WO2010100997A1 - Composant électronique et dispositif électronique - Google Patents

Composant électronique et dispositif électronique Download PDF

Info

Publication number
WO2010100997A1
WO2010100997A1 PCT/JP2010/051677 JP2010051677W WO2010100997A1 WO 2010100997 A1 WO2010100997 A1 WO 2010100997A1 JP 2010051677 W JP2010051677 W JP 2010051677W WO 2010100997 A1 WO2010100997 A1 WO 2010100997A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic component
external electrode
conductors
metal case
coil
Prior art date
Application number
PCT/JP2010/051677
Other languages
English (en)
Japanese (ja)
Inventor
隆浩 森
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2011502698A priority Critical patent/JP5516572B2/ja
Priority to CN201080010628.XA priority patent/CN102342021B/zh
Publication of WO2010100997A1 publication Critical patent/WO2010100997A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1708—Comprising bridging elements, i.e. elements in a series path without own reference to ground and spanning branching nodes of another series path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/0026—Multilayer LC-filter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F2017/008—Electric or magnetic shielding of printed inductances
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

Definitions

  • the present invention relates to an electronic component and an electronic device, and more particularly to an electronic component and an electronic device including a coil and a capacitor.
  • FIG. 7A is a cross-sectional structure diagram of the LC resonant component 110 described in Patent Document 1.
  • FIG. 7B is a diagram in which the LC resonant component 110 is mounted on the circuit board 120.
  • the LC resonant component 110 includes a multilayer body 112, external electrodes 114a and 114b, internal conductors 116a to 116e, and via hole conductors B1 to B5.
  • the stacked body 112 is configured by stacking a plurality of rectangular insulating layers.
  • the external electrodes 114a and 114b are provided on the side surface of the stacked body 112 and face each other.
  • the external electrodes 114a and 114b are connected to the ground.
  • the inner conductors 116a to 116c are provided in parallel to each other and connect the outer electrodes 114a and 114b.
  • the inner conductors 116d and 116e are provided below the inner conductors 116a to 116c in the stacking direction, and constitute a capacitor by facing each other.
  • the internal conductor 116d is connected to two external electrodes (not shown) through which signals are input and output.
  • the inner conductor 116e is connected to the outer electrodes 114a and 114b.
  • the via-hole conductors B1, B2, B4, and B5 extend in the stacking direction, connect the internal conductors 116a to 116c, and function as coils.
  • the via-hole conductor B3 extends in the stacking direction, connects the internal conductors 116a to 116d, and functions as a coil.
  • a resonant circuit is formed in which a coil and a capacitor are connected in parallel between two external electrodes (not shown) for inputting and outputting signals.
  • the LC resonant component 110 is used by being mounted on a circuit board 120 as shown in FIG. At this time, the LC resonant component 110 is covered with the metal case 122. Thereby, it is suppressed that the noise from the outside penetrates into the LC resonance component 110 and other mounting components.
  • the LC resonant component 110 may be disposed in the vicinity of the metal case 122.
  • the external electrode 114 b of the LC resonant component 110 faces the metal case 122.
  • the external electrode 114b and the metal case 122 are magnetically coupled and capacitively coupled.
  • the external electrode 114b is connected to the via-hole conductors B1 to B5 via internal conductors 116a to 116c. A signal flows through the via-hole conductors B1 to B5.
  • the noise absorbed by the metal case 122 enters the signals flowing through the via-hole conductors B1 to B5 via the external electrode 114b and the internal conductors 116a to 116c. Resulting in.
  • the internal conductor 116a to which the via-hole conductors B1 to B5 through which signals flow is connected is provided in the vicinity of the upper surface of the multilayer body 112. Therefore, the inner conductor 116a and the metal case 122 are magnetically coupled and capacitively coupled. As a result, the noise absorbed by the metal case 122 enters the signals flowing through the via-hole conductors B1 to B5 via the internal conductor 116a.
  • an object of the present invention is to provide an electronic component and an electronic device that can suppress noise from entering through a metal case provided on a substrate.
  • the electronic component according to the first aspect of the present invention includes a laminate in which a plurality of insulator layers are laminated, a plurality of internal conductors constituting coils and capacitors built in the laminate, A first ground external electrode provided on a side surface of the multilayer body; and a second ground external electrode provided on a side surface of the multilayer body and facing the first ground external electrode; The internal conductor constituting the coil is connected to the first ground external electrode and is not connected to the second ground external electrode. To do.
  • an electronic device includes a substrate, the electronic component according to the first embodiment mounted on the substrate, and the second ground external electrode, And a metal case covering the electronic component.
  • an electronic component includes a laminated body in which a plurality of insulator layers are laminated, and a plurality of internal conductors constituting a coil and a capacitor built in the laminated body.
