Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F71/00—Manufacture or treatment of devices covered by this subclass
  • H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
  • H10F71/1272—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F10/00—Individual photovoltaic cells, e.g. solar cells
  • H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
  • H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
  • H10F10/142—Photovoltaic cells having only PN homojunction potential barriers comprising multiple PN homojunctions, e.g. tandem cells
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F10/00—Individual photovoltaic cells, e.g. solar cells
  • H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
  • H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
  • H10F10/144—Photovoltaic cells having only PN homojunction potential barriers comprising only Group III-V materials, e.g. GaAs,AlGaAs, or InP photovoltaic cells
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/10—Semiconductor bodies
  • H10F77/12—Active materials
  • H10F77/124—Active materials comprising only Group III-V materials, e.g. GaAs
  • H10F77/1248—Active materials comprising only Group III-V materials, e.g. GaAs having three or more elements, e.g. GaAlAs, InGaAs or InGaAsP
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/10—Semiconductor bodies
  • H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D8/00—Diodes
  • H10D8/70—Tunnel-effect diodes
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/544—Solar cells from Group III-V materials
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/547—Monocrystalline silicon PV cells
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
  • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

• Embodiments of the subject matter described herein relate generally to a method for improving the electrical characteristics of an interconnecting tunnel junction between adjacent solar cells and a multijunction solar cell having the improved interconnecting tunnel junction.
• Multijunction solar cells are stacks of specifically oriented current generating p-n junction diodes or subcells. When electrically connected in series, current generated in one subcell is passed to the next subcell in series. Electrical characteristics of the interconnecting tunnel junction between subcells contribute to the overall efficiency of the multijunction solar cell.
• the method and improved interconnecting tunnel junction comprise a narrow, delta-doped layer within the interconnecting tunnel junction that improves the current handling capability of the interconnecting tunnel junction between subcells of the multijunction solar cell.
• a multijunction solar cell comprising: a first layer of a tunnel diode of a first p/n type semiconductor material; a delta-doped layer having a similar p/n type doping as said first p/n type semiconductor material, said delta-doped layer substantially thinner than said first layer, said delta-doped layer reaching a dopant concentration substantially higher than a dopant concentration of said first layer, and said delta-doped layer deposited on said first layer; a second layer of said tunnel diode of a second complementary p/n type semiconductor material to said first layer of said tunnel diode and said delta-dope layer, said second layer grown epitaxially on said delta-doped layer; and, at least two photovoltaic subcells electrically connected by said tunnel diode.
• the multijunction solar cell may further comprise an additional layer of said first p/n type semiconductor material between said delta-doped layer and said second layer.
• the delta-doped layer of the multijunction solar cell may have a similar p/n type doing as said second complementary p/n type semiconductor material.
• the multijunction solar cell may further comprise: an additional layer of said second complementary p/n type semiconductor material between said first layer and said delta-doped layer.
• the multijunction solar cell may further comprise a substrate; a first photovoltaic subcell grown epitaxially on said substrate; and a second photovoltaic subcell grown epitaxially on said second layer of said tunnel diode; and wherein said first layer of said tunnel diode is grown on said first photovoltaic subcell.
• the multijunction solar cell may further comprise a plurality of photovoltaic subcells, each of said plurality of photovoltaic subcells separated by a tunnel diode having a delta-doped layer.
• the dopant concentration in said delta doped layer is approximately 10 times greater than said dopant concentration of said first layer.
• the dopant concentration of the delta doped layer is greater than 1020 cm-3.
• a width of said delta doped layer is approximately 20 Angstroms.
• the first photovoltaic subcell may comprise a semiconductor material having a bandgap lower than said second photovoltaic subcell.
• the first photovoltaic subcell comprises Gallium Indium Arsenide and said second photovoltaic subcell comprises Gallium Indium Phosphide.
• the tunnel diode comprises a material having a bandgap equal to or higher than said first photovoltaic cell.
• the tunnel diode of the multijunction solar cell comprises a semiconductor material selected from the group consisting of Gallium Arsenide, Gallium Indium Arsenide, Gallium Indium Phosphide, and Aluminum Gallium Arsenide.
