-4 and 70 g of Resin Solution-1 were mixed and placed on one side of a biaxially stretched polyester film (polyethylene terephthalate film, thickness 100 ⁇ m) so that the thickness of the dried film was 2 ⁇ m.
- the sample was coated and dried in a dry oven at 150 ° C. for 30 minutes to prepare the sample of Example 4.
- Example 5 Dispersion-5 was obtained in the same manner as in Example-1, except that silicon oxide was replaced with titanium oxide having an average particle diameter of 50 nm. Furthermore, the sample of Example 5 was produced in the same manner as in Example 1.
- Example 6 30 g of Dispersion-3 and 70 g of Resin Solution-1 were mixed and placed on one side of a biaxially stretched polyester film (polyethylene terephthalate film, thickness 100 ⁇ m) so that the thickness of the dried film was 2 ⁇ m. After coating and drying in a dry oven at 70 ° C. for 20 minutes, using a near-infrared dryer (Nippon Electric Heat Co., Ltd. paint dryer PDH1000) at an output of 1 kW and at a distance of 50 cm from the coated surface, The sample of Example 6 was produced by repeating infrared irradiation for 0.5 seconds 10 times.
- a near-infrared dryer Nippon Electric Heat Co., Ltd. paint dryer PDH1000
- Example 7 30 g of Dispersion-1 and 70 g of Resin Solution-1 were mixed and placed on one side of a biaxially stretched polyester film (polyethylene terephthalate film, thickness 100 ⁇ m) so that the thickness of the dried film was 2 ⁇ m. The sample was coated and dried in a dry oven at 40 ° C. for 120 minutes to prepare a sample of Example 7.
- a biaxially stretched polyester film polyethylene terephthalate film, thickness 100 ⁇ m
- the oxygen permeability is a value measured using an oxygen gas permeability measuring device (manufactured by Modern Control Co., Ltd., OX-TRAN 2/20: trade name) under the conditions of a measurement temperature of 23 ° C. and a humidity of 90% RH. is there.
- the water vapor permeability is measured using a water vapor permeability measuring device (manufactured by Modern Control Co., Ltd., PERMATRAN-W 3/31: trade name) under the conditions of a measurement temperature of 37.8 ° C. and a humidity of 100% RH. It is a measured value.
- the water vapor transmission rate is a value measured using a water vapor transmission measurement device (manufactured by Modern Control Co., Ltd., PERMATRAN-W 3/31: trade name) under the conditions of a measurement temperature of 40.0 ° C. and a humidity of 90% RH. It is.
- Table 1 shows the results of evaluating the properties of the obtained moisture-proof film.
- the moisture-proof film according to the present invention is excellent in barrier properties against water vapor and oxygen.
- Comparative Example 2 the resin film contracted and deformed by heating, so that it could not be used as a moisture-proof film.
- Example 8 to 14 A two-component reaction type polyurethane resin adhesive 14B is applied to the outer surface side of the resin base material 13B of the moisture-proof film prepared in Example 1 (the coating amount is 5 g / m 2 ), and the inner surface base material 15B has a thickness.
- a 50 ⁇ m white polyethylene terephthalate film was laminated to prepare a back sheet for a solar cell of Example 8a having the layer structure of FIG.
- Example 8a Using the back sheet of Example 8a, as shown in FIG. 2, the glass, the filler (EVA), the solar cell element, the filler (EVA), and the back sheet were overlaid, and 150 ° C.-30 minutes-1.0 torr (1
- the solar cell module of Example 8b was laminated by vacuum heating of 3 ⁇ 10 2 Pa).
- the moisture-proof films produced in Examples 2 to 7 were also used as the solar cell backsheets of Examples 9a to 14a and the solar cell modules of Examples 9b to 14b.
