WO2010095899A2 - 반도체 패키지 가공시스템 - Google Patents

반도체 패키지 가공시스템 Download PDF

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Publication number
WO2010095899A2
WO2010095899A2 PCT/KR2010/001069 KR2010001069W WO2010095899A2 WO 2010095899 A2 WO2010095899 A2 WO 2010095899A2 KR 2010001069 W KR2010001069 W KR 2010001069W WO 2010095899 A2 WO2010095899 A2 WO 2010095899A2
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WO
WIPO (PCT)
Prior art keywords
unit
laser
semiconductor package
processing system
vision
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PCT/KR2010/001069
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English (en)
French (fr)
Korean (ko)
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WO2010095899A3 (ko
Inventor
문병관
유성만
Original Assignee
한미반도체 주식회사
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Publication of WO2010095899A2 publication Critical patent/WO2010095899A2/ko
Publication of WO2010095899A3 publication Critical patent/WO2010095899A3/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a system for laser drilling a top surface of a package to produce a package on package (PoP).
  • PoP package on package
  • portable electronic products such as mobile phones and mobile calculators require better functions and performance at the lowest production cost and limited space, and require minimum thickness and minimum weight.
  • the mounting space may be limited, or there may be a great demand for the mounting space.
  • Stacking between packages in the stacked package assembly i.e., Z-axis interconnection, is a very important technique in terms of production possibilities, design flexibility and production costs.
  • the stacked package assembly stacks chips and packages and connects them in the Z-axis direction using wire bonds, solder balls, or flip chip interconnects, thereby providing chips and packages. Can be integrated in a limited space.
  • the stacked package assemblies generally fall into two categories, one referred to as a Package on Package (PoP) assembly and the other referred to as a Package in Package (PiP) assembly.
  • PoP Package on Package
  • PiP Package in Package
  • a package-on-package assembly is adopted among the stacked package assemblies, and in order to manufacture the package-on-package assembly, lamination between the packages, that is, Z-axis stacking, is performed by laser drilling the upper surface of the package to expose the solder balls concealed in the mold.
  • lamination between the packages that is, Z-axis stacking
  • a semiconductor manufacturing facility that performs a process of drilling and cleaning the upper surface of a package with a laser is targeted.
  • the present invention has been made in view of the above, and can efficiently perform laser drilling on the upper surface of a package for manufacturing a stacked package assembly of a package-on-package type, and effectively remove contamination of the upper surface of the package due to laser processing.
  • a new layout-type processing system that introduces an automation concept that links laser processing and cleaning processes, it greatly improves overall productivity by increasing the package per hour (UPH).
  • UHP package per hour
  • the semiconductor package processing system includes an on-loader for loading a material for processing into a processing process, a chuck table unit for loading a material for processing into and out of a processing region, and in a processing region.
  • a laser unit arranged to perform laser drilling on the material, a cleaning unit to remove contaminants attached to the finished material, an offloader to unload the finished and cleaned material out of the process, the onloader, Characterized in that it comprises a picker unit for picking up and transporting materials while traveling between the chuck table unit, the cleaning unit and the off-loader.
  • the chuck table unit for supporting the material from below, the first conveyance member for the Y axis direction movement of the chuck table, and the axial table for the X axis direction movement It includes a movable block, it is preferable to arrange the chuck table and the transfer member in four rows to carry the material alternately by two rows.
  • the laser unit adopts a dual type having two laser processors, and simultaneously performs laser processing on two materials as the chuck table moves its position in the X-axis direction by the movable block. It is desirable to be configured to perform.
  • the semiconductor package processing system includes an ultrasonic cleaner for cleaning by dipping the material using ultrasonic waves to remove the contamination of the material, and a wet body nozzle cleaner for cleaning the wet body by spraying on the upper surface of the material, It may include a cleaning unit consisting of a drying unit for drying the material in a hot air spray method.
  • the semiconductor package processing system provided by the present invention has the following advantages.
  • the whole process from loading to unloading through laser processing and cleaning process can be performed in an integrated process to improve the processing speed of package processing per unit time, and thus to increase the overall output of the equipment.
  • the cleaning efficiency can be improved, such as to completely remove the various contaminants attached to the upper surface of the package after laser processing.
  • FIG. 1 is a schematic diagram illustrating an overall layout of a semiconductor package processing system according to an embodiment of the present invention.