• the first photovoltaic subcell and said second photovoltaic subcell are n-on-p subcells; and wherein said first layer and said delta-doped layer are a Group II, IV or V n-type doped semiconductor material, and said second layer is a Group IV or VI p-type doped semiconductor material.
• a method of manufacturing a delta-doped interconnection tunnel junction comprising: growing epitaxially a first layer of a tunnel diode, said first layer using a first dopant; interrupting said step of growing epitaxially said first layer of said tunnel diode; depositing a delta-doped layer of a second dopant of a same acceptor/donor type as said first dopant on said first layer of said tunnel diode, said second dopant in said delta-doped layer reaching a dopant concentration substantially greater than a concentration of said first dopant in said first layer of said tunnel diode; and growing epitaxially a second layer of said tunnel diode, said second layer using a third dopant of a complementary acceptor/donor type to said first dopant and said second dopant.
• the method of manufacturing a delta-doped interconnection tunnel further comprising: growing epitaxially an additional layer using said first dopant, after said depositing step.
• the method further comprising: preparing a substrate; growing epitaxially a first photovoltaic subcell; and
• the first photovoltaic subcell comprises a material having a bandgap lower than said second photovoltaic subcell.
• the tunnel diode comprises a material having a bandgap equal to or higher than said first photovoltaic cell.
• the dopant concentration in said delta doped layer is approximately 10 times greater than said concentration of said first dopant in said first layer of said tunnel diode.
• the delta doped layer has a dopant concentration of greater than 1020 cm-3.
• a width of said delta doped layer is approximately 20 Angstroms.
• the first dopant and said second dopant are acceptor type Group II, IV or V dopants and said third dopant is a donor type Group IV or VI dopant.
• a multijunction solar cell having an interconnection tunnel junction with a delta-doped layer prepared by a process comprising the steps of: (a) preparing a substrate; (b) growing epitaxially a first photovoltaic subcell on said substrate; (c) growing epitaxially a first layer of a tunnel diode on said first photovoltaic subcell, said first layer using a dopant of an acceptor/donor type of an adjoining portion of said first photovoltaic subcell; (d) interrupting said step of growing epitaxially said first layer of said tunnel diode; (e) depositing a delta-doped layer of a delta dopant of same acceptor/donor type as said dopant on said first layer of said tunnel diode, said delta dopant in said delta-doped layer reaching a delta dopant concentration substantially greater than a concentration of said dopant in said first layer of said tunnel diode; and (f) growing epitaxially a second layer of said
• the multijunction solar cell further comprising: (g) growing epitaxially an additional portion of said first layer using said dopant, after said step (e) depositing said delta-doped layer and before said step (f) growing epitaxially said second layer.
• the steps (e) is: (e) depositing a delta-doped layer of a delta dopant of same acceptor/donor type as said complementary dopant on said first layer of said tunnel diode, said delta dopant in said delta-doped layer reaching a delta dopant concentration substantially greater than a concentration of said complementary dopant in said second layer of said tunnel diode.
• steps (d), (e), and (f) are:(d) growing epitaxially a second layer of said tunnel diode on said first layer of said tunnel diode, said second layer using a complementary dopant of a different acceptor/donor type to said dopant of said first layer of said tunnel diode; (e) interrupting said step of growing epitaxially said second layer of said tunnel diode; and (f) depositing a delta-doped layer of a delta dopant of same acceptor/donor type as said complementary dopant on said second layer of said tunnel diode, said delta dopant in said delta- doped layer reaching a delta dopant concentration substantially greater than a concentration of said complementary dopant in said second layer of said tunnel diode.
• the first photovoltaic subcell comprises a semiconductor material having a bandgap lower than said second photovoltaic subcell.
• a multijunction solar cell is provided, wherein said tunnel diode comprises a semiconductor material having a bandgap equal to or higher than said first photovoltaic cell.
• the multijunction solar cell delta dopant concentration in said delta doped layer is approximately 10 times greater than said concentration of said dopant in said first layer of said tunnel diode.
• the delta doped layer has a delta dopant concentration of greater than 1020 cm-3.