- the solar cell modules after leaving for 3000 hours in the 85 ° C.-85% RH environment of Examples 8b to 14b showed the same power generation efficiency (15 to 18%) as before the introduction in the environment.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
本発明に係る樹脂基材としては、従来公地の種々の樹脂フィルムを用いることができる。例えば、セルロースエステル系フィルム、ポリエステル系フィルム、ポリカーボネート系フィルム、ポリアリレート系フィルム、ポリスルホン(ポリエーテルスルホンも含む)系フィルム、ポリエチレンテレフタレート、ポリエチレンナフタレート等のポリエステルフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、セロファン、セルロースジアセテートフィルム、セルローストリアセテートフィルム、セルロースアセテートプロピオネートフィルム、セルロースアセテートブチレートフィルム、ポリ塩化ビニリデンフィルム、ポリビニルアルコールフィルム、エチレンビニルアルコールフィルム、シンジオタクティックポリスチレン系フィルム、ポリカーボネートフィルム、ノルボルネン系樹脂フィルム、ポリメチルペンテンフィルム、ポリエーテルケトンフィルム、ポリエーテルケトンイミドフィルム、ポリアミドフィルム、フッ素樹脂フィルム、ナイロンフィルム、ポリメチルメタクリレートフィルム、アクリルフィルム等を挙げることができる。中でも、ポリカーボネート系フィルム、ポリエステル系フィルム、ノルボルネン系樹脂フィルム、及びセルロースエステル系フィルムが好ましい。
本発明の防湿フィルムは、樹脂基材上の少なくとも片面に防湿層を具備していることを特徴とする。また、当該防湿層は、粒径が1nm以上1μm以下の無機酸化物粒子を含有する無機酸化物膜から成る塗膜で構成されていることを特徴とする。
本発明に係る無機酸化物粒子の組成は特に制限は無いが、酸化珪素、酸化アルミニウム、酸化亜鉛、酸化チタン及び酸化ジルコニウムのいずれかであることが好ましい。
本発明に係る無機酸化物膜は、少なくとも上記の無機酸化物粒子と後述するシリカ系被膜を形成するためのポリシロキサン構造を有する化合物をその構成要素として含有する。
本発明に係るポリシロキサン構造を有する化合物としては、従来公知の種々の化合物を用いることができるが、シロキサンポリマー用いることが好ましい。
(式中、R1は、水素、炭素数1から20のアルキル基又はアリール基であり、R2は1価の有機基であり、nは、0~2の整数を示す。)
ここで、1価の有機基としては、例えば、アルキル基、アリール基、アリル基、グリジル基を挙げることができる。これらの中では、アルキル基及びアリール基が好ましい。アルキル基の炭素数は1~5が好ましく、例えば、メチル基、エチル基、プロピル基、ブチル基等を挙げることができる。また、アルキル基は直鎖状であっても分岐状であってもよく、水素がフッ素により置換されていてもよい。アリール基としては、炭素数6~20のもが好ましく、例えばフェニル基、ナフチル基等を挙げることができる。
(a1)n=0の場合、テトラメトキシシラン、テトラエトキシシラン、テトラプロポキシシラン、テトラブトキシシラン等を挙げることができ、
(a2)n=1の場合、モノメチルトリメトキシシラン、モノメチルトリエトキシシラン、モノメチルトリプロポキシシラン、モノエチルトリメトキシシラン、モノエチルトリエトキシシラン、モノエチルトリプロポキシシラン、モノプロピルトリメトキシシラン、モノプロピルトリエトキシシランなどのモノアルキルトリアルコキシシラン、モノフェニルトリメトキシシラン、モノフェニルトリエトキシシランなどのモノフェニルトリアルコキシシラン等を挙げることができ、
(a3)n=2の場合、ジメチルジメトキシシラン、ジメチルジエトキシシラン、ジメチルジプロポキシシラン、ジエチルジメトキシシラン、ジエチルジエトキシシラン、ジエチルジプロポキシシラン、ジプロピルジジメトキシシラン、ジプロピルジエトキシシラン、ジプロピルジプロポキシシランなどのジアルキルジアルコキシシラン、ジフェニルジメトキシシラン、ジフェニルジエトキシシランなどのジフェニルジアルコキシシラン等を挙げることができる。
シリカ系被膜の形成方法としては、まず、シリカ系被膜形成用組成物を基板上に塗布する。基板上にシリカ系被膜形成用組成物を塗布する方法としては、例えば、スプレー法、スピンコート法、ディップコート法、ロールコート法など、任意の方法を用いることができるが、通常スピンコート法が用いられる。