  • 2, 3, 4, 5 is a schematic diagram showing the operation of the ultrasonic cleaner in the semiconductor package processing system according to an embodiment of the present invention
  • 6,7,8,9 are schematic diagrams illustrating an operation process of the weaning body nozzle cleaner in the semiconductor package processing system according to an embodiment of the present invention.
  • 10, 11, 12, 13, 14, 15, and 16 are schematic diagrams showing the operation of the semiconductor package processing system according to an embodiment of the present invention.
  • FIG. 17 is a schematic diagram showing an overall layout of a semiconductor package processing system according to another embodiment of the present invention.
  • 18 to 21 are schematic views showing an operation of the ultrasonic cleaner in the semiconductor package processing system according to the embodiment of FIG.
  • FIG. 22 is a schematic diagram illustrating an operation process of a weaning body nozzle cleaner in the semiconductor package processing system according to the embodiment of FIG. 17.
  • FIG. 23 is a side view illustrating a dual type laser processor in the semiconductor package processing system of FIG. 17.
  • FIG. 1 is a schematic diagram showing an overall layout of a semiconductor package processing system according to an embodiment of the present invention.
  • the semiconductor package processing system includes an onloader 10 for loading a material for processing into a processing process, an offloader 14 for unloading a material after processing is completed, and a material for processing.
  • the chuck table unit 11 for transferring the processed material into the processing area or the finished material out of the processing area, the laser unit 12 for performing laser drilling on the material substantially, and cleaning and drying the finished material.
  • Picker unit 15 for picking up and transporting materials between the cleaning unit 13, the onloader 10, the chuck table unit 11, the cleaning unit 12, and the offloader 14 to remove contaminants. ) And the like.
  • the onloader 10 is provided with a plurality of magazines loaded with a plurality of materials, for example, a strip-shaped semiconductor material.
  • a plurality of materials for laser processing may be stacked and provided in a cassette magazine format.
  • the on-loader 10 is provided with a conveying means for conveying the cassette magazine, the conveying means at this time may be applied in various ways, preferably may be made of a belt drive.
  • the cassette magazine for loading the material is preferably advanced in a layer structure.
  • the cassette magazine containing the material is disposed in the lower floor, and after supplying the material in an elevator form while proceeding by using the transfer means, the empty cassette magazine may be discharged to the upper floor.
  • the onloader 10 is provided with a pusher 33 for pushing the material in the cassette magazine.
  • the pusher 33 serves to push the material loaded in the cassette magazine to one side so as to be seated on the rail 34 located in front of the material progress direction.
  • a gripper 35 is provided at the front of the pusher 33, and the gripper 35 is positioned to face the pusher 33, so that the pusher 33 is on one side of the material in the direction of the rail 34. When pressed, the gripper 35 serves to facilitate the transfer of the material by grasping and pulling the other side of the material.
  • the chuck table unit 11 is provided at a position adjacent to the on-loader 10 in the X-axis direction.
  • the chuck table unit 11 serves to stably hold the material during the laser processing, and injects the material into the working area where the laser processing is in progress while the material is seated, or finishes the material after the laser processing. It takes the work out of the work area.
  • the chuck table unit 11 includes a chuck table 16 for supporting materials from below, a first transfer member 17 for moving the chuck table 16 in the Y-axis direction, and the chuck table. And a movable block 47 for moving 16 in the X-axis direction.
  • the movable block 47 is a component that moves the first transfer member 17 while moving to move the chuck table 16 together with the first transfer member 17 in the X-axis direction. As the first transfer member 17 is moved in the X-axis direction, the position of the chuck table 16 may be moved in the X-axis direction.
  • the chuck table 16 serves to fix and support the material from below when the upper surface of the material is processed by the laser processing machine 18 described later.
  • chuck table 16 Any kind of such chuck table 16 may be employed at the level of those skilled in the art.
  • the first conveying member 17 is installed in a form extending in the Y-axis direction, the chuck table 16 can be placed on the first conveying member 17 is installed so, the chuck table 16 Can move along the Y axis with the material.
  • the first transfer member 17 may be applied to any configuration as long as the configuration allows the chuck table 16 to be movable.
  • the first transfer member 17 may be provided with a screw shaft therein. It is possible to apply a form in which the chuck table is combined into a rotatable structure, or an LM unit type may be applied.
