WO2010074232A1

WO2010074232A1 - Wiring structure and micro relay comprising same

Info

Publication number: WO2010074232A1
Application number: PCT/JP2009/071596
Authority: WO
Inventors: 敦諏訪; 早崎　嘉城; 橋本　健; 浩司横山; 健雄白井; 西村　太; 雅和足立; 吉原　孝明; 徹馬場; 成正岩本; 隆司西條
Original assignee: パナソニック電工株式会社
Priority date: 2008-12-26
Filing date: 2009-12-25
Publication date: 2010-07-01

Abstract

Disclosed is a wiring structure for an MEMS device, which comprises a transmission line for transmitting a high frequency signal on the upper surface of a base. In the wiring structure, the base comprises, on the upper surface, an upper ground electrode which is electrically insulated from the transmission line; the upper ground electrode surrounds the transmission line; the base comprises a through interconnect that is arranged within a through hole formed in the base along the thickness direction; the through interconnect is electrically connected to the transmission line; the base comprises, on the lower surface, an external terminal that is electrically connected to the through interconnect, and a lower ground electrode that is electrically insulated from the external terminal; the lower ground electrode surrounds the external terminal; the base comprises a first shield which is formed along the thickness direction of the base and electrically insulated from the through interconnect; and the first shield is arranged in the base so as to surround the through interconnect.

Description

Wiring structure and microrelay having the same

The present invention relates to a wiring structure employed in a transmission line that transmits microwaves and the like. The present invention also relates to a microrelay having this wiring structure.

Conventionally, transmission lines that transmit microwaves and the like are known. Such a transmission line is disclosed in Japanese Laid-Open Patent Publication No. 10-173410 (hereinafter referred to as Patent Document 1). In Patent Document 1, a transmission line is provided on the upper surface of a dielectric substrate made of PTFE, and one end of the transmission line is electrically connected to one end of the transmission line via a connection through hole on the rear surface side of the dielectric substrate. Is provided. Furthermore, the first ground conductor is provided on the lower surface of the dielectric substrate, and the second ground conductor is provided on the lower surface of the dielectric substrate, thereby forming microstrip lines on the front and back surfaces of the dielectric substrate.

A plurality of grounding through holes whose upper ends are connected to the second grounding conductor are provided so as to surround the connecting through holes. Thereby, the transmission characteristic equivalent to a cylindrical dielectric line is obtained, and it is supposed that the impedance of the transmission line of a connection through hole can be stabilized.

However, the resonance phenomenon that occurs between the grounding through-holes cannot be suppressed only by arranging a plurality of grounding through-holes so as to surround the connecting through-holes. Specifically, the resonance phenomenon that occurs when the distance between the grounding through-holes becomes ¼ of the wavelength of the high-frequency wave transmitted through the connecting through-holes cannot be suppressed, and ripples are generated in the transmission characteristics of the transmission line. Will occur.

The present invention has been made in view of the above problems, and its object is to suppress the resonance phenomenon that occurs when the interval between the buried ground wirings is ¼ of the wavelength of the high frequency transmitted through the transmission line. It is to provide a wiring structure.

In order to solve the above problems, the wiring structure of the present invention is used in a MEMS device. This MEMS device includes a base and a transmission line provided on the base. The transmission line is provided for transmitting a high-frequency signal. The base has an upper surface ground electrode on its upper surface. The upper surface ground electrode is electrically insulated from the transmission line. The upper surface ground electrode is provided on the upper surface of the base so as to surround the periphery of the transmission line. The base is formed with a through hole along the thickness direction of the base. The base includes a through wiring, and this through wiring is disposed inside the through hole. The through wiring is electrically connected to the transmission line. The base has an external terminal and a lower surface ground electrode on its lower surface. The external terminal is electrically connected to the through wiring. The lower surface ground electrode is electrically insulated from the external terminal. The lower surface ground electrode is provided on the lower surface of the base so as to surround the external terminal. The base includes a first shield formed along the thickness direction of the base. The first shield is electrically insulated from the through wiring. The first shield is electrically connected to at least one of the upper surface ground electrode and the lower surface ground electrode.

In this case, the first shield is located around the through wiring. Therefore, the first shield forms a pseudo coaxial structure with respect to the through wiring. Therefore, the transmission loss of the high frequency signal transmitted through the through wiring can be reduced.

The base preferably has a plurality of first shields. The plurality of first shields are arranged along a circle surrounding the through wiring. Each first shield is separated from the adjacent first shield by a predetermined distance. The high frequency signal has a first signal having the highest frequency. The predetermined distance is set to a length less than ¼ of the wavelength of the first signal.

When the distance between the first shields is ¼ of the wavelength of the high frequency, a resonance phenomenon and a ripple due to this phenomenon occur. However, when the interval between the first shields is less than ¼ of the wavelength of the high frequency, this resonance phenomenon and ripple can be prevented.

The base preferably further has a second shield. The second shield is provided inside the base so as to overlap the transmission line in the thickness direction of the base. The upper end of the second shield is separated from the transmission line. Thereby, the second shield is electrically insulated from the transmission line. The lower end of the second shield is electrically connected to the lower surface ground electrode.

The base preferably further has a lead-out wiring on the lower surface. The lead-out wiring is electrically connected to the through wiring. The external terminal is electrically connected to the through wiring via the extraction wiring. The base further includes a third shield. The third shield overlaps with the extraction wiring in the thickness direction of the base. The lower end of the third shield is separated from the extraction wiring. Thereby, the third shield is electrically insulated from the extraction wiring. The upper end of the third shield is electrically connected to the upper surface ground electrode.

The first shield is preferably formed along a circle surrounding the through wiring.

The present invention further aims to reduce transmission loss of a high-frequency signal flowing through a transmission line.

In order to solve this problem, the base preferably includes a fourth shield formed so as to cover the lower part of the transmission line.

The base has a first hole and a second hole. Each of the first hole and the second hole penetrates in the thickness direction of the base. Each of the first hole and the second hole has a width along the width direction of the transmission line. The transmission line is located between the first hole and the second hole. The base further includes a first conductor, a second conductor, and a third conductor. The first conductor is provided in the first hole. The second conductive part is provided in the second hole. The third conductor is provided on the lower surface of the base so as to overlap the transmission line in the thickness direction of the base. The third conductor is electrically connected to each of the first conductor and the second conductor. The first conductor forms a fourth shield in cooperation with the second conductor and the third conductor. The widths of the lower ends of the first hole and the second hole are respectively larger than the widths of the upper ends of the first hole and the second hole.

In addition, each of the first hole and the second hole is preferably formed in a slit shape. And this slit-shaped 1st hole part and 2nd hole part are formed so that it may have the length along the length of a transmission line.

The base has a plurality of first holes and a plurality of second holes, and each of the first holes and the second holes is along the length direction of the transmission line. It is preferable that the predetermined intervals are arranged, and the predetermined intervals are less than ¼ of the wavelength of the signal having the highest frequency among the high frequencies.