本発明の防湿フィルムは、樹脂基材上に防湿層を設けた防湿フィルムであって、当該防湿層が、前記無機酸化物粒子を含有する分散物から成る塗膜の加熱処理により形成されたことを特徴とする。
本発明においては、前記防湿層のほかに、合成樹脂層を設けることも好ましい。本発明に係る合成樹脂層は、前記防湿層が、防湿フィルムの屈曲などでクラックが入らないようにする応力緩和層としての機能や、防湿層が汚れて本来の防湿性が損なわれることを防ぐ防汚層としての機能を得ることを目的とするものである。
本発明の防湿フィルム用の樹脂基材の製造方法としては、通常のインフレーション法、T-ダイ法、カレンダー法、切削法、流延法、エマルジョン法、ホットプレス法等の製造法が使用できるが、着色抑制、異物欠点の抑制、ダイラインなどの光学欠点の抑制などの観点から流延法による溶液流延法、溶融流延法が好ましい。
(有機溶媒)
本発明に係る樹脂基材を溶液流延法で製造する場合、ドープを形成するのに有用な有機溶媒は、セルロースエステル樹脂等の熱可塑性樹脂を溶解するものであれば制限なく用いることができる。
熱可塑性樹脂に対する良溶媒を主とする有機溶媒に、溶解釜中で熱可塑性樹脂、その他の添加剤を攪拌しながら溶解しドープを形成する工程である。
ドープを、送液ポンプ(例えば、加圧型定量ギヤポンプ)を通して加圧ダイに送液し、無限に移送する無端の金属ベルト、例えばステンレスベルト、あるいは回転する金属ドラム等の金属支持体上の流延位置に、加圧ダイスリットからドープを流延する工程である。
ウェブ(流延用支持体上にドープを流延し、形成されたドープ膜をウェブと呼ぶ)を流延用支持体上で加熱し、溶媒を蒸発させる工程である。
金属支持体上で溶媒が蒸発したウェブを、剥離位置で剥離する工程である。剥離されたウェブは次工程に送られる。
なお、残留溶媒量を測定する際の加熱処理とは、115℃で1時間の加熱処理を行うことを表す。
剥離後、ウェブを乾燥装置内に複数配置したロールに交互に通して搬送する乾燥装置35、及び/又はクリップでウェブの両端をクリップして搬送するテンター延伸装置34を用いて、ウェブを乾燥する。
・幅手方向に延伸-幅手方向に延伸-流延方向に延伸-流延方向に延伸
また、同時二軸延伸には、一方向に延伸し、もう一方を、張力を緩和して収縮させる場合も含まれる。同時二軸延伸の好ましい延伸倍率は幅手方向、長手方向ともに×1.01倍~×1.5倍の範囲でとることができる。
ウェブ中の残留溶媒量が2質量%以下となってからフィルムとして巻き取り機37により巻き取る工程であり、残留溶媒量を0.4質量%以下にすることにより寸法安定性の良好なフィルムを得ることができる。特に0.00~0.10質量%で巻き取ることが好ましい。
本発明に係る樹脂基材を、フィルム状樹脂基材として、溶融流延製膜法により製造する場合の方法について説明する。
溶融押出に用いる熱可塑性樹脂からなるフィルムを構成する組成物は、通常あらかじめ混錬してペレット化しておくことが好ましい。
まず、作製したペレットを一軸や二軸タイプの押出機を用いて、押し出す際の溶融温度Tmを200~300℃程度とし、リーフディスクタイプのフィルターなどでろ過し異物を除去した後、Tダイからフィルム状に共押出し、冷却ロール上で固化し、弾性タッチロールと押圧しながら流延する。
本発明では、上記のようにして得られたフィルムは冷却ロールに接する工程を通過後、さらに少なくとも1方向に1.01~3.0倍延伸することもできる。
図1は、本発明に係る樹脂基材の製造装置の一例の全体構成を示す概略フローシートである。図1において、樹脂基材の製造方法は、熱可塑性樹脂等のフィルム材料を混合した後、押出し機1を用いて、流延ダイ4から第1冷却ロール5上に溶融押し出し、第1冷却ロール5に外接させるとともに、更に、第2冷却ロール7、第3冷却ロール8の合計3本の冷却ロールに順に外接させて、冷却固化してフィルム10とする。次いで、剥離ロール9によって剥離したフィルム10を、次いで延伸装置12によりフィルムの両端部を把持して幅方向に延伸した後、巻取り装置16により巻き取る。また、平面性を矯正するために溶融フィルムを第1冷却ロール5表面に挟圧するタッチロール6が設けられている。このタッチロール6は表面が弾性を有し、第1冷却ロール5との間でニップを形成している。
本発明においては、前述した本発明の防湿フィルムを用いて種々の態様の太陽電池モジュール用バックシートを作製することができる。
本発明の防湿フィルムは、種々の態様の太陽電池モジュールに適用できる。
「光反射性絶縁膜」とは、入射光を反射して光電変換膜に導ける性質を有する絶縁性の膜を意味し、かかる性質を有する膜であれば、有機物、無機物を問わず、特に制限なく使用できる。光反射性絶縁膜として、光電変換膜が感度を有する範囲の波長のすべて又はその一部を反射する反射スペクトルを有する膜を使用することは、入射光の利用効率を向上させる観点から、好ましい態様である。