  • the chuck table unit 11 may be configured in plural, and each chuck table unit 11 is configured to be arranged in parallel along the Y-axis direction.
  • the chuck table unit 11 is composed of four pieces.
  • the four chuck table units 11, that is, the chuck tables 16 and the first transfer member 17 arranged side by side in four rows are configured to carry materials alternately by two rows during material transfer.
  • the second row will enter the work area with the material first, and if the material is placed in the first and third row 2, then the second row will be in the next order. Take the material into the working area.
  • the chuck table unit 11 alternately transfers materials by two rows alternately, and laser processing is performed for two rows in the working area.
  • the laser unit 12 is provided above one side of the first transfer member 17, and the laser unit 12 serves to perform laser drilling on a material placed on the chuck table 16.
  • the laser unit 12 may be provided with a plurality of, one embodiment of the present invention consists of a dual type is provided with two laser processing machine (18).
  • the two laser processors 18 may be positioned above the first transfer member 17 in the second row and the first transfer member 17 in the fourth row.
  • the two laser processors 18 may be located above the first transfer member 17 in the first row and the first transfer member 17 in the third row.
  • the movable block 47 is a component that moves the chuck table 16 in the X-axis direction while moving, the chuck table 16 is moved in the X-axis direction by the movable block 47.
  • the relative position with the laser processing machine 18 in a fixed position can be changed to perform laser processing on the material.
  • the laser processing machine 18 may perform laser processing on the material while moving the position in the X-axis direction.
  • the two laser processing machines 18 may simultaneously process materials located in the second and fourth row two, and then simultaneously move materials located in the first and third row two in the X-axis direction. You can also process.
  • the beam irradiator (not shown) of the laser processing machine 18 is capable of adjusting the beam irradiation angle, and thus can cover all of the processing sites in one row of materials while changing the beam irradiation angle.
  • a vision unit 32 is provided at an upper portion of one side of the second transfer member 19.
  • the vision unit 32 is provided with a second vision 30 for detecting a position where the material is seated on the chuck table 16 of the first transfer member 17.
  • the second vision 30 may be moved in the X-axis direction by the second transfer member 19.
  • the second vision 30 is provided to perform alignment inspection such as the position state of the material before laser processing, and each processing part of the material through the material alignment information provided from the second vision 30 at this time. Laser processing can be done for.
  • the second vision 30 detects the alignment of the material and transmits the alignment to the control unit (not shown) of the laser unit 12 to adjust the irradiation angle of the beam irradiator of the laser processor 18.
  • the cleaning unit 13 and the drying unit 22 are provided at positions adjacent to the X-axis direction of the chuck table unit 11.
  • the cleaning unit 13 includes an ultrasonic cleaner 20 for washing using ultrasonic waves, and a wet body nozzle washing machine 21 for spraying and cleaning the baby body, and the drying unit 22 includes a drying block incorporating a heater. It consists of 40 and the dryer 41 which injects hot air.
  • the ultrasonic cleaner 20, the weaning nozzle cleaner 21 and the drying unit 22 are sequentially disposed along the X-axis direction, the material may be removed during the cleaning or drying process in turn to remove the contamination.
  • the ultrasonic cleaner 20 is a means for removing ultrasonic contaminants on the material by generating ultrasonic waves for the material dipped in water, and the contaminants may be cleaned very well due to cavitation during ultrasonic cleaning.
  • the ultrasonic cleaner 20 is filled with a certain amount of fluid in the water tank 23, the upper portion of the water tank 23 is supported by a cylinder rod rotatable 180 °
  • the first table 24 is installed, and the lower portion of the first table 24 is provided with a cylinder 25 supported on the rotating shaft 36.
  • the first table 24 is a portion for adsorption and fixing the material
  • the cylinder 25 is to move the first table 24 up and down to receive the material and to enter the material into the fluid.
  • the rotary shaft 36 may be connected to an actuator 37 such as a known motor to rotate.
  • the frequency for enhancing the ultrasonic cleaning effect is suitable in the range of 20 to 150 kHz, and the temperature of the fluid is preferably 20 ° C. or higher because it results in improved cleaning results.
  • the fluid in which the ultrasonic cleaning process is performed basically consists of water, and may include one or more surfactants and the like.
  • the first table 24 passed the material 100 from the picker 45 rotates by 180 ° about the rotation axis 36 by the operation of the actuator 37, and then continues to operate the cylinder 25.