Also, the base preferably has a plurality of first holes and a plurality of second holes. The first holes are arranged at predetermined intervals along the length direction of the transmission line. The second holes are also arranged at predetermined intervals along the length direction of the transmission line. The high frequency signal has a first signal. The predetermined distance is set to a length less than ¼ of the wavelength of the first signal.

In these cases, the fourth shield provided on the base is located below the transmission line. Therefore, a 4th shield prevents the transmission loss of the high frequency signal transmitted via a transmission line.

The upper surface ground electrode is preferably composed of a fourth conductor and a fifth conductor formed on the upper surface of the base. The fourth conductor is disposed so as to surround the transmission line in cooperation with the fifth conductor. The fourth conductor and the fifth conductor are electrically connected to the first conductor and the second conductor, respectively.

The MEMS device preferably further includes a functional part and a cover. The functional unit is provided on the base. The cover is provided on the functional unit. The functional unit has a fifth shield. The cover has a sixth shield. The fourth shield cooperates with the fifth shield and the sixth shield to surround the transmission line.

In this case, the fourth shield, the fifth shield, and the sixth shield surround the transmission line. Therefore, the fourth shield can prevent transmission loss of the high frequency signal passing through the transmission line in cooperation with the fifth shield and the sixth shield.

The functional unit is preferably joined to the base by the upper surface ground electrode.

It is preferable that a hole is formed on the upper surface of the base, and all of the transmission lines are disposed at the bottom of the hole.

It is preferable that the width of the first hole and the second hole increase stepwise from the upper surface to the lower surface of the base.

The functional unit preferably has a frame. Thereby, a function part has opening. The transmission line is arranged so as to be located inside the frame. The cover has a lower surface region facing the transmission line through the opening. The frame has a first edge and a second edge extending along the length direction of the transmission line.

The frame is preferably provided with a sixth conductor on the first edge. The frame is provided with a seventh conductor on the second edge. The sixth conductor defines the fifth shield in cooperation with the seventh conductor. The sixth conductor and the seventh conductor are electrically connected to the first conductor and the second conductor, respectively. The cover is provided with an eighth conductor in the lower surface region. The eighth conductor defines the sixth shield. The eighth conductor is electrically connected to both the sixth conductor and the seventh conductor.

It is preferable that each of the first edge and the second edge is formed with a slogan formed so as to penetrate along the thickness direction of the frame. The sixth conductor is provided in the connection hole on the first edge. The seventh conductor is provided in the connection hole on the second edge.

It is preferable that a connection slit is formed in each of the first edge and the second edge. This connection slit is formed penetrating along the thickness direction of the frame. The connection slit has a length along the length direction of the transmission line. The sixth conductor is provided inside the connection slit on the first edge. The seventh conductor is provided inside the connection slit on the second edge.

In this case, the sixth conductor and the seventh conductor can be arranged on the frame.

On the other hand, it is also preferable that the MEMS device has a functional unit provided on the base. In this case, the function unit is provided with a fifth shield. The fifth shield has a length along the length direction of the transmission line. The fourth shield cooperates with the fifth shield to surround the transmission line.

The functional part preferably has a first recess having a length along the length direction of the transmission line on the lower surface. The length of the first recess is larger than the length of the transmission line. The first recess has a first inner surface and a second inner surface formed along the length direction of the transmission line, and a bottom surface. The functional unit is provided with a sixth conductor on the first inner surface. The functional part is provided with a seventh conductor on the second inner surface. The functional part is provided with an eighth conductor on the bottom surface. The sixth conductor, the seventh conductor, and the eighth conductor cooperate with each other to define the fifth shield. The sixth conductor and the seventh conductor are electrically connected to the first conductor and the second conductor, respectively. The eighth conductor is electrically connected to the sixth conductor and the seventh conductor.

It is preferable that the functional part further has a second recess. The second recess is formed at the bottom of the first recess. The second recess is located at a position facing the transmission line.

The base preferably has a recess formed on the upper surface thereof. The base preferably has a support. The support is disposed on the base so as to overlap the recess. The recess has a width larger than the width of the transmission line. The transmission line is disposed on the support. The first hole and the second hole are formed so as to penetrate from the bottom surface of the recess to the bottom surface of the base. The recess has a first inner surface and a second inner surface formed along the length direction of the transmission line. The base has a ninth conductor on the first inner surface. The base has a tenth conductor on the second inner surface. The ninth conductor is electrically connected to the first conductor and the sixth conductor. The tenth conductor is electrically connected to the second conductor and the seventh conductor.

In this case, the arrangement of the fourth shield, the fifth shield, the sixth shield and the transmission line can be made closer to the coaxial cable.

The support preferably includes a frame portion and a crossbar. The frame portion has a length along the length direction of the transmission line. The cross bar is separated from both edges in the width direction of the frame. The cross bar is connected to both edges in the length direction of the frame portion. Thereby, the opening window is formed in the both sides of the crossbar. The transmission line is arranged along the crossbar.

On the other hand, it is also preferable that the base has a groove formed on its upper surface. This groove is provided on each side of the transmission line. The groove is formed along the length direction of the transmission line. The groove has a first inner surface, a second inner surface, and a bottom surface. Each of the first inner surface, the second inner surface, and the bottom surface is formed along the length direction of the transmission line. The second inner surface is located farther from the transmission line than the first inner surface. The base is provided with a first conductive portion on the second inner surface. The base is provided with a second conductive portion on the bottom surface. The first conductive part and the second conductive part define a fourth shield.

The functional unit preferably has a frame. Thereby, the functional part has an opening. And the transmission line is arrange | positioned so that it may be located inside a flame | frame. The cover has a lower surface region facing the transmission line through the opening. The cover is provided with a third conductive portion in the lower surface region. The third conductive part defines a sixth shield. The frame has a first edge and a second edge extending along the length direction of the transmission line. The frame is provided with a fourth conductive portion at the first edge. The frame is provided with a fifth conductive portion at the second edge. The fourth conductive part and the fifth conductive part define a fifth shield. The fourth conductive part is electrically connected to the first conductive part and the third conductive part. The fifth conductive part is electrically connected to the second conductive part and the third conductive part.

It is preferable that the base further has a sixth conductive part. The sixth conductive part is disposed inside the base so as to be electrically connected to the first conductive part and the second conductive part.

The base preferably has a recess formed on its upper surface. The base further includes a support body arranged to overlap the recess. The recess is provided with a conductive portion on its inner surface. The recess has a width larger than the width of the transmission line. The transmission line is disposed on the support.

The support preferably has a frame portion and a crossbar. The frame portion has a length along the length direction of the transmission line. The cross bar is separated from both edges in the width direction of the frame portion. The crossbar is connected to both edges in the length direction of the frame. Thereby, a support body has an opening window and this opening window is located in the both sides of a cross bar. The transmission line is arranged along the crossbar.

It is preferable that each opening window has a shape along the length direction of the transmission line.

It is preferable that a plurality of holes penetrating in the thickness direction of the frame are formed in each of the first edge and the second edge. The plurality of holes are arranged along the length direction of the transmission line. The fourth conductive portion is provided in the plurality of holes on the first edge. The fifth conductive portion is provided in the plurality of holes on the second edge.