「光電変換膜」とは、光エネルギーを電気エネルギーに変換する性質を有する膜をいい、かかる性質を有する膜であれば、有機物、無機物を問わず、特に制限なく使用できる。太陽電池用の光電変換薄膜としては、アモルファスシリコン、多結晶シリコン等が一般的に用いられている。
「光透過性導電膜」とは、光電変換膜で生じた電流を取り出すために光電変換膜の光入射側に設けられた光透過性の電極を意味し、かかる性質を有する膜であれば特に制限はないが、一般にはインジウム錫酸化物(ITO)、錫酸化物(SnO2)等が用いられる。
「裏面電極膜」とは、光電変換膜で生じた電流を取り出すために光電変換膜の裏面(光入射の反対側)に設けられた電極を意味し、光を透過する必要がないので、通常金属電極が用いられる。金属電極としては、通常0.1~1μm程度の銀やアルミニウム等が用いられる。
「光透過性絶縁膜」とは、入射光を透過する性質を有する絶縁性の膜であって、光透過性導電膜より低い屈折率を有していることが必要である。光透過性導電膜以上の屈折率では光透過性絶縁膜から入射光が漏れてしまうからである。光透過性絶縁膜であってもその屈折率が光透過性絶縁膜より低ければ、光透過性導電膜と光透過性絶縁膜との界面に形成されているテクスチャ構造によって、入射光が光透過性導電膜及び光透過性絶縁基板内に封じ込められるからである。かかる性質を有するものであれば、有機物、無機物を問わず、特に制限なく使用できる。透明膜及び半透明膜を含む。
(真空蒸着による防湿層の形成工程)
基材として、二軸延伸ポリエステルフィルム(ポリエチレンテレフタレートフィルム、厚み100μm)を用いた。次に、巻き取り式の真空蒸着装置を用い、チャンバーの到達真空度が3.0×10-5torr(4.0×10-3Pa)になるまで排気した後、酸素ガスをコーティングドラムの近傍に、チャンバー内の圧力を3.0×10-4torr(4.0×10-2Pa)に保って導入し、蒸発源の一酸化ケイ素をピアス型電子銃により、約10kWの電力で加熱して蒸着させ、コーティングドラム上を120m/minの速度で走行するポリエステルフィルム上に、厚さが2μmの酸化ケイ素の防湿層を形成し、比較例1のサンプルを作製した。
(有機金属化合物を原料とするゾルを用いる防湿層形成工程)
有機金属化合物を原料とするゾル溶液として、テトラエトキシシラン(和光純薬製)0.04molをポリプロピレンビーカーに秤量する。撹拌しながらエチルアルコール0.25molを添加し、マグネチックスターラーにより10分間撹拌する。更に、純水0.24molを添加し10分間撹拌した後、1mol/L HCL 1mlを添加し、ゾル溶液-1を調製した。二軸延伸ポリエステルフィルム(ポリエチレンテレフタレートフィルム、厚さ100μm)の片面側に、前述のゾル溶液-1を、乾燥後の膜の厚さが2μmとなるようにバーコーティングし、ドライオーブンにて150℃、30分加熱乾燥し、比較例2のサンプルを作製した。
1Lのステンレスポットに純水400gを入れ、ウルトラタラックス T25 デジタル(IKA社)を用いて6000rpmにて、酸化珪素(平均粒径1.3μm)600gを5分かけて添加し、その後30分間分散を行った。その後、1000gのMEKを添加し、バス温40℃、2.0×102torr(2.7×104Pa)の減圧下にて残質量が800gとなるまでエバポレーターにより溶媒除去する操作を3回繰り返し、最後にMEKを200g加えて総質量を1000gとし、分散液-Aを得た。二軸延伸ポリエステルフィルム(ポリエチレンテレフタレートフィルム、厚さ100μm)の片面側に、分散液-Aを、乾燥後の膜の厚さが2μmとなるようにバーコーティングし、ドライオーブンにて150℃、30分加熱乾燥し、比較例3のサンプルを作製した。
1Lのステンレスポットに純水400gを入れ、ウルトラタラックス T25 デジタル(IKA社)を用いて6000rpmにて、酸化珪素(電気化学工業株式会社製 商品名:SFP-30M 平均粒径700nm)600gを5分かけて添加し、その後30分間分散を行った。その後、1000gのMEKを添加し、バス温40℃、2.0×102torr(2.7×104Pa)の減圧下にて残質量が800gとなるまでエバポレーターにより溶媒除去する操作を3回繰り返し、最後にMEKを200g加えて総質量を1000gとし、分散液-1を得た。次に、テトラエトキシシラン(Si(C2H5O)4)を20質量部と、フェニルトリエトキシシラン(C6H5Si(OC2H5)3)を80質量部とをエチルアルコール100質量部に混合し、蟻酸を触媒として反応させ、酸性の溶液を得た。次に、その酸性溶液をトリエチルアミン((C2H5)3N)によって中和し、中和溶液を得た。そして、中和溶液をメチルエチルケトンで溶剤置換し、樹脂不揮発分濃度60%、粘度400mPa・sの樹脂溶液-1を得た。分散液-1の30gと樹脂溶液-1の70gを混合し、この混合分散物を2軸延伸ポリエステルフィルム(ポリエチレンテレフタレートフィルム、厚さ100μm)の片面側に、乾燥後の膜の厚さが2μmとなるようにバーコーティングし、ドライオーブンにて150℃、30分加熱乾燥し、実施例1のサンプルを作製した。