  • the material on the table is also positioned in the fluid, and in this state, an ultrasonic generator (not shown) may be operated to perform an ultrasonic cleaning process for the material.
  • the method of seating the material on the first table 24 for cleaning may be such that the first table is moved up and down by the cylinder 25 to be passed the material from the picker 45 as described above. (45) Since it is a component that can be loaded or unloaded while moving up and down after picking up materials, instead of moving up and down of the first table 24, the picker 45 descends and picks up the first picked up material. (24) It is possible to settle up and allow the picker 45 to pick up and lift the material again after cleaning.
  • the weaning body nozzle washer 21 is a means for removing contaminants on the material by spraying the weaning body on the upper surface of the material.
  • the weaning body nozzle cleaner 21 as shown in Figures 6 to 9, the weaning body nozzle 28 is installed inside the chamber 26 to form a predetermined space to be blocked from the outside and
  • the second table 27 rotatable 180 ° may be installed in the ceiling of the chamber 26 in a rotatable structure.
  • the second table 27 is a means for fixing the material and rotating together with the seated material to position the material into and out of the chamber 26, and the weaning body nozzle 28 is located inside the chamber 26. It is a means for spraying the weaning body on the upper surface of the material installed and looking down.
  • the rubber body 38 is installed in a form that covers the gap between the chamber 26 and the second table 27.
  • the weaning body nozzle 28 may be an internal mixing type that produces fine water droplets by mixing and spraying gas and liquid in the nozzle, and the spraying angle at this time is preferably between 10 and 120 °, and at least one Can be deployed and used.
  • the second table 27 passed the material 100 from the picker 46 rotates 180 ° about the rotation axis by the operation of an actuator (not shown), and is thus fixed to the second table 27.
  • the material is located inside the chamber 26, and in this state, the weaning body is sprayed from the weaning body nozzle 28, so that the weaning body cleaning process for the material may be performed.
  • the drying unit 22 is a means for drying the material that has been washed twice using a drying block with a heater and a dryer for blowing hot air.
  • the drying unit 22 has a third transfer member 39 disposed to extend in the Y-axis direction, and a drying block 40 that fixes and seats the material and moves along the third transfer member 39. And a dryer 41 disposed above one side of the third transfer member 39 to inject hot air.
  • the drying block 40 may be applied to the heat coming out from the surface by embedding the heater, the material can be dried more effectively by the hot air and the hot air sprayed from the block side.
  • the drying unit 22 is provided with a third vision 31 for final inspection of the state of the material, for example, good materials (genuine) and rejected materials (defective).
  • the third vision 31 photographs the upper surface of the dried material with a vision camera to check whether the ball is well seen, and whether the diameter, pitch, etc. of the laser processing part are correct, and the like. ) Can be unloaded by dividing it into good and reject materials.
  • the offloader 14 is provided on the opposite side of the onloader 10.
  • the offloader 14 includes a plurality of cassette magazines in which a plurality of finished materials are stacked.
  • the offloader 14 is provided with a conveying means for conveying the cassette magazine, and the conveying means at this time may be applied in various ways, but preferably may be made of a belt drive.
  • the offloader 14 is also provided with a rail 34 and a pusher 33.
  • the pusher 33 serves to push one side of the material placed on the rail 34 into the empty cassette magazine.
  • the cassette magazine for unloading the material is preferably advanced in a layer structure.
  • an empty cassette magazine is disposed on the lower floor, and after unloading the material in an elevator form while proceeding by using a transfer means, the cassette magazine filled with the material may be discharged to the upper floor.
  • Reference numeral 42 denotes a reject sorting unit for recovering reject material.
  • the picker unit 15 is arranged at the top of each process in parallel along the X-axis direction to transfer the material for each process, the transfer for moving each picker belonging to the picker unit 15
  • the rail 43 is provided.
  • the picker unit 15 may be provided in plural, and in one embodiment of the present invention, three pickers 44, 45, and 46 are used.
  • pickers serve to pick up and drop materials between the onloader 10, the chuck table unit 11, the cleaning unit 13, and the offloader 14, and drop them to a corresponding process position.
  • the first picker 44 moves materials supplied from the onloader 10 to the chuck table 16 while traveling between the rail 34 of the onloader 10 and the chuck table unit 11.