Further, it is preferable that a connection slit is formed in each of the first edge and the second edge. This connection slit is formed penetrating along the thickness direction of the frame. The connection slit has a length along the length direction of the transmission line. The fourth conductive portion is provided inside the connection slit on the first edge. The fifth conductive portion is provided inside the connection slit on the second edge.

And such a wiring structure is adopted for a micro relay. The micro relay includes the base, the functional unit, and the cover, the micro relay includes an electromagnet device, and the base includes a pair of transmission lines and a pair of fixed contacts. The pair of fixed contacts are electrically connected to each of the pair of transmission lines, and the functional unit further includes an armature, and the armature includes a movable plate, a magnetic plate, and a movable contact. The magnetic plate is attached to the movable plate, the movable contact is disposed on the movable plate so as to face the pair of fixed contacts, and the armature is configured to be the movable plate. Is arranged inside the frame so as to be movable between a first position and a second position, and when the movable plate is located at the first position, the movable contact is both fixed contacts. When the movable plate contacts and the blade is located at the second position, the movable contact of the blade is separated from both of the fixed contacts, and the electromagnet device is provided on the cover, and supplies current to the coil and the coil. A pair of coil terminals for supplying the coil, and the coil generates a magnetic field for moving the magnetic plate when current is supplied through the coil terminal. Move to the first position or the second position.

FIG. 1 is a perspective view showing an external appearance of a microrelay in which the transmission lines described in Embodiments 1-1 to 3-6 of the present invention are employed. FIG. 2 is an exploded perspective view of the micro relay. FIG. 3A is a schematic top view of the transmission line according to Embodiment 1-1. This transmission line is employed in a portion surrounded by dotted lines G1 and G2 in FIG. FIG. 3B is a bottom view of the embodiment 1-1. FIG. 4A is a perspective view showing the arrangement of one end of the signal wiring 10, the through wiring 12, and the first shields 15a to 15g. FIG. 4B is a cross-sectional view taken along the line AA in FIG. FIG. 5A is a top view showing a configuration of a transmission line according to the embodiment 1-2 of the present invention, which is applied to a portion surrounded by dotted lines G1 and G2 in FIG. FIG. 5B is a bottom view thereof. FIG. 6A is a perspective view showing the arrangement of the through wiring 12 and the embedded ground wirings 15a to 15c and 15e to 15g at one end of the signal wiring 10. FIG. FIG. 6B is a cross-sectional view taken along line BB in FIG. FIG. 7A is a top view showing a configuration of a transmission line according to Embodiment 1-3 of the present invention, which is applied to a portion surrounded by dotted lines G1 and G2 in FIG. FIG. 7B is a bottom view thereof. FIG. 7C is a perspective view showing the arrangement of the through wiring 12 and the embedded ground wiring 17 at one end of the signal wiring 10. FIG. 8A is a top view showing a configuration of a transmission line according to a modification of Embodiment 1-1 of the present invention, which is applied to a portion surrounded by dotted lines G1 and G2 in FIG. FIG. 8B is a bottom view thereof. FIG. 8C is a cross-sectional view along the CD line in FIG. FIG. 9A is a plan view showing the wiring structure of the embodiment 2-1. FIG. 9B is a cross-sectional view taken along the line AA in FIG. FIG. 9C is a cross-sectional view taken along line BB in FIG. FIG. 9D is a cross-sectional view taken along the line CC of FIG. 9A. FIG. 10A is a plan view showing a modification of the wiring structure of the embodiment 2-1. FIG. 10B is a cross-sectional view taken along the line AA in FIG. FIG. 10C is a cross-sectional view taken along line BB in FIG. FIG. 10D is a cross-sectional view taken along the line CC of FIG. FIG. 11A is a plan view showing the wiring structure of the embodiment 2-2. FIG. 11B is a cross-sectional view taken along the line AA in FIG. FIG. 11C is a cross-sectional view taken along the line BB in FIG. FIG. 11D is a cross-sectional view taken along the line CC of FIG. FIG. 12A is a plan view showing the wiring structure of the embodiment 2-3. FIG. 12B is a cross-sectional view taken along the line AA in FIG. FIG. 12C is a cross-sectional view taken along the line BB in FIG. FIG. 12D is a cross-sectional view taken along the line CC of FIG. FIG. 13 is a plan view showing the wiring structure of the embodiment 2-4. FIG. 13B is a cross-sectional view taken along the line AA in FIG. FIG. 13C is a sectional view taken along line BB in FIG. FIG. 13D is a cross-sectional view taken along the line CC of FIG. FIG. 14A is a plan view showing the wiring structure of the embodiment 2-5. FIG. 14B is a cross-sectional view taken along the line AA in FIG. FIG. 14C is a cross-sectional view taken along line BB in FIG. FIG. 14D is a cross-sectional view taken along the line CC of FIG. FIG. 15A is a plan view showing a modification of the wiring structure of the embodiment 2-5. FIG. 15B is a cross-sectional view taken along the line AA in FIG. FIG. 16A is a plan view showing the arrangement of the base, the support, and the signal wiring in Embodiment 2-6. FIG. 16B is a cross-sectional view taken along the line AA in FIG. FIG. 17A is a plan view showing a modified example of the arrangement of the base, the support, and the signal wiring in the embodiment 2-6. FIG. 17B is a plan view showing still another modified example of the arrangement of the base, the support, and the signal wiring in the embodiment 2-6. FIG. 18A is a plan view showing the wiring structure of the embodiment 2-7. FIG. 18B is a cross-sectional view taken along the line AA in FIG. FIG. 18C is a cross-sectional view taken along the line BB in FIG. FIG. 18D is a cross-sectional view taken along the line CC of FIG. FIG. 19A is a cross-sectional view showing a wiring structure according to Embodiment 2-8. This sectional view is along a plane orthogonal to the width direction of the signal wiring. FIG. 19B is a cross-sectional view showing the wiring structure of the embodiment 2-8. This sectional view is along a plane orthogonal to the length direction of the signal wiring. FIG. 20A is a cross-sectional view showing a modification of the wiring structure of the embodiment 2-8. This sectional view is along a plane orthogonal to the width direction of the signal wiring. FIG. 20B is a cross-sectional view showing a modification of the wiring structure of the embodiment 2-8. This sectional view is along a plane orthogonal to the length direction of the signal wiring. FIG. 21 is a cross-sectional view of a wiring structure according to Embodiment 2-9. This sectional view is along a plane orthogonal to the width direction of the signal wiring. 3A shows a wiring structure of Embodiment 3-1, (a) is a plan view, (b) is a cross-sectional view taken along line AA in FIG. (A), and (c) is a cross-sectional view along line BB in FIG. FIG. It is sectional drawing of the wiring structure of Embodiment 3-2. The wiring structure of Embodiment 3-3 is shown, (a) is a plan view, (b) is a cross-sectional view taken along line AA in FIG. (A), and (c) is a cross-sectional view along line BB in FIG. FIG. The main part of the wiring structure of Embodiment 3-4 is shown, (a) is a plan view, and (b) is a cross-sectional view taken along line AA in FIG. The principal part of the wiring structure of the other example of Embodiment 3-4 is shown, (a) is a top view, (b) is the AA arrow directional cross-sectional view of the same figure (a). The main part of the wiring structure of still another example of Embodiment 3-4 is shown, (a) is a plan view, and (b) is a cross-sectional view taken along line AA in FIG. The wiring structure of Embodiment 3-5 is shown, (a) is a plan view, (b) is a cross-sectional view taken along line AA in FIG. (A), and (c) is a cross-sectional view along line BB in FIG. FIG. FIG. 6 shows a wiring structure of Embodiment 3-6, where (a) is a plan view, (b) is a cross-sectional view taken along line AA in FIG. FIG.