• a width of said delta doped layer is approximately 20 Angstroms.
• the dopant is an acceptor type Group II, IV or V dopant and said complementary dopant is a donor type Group IV or VI dopant.
• FIG. 1 is an illustration of bandgaps of two subcells of a multijunction solar cell in one embodiment of the highly doped layer for tunnel junctions in solar cells system and method;
• Fig. 2 is an illustration of a reversed biased junction between two subcells of a multijunction solar cell in one embodiment of the highly doped layer for tunnel junctions in solar cells system and method
• Fig. 3 is an illustration of an interconnecting tunnel junction between two subcells of a multijunction solar cell in one embodiment of the highly doped layer for tunnel junctions in solar cells system and method
• Fig. 4 is an illustration of an interconnecting tunnel junction having a delta-doped layer between two subcells of a multijunction solar cell in the highly doped layer for tunnel junctions in solar cells system and method;
• Fig. 5 is an illustration of an interconnecting tunnel junction having a delta-doped layer and corresponding dopant concentrations in one embodiment of the highly doped layer for tunnel junctions in solar cells system and method;
• Fig. 6 is an block diagram of a manufacturing process for producing a multijunction solar cell having an interconnecting tunnel junction with a delta-doped layer in one embodiment of the highly doped layer for tunnel junctions in solar cells system and method.
• Multijunction solar cells are constructed with a number of subcells stacked one on top of the other, each subcell being a current generating p-n junction diode.
• photons having energies at or around the bandgap, Eg are absorbed and converted into electrical current by the p-n junction.
• Photons having energies less than the bandgap are passed through the subcell to a lower subcell, while photons having energies higher than the bandgap are generally converted into excess heat.
• a topmost subcell with a comparatively high bandgap, and lower subcells of successively lower bandgaps more of the available spectrum from the light is available to each subcell to be converted into electricity. Selection of the materials in each subcell determines the available energy to lower subcells.
• a two cell solar cell 100 having a top cell 102 comprised of Gallium Indium Phosphide (GaInP) and a bottom cell 104 comprised of Gallium Indium Arsenide (GaInAs) is presented.
• the cells 102, 104 are grown epitaxially, starting with a Germanium (Ge) substrate, and depositing layers of p-type GaInAs, n-type GaInAs, p-type GaInP, and n-type GaInP.
• Incident light 108 is directed at the top cell 102 of the two cell solar cell 100. A portion of the light 108 is reflected 120.
• a portion of the light 108 enters the top cell 102 and is absorbed and converted into heat 110, especially those high energy photons 112 in the light 108 having an energy higher than the bandgap of the GaInP material, Eg > 1.87 eV, of the top cell 102.
• High energy photons 112 having energy approximating the bandgap of the GaInP material in top cell 102, Eg > 1.87 eV, are absorbed by electrons in the GaInP material.
• the additional energy allows electrons bound in the valence band of the GaInP crystalline lattice to move into the higher energy conduction band, creating free electrons 118 that contribute to the current generation of the two cell solar cell 100.
• Low energy photons 114 have too little energy to free electrons 118 in the GaInP material and pass through the top cell 102 into the bottom cell 104.
• the bandgap is illustrated as 1.87 eV, the bandgap for GaInP may vary from approximately 1.75 eV to approximately 1.90 eV.
• a portion of the light 108 is again absorbed and converted into heat 110, especially those low energy photons 114 that have an energy higher than the bandgap of the GaInAs material, Eg > 1.39 eV, of the bottom cell 104.
• Low energy photons 114 having energy approximating the bandgap of the GaInP material in bottom cell 104, Eg > 1.39 eV, are converted into free electrons 118.
• the remaining photons 116 pass into the substrate 106 where the remaining photons 116 generally are converted into heat 110.
• the bandgap is illustrated as 1.39 eV, the bandgap for GaInP may vary from approximately 1.35 eV to approximately 1.43 eV.
• Each cell 102, 104 is comprised of a p-n junction diode that generates current.
• the p-n junction diodes can be n-on-p type junction diodes, or p-on-n type junction diodes.
• FIG 2 two stacked cells of n-on-p type junction diodes 200 are illustrated.