  • the second picker 45 moves between the chuck table unit 11 and the cleaning unit 13 to transfer the processed material to the washing process
  • the third picker 46 is the cleaning unit. Moving between the 13 and the offloader 14 serves to transfer the material onto the rail for each cleaning process or unloading.
  • the first picker 44 moves between the rail 34 of the onloader 10 and the ultrasonic cleaner 20 of the chuck table unit 11 and the cleaning unit 11.
  • the second picker 45 is the cleaning unit 13 and the drying unit 22 It serves to transfer the finished material to the washing and drying process while moving between), and the third picker 46 moves between the drying unit 13 and the offloader 14 to remove the material for each unloading. It can also play a role in everyday life.
  • the picker unit 15 is provided with a vision unit 32, and the vision unit 32 at this time means a first vision 29 mounted on the first picker 44.
  • the first vision 29 is a part for recognizing the orientation of the material, that is, the specification or characteristics of the material, and the program in the system is converted by the vision information provided in the first vision 29, and the The entire system can be operated to specification.
  • 10 to 16 are schematic diagrams illustrating an operation process of a semiconductor package processing system according to an exemplary embodiment of the present inventive concept.
  • the pusher 33 is operated to move the material in the cassette magazine to the rail 34. As shown in FIG. 11, when the cassette magazine is located in the moving direction of the pusher 33, the pusher 33 is operated to move the material in the cassette magazine to the rail 34. As shown in FIG. 11, when the cassette magazine is located in the moving direction of the pusher 33, the pusher 33 is operated to move the material in the cassette magazine to the rail 34. As shown in FIG. 11, when the cassette magazine is located in the moving direction of the pusher 33, the pusher 33 is operated to move the material in the cassette magazine to the rail 34. As shown in FIG.
  • the gripper 35 grips the other side of the material and pulls it toward the rail 34.
  • the pusher 33 and the gripper 35 cooperate with each other to seat the material on the rail 34.
  • the first picker 44 moves along the transfer rail 43 to pick up the material seated on the rail 34. It is seated on each chuck table 16 in the first conveying member 17 in the second and fourth rows.
  • each chuck table 16 in the first conveying member 17 in the first and third rows can also be seated on each chuck table 16 in the first conveying member 17 in the first and third rows.
  • the first vision 29 is used to grasp information such as the specification and format of the material and transmit the information to the system control unit.
  • the system transition is made to the specification.
  • the chuck tables 16 in the second and fourth rows on which the materials are seated are Y along the first transfer member 17, respectively. It moves in the axial direction.
  • the chuck table 16 when the chuck table 16 is positioned at a predetermined position, that is, when the chuck table 16 moves in the Y-axis direction and is located below the movement path of the second vision 30,
  • the second vision 30 moves along the second conveying member 19 in the X-axis direction to obtain alignment information of the material seated on the chuck tables 15 in the second and fourth rows, and then lasers them. It transmits to the control part of the unit 12.
  • the movable block 47 moves in the X-axis direction to move the second and fourth rows of the chuck tables 16 in the X-axis direction so as to be coaxial with the laser processing machine 18.
  • the movable block 47 does not move but the chuck table 16 immediately moves along the first transfer member 17 in the Y-axis direction.
  • the laser drilling process for the material is performed by the laser processing machine 18 in accordance with the obtained alignment information.
  • the material is also supplied to the chuck tables 16 located in the first and third rows by the first picker 44. It is seated.
  • the alignment information for the materials in the first and third columns is then obtained in the same way as the materials in the second and fourth columns. That is, when the chuck table 16 of the first third row moves along the first conveying member 17 in the Y-axis direction and is located below the moving path of the second vision 30, the second vision 30 is formed. 2 moves along the transfer member 19 in the X-axis direction to obtain alignment information of the material seated on the chuck table 16 of the first third row.
  • the chuck tables 16 in the second and fourth rows are Y along the first transfer member 17. It moves in the axial direction and returns to the original position, and the chuck tables 16 in the first and third rows move the chuck tables 16 in the first and third rows as the movable block 47 moves in the X axis direction.
  • the laser processing machine 18 moves along the first conveying member 17 in the Y-axis direction and moves downward of the laser processing machine 18. Will move.
  • the materials on the chuck tables 16 of the first and third rows are processed by the laser processor 18 in the same manner as the materials of the second and fourth rows, that is, the previously obtained alignment information.
