WO2010095482A3 - 電子部品用基板、発光装置および電子部品用基板の製造方法 - Google Patents

電子部品用基板、発光装置および電子部品用基板の製造方法 Download PDF

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Publication number
WO2010095482A3
WO2010095482A3 PCT/JP2010/050498 JP2010050498W WO2010095482A3 WO 2010095482 A3 WO2010095482 A3 WO 2010095482A3 JP 2010050498 W JP2010050498 W JP 2010050498W WO 2010095482 A3 WO2010095482 A3 WO 2010095482A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electronic components
frame
light emitting
emitting device
Prior art date
Application number
PCT/JP2010/050498
Other languages
English (en)
French (fr)
Other versions
WO2010095482A2 (ja
Inventor
尾前　充弘
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP2011500546A priority Critical patent/JPWO2010095482A1/ja
Publication of WO2010095482A2 publication Critical patent/WO2010095482A2/ja
Publication of WO2010095482A3 publication Critical patent/WO2010095482A3/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

【課題】　放熱性を向上させることが可能な電子部品用基板を提供する。 【解決手段】　この電子部品用基板は、互いに電気的に絶縁されたフレーム部２ａおよび２ｂを有し、フレーム部２ａ上にＬＥＤ１が搭載される金属製のフレーム２と、そのフレーム２上に配置された反射枠３とを備えている。そして、フレーム部２ａが反射枠３に直接接触し、かつ、フレーム部２ｂが反射枠３に直接接触しないように、フレーム２および反射枠３が樹脂部材６によって互いに接着固定されている。
PCT/JP2010/050498 2009-02-20 2010-01-18 電子部品用基板、発光装置および電子部品用基板の製造方法 WO2010095482A2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011500546A JPWO2010095482A1 (ja) 2009-02-20 2010-01-18 電子部品用基板、発光装置および電子部品用基板の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009038296 2009-02-20
JP2009-038296 2009-02-20

Publications (2)

Publication Number Publication Date
WO2010095482A2 WO2010095482A2 (ja) 2010-08-26
WO2010095482A3 true WO2010095482A3 (ja) 2011-02-24

Family

ID=42634285

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/050498 WO2010095482A2 (ja) 2009-02-20 2010-01-18 電子部品用基板、発光装置および電子部品用基板の製造方法

Country Status (2)

Country Link
JP (1) JPWO2010095482A1 (ja)
WO (1) WO2010095482A2 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5546390B2 (ja) * 2010-08-27 2014-07-09 京セラ株式会社 発光素子搭載用基板およびその製造方法
KR102029802B1 (ko) * 2013-01-14 2019-10-08 엘지이노텍 주식회사 발광 소자 및 이를 구비한 조명 장치
JP2017157684A (ja) * 2016-03-02 2017-09-07 ローム株式会社 発光装置およびその製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0997928A (ja) * 1995-09-29 1997-04-08 Rohm Co Ltd Ｌｅｄ表示器、およびｌｅｄ表示器の反射ケース
JP2004214436A (ja) * 2003-01-06 2004-07-29 Sharp Corp 半導体発光装置およびその製造方法
JP2005039100A (ja) * 2003-07-16 2005-02-10 Matsushita Electric Works Ltd 高熱伝導性発光素子用回路部品及び高放熱モジュール
WO2006016398A1 (ja) * 2004-08-10 2006-02-16 Renesas Technology Corp. 発光装置および発光装置の製造方法
JP2006332618A (ja) * 2005-04-25 2006-12-07 Naoya Yanase 電子部品実装基板、及びその電子部品実装基板の製造方法
JP2007002096A (ja) * 2005-06-23 2007-01-11 Idemitsu Kosan Co Ltd 反射体用樹脂組成物及びそれからなる反射体
JP2008235867A (ja) * 2007-02-22 2008-10-02 Sharp Corp 表面実装型発光ダイオードおよびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0997928A (ja) * 1995-09-29 1997-04-08 Rohm Co Ltd Ｌｅｄ表示器、およびｌｅｄ表示器の反射ケース
JP2004214436A (ja) * 2003-01-06 2004-07-29 Sharp Corp 半導体発光装置およびその製造方法
JP2005039100A (ja) * 2003-07-16 2005-02-10 Matsushita Electric Works Ltd 高熱伝導性発光素子用回路部品及び高放熱モジュール
WO2006016398A1 (ja) * 2004-08-10 2006-02-16 Renesas Technology Corp. 発光装置および発光装置の製造方法
JP2006332618A (ja) * 2005-04-25 2006-12-07 Naoya Yanase 電子部品実装基板、及びその電子部品実装基板の製造方法
JP2007002096A (ja) * 2005-06-23 2007-01-11 Idemitsu Kosan Co Ltd 反射体用樹脂組成物及びそれからなる反射体
JP2008235867A (ja) * 2007-02-22 2008-10-02 Sharp Corp 表面実装型発光ダイオードおよびその製造方法

Also Published As

Publication number Publication date
JPWO2010095482A1 (ja) 2012-08-23
WO2010095482A2 (ja) 2010-08-26

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