  • the inner conductor constituting the coil is provided on the upper side in the stacking direction than the inner conductor constituting the capacitor, and the inner conductor provided on the uppermost side in the stacking direction.
  • the dielectric layer provided on the upper side in the stacking direction is lower in relative dielectric constant than the insulator layer provided on the lower side in the stacking direction than the inner conductor provided on the uppermost side in the stacking direction. It is characterized by having a rate.
  • An electronic device includes a substrate, an electronic component according to the third embodiment mounted on the substrate, and a metal case covering the electronic component. It is characterized by this.
  • noise can be prevented from entering through the metal case provided on the substrate.
  • FIG. 1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on 1st Embodiment.
  • FIG. 3 is a perspective view of an electronic device in which the electronic component of FIG. 2 is mounted on a circuit board.
  • FIG. 3 is an equivalent circuit diagram of the electronic component of FIG. 2.
  • FIG. 6 is a perspective view of an electronic device in which the electronic component of FIG. 5 is mounted on a circuit board.
  • FIG. 7A is a cross-sectional structure diagram of the LC resonant component described in Patent Document 1.
  • FIG. FIG. 7B is a diagram in which the LC resonant component is mounted on a substrate.
  • FIG. 1 is an external perspective view of electronic components 10a and 10b according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the multilayer body 12a of the electronic component 10a.
  • FIG. 3 is a perspective view of an electronic device 50 a in which the electronic component 10 a is mounted on the circuit board 30.
  • FIG. 4 is an equivalent circuit diagram of the electronic component 10a.
  • the stacking direction of the electronic component 10a is defined as the z-axis direction
  • the direction along the long side of the electronic component 10a is defined as the x-axis direction
  • the direction along the short side of the electronic component 10a is defined as the y-axis direction.
  • the origin in the x-axis direction, y-axis direction, and z-axis direction is the center of the electronic component 10a.
  • the electronic component 10a includes a laminated body 12a, external electrodes 14 (14a to 14d), a recognition mark 15, internal conductors 18 (18a to 18h), and via-hole conductors b (b1, b2). I have.
  • the laminated body 12a is formed by laminating a plurality of rectangular dielectric layers 16 (16a to 16g) in this order, and has a rectangular parallelepiped shape.
  • the external electrode 14a is provided on the side surface on the negative direction side in the x-axis direction of the multilayer body 12a, and is used as a signal input terminal.
  • the external electrode 14b is provided on the side surface on the positive side in the x-axis direction of the multilayer body 12a, and is used as a signal output terminal.
  • the external electrode 14c is provided on the side surface on the negative side in the y-axis direction of the multilayer body 12a and is used as a ground terminal.
  • the external electrode 14d is provided on the side surface on the positive side in the y-axis direction of the multilayer body 12a and is used as a ground terminal.
  • the external electrode 14d is opposed to the external electrode 14c.
  • the recognition mark 15 is provided on the upper surface on the positive side in the z-axis direction of the laminated body 12a, and is used for identifying the direction of the electronic component 10a during mounting.
  • the dielectric layer 16 is a rectangular insulating layer made of, for example, a Ba—Al—Si based dielectric ceramic.
  • the inner conductor 18 is made of a conductive material mainly composed of Cu, and constitutes coils L1 and L2 and capacitors C1 to C3 built in the multilayer body 12a. More specifically, each of the inner conductors 18a and 18b extends from the negative side in the y-axis direction toward the positive direction in the y-axis direction on the main surface of the dielectric layer 16b. Part of the coils L1 and L2 is configured. However, the inner conductors 18a and 18b are not drawn out to the side on the positive direction side in the y-axis direction. Therefore, the internal conductors 18a and 18b are connected to the external electrode 14c but are not connected to the external electrode 14d.
  • the inner conductors 18c and 18d are provided on the main surface of the dielectric layer 16c so as to overlap with the inner conductors 18a and 18b and the dielectric layer 16b when viewed in plan from the z-axis direction.
  • the internal conductor 18c is connected to the external electrode 14a by being drawn out to the side on the negative side in the x-axis direction in the dielectric layer 16c.
  • the internal conductor 18d is connected to the external electrode 14b by being drawn out to the side on the positive direction side in the x-axis direction in the dielectric layer 16c.
  • the via-hole conductor b1 penetrates the dielectric layer 16b in the z-axis direction, and connects the internal conductor 18a and the internal conductor 18c.
  • the via-hole conductor b2 penetrates the dielectric layer 16b in the z-axis direction, and connects the internal conductor 18b and the internal conductor 18d.
  • Via-hole conductors b1 and b2 constitute part of coils L1 and L2, respectively.
  • the inner conductor 18a and the via hole conductor b1 constitute the coil L1 in FIG.
  • the internal conductor 18b and the via-hole conductor b2 constitute the coil L2 in FIG.
  • the via-hole conductor b is made of, for example, a conductive material whose main component is copper.