  • the chuck table 16 may move under the laser processing machine 18 to process the laser processing machine 18.
  • the machining may proceed by moving upwards of each chuck table 16.
  • the chuck table 16 on which the material on which the laser processing is completed is seated moves along the first conveying member 17 in the Y-axis direction and returns to its original position.
  • the second picker 45 moves along the feed rail 43 to the upper portion of the chuck table 16, and then continues.
  • the second picker 45 picks up the finished material and places it on the first table 24 of the ultrasonic cleaner 20, which is the first cleaning process of the cleaning unit 13.
  • the washing and drying processes for the material on which the laser processing is completed are all performed in three steps, and then sent to the offloader 14 side to be unloaded.
  • the material when the material is seated and fixed on the first table 24 of the ultrasonic cleaner 20 by the second picker 45, the material is fluidized by the extension of the cylinder 25 after the first table 24 is rotated.
  • the contaminants, such as foreign matters, which are located in the inside and are subsequently buried by the operation of the ultrasonic vibration source (not shown) can be cleanly removed.
  • the material on the first table 24 is the weaning nozzle cleaner 21 next to it by the third picker 46. ) Is moved onto the second table 27 of.
  • the material seated and fixed to the second table 27 of the weaning nozzle cleaner 21 is positioned inside the chamber 26 with the rotation of the second table 27 and is injected from the weaning nozzle 28. Fine droplets of gas and liquid are sprayed on the upper surface of the material so that the remaining contaminants of the material can be completely removed.
  • the drying block 40 moves in the Y-axis direction along the third member 39, and is positioned directly below the upper dryer 41, in this state.
  • the material on the drying block 40 is dried by heat emitted by the block itself and hot air received from the dryer 41.
  • the material on the drying block 40 is subjected to a good or reject determination, that is, a genuine or defective product through the vision inspection of the third vision 31.
  • the material is sent to the offloader 14, and when the material is determined to be defective, it is sent to the reject sorting unit 42.
  • the pusher 33 is on one side of the material. Is pushed toward the empty cassette magazine, the material is loaded one by one in the cassette magazine, and the cassette magazine filled with material is unloaded to complete the one-cycle process for processing semiconductor packages. Through the automated process, the whole system is operated.
  • FIG. 17 is a schematic diagram showing an overall layout of a semiconductor package processing system according to another embodiment of the present invention.
  • the embodiment of FIG. 17 differs in that the laser unit 12 which performs laser drilling on the material has two laser machines 18a and 18b arranged in the Y-axis direction when compared to the embodiment of FIG. It is.
  • the embodiment of Figure 1 is located on top of the first conveying member 17 of the second and fourth row (or first and third row), respectively, so that two laser machines (reference numeral 18 in FIG. 1) are arranged in each row.
  • the embodiment of Fig. 17 shows two laser machines 18a in the Y-axis direction (vertical direction in the drawing) of each column.
  • 18b) is arranged so that the laser processing machine is provided as a dual type in both directions of the X axis and the Y axis as a whole.
  • the laser processing machines are arranged in the second row and the fourth row, respectively, and the two laser processing machines are arranged in the Y-axis direction in each of the second and fourth rows, so that a total of four laser processors 18a and 18b are arranged. Is being used.
  • the two laser machines 18a and 18b arranged in the Y-axis direction in each row are responsible for processing one material seated on the chuck table 16 in the corresponding row, in which case the Y-axis for one material Two laser machines in the direction can perform the machining simultaneously (see FIG. 23).
  • the number of the laser processing machines 18a and 18b arranged in the Y-axis direction to allow simultaneous processing of one material may be two as in the preferred embodiment of FIG. 17, but the number may be changed as necessary. have.
  • the first picker 44 has two adsorption portions (refer to FIGS. 18 and 19, and reference numerals 44a and 44b) when compared with the embodiment of FIG. 1, and also for cleaning.
  • the first table 24 of the ultrasonic cleaner 20 to suck and fix the two materials seating portion (24a, 24b) is provided to be able to fix the two materials at the same time there is a difference in the configuration of the dual type .
  • the second table 27 of the weaning body nozzle washing machine 21 a table for seating and fixing the material on both the upper and lower surfaces is used (see FIG. 22), and two drying units 22 are adjacent to each other in the X-axis direction. It is provided so that two materials placed and washed can be dried simultaneously.