Embodiments of the present invention will be described below with reference to the drawings. In the description of the drawings, the same parts are denoted by the same reference numerals.

Embodiment 1-1
First, with reference to FIG.1 and FIG.2, the structure of a micro relay is demonstrated as an example of the MEMS structure which has the wiring structure employ | adopted as the transmission line of this embodiment. The micro relay according to the present embodiment is a MEMS relay that handles a high-frequency electric signal and has a micro drive mechanism that is manufactured using a semiconductor process, and further includes a normally open contact and a normally closed contact. It is a latching type relay. As shown in FIG. 2, the width direction of the micro relay is defined by the x direction. Similarly, the length direction of the micro relay is defined by the y direction. The height direction of the micro relay is defined by the z direction.

As shown in FIG. 1, the micro relay includes a base 20, a functional unit 30, a cover 40, and a drive device 50 having an electromagnet device 51. FIG. 2 illustrates each configuration of the base 20, the functional unit 30, the cover 40, and the driving device 50 in a state where they are separated in the stacking direction (z direction). The transmission line according to Embodiment 1-1 of the present invention is used in a part of the base 20, for example, a part surrounded by dotted lines G1 and G2.

As shown in FIG. 2, the base 20 includes a signal wiring 10 disposed on the upper surface thereof. This signal wiring 10 is a so-called transmission line. The signal wiring 10 is provided for transmitting a high frequency signal. The signal wirings 10 are arranged in pairs at both ends in the longitudinal direction of the base 20. The length direction of each signal wiring 10 coincides with the width direction (x direction) of the base 20, and the pair of signal wirings 10 are arranged side by side in the length direction.

A plurality of fixed contacts 26 that are electrically connected to the signal wiring 10 are formed on the upper surface of the base 20. Each fixed contact 26 is connected to an end portion of each signal wiring 10 located at the center in the width direction of the base 20. That is, the signal wiring 10 has a first end located at one end in the width direction of the base 20 and a second end located on the opposite side to the first end. Each fixed contact 26 is provided at the second end.

The fixed contact 26 is a metal thin film made of a metal material having good conductivity such as copper (Cu) or gold (Au). Such a fixed contact 26 can be formed using a sputtering method, an electroplating method, a vacuum deposition method, or the like. The fixed contact 26 is not limited to a single layer structure, and may be a multilayer structure including, for example, an Au layer and a Ti layer interposed between the Au layer and the base 20.

The functional unit 30 mainly includes an armature 32 and a frame 33 surrounding the armature 32.

As shown in FIG. 2, the frame 33 is formed in a rectangular frame shape. The length direction and width direction of the base 20 are equal to the length direction and width direction of the frame 33, respectively. At both ends of the frame 33 in the length direction, there are first openings 31 for positioning the signal wiring 10 inside the frame 33. In other words, the signal wiring 10 is disposed so as to be positioned inside the frame 33, and thereby the signal wiring 10 is positioned in the first opening 31. The signal wiring 10 faces the cover 40 through the first opening 31. Further, a second opening 34 for arranging the armature 32 inside the frame 33 is formed at the center of the frame 33. Each of the first openings 31 and the second openings 34 are in communication with each other at the center in the width direction of the frame 33. The frame 33 has inner peripheral surfaces located at both ends in the width direction, and includes a regulation protrusion 330 protruding from the inner peripheral surface in the width direction of the frame. Each regulation protrusion 330 is located between the first opening 31 and the second opening 34. That is, the first opening 31 is delimited by the second opening 32 and the regulation protrusion 330. The outer size of the frame 33 is equal to the outer size of the base 20. Further, the signal wiring 10 is disposed so as to be positioned inside the frame 33, and thus the signal wiring 10 is positioned in the first opening 31. The signal wiring 10 faces the cover 40 through the first opening 31.

Therefore, the frame 33 has the first edge 331, the second edge 332, the third edge 333, and the fourth edge 334. The first edge 331, the second edge 332, the third edge 333, and the fourth edge 334 cooperate with each other to form the first opening 31. The first edge 331 is defined by the edge of the frame located at one end in the length direction of the frame 33. That is, the frame 33 has a first edge 331 formed along the length direction of the transmission line. The second edge 332 is defined by a pair of restricting protrusions 330. That is, the frame 33 has a second edge 332 formed along the length direction of the transmission line. The second edge 332 is located on the opposite side of the first edge 331. The third edge 333 is defined by the edge of the frame located at one end in the width direction of the frame 33. The fourth edge 334 is defined by the edge of the frame located at one end in the width direction of the frame and is located on the opposite side to the third edge 333.

The armature 32 has a movable plate 3, a magnetic plate 60, and a movable contact. The movable plate 3 includes a main body 320 disposed in the second opening 34 of the frame 33 and contact protrusions 321 respectively disposed in the first opening 31 of the frame 33. The main body 320 is formed in a rectangular plate shape. The longitudinal direction of the main body 320 and the longitudinal direction of the frame 33 substantially coincide with each other. A contact protrusion 321 protruding in the longitudinal direction of the armature 32 is provided at the center of each of both ends in the longitudinal direction of the main body 320. The tip of the contact protrusion 321 is disposed in the first opening 31. A movable contact (not shown) is provided on the lower surface of the contact protrusion 321. When the movable contact simultaneously contacts each of the pair of fixed contacts 26, the movable contact short-circuits between the pair of fixed contacts 26. On the other hand, a fulcrum protrusion 323 that protrudes in the width direction of the main body 320 protrudes from the center of each of both ends in the width direction of the main body 320. A fulcrum protrusion 324 is provided on the upper surface of the fulcrum protrusion 323. The fulcrum protrusion 324 is used as a fulcrum for the swinging motion (seesaw motion) of the armature 32. Therefore, the armature is disposed inside the frame so that the movable plate can move between the first position and the second position. When the movable plate is positioned at the first position, the fixed contact provided at the left end contacts the movable contact. When the movable plate is located at the second position, the fixed contact provided at the left end is separated from the movable contact.