  • the inner conductor 18e is provided on the dielectric layer 16d so as to face the inner conductors 18c and 18d with the dielectric layer 16c interposed therebetween when viewed in plan from the z-axis direction.
  • the inner conductors 18c and 18e constitute the capacitor C1 in FIG.
  • the internal conductors 18d and 18e also constitute the capacitor C1 in FIG.
  • the inner conductor 18 e is provided at the center of the dielectric layer 16 d and is not connected to any of the outer electrodes 14.
  • the inner conductors 18f and 18g are provided on the main surface of the dielectric layer 16e so as to overlap with the inner conductor 18e and the dielectric layer 16d when viewed in plan from the z-axis direction.
  • the internal conductors 18e and 18f constitute the capacitor C1 of FIG.
  • the inner conductors 18e and 18g also constitute the capacitor C1 in FIG.
  • the internal conductor 18f is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 16e.
  • the internal conductor 18g is connected to the external electrode 14b by being drawn out to the side on the positive direction side in the x-axis direction in the dielectric layer 16e.
  • the inner conductor 18h is provided on the dielectric layer 16f so as to face the inner conductors 18f and 18g with the dielectric layer 16e interposed therebetween when viewed in plan from the z-axis direction.
  • the inner conductors 18f and 18h constitute the capacitor C2 in FIG. 4
  • the inner conductors 18g and 18h constitute the capacitor C3 in FIG.
  • the inner conductor 18h is connected to the outer electrodes 14c and 14d by being drawn out to the side on the positive side and the side on the negative direction in the dielectric layer 16f. Has been.
  • the internal conductors 18a and 18b and the via-hole conductors b1 and b2 constituting the coils L1 and L2 are the internal conductors constituting the capacitors C1 to C3. It is provided on the positive direction side in the z-axis direction from 18c to 18h.
  • the electronic component 10a is mounted on the circuit board 30 as shown in FIG.
  • a metal case 32 is provided so as to cover the main surface of the circuit board 30.
  • the metal case 32 has a side surface portion 32a and an upper surface portion 32b, and plays a role of suppressing external noise from entering the electronic component 10a and the like.
  • the side surface portion 32a is attached perpendicular to the circuit board 30 and faces the external electrode 14d.
  • the upper surface portion 32 b is connected to the side surface portion 32 a and covers the main surface of the circuit board 30 with a predetermined distance from the main surface of the circuit board 30.
  • the electronic component 10 a is covered with the metal case 32.
  • the metal case 32 does not face the external electrode 14c.
  • the internal conductors 18a and 18b constituting the coils L1 and L2 are not connected to the external electrode 14d facing the metal case 32. Therefore, the noise absorbed by the metal case 32 does not enter the laminated body 12a from the internal electrodes 18a and 18b from the external electrode 14b. Therefore, in the electronic component 10a and the electronic device 50a, it is possible to prevent noise from entering the electronic component 10a through the metal case 32.
  • the inner conductors 18a and 18b constituting the coils L1 and L2 are provided above the inner conductors 18c to 18h constituting the capacitors C1 to C3 in the z-axis direction. Furthermore, in the electronic component 10a, the inner conductors 18a and 18b are provided on the uppermost side in the z-axis direction. Therefore, the inner conductors 18a and 18b are easily affected by noise from the metal case 32 because the distance between the inner conductors 18a and 18b is shorter than the inner conductors 18c to 18h. Therefore, by not connecting the internal conductors 18a and 18b to the external electrode 14d, it is possible to effectively suppress noise from entering the internal conductors 18a and 18b from the metal case 32.
  • the internal conductors 18a and 18b are provided only between the via-hole conductors b1 and b2 and the external electrode 14c, respectively. Therefore, the internal conductors 18a and 18b are not provided on the external electrode 14d side than the via-hole conductors b1 and b2. Therefore, the size of the area where the inner conductors 18a, 18b and the metal case 32 face each other is reduced. As a result, magnetic coupling and capacitive coupling between the inner conductors 18a and 18b and the metal case 32 are reduced. Therefore, it is possible to prevent noise from entering the inner conductors 18a and 18b from the metal case 32.
  • a plurality (two) of the internal conductors 18a and 18b constituting the coils L1 and L2 are provided on the same dielectric layer 16b. Furthermore, a plurality (two) of via-hole conductors b1 and b2 are provided so as to be connected to the internal conductors 18a and 18b, respectively. Thereby, the coil L1 and the coil L2 come close to each other. As a result, the magnetic coupling between the coil L1 and the coil L2 can be strengthened.
  • FIG. 5 is an exploded perspective view of the multilayer body 12b of the electronic component 10b.
  • FIG. 6 is a perspective view of an electronic device 50 b in which the electronic component 10 b is mounted on the circuit board 30.
  • the stacking direction of the electronic component 10b is defined as the z-axis direction
  • the direction along the long side of the electronic component 10b is defined as the x-axis direction
  • the direction along the short side of the electronic component 10b is defined as the y-axis direction.
  • the origin in the x-axis direction, y-axis direction, and z-axis direction is the center of the electronic component 10b. 1 and 4 are used for an external perspective view and an equivalent circuit diagram of the electronic component 10b.