• Each cell 102, 104 is comprised of an n-type doped layer 202 and a p-type doped layer 204.
• Current is generated in the n-to-p direction in each cell as illustrated by the arrow I and collected through electrical connections V+ at the top of the two stacked cells of n-on-p type junction diodes 200, and V- at the substrate 106.
• the voltage differential between the p-type doped layer 202 of the top cell 102, and the n-type doped layer 204 of the bottom cell creates a reversed biased junction 206 with a depletion region 208 relatively devoid of free elections 118.
• a reversed biased junction 206 with a depletion region 208 relatively devoid of free elections 118.
• a small amount of leakage current 212 is capable of flowing across the reversed biased junction 206.
• an interconnecting tunnel junction is epitaxially grown between the top cell 102 and the bottom cell 104 to create a multijunction solar cell 300.
• the ICTJ 302 in the multijunction solar cell 300 comprises a highly doped p+-type layer 304 of GaInAs, GaInP, or AlGaAs, and a highly doped n+-type layer 306 of GaInAs, GaInP, or AlGaAs.
• the highly doped ICTJ 302 allows electrons to penetrate across the depletion region 208, allowing an amount of tunneled current 308 to flow across the reverse-biased junction 206 that is proportional to the voltage, as illustrated in the tunnel junction voltage-current graph 310.
• the ICTJ 302 is constructed to pass the large amount of current that flows between the top cell 102 and the bottom cell 104.
• the ICTJ 302 is optically transparent in order to pass as much light 108 as possible between the top cell 102 and the bottom cell 104.
• the ICTJ 302 design is not sensitive to slight variations common in high volume manufacturing processes.
• the ICTJ 302 is thin and generally has a bandgap, Eg, equal to or higher than the bottom cell to avoid capturing light 108, specifically low energy photons 114 (shown in Fig. 1), that would otherwise be converted to free electrons 118 in the bottom cell 104.
• the thinness and bandgap, Eg, requirements for the ICTJ 302 limits the amount of dopants or intentional impurities (N A or N D ) that can be incorporated into the ICTJ 302. These limitations in turn limit the peak tunneling current through an approximate relationship:
• Eg is the bandgap of the material used to grow the ICTJ 302
• N A is the acceptor dopant concentration in the highly doped p+-type layer 304
• N D is the donor concentration in the highly doped n+-type layer 306. Note that lower dopant concentrations and higher bandgaps reduce the peak tunneling current possible in the ICTJ 302.
• incident light 108 is concentrated and focused on the multijunction solar cell 300. This increase in concentrated illumination increases the current flowing through the ICTJ 302. If the peak carrying capacity, J pea k , is exceeded, a knee 312, or sudden decrease, in amount of tunneled current 308 flowing across the reverse-biased junction 206 develops, as illustrated in the tunnel junction voltage-current graph 310.
• the intensity of the light 108 can be the equivalent of 2000 suns or 2000 times AM 1.5, a measure of spectrum and amplitude of solar radiation reaching the surface of the earth. This corresponds to a minimum J pea k of 30 A/cm 2 .
• the ICTJ 302 is epitaxially grown as a thin 150 A layer ( ⁇ 20 atomic layers) and therefore doping levels in such thin layers are well monitored to ensure proper dopant concentrations are achieved. However doping levels can drift during production and therefore a design criteria for a J peak of lOOA/cm 2 is used to ensure proper yields during the manufacturing process.
• the ⁇ 20 atomic layers are deposited across a 20" substrate millions of times.
• a 10% variability in thickness is a standard requirement.
• the ICTJ 302 thickness therefore needs to be controlled to just + or - 2 atomic layers across the entire area of the 20" substrate during manufacturing.
• the peak amount of dopant scales inversely with the band gap, Eg, of the material being doped. This limits the N A or N D dopant concentration to the approximately 10 19 cm “3 range for materials having band gaps of 1.8 to 1.9 eV and 10 20 cm “3 for materials having a band gap of 1.4eV.
• ICTJ 302 Using materials with higher bandgaps improves the transparency, but manufacturing the ICTJ 302 requires tight control of doping levels to achieve the minimum J peak of 30 A/cm 2 to 100 A/cm 2 .