The armature 32 is integrally connected to the frame 33 by a plurality of support pieces 35. In the present embodiment, the armature 32 is integrally connected to the frame 33 by four support pieces 35. Each support piece 35 integrally connects the inner side surface in the longitudinal direction of the second opening 34 of the frame 33 and the outer side surface in the width direction of the main body 320. The four support pieces 35 are arranged at positions that are point-symmetric with respect to the center of the main body 320.

The support piece 35 has a curved shape that advances while meandering in a direction along the longitudinal direction of the main body 320 in a plane orthogonal to the height direction. As a result, the armature 32 is swingably supported with respect to the frame 33. By forming the support piece 35 in a meandering shape, the length of the support piece 35 can be increased. Therefore, the spring constant of the spring force generated when the support piece 35 is twisted when the armature 32 swings can be appropriately reduced, and the stress applied to the support piece 35 can also be dispersed.

The armature 32, the frame 33, and the support piece 35 are made of, for example, a semiconductor substrate having a thickness of about 50 μm to 300 μm, preferably about 200 μm (for example, a silicon substrate or an SOI substrate), a semiconductor microfabrication technique such as a photolithography technique and an etching technique It can form by patterning using.

A magnetic plate 60 is provided on the upper surface of the main body 320. The magnetic plate 60 is made of, for example, a magnetic material such as electromagnetic soft iron, electromagnetic stainless steel, and permalloy machined into a rectangular plate shape, and is joined to the main body 320 by a method such as adhesion, welding, heat fitting, or brazing. The The magnetic plate 60 is used for swinging the armature 32 by a magnetic field generated by the electromagnet device 51 of the driving device 50. On the other hand, a reciprocal (residual) 70 is provided on the lower surface of the armature 32. The sequential 70 is used to set the distance between the armature 32 and the base 20 to a suitable distance.

The functional unit 30 is joined to the base 20 in a state in which the movable contact and the pair of fixed contacts 26 are aligned so as to face each other. Thereby, the functional unit 30 is attached to the upper surface of the base 20. When the movable plate is located at the first position, the movable contact contacts both of the fixed contacts. When the movable plate is located at the second position, the movable contact is separated from both fixed contacts. In joining the frame 33 to the base 20, a joining metal layer (not shown) can be used. The metal layer can be used as a ground.

The cover 40 is made of an insulating material (for example, glass). The outer size of the cover 40 is equal to the outer size of the base 20. An opening 41 that penetrates the cover 40 in the thickness direction (z direction) is formed at the center of the cover 40. The closing plate 42 is tightly bonded to the lower surface of the cover 40 and closes the entire opening 41. Therefore, a space surrounded by the inner peripheral surface of the opening 41 and the closing plate 42 constitutes a storage chamber of the driving device 50. The closing plate 42 is made of, for example, a thin plate such as a silicon plate or a glass plate having a thickness of about 5 to 50 μm, preferably about 20 μm. The cover 40 is joined to the upper surface of the frame 33. In joining the cover 40 to the frame 33, a joining metal layer (not shown) can be used. The metal layer can be used as a high-frequency shield layer. However, a nonmagnetic material is used as the material of the metal layer so as not to block the magnetic field of the driving device 50.

The driving device 50 includes an electromagnet device 51 that generates a magnetic field for attracting the magnetic plate 60 and a permanent magnet 52 for latching the armature 32. The electromagnet device 51 mainly includes a yoke 53 and a pair of coils 54. The yoke 53 is integrally provided with a long rectangular plate-shaped main piece 530 and rectangular plate-shaped leg pieces 531 projecting from both ends in the longitudinal direction of the lower surface of the main piece 530. Such a yoke 53 is formed by bending or forging an iron plate such as electromagnetic soft iron. The permanent magnet 52 is formed in a rectangular parallelepiped shape, and is magnetized so that the upper surface and the lower surface have different polarities. The permanent magnet 52 is attached to the yoke 53 such that the lower surface thereof is in contact with the longitudinal central portion of the upper surface of the main piece 530 of the yoke 53. Each coil 54 is wound around each portion of the main piece 530 between each leg piece 531 and the permanent magnet 52. The drive device 50 is provided with a pair of coil terminals 55. By applying a voltage between the pair of coil terminals 55, a current flows through each coil 54. When a current flows through the coil 54, the coil generates a magnetic field. This magnetic field moves the magnetic plate 60. Since the magnetic plate 60 is fixed to the movable plate, the movable plate also moves between the first position and the second position as the magnetic plate 60 moves. Such a driving device 50 is stored in the storage chamber of the cover 40.

In the micro relay shown in FIGS. 1 and 2, a drive electrode (not shown) for energizing the coil 54 is formed on the lower surface of the base 20. A wiring pattern 43 to which the coil terminal 55 is connected is formed on the upper surface of the cover 40. Here, the drive electrode and the wiring pattern 43 described above are a through via 27 that penetrates the base 20 in the stacking direction, a through via 36 that penetrates the frame 33 in the thickness direction, and a through via that penetrates the cover 40 in the thickness direction. 44 and are electrically connected.

Although not shown in FIGS. 1 and 2, the end portion of the signal wiring 10 that is located at one end in the width direction of the base 20 is connected through the through wiring 12 provided inside the hole that penetrates the base 20. The back surface extraction electrode disposed on the lower surface of the base 20 is electrically connected. The transmission line according to this embodiment is applied to a portion surrounded by dotted lines G1 and G2 in FIG. 2 including the signal wiring 10, the through wiring 12, and the back surface extraction electrode.

Next, with reference to FIG. 3 and FIG. 4, the configuration of the transmission line according to this embodiment applied to the portion surrounded by the dotted lines G1 and G2 in the base 20 shown in FIG. In FIG. 3 and the like, the signal wiring is shown as one signal wire for the sake of simplicity. Such a signal wiring is divided into two at the center in the length direction of the signal wiring 10 in a micro relay or the like.

3A is a plan view showing an upper surface of a portion surrounded by dotted lines G1 and G2 in the base 20 shown in FIG. 2, and FIG. 3B is a plan view showing a lower surface.

The transmission line of this embodiment is an electric wire used for a micro relay as an example of a MEMS structure. This micro relay includes a base 20, a signal wiring 10, an upper surface ground electrode 16, a through wiring 12, a lower surface ground electrode 14, and embedded

ground wirings

15a, 15b, 15c, 15d, 15e, 15f, and 15g. Have. The base 20 has an upper surface and a lower surface and is made of a dielectric. The signal wiring 10 is provided for transmitting a high frequency signal. This high frequency signal has a first signal having the highest frequency. The upper surface ground electrode 16 is disposed on the upper surface of the base 20 and is electrically insulated from the signal wiring 10. The through wiring 12 penetrates from the upper surface to the lower surface of the base 20 and is electrically connected to the signal wiring 10. The lower surface ground electrode 14 is disposed on the lower surface of the base 20 and is electrically insulated from the through wiring 12. The plurality of embedded ground wirings 15 a, 15 b, 15 c, 15 d, 15 e, 15 f, and 15 g are embedded along the circle that is embedded in the base 20 and surrounds the periphery of the through wiring 12. These embedded

ground wirings

15a, 15b, 15c, 15d, 15e, 15f, and 15g each constitute a first shield. Accordingly, the base 20 has a plurality of first shields. The first shield is disposed in the base 20 so as to surround the through wiring 12. Each embedded

ground wiring

15 a, 15 b, 15 c, 15 d, 15 e, 15 f, 15 g is formed along the thickness direction of the base 20. Each of the embedded ground wirings 15a to 15g is electrically connected to at least one of the upper surface ground electrode 16 and the lower surface ground electrode. The plurality of buried ground wirings 15a to 15g are arranged at a predetermined distance from the neighboring buried ground wiring. The predetermined distance is set to a distance less than ¼ of the wavelength of the high frequency transmitted through the signal wiring 10. More specifically, the predetermined distance is less than ¼ of the wavelength of the first signal. The base 20 has a through hole 22 that penetrates in the thickness direction. The through wiring 12 is disposed inside the through hole 22.