  • the electronic component 10b includes a laminated body 12b, external electrodes 14 (14a to 14d), a recognition mark 15, internal conductors 68 (68a to 68h), and via-hole conductors b (b11, b12). I have.
  • the multilayer body 12b is formed by laminating a plurality of rectangular dielectric layers 65 (65a) and 66 (66b to 66g) in this order, and forms a rectangular parallelepiped shape.
  • the external electrode 14a is provided on the side surface on the negative direction side in the x-axis direction of the multilayer body 12b, and is used as a signal input terminal.
  • the external electrode 14 b is provided on the side surface on the positive side in the x-axis direction of the multilayer body 12 b and is used as a signal output terminal.
  • the external electrode 14c is provided on the side surface on the negative direction side in the y-axis direction of the multilayer body 12b and is used as a ground terminal.
  • the external electrode 14d is provided on the side surface on the positive side in the y-axis direction of the multilayer body 12b and is used as a ground terminal.
  • the external electrode 14c is opposed to the external electrode 14d.
  • the recognition mark 15 is provided on the upper surface of the laminated body 12b on the positive side in the z-axis direction, and is used for identifying the direction of the electronic component 10b during mounting.
  • the dielectric layers 65 and 66 are rectangular insulating layers made of, for example, a Ba—Al—Si based dielectric ceramic.
  • the inner conductor 68 is made of a conductive material containing Cu as a main component, and constitutes coils L1 and L2 and capacitors C1 to C3 built in the multilayer body 12b. More specifically, the inner conductors 68a and 68b extend from the negative side in the y-axis direction to the positive side in the y-axis direction on the main surface of the dielectric layer 66b, and the coil L1. , L2 is configured. Thereby, the inner conductors 68a and 68b are connected to the outer electrodes 14c and 14d.
  • the inner conductors 68c and 68d are provided on the main surface of the dielectric layer 66c so as to overlap with the inner conductors 68a and 68b and the dielectric layer 66b when viewed in plan from the z-axis direction.
  • the internal conductor 68c is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 66c.
  • the internal conductor 68d is connected to the external electrode 14b by being drawn out to the side on the positive side in the x-axis direction in the dielectric layer 66c.
  • the via-hole conductor b11 passes through the dielectric layer 66b in the z-axis direction, and connects the internal conductor 68a and the internal conductor 68c.
  • the via-hole conductor b12 passes through the dielectric layer 66b in the z-axis direction, and connects the internal conductor 68b and the internal conductor 68d.
  • the via-hole conductors b11 and b12 constitute part of the coils L1 and L2, respectively.
  • the internal conductor 68a and the via hole conductor b11 constitute the coil L1 in FIG.
  • the inner conductor 68b and the via-hole conductor b12 constitute the coil L2 in FIG.
  • the via-hole conductor b is made of, for example, a conductive material whose main component is copper.
  • the inner conductor 68e is provided on the dielectric layer 66d so as to face the inner conductors 68c and 68d with the dielectric layer 66c interposed therebetween when viewed in plan from the z-axis direction.
  • the internal conductors 68c and 68e constitute the capacitor C1 of FIG.
  • the internal conductors 68d and 68e also constitute the capacitor C1 in FIG.
  • the inner conductor 68 e is provided in the center of the dielectric layer 66 d and is not connected to any of the outer electrodes 14.
  • the inner conductors 68f and 68g are provided on the main surface of the dielectric layer 66e so as to overlap with the inner conductor 68e and the dielectric layer 66d when viewed in plan from the z-axis direction.
  • the inner conductors 68e and 68f constitute the capacitor C1 in FIG.
  • the internal conductors 68e and 68g also constitute the capacitor C1 in FIG.
  • the internal conductor 68f is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 66e.
  • the internal conductor 68g is connected to the external electrode 14b by being drawn out to the side on the positive side in the x-axis direction in the dielectric layer 66e.
  • the inner conductor 68h is provided on the dielectric layer 66f so as to face the inner conductors 68f and 68g with the dielectric layer 66e interposed therebetween when viewed in plan from the z-axis direction.
  • the inner conductors 68f and 68h constitute the capacitor C2 of FIG. 4
  • the inner conductors 68g and 68h constitute the capacitor C3 of FIG.
  • the inner conductor 68h is connected to the outer electrodes 14c and 14d by being drawn out to the positive side and the negative side in the dielectric layer 66f. Has been.
  • the internal conductors 68a and 68b and the via-hole conductors b11 and b12 constituting the coils L1 and L2 constitute the capacitors C1 to C3. It is provided on the positive side in the z-axis direction from the internal conductors 68c to 68h.
  • the dielectric layer 65a is provided on the positive side in the z-axis direction relative to the inner conductors 68a and 68b provided on the most positive direction side in the z-axis direction, and is located on the positive side in the z-axis direction.
  • the dielectric constant is lower than that of the dielectric layer 66 provided on the negative side in the axial direction.
  • the electronic component 10b is mounted on the circuit board 30 as shown in FIG.
  • a metal case 32 is provided so as to cover the main surface of the circuit board 30.
  • the metal case 32 has a side surface portion 32a and an upper surface portion 32b, and plays a role of suppressing external noise from entering the electronic component 10b and the like.