分散液-1に対して、酸化珪素を電気化学工業株式会社製 商品名:SFP-20M(粒径300nm)に替えた以外は全て同じ操作にて、分散液-2を得た。更に実施例1と同様の操作にて、実施例2のサンプルを作製した。
分散液-1に対して、酸化珪素をコアフロント株式会社製 商品名:sicastar(粒径70nm)に替えた以外は全て同じ操作にて、分散液-3を得た。更に実施例1と同様の操作にて、実施例3のサンプルを作製した。
1Lのステンレスポットに酸化アルミニウムの水分散物(株式会社テツタニ製 商品名:NANOBYK-3600 平均粒径40nm)と1000gのMEKを添加し、バス温40℃、2.0×102torr(2.7×104Pa)の減圧下にて残質量が800gとなるまでエバポレーターにより溶媒除去する操作を3回繰り返し、最後にMEKを200g加えて総質量を1000gとし、分散液-4を得た。分散液-4の30gと樹脂溶液-1の70gを混合し、二軸延伸ポリエステルフィルム(ポリエチレンテレフタレートフィルム、厚さ100μm)の片面側に、乾燥後の膜の厚さが2μmとなるようにバーコーティングし、ドライオーブンにて150℃、30分加熱乾燥し、実施例4のサンプルを作製した。
分散液-1に対して、酸化珪素を平均粒径50nmの酸化チタンに替えた以外は実施例-1と同じ操作にて、分散液-5を得た。更に実施例1と同様の操作にて、実施例5のサンプルを作製した。
分散液-3の30gと樹脂溶液-1の70gを混合し、二軸延伸ポリエステルフィルム(ポリエチレンテレフタレートフィルム、厚さ100μm)の片面側に、乾燥後の膜の厚さが2μmとなるようにバーコーティングし、ドライオーブンにて70℃、20分加熱乾燥した後に、近赤外線乾燥機(日本電熱(株)製ペイントドライヤーPDH1000)を用いて、1kWの出力にて、塗布面から50cmの距離において、0.5秒間の赤外線照射を10回繰り返し、実施例6のサンプルを作製した。
分散液-1の30gと樹脂溶液-1の70gを混合し、二軸延伸ポリエステルフィルム(ポリエチレンテレフタレートフィルム、厚さ100μm)の片面側に、乾燥後の膜の厚さが2μmとなるようにバーコーティングし、ドライオーブンにて40℃、120分加熱乾燥し、実施例7のサンプルを作製した。
上記で得た各種サンプルについて酸素透過度及び水蒸気透過度を下記の方法により測定し、評価した。
酸素透過度は、測定温度23℃、湿度90%RHの条件下で、酸素ガス透過度測定装置(モダンコントロール(株)製、OX-TRAN 2/20:商品名)を用いて測定した値である。また、上記水蒸気透過度は、測定温度37.8℃、湿度100%RHの条件下で、水蒸気透過度測定装置(モダンコントロール(株)製、PERMATRAN-W 3/31:商品名)を用いて測定した値である。
水蒸気透過度は、測定温度40.0℃、湿度90%RHの条件下で、水蒸気透過度測定装置(モダンコントロール(株)製、PERMATRAN-W 3/31:商品名)を用いて測定した値である。
実施例1で作製した防湿フィルムの樹脂基材13Bの外面側に、二液反応型のポリウレタン樹脂系接着剤14Bを塗布し(塗布量は5g/m2)、内面基材15Bとなる厚さ50μmの白色ポリエチレンテレフタレートフィルムを貼り合わせ、図4(a)の層構成からなる実施例8aの太陽電池用のバックシートを作製した。
2 フィルター
3 スタチックミキサー
4 流延ダイ
5 回転支持体(第1冷却ロール)
6 挟圧回転体(タッチロール)
7 回転支持体(第2冷却ロール)
8 回転支持体(第3冷却ロール)
9 剥離ロール
10 フィルム
11、13、14 搬送ロール
12 延伸機
15 スリッター
16 巻き取り機
F 本発明に係るフィルム状樹脂基材
A 太陽電池モジュール
10A バックシート
11A 内面基材
12A バリア層
12Aa 第1バリア層
12Ab 第2バリア層
12Ac 着剤層
13A 外面基材
20A 充填材
30A 太陽電池素子
40A 前面ガラス
50A アルミニウム枠
60A リード線
70A 端子
80A 端子箱
90A シール材
10B 太陽電池用バックシート
11B 合成樹脂層
12B 防湿層
13B 樹脂基材
14B 接着層
15B 内面基材
Claims (5)
- 樹脂基材上に防湿層を設けた防湿フィルムであって、当該防湿層が、平均粒径が1nm以上1μm以下の無機酸化物粒子を含有する無機酸化物膜から成る塗膜で構成されていることを特徴とする防湿フィルム。
- 前記無機酸化物粒子が、酸化珪素、酸化アルミニウム、酸化亜鉛、酸化チタン及び酸化ジルコニウムのうちの少なくとも一つの化合物を含有することを特徴とする請求項1に記載の防湿フィルム。