The upper surface ground electrode 16 is disposed on the upper surface of the base 20 so as to surround the signal wiring 10, and a predetermined gap is formed between the upper surface ground electrode 16 and the signal wiring 10. The predetermined gap is constant along the longitudinal direction of the signal wiring 10, and the base 20 is exposed in the predetermined gap. Therefore, the upper surface ground electrode 16 is electrically insulated from the transmission line. The upper surface ground electrode 16 is electrically connected to the ground (earth).

As shown in FIG. 3B, an external terminal 13 is disposed on the lower surface of the base 20. The external terminal 13 is disposed so as to be electrically connected to the through wiring 12 in FIG. The lower surface ground electrode 14 is disposed on the lower surface of the base 20 so as to surround the external terminal 13, and a predetermined gap is formed between the lower surface ground electrode 14 and the external terminal 13. The base 20 is exposed in the predetermined gap. Therefore, the external terminal 13 is electrically insulated from the lower surface ground electrode 14.

In this embodiment, each of the embedded ground wirings 15a to 15g is electrically connected to both the upper surface ground electrode 16 and the lower surface ground electrode.

Next, the arrangement of the through wiring 12 and the embedded ground wirings 15a to 15g at one end of the signal wiring 10 will be described with reference to FIG. FIG. 4A shows only wirings and electrodes except for the base 20.

The through wiring 12 penetrates from the upper surface to the lower surface of the base 20, and the upper end and the lower end of the through wiring 12 are electrically connected to the signal wiring 10 and the external terminal 13, respectively. The plurality of embedded ground wirings 15 a to 15 g penetrate from the upper surface to the lower surface of the base 20, and are arranged in an arc shape and at equal intervals around the through wiring 12 except for the signal wiring 10. . The reason for excluding the portion of the signal wiring 10 is that if the embedded ground wiring penetrating from the upper surface to the lower surface of the base 20 is disposed in the portion where the signal wiring 10 is disposed, the embedded ground wiring is formed on the surface of the base 20. This is because they are in contact with the signal wiring 10.

The embedded ground wirings 15a to 15g and the through wiring 12 have a cylindrical shape. The distances between the centers of the embedded ground wirings 15a to 15g and the center of the through wiring 12 are equal, and the embedded ground wirings 15a to 15g are arranged on one arc centering on the through wiring 12. The distances between the buried ground wirings 15a to 15g are equal and less than ¼ of the wavelength of the high frequency transmitted through the signal wiring 10. Here, a case where seven embedded ground wirings 15 a to 15 g are arranged at one end of the signal wiring 10 is shown, but the interval between the embedded ground wirings 15 a to 15 g is ¼ of the wavelength of the high frequency transmitted through the signal wiring 10. If it is less, the number of buried ground wirings 15a to 15g may be increased or decreased.

For example, when designing a transmission line that transmits a high frequency of 40 GHz, the interval between the embedded ground wirings 15a to 15g is designed to be 1/4 of the high frequency wavelength of 50 GHz, so that 1 / of the high frequency wavelength of 40 GHz is obtained. The buried ground wirings 15a to 15g can be arranged at intervals of less than 4. Hereinafter, the interval less than ¼ will be described more specifically. When the first signal flowing through the signal wiring 10 is 40 GHz, ¼ of the wavelength of the first signal corresponds to 1.875 mm. Therefore, it is preferable that the interval between the buried ground wirings 15a to 15g is 1.5 mm or less.

Further, the characteristic impedance of the transmission line can be arbitrarily designed by adjusting the diameter of the through wiring 12 and the distance between the through wiring 12 and the embedded ground wirings 15a to 15g.

Further, as shown in FIG. 4B, the upper end and the lower end of the embedded ground wiring 15d are electrically connected to the upper surface ground electrode 16 and the lower surface ground electrode 14, respectively. The upper end and the lower end of the through wiring 12 are electrically connected to the signal wiring 10 and the external terminal 13, respectively. The base 20 is exposed between the signal wiring 10 and the upper surface ground electrode 16 and between the external terminal 13 and the lower surface ground electrode 14. By adjusting the distance between the signal wiring 10 and the upper surface ground electrode 16 and the distance between the external terminal 13 and the lower surface ground electrode 14, the characteristic impedance of the transmission line can be arbitrarily designed. Although not shown, the embedded ground wirings 15a to 15c and 15e to 15g have the same cross-sectional structure as the embedded ground wiring 15d.

Next, an example of a method for manufacturing the transmission line shown in FIGS. 3 and 4 will be described. Through holes for the through wiring 12 and the buried ground wirings 15a to 15g are formed in the base 20 by blasting or the like. Then, a metal film such as gold (Au) or copper (Cu) is formed on the back surface of the base 20 by plating. At this time, the metal is filled in the above-described through hole. Thereafter, using the photolithography technique and the etching technique, the lower surface ground electrode 14 and the external terminal 13 are patterned as shown in FIG.

Similarly, a metal film such as Au or Cu is formed on the upper surface of the base 20 by plating. Thereafter, the upper surface ground electrode 16 and the signal wiring 10 are patterned by using a photolithography technique and an etching technique as shown in FIG.

As described above, according to the wiring structure of the present embodiment, a plurality of embedded ground wirings 15a to 15g are arranged at intervals of less than ¼ of the wavelength λ of the high frequency transmitted through the signal wiring 10. It is possible to suppress the resonance phenomenon that occurs when the interval between the buried ground wirings becomes ¼ of the wavelength of the high frequency that is transmitted through the signal wiring 10 and the occurrence of ripples due to the resonance phenomenon. That is, if the interval between the buried ground wirings 15a to 15g is set to be shorter than 1/4 of the shortest wavelength in the high-frequency band transmitted through the transmission line, the occurrence of this resonance phenomenon and ripple can be suppressed. it can.

Further, by arranging a plurality of embedded ground wirings 15a to 15g around the through wiring 12 used when a signal transmitted through the signal wiring 10 disposed on the upper surface of the base 20 is drawn to the lower surface, a pseudo- A simple coaxial structure can be realized. The capacitance between the through wiring 12 and each of the embedded ground wirings 15a to 15g is constant in any part of the through wiring 12. Therefore, since the characteristic impedance of the through wiring 12 can be matched, reflection of signals and mutual interference between signals due to the reflection can be suppressed, and high-frequency transmission characteristics of the transmission line can be improved.