  • each drying unit 22 may be composed of a third transfer member 39, the drying block 40, as in the embodiment of FIG.
  • the drying block 40 like the first embodiment of Figure 1 it can be configured to include a dryer (41).
  • the third vision of the drying unit 22 also includes two visions, 2D vision 31a for inspecting two-dimensionally on the upper surface of the finished and dried material and 3D vision 31b for inspecting three-dimensionally. It is provided separately.
  • Both the 2D vision 31a and the 3D vision 31b are used to inspect the state of materials, for example, good materials (genuine) and rejected materials (defective products), and the diameter of the processing hole is used as the 2D vision 31a.
  • the diameter, ball size, ball pitch, offset, and residue of the solder ball are inspected, and the depth and flatness of the ball are examined with the 3D vision 31b.
  • the good and reject materials may be determined by comprehensively determining the inspection results of the 2D vision 31a and the 3D vision 31b, so that the good and reject materials may be removed from the offloader 14 as in the embodiment of FIG. 1. It can be unloaded separately.
  • a first picker 44 having two adsorption units is disposed between the onloader 10 and the chuck table unit 11, and the ultrasonic cleaner of the chuck table unit 11 and the cleaning unit 13 ( 20) material is moved between the second picker 45 and the second picker 45 in the cleaning unit 13 between the ultrasonic cleaner 20 and the baby body nozzle cleaner 21 and the baby body nozzle cleaner 21.
  • the material is moved between the drying unit 22 and the third picker 46 moves the material between the drying unit 22 and the offloader 14.
  • the moving range of the first picker 44 is expanded and the moving range of the second picker 45 is reduced.
  • the first picker 44 two materials are picked up from the onloader 10 to the two adsorption units, and then moved in the X-axis direction so that two columns (the second and fourth columns, or the first and third columns)
  • the material fixed to the two rows of chuck table 16 is returned to the on-loader 10 again during laser processing to pick up two new materials with two suction units.
  • the process of seating on the remaining two rows of chuck tables, and then picking up the two materials on the chuck table, the laser processing is completed and seated on the first table 24 of the ultrasonic cleaner 20 sequentially.
  • the ultrasonic washing machine 20 picks up the material, which has been cleaned one by one, from the first table 24 and seats it on the second table 27 of the weaning nozzle cleaner 21. After the process of picking up the material from the second table 27 one by one in the weaning body nozzle washer 21 and then seating on each drying block (40a, 40b) of the drying unit 22 of the dual type It will be repeated sequentially.
  • the dried material is picked up from each drying block 40a and 40b and then moved to the offloader 24.
  • 18 to 21 are schematic views illustrating an operation of the ultrasonic cleaner in the semiconductor package processing system according to the embodiment of FIG. 17.
  • the first picker 44 has two adsorption portions 44a and 44b, and each of the adsorption portions 44a and 44b provides one material 100.
  • the first table 24 can simultaneously adsorb, fix and wash the two materials 100 passed from the adsorption portions 44a and 44b of the first picker 44. It has two material seating parts (references 24a, 24b in FIG. 17).
  • the first picker 44 moves up and down to simultaneously seat the two materials 100 on each material seating portion of the first table 24.
  • FIG. 18 illustrates a state in which the first picker 44 descends in a state where two materials 100 are picked up
  • FIG. 19 illustrates that the first picker 44 simultaneously moves two materials 100 to the first table 24.
  • the first picker 44 rises as shown by the arrow and returns to the original position.
  • FIG. 20 shows a state in which the cylinder 25 and the first table 24 supported by the actuator 37 are rotated 180 degrees by the driving of the actuator 37.
  • the cylinder rod is moved forward (as shown in FIG. 21). Down), the material 100 enters into the fluid with the first table 24 and is cleaned.
  • FIG. 22 is a schematic diagram illustrating an operation process of the weaning body nozzle cleaner in the semiconductor package processing system according to the embodiment of FIG. 17, wherein two materials 100 transferred by the second picker after the cleaning process is completed in the ultrasonic cleaner. Is fixed to the second table 27 of the baby body nozzle washer.
  • the second table 27 of the weaning nozzle washer is installed to be rotatable in the chamber 26 is the same as the embodiment of Figure 1 (see Figures 6 to 9), but the material on both sides It is provided to be able to fix the (100).
  • the second table 27 is rotated to enter the chamber 26.