- 請求項1又は請求項2に記載の防湿フィルムを製造する防湿フィルムの製造方法であって、樹脂基材上に、ポリシロキサン構造を有する化合物と無機酸化物粒子を含有する分散物を塗布し塗膜を形成する工程、及び、当該塗膜を50℃以上200℃以下の加熱温度で加熱処理することにより、無機酸化物粒子を含有する無機酸化物膜を形成する工程、を有することを特徴とする防湿フィルムの製造方法。
- 請求項1又は請求項2に記載の防湿フィルムを用いたことを特徴とする太陽電池モジュール用バックシート。
- 請求項1又は請求項2に記載の防湿フィルムをバックシートとして用いたことを特徴とする太陽電池モジュール。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011505912A JPWO2010109947A1 (ja) | 2009-03-27 | 2010-02-01 | 防湿フィルム、その製造方法、それを用いた太陽電池モジュール用バックシート及び太陽電池モジュール |
US13/257,625 US20120006387A1 (en) | 2009-03-27 | 2010-02-01 | Moisture-proof film, method for manufacturing the same, back sheet for solar cell module and solar cell module using the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-078721 | 2009-03-27 | ||
JP2009078721 | 2009-03-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010109947A1 true WO2010109947A1 (ja) | 2010-09-30 |
Family
ID=42780643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/051338 WO2010109947A1 (ja) | 2009-03-27 | 2010-02-01 | 防湿フィルム、その製造方法、それを用いた太陽電池モジュール用バックシート及び太陽電池モジュール |
Country Status (3)
Country | Link |
---|---|
US (1) | US20120006387A1 (ja) |
JP (1) | JPWO2010109947A1 (ja) |
WO (1) | WO2010109947A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012127742A1 (ja) * | 2011-03-18 | 2012-09-27 | 富士フイルム株式会社 | 太陽電池モジュールおよびその製造方法 |
JP2013038414A (ja) * | 2011-07-14 | 2013-02-21 | Fujifilm Corp | 太陽電池用ポリマーシート及び太陽電池モジュール |
JP2013042016A (ja) * | 2011-08-17 | 2013-02-28 | Fujifilm Corp | 太陽電池用ポリマーシート、太陽電池用バックシート、及び太陽電池モジュール |
WO2016103719A1 (ja) * | 2014-12-24 | 2016-06-30 | 株式会社クラレ | 多層構造体およびその製造方法、それを用いた包装材および製品、ならびに電子デバイスの保護シート |
WO2016103720A1 (ja) * | 2014-12-24 | 2016-06-30 | 株式会社クラレ | 電子デバイスおよびその製造方法 |
CN108807579A (zh) * | 2018-06-08 | 2018-11-13 | 汉能新材料科技有限公司 | 薄膜封装方法和器件、薄膜封装系统、太阳能电池 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10295712B2 (en) * | 2012-04-19 | 2019-05-21 | Honeywell International Inc. | Backsheets for photovoltaic modules using infrared reflective pigments |
JP5860426B2 (ja) * | 2013-03-15 | 2016-02-16 | 富士フイルム株式会社 | 積層シート及び太陽電池モジュール用バックシート |
CN103618015A (zh) * | 2013-12-12 | 2014-03-05 | 常州回天新材料有限公司 | 一种新型太阳能电池背板及其制备方法 |