Embodiment 1-2
FIG. 5A and FIG. 5B show views of the upper surface and the lower surface of the base 20 having the wiring structure of this embodiment. In the present embodiment, a description will be given of a wiring structure having a buried ground wiring in which the lower surface extraction electrodes are each extended outward from the signal wiring 10 and the arrangement thereof is changed.

As shown in FIG. 5A, the transmission line according to the present embodiment is different from FIG. 3A in that it does not have the embedded ground wiring 15d, and other configurations are the same as those in FIG. It is. Further, as shown in FIG. 5B, in the transmission line according to the present embodiment, the external terminals 13b are each extended outward from the signal wiring 10, and the other configurations are as shown in FIG. Same as b). That is, in the transmission line according to the present embodiment, the lower surface electrode 13 b extends toward the outer periphery of the base 20 along the width direction of the base 20.

Next, with reference to FIG. 6A and FIG. 6B, the arrangement of the through wiring 12 and the embedded ground wirings 15a to 15c and 15e to 15g at one end of the signal wiring 10 will be described. FIG. 6A shows only wirings and electrodes except for the base 20. FIG. 6B is a cross-sectional view taken along the line BB in FIG.

The base is provided with an extraction wiring 13b on the lower surface thereof. One end of the extraction wiring is electrically connected to the through wiring 12, and the other end is electrically connected to the external terminal 13.

In this case, the extraction wiring 13b is extended in a direction in which the longitudinal direction thereof coincides with the longitudinal direction of the signal wiring 10. For this reason, the extended portion of the extraction wiring 13b and the embedded ground wiring 15d overlap each other. Since the embedded ground wiring 15 d penetrates to the back surface of the base 20, the embedded ground wiring 15 d comes into contact with an extended portion of the extraction wiring 13 b disposed on the back surface of the base 20. Therefore, in this embodiment, since the extraction wiring 13b is extended outward from the signal wiring 10, only the embedded ground wirings 15a to 15c and 15e to 15g except the embedded ground wiring 15d are arranged. .

As described above, according to the present embodiment, the embedded ground wirings 15a to 15c are arranged at an interval of less than ¼ of the wavelength λ of the high frequency transmitted through the signal wiring 10, and the embedded ground wirings 15e to 15g are arranged. Occurs when the interval between the embedded ground wirings becomes ¼ of the wavelength of the high frequency transmitted through the signal wiring 10 by being arranged at an interval of less than ¼ of the wavelength λ of the high frequency transmitting the signal wiring 10. And the occurrence of ripple due to the resonance phenomenon can be suppressed. That is, if the interval between the buried ground wires 15a to 15c and the interval between the buried ground wires 15e to 15g are set to be shorter than 1/4 of the shortest wavelength in the high-frequency band transmitted through the transmission line. Resonance and ripple can be suppressed.

(Embodiment 1-3)
In the present embodiment, a description will be given of a case where, instead of the plurality of embedded ground wirings 15a to 15g, embedded ground wiring that surrounds the through wiring 12 in an arc shape and continuously is used.

7A and 7B show the configuration of the transmission line according to the present embodiment, which is applied to the portion surrounded by the dotted lines G1 and G2 in the base 20 shown in FIG. 7A is a plan view showing an upper surface of a portion surrounded by dotted lines G1 and G2 in the base 20 shown in FIG. 2, and FIG. 7B is surrounded by a dotted line G1 in the base 20 shown in FIG. It is a top view which shows the lower surface of a part. FIG. 7C shows only the wiring and electrodes except for the base 20.

The transmission line according to the present embodiment is a transmission line used for a micro relay as an example of a MEMS structure, and includes a base 20 having an upper surface and a lower surface, and a signal wiring 10 disposed on the upper surface and transmitting a high frequency. And an upper surface ground electrode 16 disposed on the upper surface and electrically insulated from the signal wiring 10, and a through wiring 12 penetrating from the upper surface to the lower surface of the base 20 and electrically connected to the signal wiring 10. And a bottom ground electrode 14 disposed on the bottom surface and electrically insulated from the through wiring 12, and a buried ground wiring 17 embedded in the base 20 and extending along a circle surrounding the through wiring 12. .

As shown in FIG. 7B, external terminals 13 are disposed on the lower surface of the base 20. The external terminal 13 is disposed at a position corresponding to the through wiring 12 in FIG. Further, the lower surface ground electrode 14 is disposed on the back surface of the base 20 so as to surround the external terminal 13, and a predetermined gap is formed between the lower surface ground electrode 14 and the external terminal 13. The base 20 is exposed in the predetermined gap. The external terminal 13 is electrically insulated from the lower surface ground electrode 14.

In the present embodiment, the buried ground wiring 17 is electrically connected to both the upper surface ground electrode 16 and the lower surface ground electrode 14. The embedded ground wiring 17 penetrates from the upper surface to the lower surface of the base 20, and is continuously arranged in an arc shape around the through wiring 12 except for the signal wiring 10. In other words, the embedded ground wiring 17 is arranged on one arc centering on the through wiring 12 and has a planar shape that approximates the alphabet “C”. The reason for excluding the portion of the signal wiring 10 is that if the embedded ground wiring 17 penetrating from the front surface to the back surface of the base 20 is disposed in the portion where the signal wiring 10 is disposed, the embedded ground is formed on the surface of the base 20. This is because the wiring 17 comes into contact with the signal wiring 10.

By adjusting the diameter of the through wiring 12 and the distance between the through wiring 12 and the embedded ground wiring 17, the characteristic impedance of the transmission line can be arbitrarily designed.

Other configurations are the same as those shown in FIG. 3 and FIG.

As described above, according to the present embodiment, the embedded ground wiring 17 surrounds the periphery of the through wiring 12 in an arc shape and continuously, so that the pseudo coaxial structure is strengthened and the impedance can be made constant. it can.

In the embodiments 1-1 and 1-2, since the plurality of embedded ground wirings 15 are arranged in an arc around the through wiring 12, it is necessary to adjust the interval between the embedded ground wirings 15 to a predetermined value or less. . On the other hand, in Embodiment 1-3, instead of the plurality of embedded ground wirings 15, one continuous embedded ground wiring 17 is arranged around the through wiring 12. It is possible to prevent a resonance phenomenon that occurs when the wavelength of the high-frequency wave transmitted through the wiring 10 is ¼, and the occurrence of ripples. That is, the concept of the interval between the embedded ground wirings is eliminated, and it is not necessary to consider 1/4 of the wavelength λ of the high frequency, and the transmission line can be easily designed.

Embodiment 1-4
FIG. 8A is a top view showing the configuration of the transmission line according to the modification of the embodiment 1-1 of the present invention applied to the portion surrounded by the dotted line G1 in FIG. Is a bottom view thereof. For example, as shown in FIGS. 8A and 8B, as a modification of the embodiment 1-1 of the present invention, a plurality of embedded ground wirings 15a to 15g, 15h, and 15j are connected to the signal wiring 10. You may arrange | position circularly and equidistantly around the penetration wiring 12 including an overlapping part.