• Direct methods of doping the ICTJ 302 layers is limited as the bulk doping properties of Group VI dopants like Te, Se, and S are limited by the presence of an atomic surface liquid layer concentration that needs to be established prior to doping and the overall solubility of a bulk mixture. These manufacturing constraints limit the peak concentrations and limits how thin the ICTJ 302 layers can be reliably grown.
• Group IV dopants like C, Si, Ge, and Sn will act as both donors and acceptors negating the overall dopant concentration, limiting their usefulness to the range from approximately 10 18 cm “3 to low 10 19 cm “3 concentrations.
• Group II dopants like Zn, Cd, and Hg tend to be mobile in the lattice, diffusing away from high concentration regions during subsequent epitaxy processes. This reduces the applicability of using Group II dopants to achieve the high dopant concentrations necessary to epitaxially grow the ICTJ 302.
• the multijunction solar cell with a delta-doped layer 400 comprises a top cell 102, and bottom cell 104, and an interconnecting tunnel junction with a delta-doped layer, or ⁇ -doped ICTJ 402.
• the ⁇ -doped layer 404 is a thin, approximately 20 A in width highly doped layer with a peak dopant concentration of 10 20 cm "3 .
• the ⁇ refers to the shape of the doping profile of the ⁇ - doped layer that approaches a Dirac delta function.
• a Dirac delta function, or ⁇ is a function that is infinite at one point and zero everywhere else.
• the ⁇ -doped layer 404 is positioned in the ⁇ -doped ICTJ 402 and adds to the effective N A or N D dopants, increasing the peak tunneling current of the ⁇ -doped ICTJ 402 layer.
• the ⁇ -doped layer 404 increases the tunnel current carrying capability of the ⁇ -doped ICTJ 402 by approximately a factor of two over the ICTJ 302 of Figure 3 without a ⁇ -doped layer 404.
• ⁇ -doped tunnel junction voltage-current graph 408 which shows the ⁇ -doped tunnel current 406 for a reverse biased ⁇ - doped ICTJ 402 to be approximately twice as steep as the curve representing the tunnel current 308 for an ICTJ 302 without a ⁇ -doped layer 404.
• a ⁇ -doped ICTJ 402 is shown in an exploded view.
• the highly doped p+-type layer 304 and the highly doped n+-type layer 306 adjoin to form the reversed biased junction 206.
• An n-type ⁇ -doped layer 502 is displaced within the highly doped n+-type layer 306 in close proximity to the highly doped p+-type layer 304. Placing the n-type ⁇ -doped layer 502 close to the highly doped p+-type layer 304 shortens the distance electrons have to travel to cross the reverse biased junction 206 and reduces the chance that electrons will recombine prior to crossing the reverse biased junction 206, improving the peak tunneling current density.
• a dopant concentration chart 504 illustrates approximately the relevant dopant concentration levels for the p-dopant concentration 506, the n-dopant concentration 508, and n- type ⁇ -doped concentration 510 in the ⁇ -doped ICTJ 402.
• a portion of the n-type ⁇ -doped concentration 510 is estimated as shown by the dotted lines as the narrow width of the ⁇ -doped layer makes concentrations difficult to measure.
• the n-type ⁇ -doped layer 502 is directly adjacent to the highly doped p+-type layer 304. In other embodiments, the n-type ⁇ -doped layer 502 is centered in the highly doped n+-type layer 306, displaced closer to the bottom cell 104, and placed between the bottom cell 104 and the highly doped n+-type layer 306. In another embodiment, the ⁇ -doped ICTJ 402 contains p-type ⁇ -doped layer (not shown) in the highly doped p+-type layer 304.
• the ⁇ -doped ICTJ 402 utilizes both a p-type ⁇ -doped layer in the highly doped p+-type layer 304 and an n-type ⁇ -doped layer 502 in the highly doped n+-type layer 306.
• an ICTJ 302 is placed between the bottom cell 104 and the substrate 106.
• a ⁇ -doped ICTJ 402 is placed between the bottom cell 104 and the substrate 106.