ES2551759B1 (es) * | 2014-05-20 | 2016-09-09 | Universidad De Cantabria | Procedimiento de fabricación de tejidos fosforescentes de larga duración y tejidos otenidos a partir del mismo |
ES2772256T3 (es) * | 2015-11-06 | 2020-07-07 | Meyer Burger Switzerland Ag | Láminas conductoras de polímero, celdas solares y métodos para producirlos |
CN106374003A (zh) * | 2016-11-04 | 2017-02-01 | 秦皇岛博硕光电设备股份有限公司 | 一种太阳能电池组件及所用的背板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000053917A (ja) * | 1998-08-11 | 2000-02-22 | Jsr Corp | コーティング用組成物およびコーティングフィルム |
JP2000294813A (ja) * | 1999-04-07 | 2000-10-20 | Bridgestone Corp | 太陽電池用バックカバー材及び太陽電池 |
JP2003003118A (ja) * | 2001-06-21 | 2003-01-08 | Jsr Corp | ガスバリアコーティング組成物、およびガスバリアコーティングフィルム |
-
2010
- 2010-02-01 JP JP2011505912A patent/JPWO2010109947A1/ja active Pending
- 2010-02-01 WO PCT/JP2010/051338 patent/WO2010109947A1/ja active Application Filing
- 2010-02-01 US US13/257,625 patent/US20120006387A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000053917A (ja) * | 1998-08-11 | 2000-02-22 | Jsr Corp | コーティング用組成物およびコーティングフィルム |
JP2000294813A (ja) * | 1999-04-07 | 2000-10-20 | Bridgestone Corp | 太陽電池用バックカバー材及び太陽電池 |
JP2003003118A (ja) * | 2001-06-21 | 2003-01-08 | Jsr Corp | ガスバリアコーティング組成物、およびガスバリアコーティングフィルム |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012127742A1 (ja) * | 2011-03-18 | 2012-09-27 | 富士フイルム株式会社 | 太陽電池モジュールおよびその製造方法 |
JP2013038414A (ja) * | 2011-07-14 | 2013-02-21 | Fujifilm Corp | 太陽電池用ポリマーシート及び太陽電池モジュール |
JP2013042016A (ja) * | 2011-08-17 | 2013-02-28 | Fujifilm Corp | 太陽電池用ポリマーシート、太陽電池用バックシート、及び太陽電池モジュール |
WO2016103719A1 (ja) * | 2014-12-24 | 2016-06-30 | 株式会社クラレ | 多層構造体およびその製造方法、それを用いた包装材および製品、ならびに電子デバイスの保護シート |
WO2016103720A1 (ja) * | 2014-12-24 | 2016-06-30 | 株式会社クラレ | 電子デバイスおよびその製造方法 |
JP6014790B1 (ja) * | 2014-12-24 | 2016-10-25 | 株式会社クラレ | 多層構造体およびその製造方法、それを用いた包装材および製品、ならびに電子デバイスの保護シート |
JP6014791B1 (ja) * | 2014-12-24 | 2016-10-25 | 株式会社クラレ | 電子デバイスおよびその製造方法 |
US10414144B2 (en) | 2014-12-24 | 2019-09-17 | Kuraray Co., Ltd. | Multilayer structure, method for producing same, packaging material and product including same, and protective sheet for electronic device |