  • the side surface portion 32a is attached perpendicularly to the circuit board 30 and faces the external electrode 14d.
  • the upper surface portion 32 b is connected to the side surface portion 32 a and covers the main surface of the circuit board 30 with a predetermined distance from the main surface of the circuit board 30. Thereby, the electronic component 10 b is covered with the metal case 32.
  • the metal case 32 does not face the external electrode 14c.
  • the dielectric layer 65a provided on the positive side in the z-axis direction relative to the internal conductors 68a and 68b provided on the most positive direction side in the z-axis direction includes the internal conductor 68a, It has a relative dielectric constant lower than that of the dielectric layer 66 provided on the negative side in the z-axis direction from 68b.
  • stray capacitance generated between the inner conductors 68a and 68b and the upper surface portion 32b of the metal case 32 is reduced.
  • the electronic component 10b it is possible to prevent noise from entering the electronic component 10b via the metal case 32.
  • the inner conductors 68a and 68b constitute coils L1 and L2. Therefore, a signal flows through the internal conductors 68a and 68b. Therefore, by reducing the stray capacitance between the inner conductors 68a and 68b and the metal case 32, it is possible to more effectively suppress noise from entering the signal in the electronic component 10b.
  • the manufacturing method of the electronic component 10a is demonstrated, referring FIG.1 and FIG.2.
  • the manufacturing method of the electronic component 10b is basically the same as the manufacturing method of the electronic component 10a, and thus the description thereof is omitted.
  • a ceramic green sheet to be the dielectric layer 16 is prepared. Specifically, each material obtained by weighing barium oxide (BaO), aluminum oxide (Al 2 O 3 ), and silicon oxide (SiO 2 ) at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a dielectric ceramic powder.
  • barium oxide (BaO), aluminum oxide (Al 2 O 3 ), and silicon oxide (SiO 2 ) at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a dielectric ceramic powder.
  • This binder ceramic powder is mixed with a binder, a plasticizer, a wetting material, and a dispersing agent, mixed with a ball mill, and then defoamed under reduced pressure.
  • the obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the dielectric layer 16.
  • via hole conductors b1 and b2 are formed in each of the ceramic green sheets to be the dielectric layer 16b. Specifically, a via hole is formed by irradiating a ceramic green sheet to be the dielectric layer 16b with a laser beam. Next, the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.
  • a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.
  • a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied on the ceramic green sheets to be the dielectric layers 16b to 16f by a method such as a screen printing method or a photolithography method.
  • the inner conductors 18a to 18h are formed.
  • the step of forming the internal conductors 18a to 18h and the step of filling the via hole with the conductive paste may be performed in the same step.
  • each ceramic green sheet is laminated. Specifically, a ceramic green sheet to be the dielectric layer 16g is disposed. The carrier film of the ceramic green sheet to be the dielectric layer 16g is peeled off, and the ceramic green sheet to be the dielectric layer 16f is disposed on the ceramic green sheet to be the dielectric layer 16g. Thereafter, the ceramic green sheet to be the dielectric layer 16f is pressure-bonded to the ceramic green sheet to be the dielectric layer 16g.
  • the discharge method of the carrier film is discharge by suction and grabbing discharge by a chuck. Thereafter, the ceramic green sheets to be the dielectric layers 16e, 16d, 16c, 16b, and 16a are similarly laminated and pressure-bonded in this order. Thereby, a mother laminated body is formed. The mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like.
  • the mother laminated body is cut into a laminated body 12a having a predetermined size with a cutting blade. Thereby, the unsintered laminated body 12a is obtained.
  • This unfired laminate 12a is subjected to binder removal processing and firing.
  • the fired laminated body 12a is obtained through the above steps.
  • the laminated body 12a is barrel-processed and chamfered. Thereafter, a copper electrode to be the external electrodes 14a to 14d is formed on the surface of the laminated body 12a by applying and baking an electrode paste whose main component is copper by a method such as dipping.
  • the external electrodes 14a to 14d are formed by performing Ni plating / Sn plating on the surface of the copper electrode. Through the above steps, an electronic component 10a as shown in FIG. 1 is completed.
  • the electronic component and the electronic device according to the present invention are not limited to the electronic components 10a and 10b and the electronic devices 50a and 50b shown in the above-described embodiment, and can be changed within the scope of the gist thereof.
  • a resin may be used as the dielectric layer.
  • the present invention is useful for electronic parts and electronic devices, and is particularly excellent in that noise can be prevented from entering through a metal case provided on a substrate.
  • Capacitors L1, L2 Coils b1, b2, b11, b12 Via hole conductors 10a, 10b Electronic parts 12a, 12b Laminated bodies 14a-14d External electrodes 16a-16g, 65a, 66b-66g Dielectric layers 18a-18h, 68a- 68h Inner conductor 30 Circuit board 32 Metal case 32a Side surface portion 32b Upper surface portion 50a, 50b Electronic device