• one or more ICTJs 302 and/or one or more ⁇ -doped ICTJs 402 are placed between adjacent cells or cells and other structures, including but not limited to electrical connection points and layers, in the multijunction solar cell with a delta- doped layer 400.
• each cell 102, 104 has been illustrated as an n-on-p type junction diode, and the ⁇ -doped ICTJ 402 as a p-on-n tunnel junction, this was for illustration purposes only. In other embodiments, there are a plurality of cells 102, 104 and each cell 102, 104 is separated from an adjacent cell 102, 104 by a ⁇ -doped ICTJ 402.
• the multijunction solar cell with a delta-doped layer 400 comprises a plurality of cells 102, 104 that are p-on-n type junction diodes, and each cell 102, 104 is separated from an adjacent cell 102, 104 by a ⁇ -doped ICTJ 402 that is an n-on-p tunnel junction.
• adjacent portions of the ⁇ -doped ICTJ 402 and the cell 102, 104 have the same p/n type doping, either both use acceptor type N A dopants or both use donor type N D dopants.
• the non-adjacent portion of the ⁇ -doped ICTJ 402 has a complementary p/n type doping. For example, if the adjacent portion of the cell 102, 104 is a p-type type semiconductor material, then the adjacent portion of the ⁇ -doped ICTJ 402 is also a p-type semiconductor material, and both comprise acceptor type N A dopants.
• the other portion of the ⁇ -doped ICTJ 402 is a complementary n-type semiconductor material, and comprises a donor type N D dopants.
• the adjacent portions of the ⁇ -doped ICTJ 402 and the cell 102, 104 use the same acceptor/donor type dopant, however in one embodiment the adjacent portions of the ⁇ -doped ICTJ 402 and the cell 102, 104 use the same dopant, and in another embodiment the adjacent portions of the ⁇ - doped ICTJ 402 and the cell 102, 104 use different dopants. In one embodiment the adjacent portions of the ⁇ -doped ICTJ 402 and the cell 102, 104 use the same base semiconductor material.
• the adjacent portions of the ⁇ -doped ICTJ 402 and the cell 102, 104 use the different base semiconductor materials. In one embodiment, both portions of the ⁇ - doped ICTJ 402 use the same base semiconductor material. In one embodiment, the portions are comprised of different base semiconductor materials.
• the ⁇ -doped ICTJ manufacturing process starts by preparing 602 a Ge substrate 106. On the Ge substrate 106, grow epitaxially 604 a bottom cell 104 of n-on-p GaInAs. After the bottom cell 104 is complete, begin to grow 606 the highly doped n+-type layer 306 of GaInAs of the ⁇ -doped ICTJ 402.
• SiH 4 is used instead Of Si 2 H 6 .
• the cells 102, 104 are p-on-n cells and the ⁇ -doped ICTJ 402 is an n-on-p tunnel junction.
• the ⁇ -doped layer 404 is deposited 608 during the step of growing epitaxially 612 the highly doped p+-type layer 304 of GaInAs.
• the deposit 608 step produces a ⁇ -doped layer 404 using other methods and process steps for depositing silicon layers as known to those of ordinary skill.
• each of the P-dopants is selected from one of the Group II, IV or V elements
• each of the N-dopants is selected from one of the Group IV or VI elements.
• the substrate, subcells, and tunnel junction materials are selected each from semiconductor materials including germanium, silicon, including crystalline, multicrystalline, and amorphous silicon, polycrystalline thin films including copper indium diselenide (CIS), cadmium telluride (CdTe), and thin film silicon, and crystalline thin films including Gallium Indium Arsenide (GaInAs) and Gallium Indium Phosphide (GaInP).
• the substrate, subcells, and tunnel junction materials are selected from the alloys GaAs, InAs, GaP, InP, AlAs, AlP, AlGaInP, AlGaP, AlInP, GaInP, AlInAs, AlGaInAs, GaInAs, GaAsP, GaInAsP, GaAsSb, GaInAsSb, AlInSb, AlGaSb, GaInNAs, GaInNAsSb, GaInNP, GaInNAs, SiGe, Ge, ErP, ErAs, ErGaAs, ErInAs.

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