US10584282B2 (en) | 2014-12-24 | 2020-03-10 | Kuraray Co., Ltd. | Electronic device and method for producing same |
CN108807579A (zh) * | 2018-06-08 | 2018-11-13 | 汉能新材料科技有限公司 | 薄膜封装方法和器件、薄膜封装系统、太阳能电池 |
WO2019232903A1 (zh) * | 2018-06-08 | 2019-12-12 | 汉能新材料科技有限公司 | 薄膜封装方法、薄膜封装器件及太阳能电池 |
CN108807579B (zh) * | 2018-06-08 | 2020-01-21 | 汉能新材料科技有限公司 | 薄膜封装方法和器件、薄膜封装系统、太阳能电池 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2010109947A1 (ja) | 2012-09-27 |
US20120006387A1 (en) | 2012-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010109947A1 (ja) | 防湿フィルム、その製造方法、それを用いた太陽電池モジュール用バックシート及び太陽電池モジュール | |
JP5835667B2 (ja) | 太陽電池裏面封止用ポリエステルフィルムの製造方法 | |
TWI801599B (zh) | 偏光膜及偏光膜之製造方法 | |
JPWO2014038466A1 (ja) | タッチパネル付き表示装置 | |
TWI775940B (zh) | 偏光板、偏光板捲材及偏光膜之製造方法 | |
EP2484716A1 (en) | Polyester film for solar cells | |
CN103869403A (zh) | 光学膜层压体的制造方法 | |
JP2011178866A (ja) | ポリエステルフィルム及びその製造方法、並びに太陽電池裏面封止用ポリエステルフィルム、太陽電池裏面保護膜及び太陽電池モジュール | |
KR20210060671A (ko) | 이형 필름 | |
CN111095051B (zh) | 偏振片、偏振片卷、及偏振膜的制造方法 | |
JP5722287B2 (ja) | 太陽電池用バックシート及びその製造方法並びに太陽電池モジュール | |
WO2010097998A1 (ja) | 防湿フィルム、その製造方法、それを用いた太陽電池モジュール用バックシート、及び太陽電池モジュール | |
WO2010150570A1 (ja) | フィルムミラー、その製造方法、それを用いた太陽光反射ミラー | |
EP2689914B1 (en) | Method for stretching film | |
TWI823856B (zh) | 偏光膜、偏光板、偏光板捲材及偏光膜之製造方法 | |
TWI762667B (zh) | 偏光膜、偏光板、偏光板捲材及偏光膜之製造方法 | |
WO2014157108A1 (ja) | ポリエステルフィルム及びその製造方法 | |
WO2010137367A1 (ja) | フィルムミラー、その製造方法、それを用いた太陽光反射用ミラー | |
WO2010071009A1 (ja) | 可撓性樹脂基板及びそれを用いた表示装置 | |
WO2014157109A1 (ja) | ポリエステルフィルム及びその製造方法 | |
JP2011077425A (ja) | 防湿フィルム、その製造方法、それを用いた太陽電池モジュール用バックシート、及び太陽電池モジュール | |
TW201324816A (zh) | 太陽能電池用白色聚酯薄膜、使用其之太陽能電池背面封裝片及太陽能電池模組 | |
JP5562889B2 (ja) | 積層フィルム、太陽電池用バックシートおよび積層フィルムの製造方法 | |
JP2011207168A (ja) | 熱可塑性樹脂フィルムの製造方法 | |
TWI789514B (zh) | 偏光板、偏光板捲材、及偏光膜之製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10755748 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011505912 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13257625 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10755748 Country of ref document: EP Kind code of ref document: A1 |