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Filters And Equalizers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

La présente invention concerne un composant électronique et un dispositif électronique dans lesquels l'intrusion de bruit à travers un boîtier métallique réalisé sur un substrat peut être réduite. Un empilement (12a) comprend une pluralité de couches diélectriques (16). Des conducteurs internes (18) forment des bobines (L1, L2) et des condensateurs (C1 à C3) incorporés à l'intérieur de l'empilement (12a). Deux électrodes externes sont réalisées sur les surfaces du côté opposé de l'empilement (12) et sont utilisées comme bornes de mise à la masse. Les conducteurs internes (18a, 18b) qui forment les bobines (L1, L2) sont connectés à l'une des électrodes externes mais ne sont pas connectés à l'autre des électrodes externes.
PCT/JP2010/051677 2009-03-02 2010-02-05 Composant électronique et dispositif électronique WO2010100997A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011502698A JP5516572B2 (ja) 2009-03-02 2010-02-05 電子部品及び電子装置
CN201080010628.XA CN102342021B (zh) 2009-03-02 2010-02-05 电子元器件及电子装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-048266 2009-03-02
JP2009048266 2009-03-02

Publications (1)

Publication Number Publication Date
WO2010100997A1 true WO2010100997A1 (fr) 2010-09-10

Family

ID=42709559

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/051677 WO2010100997A1 (fr) 2009-03-02 2010-02-05 Composant électronique et dispositif électronique

Country Status (3)