  • the weaning body is sprayed onto the material inside the chamber.
  • the material on the upper side of which the cleaning is completed while the weaning body is injected into the material 100 in the chamber 26 is picked up by the second picker and placed on the drying block 40a in which the heater of the drying unit 22 is embedded. It is seated and dried.
  • the drying block 40a moves along the third transfer member 39 in the Y-axis direction, and the state of the material, for example, good material (genuine), is moved by the third vision 31 above the movement path. Inspect for rejected materials.
  • the 2D vision 31a inspects the diameter of the processing hole, the solder ball diameter, the ball size, the ball pitch, the offset, the residue, and the like
  • the 3D vision 31b inspects the depth of the ball, the flatness, and the like.
  • the second material that has been washed is picked up by the second picker 45 and seated on the drying block 40b, and moved along the third transfer member 39 in the Y-axis direction as described above to move the material above the moving path.
  • the state of materials is inspected by the 3 vision (31). That is, the 2D vision 31a and the 3D vision 31b of the third vision move along the X axis along the fourth transfer member 49 to inspect the material state on the drying blocks 40a and 40b. Thereafter, the completed inspection and drying of the material is picked up by the third picker 46 and transferred to the offloader 14.
  • FIG. 23 is a side view showing a dual-type laser processing machine in the semiconductor package processing system according to the embodiment of FIG. 17, wherein the chuck table 16 is formed by two laser processors 18a and 18b arranged in the Y-axis direction, that is, the longitudinal direction. ) Shows a state that the material 100 fixed to the laser processing. Specifically, two laser heads are disposed in one oscillator in the longitudinal direction to simultaneously process one material. At this time, it is preferable that the lens used for the laser head is a telecentric lens due to the characteristics of the drilling equipment characterized by precise processing.
  • the processing speed per unit time may be increased. Since the washing machine 20, the weaning nozzle washing machine 21, and the drying unit 22 are configured in a dual type to perform work in a state in which two materials are fixed, the overall process processing speed may be improved.
  • ultrasonic cleaner 21 baby nozzle nozzle cleaner
  • drying block 41 hair dryer

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Semiconductor Lasers (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/KR2010/001069 2009-02-23 2010-02-22 반도체 패키지 가공시스템 WO2010095899A2 (ko)

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KR20090014669 2009-02-23

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KR102334138B1 (ko) * 2019-10-10 2021-12-01 한미반도체 주식회사 반도체 자재 절단 장치

Citations (4)

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KR20040092196A (ko) * 2003-04-25 2004-11-03 삼성전자주식회사 반도체 제조공정의 소잉장치
KR20050094519A (ko) * 2004-03-23 2005-09-28 삼성전자주식회사 반도체 칩 패키지 제조용 절단 장치의 척 테이블 유닛
JP2008033224A (ja) * 2006-02-24 2008-02-14 Kyocera Corp 電子写真感光体およびこれを備えた画像形成装置
JP2008033225A (ja) * 2006-02-24 2008-02-14 Kyocera Corp 画像形成装置

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US20060131268A1 (en) * 2004-12-21 2006-06-22 Lam Research Corp. Non-contact discrete removal of substrate surface contaminants/coatings, and method, apparatus, and system for implementing the same
US8398355B2 (en) * 2006-05-26 2013-03-19 Brooks Automation, Inc. Linearly distributed semiconductor workpiece processing tool
US7732728B2 (en) * 2007-01-17 2010-06-08 Lam Research Corporation Apparatuses for adjusting electrode gap in capacitively-coupled RF plasma reactor

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
KR20040092196A (ko) * 2003-04-25 2004-11-03 삼성전자주식회사 반도체 제조공정의 소잉장치
KR20050094519A (ko) * 2004-03-23 2005-09-28 삼성전자주식회사 반도체 칩 패키지 제조용 절단 장치의 척 테이블 유닛
JP2008033224A (ja) * 2006-02-24 2008-02-14 Kyocera Corp 電子写真感光体およびこれを備えた画像形成装置
JP2008033225A (ja) * 2006-02-24 2008-02-14 Kyocera Corp 画像形成装置

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TW201036094A (en) 2010-10-01
KR101228334B1 (ko) 2013-01-31
KR20100096009A (ko) 2010-09-01
TWI500097B (zh) 2015-09-11

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