Country Link
JP (1) JP5516572B2 (fr)
CN (1) CN102342021B (fr)
WO (1) WO2010100997A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013069419A1 (fr) * 2011-11-09 2013-05-16 株式会社村田製作所 Filtre lc empilé
WO2018100923A1 (fr) * 2016-12-02 2018-06-07 株式会社村田製作所 Résonateur lc et filtre lc

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6593209B2 (ja) * 2016-02-05 2019-10-23 株式会社村田製作所 電子部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136644A (ja) * 1991-11-11 1993-06-01 Tdk Corp Ｌｃ共振器
JP2000323908A (ja) * 1999-05-07 2000-11-24 Murata Mfg Co Ltd 積層型ｌｃフィルタ
JP2001143965A (ja) * 1999-11-16 2001-05-25 Murata Mfg Co Ltd 複合電子部品
JP2006025145A (ja) * 2004-07-07 2006-01-26 Tdk Corp 積層型ｌｃ複合部品
JP2007158440A (ja) * 2005-11-30 2007-06-21 Tdk Corp 積層型誘電体共振器およびバンドパスフィルタ
JP2007306172A (ja) * 2006-05-10 2007-11-22 Tdk Corp バンドパスフィルタ素子および高周波モジュール

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3500319B2 (ja) * 1998-01-08 2004-02-23 太陽誘電株式会社 電子部品

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136644A (ja) * 1991-11-11 1993-06-01 Tdk Corp Ｌｃ共振器
JP2000323908A (ja) * 1999-05-07 2000-11-24 Murata Mfg Co Ltd 積層型ｌｃフィルタ
JP2001143965A (ja) * 1999-11-16 2001-05-25 Murata Mfg Co Ltd 複合電子部品
JP2006025145A (ja) * 2004-07-07 2006-01-26 Tdk Corp 積層型ｌｃ複合部品
JP2007158440A (ja) * 2005-11-30 2007-06-21 Tdk Corp 積層型誘電体共振器およびバンドパスフィルタ
JP2007306172A (ja) * 2006-05-10 2007-11-22 Tdk Corp バンドパスフィルタ素子および高周波モジュール

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013069419A1 (fr) * 2011-11-09 2013-05-16 株式会社村田製作所 Filtre lc empilé
WO2018100923A1 (fr) * 2016-12-02 2018-06-07 株式会社村田製作所 Résonateur lc et filtre lc
JPWO2018100923A1 (ja) * 2016-12-02 2019-10-17 株式会社村田製作所 Ｌｃ共振器およびｌｃフィルタ
US10944376B2 (en) 2016-12-02 2021-03-09 Murata Manufacturing Co., Ltd. LC resonator and LC filter

Also Published As

Publication number Publication date
CN102342021B (zh) 2014-07-23
JP5516572B2 (ja) 2014-06-11
CN102342021A (zh) 2012-02-01
JPWO2010100997A1 (ja) 2012-09-06

Similar Documents

Publication Publication Date Title
JP6064973B2 (ja) 電子部品及びその製造方法
KR102105389B1 (ko) 적층 전자부품
JP5787760B2 (ja) フィルタ
TWI434308B (zh) 電子零件
KR101092390B1 (ko) 적층형 전자 부품 및 그 제조 방법
US7430107B2 (en) Monolithic capacitor, circuit board, and circuit module
TWI433456B (zh) Electronic Parts
KR101536678B1 (ko) 전자부품
WO2017169102A1 (fr) Composant électronique
US10645798B2 (en) Composite component-embedded circuit board and composite component
KR101523872B1 (ko) 전자 부품
JP6083394B2 (ja) 有極型ローパスフィルタおよび分波器
JP6673298B2 (ja) コイル部品
JP2010232343A (ja) 電子部品及びその製造方法
JP5163714B2 (ja) 電子部品
JP5516572B2 (ja) 電子部品及び電子装置
US20220115171A1 (en) High-frequency inductor component
US11456109B2 (en) Coil component
JP2012146940A (ja) 電子部品および電子装置
JP2010147701A (ja) 電子部品
JPWO2006085465A1 (ja) Ｌｃフィルタ複合モジュール
JP5915800B2 (ja) 電子部品
JP2023143583A (ja) 積層型キャパシタ及びその内蔵基板
JP2023047754A (ja) 配線基板

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201080010628.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10748594

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2011502698

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10748594

Country of ref document: EP

Kind code of ref document: A1