That is, in this modification, the base 20 has embedded

ground wirings

15h and 15j in addition to the plurality of embedded ground wirings 15a to 15g shown in FIGS. 3 (a) and 3 (b). Each of the buried

ground lines

15h and 15j constitutes a second shield. The buried ground wirings 15a to 15g, 15h, and 15j are arranged on the base 20 along a circle surrounding the periphery of the through wiring 12. As a result, the effect of suppressing the resonance phenomenon that occurs when the interval between the embedded ground wirings becomes ¼ of the wavelength of the high frequency transmitted through the signal wiring 10 is increased. Further, the range surrounding the through wiring 12 in an arc shape is widened, the pseudo coaxial structure is strengthened, and the impedance can be made constant.

FIG. 8C is a cross-sectional view taken along the CD line in FIG. As shown in FIG. 8C, the embedded ground wirings 15 a to 15 g penetrate from the upper surface to the lower surface of the base 20 and are in contact with the upper surface ground electrode 16 and the lower surface ground electrode 14. The base 20 further has embedded

ground wirings

15 h and 15 j, which overlap with the signal wiring 10 in the thickness direction of the base 20. A base 20 is interposed between the signal wiring 10 and the upper surface ground electrode 16. Thereby, the buried ground wiring and the signal wiring 10 can be electrically insulated. Note that the lower ends of the embedded

ground wires

15 h and 15 j are in contact with the lower surface ground electrode 14 on the lower surface of the base 20. Thereby, the embedded

ground wirings

15h and 15j are grounded.

By adjusting the distance between the embedded

ground wirings

15h and 15j and the signal wiring 10, the characteristic impedance of the transmission line can be arbitrarily designed. For example, if the base 20 having a laminated structure made of two or more different materials having etching selectivity is prepared and the etching selectivity is used, the embedding depth of the embedded

ground wirings

15h and 15j, that is, the embedded ground wiring 15h. , 15j and the signal wiring 10 can be easily made constant. Furthermore, by adjusting the thickness of each layer of the base 20, the characteristic impedance of the transmission line can be arbitrarily designed.

Furthermore, the present invention can be similarly applied to the transmission lines shown in FIGS. That is, the base 20 further includes a third shield. The third shield is placed in the thickness direction of the base and overlaps with the extraction wiring. The base 20 is interposed between the lower end of the third shield and the lower surface of the base 20, whereby the third shield is electrically insulated from the extraction wiring. The upper end of the third shield reaches the upper surface of the base 20, whereby the third shield is electrically connected to the upper surface ground electrode.

In Embodiments 1-1 to 1-3, the base 20 has been described as an example of a dielectric substrate. However, the dielectric substrate is a silicon substrate made of single crystal silicon or a low-temperature co-fired ceramic substrate (LTCC substrate). It does not matter. The advantages of each substrate are described. First, in the case of a silicon substrate, a semiconductor microfabrication technique such as a photolithography technique and an etching technique can be used. Therefore, the base 20 can be easily processed as compared with the case where the base 20 is used. In particular, since the functional unit 30 is formed using silicon, the linear expansion coefficients of the functional unit 30 and the base 20 can be made approximately equal. Therefore, the stress resulting from the difference in linear expansion coefficient can be reduced. As the silicon substrate, it is desirable to use high resistance silicon. In this case, high frequency characteristics (particularly, high frequency characteristics in the slow wave mode) can be improved.

When the dielectric substrate is the base 20, the high frequency characteristics can be improved by using glass which is a substance having a relatively low dielectric constant.

The low-temperature co-fired ceramic substrate can easily form circular through-holes and internal wiring (ground layer) having a uniform diameter as compared with the base 20. When the diameter of the through hole is uniform, the high frequency characteristics are improved as compared with the case where the diameter of the through hole is not uniform (for example, when the diameter changes according to the depth of the hole). Further, by providing a ground layer inside the substrate, the impedance can be adjusted, and the impedance design becomes easy. Therefore, high-frequency transmission characteristics can be improved compared to a glass substrate.

In Embodiments 1-1 to 1-3 of the present invention, a micro relay has been described as an example of a MEMS structure. However, the present invention is not limited to this, and a high frequency switch, a resonator, a filter, An oscillator is also included.

Embodiment 2-1
In the present embodiment, a shield structure surrounding a signal wiring formed on the upper surface of the base 20 will be described. The wiring structure of the present embodiment is applied to a MEMS device including a base 20, a functional unit 30, and a cover 40, for example, as shown in FIGS. 9 (a) to 9 (d). 9 to 21, the structure of the MEMS device is shown in a simplified manner in order to briefly explain the main points of the wiring structure of the present embodiment. That is, the base 20, the functional unit 30, the cover 40, and the like described in FIGS. 9 to 21 are applied to a portion surrounded by a dotted line G1 in FIG. The second edge 332 is defined by a pair of restricting protrusions 330 in the micro relay. However, in FIGS. 9 to 21, the pair of restricting protrusions 330 are described as a single unit, and thereby represent the second edge 332.

The base 20 is made of a substrate (in this embodiment, a glass substrate). A signal wiring 10 is formed on the upper surface of the base 20. Note that the base 20 may be formed of a silicon substrate instead of an insulating substrate such as a glass substrate. In particular, since the functional unit 30 is formed using silicon, the linear expansion coefficients of the functional unit 30 and the base 20 can be approximately equal. Therefore, the stress resulting from the difference in linear expansion coefficient can be reduced. As the silicon substrate, it is preferable to use a high resistance silicon substrate using high resistance silicon. In this case, the high frequency characteristics (particularly, the high frequency characteristics in the slow wave mode) can be improved.

The signal wiring 10 is formed in a straight line as shown in FIG.

A pair of external terminals 13 are formed on the lower surface of the base 20. Further, the base 20 is formed with a pair of through holes 22 that penetrates the base 20 in the thickness direction. Since the base 20 is a glass substrate, the through hole 22 is formed by blasting (for example, sand blasting) from the lower surface of the base 20. Inside the through hole 22, the through wiring 12 that electrically connects each end of the signal wiring 10 in the longitudinal direction to the external terminal 13 is formed. Accordingly, the pair of external terminals 13 are electrically connected to each other by the signal wiring 10.

The base 20 includes a first hole 24 and a second hole 25. Each first hole 24 and second hole 25 penetrates the base 20 in the thickness direction. The first hole 24 is located on the left side of the signal wiring 10. The second hole 25 is located on the right side of the signal wiring 10. As described above, the first hole 24 and the second hole 25 are provided adjacent to the left and right sides of the signal wiring 10. In other words, the signal wiring 10 is located between the first hole 24 and the second hole 25. Here, the distance between each of the

holes

24 and 25 and the signal wiring 10 is set to such a distance that a transmission loss of a high-frequency signal passing through the signal wiring 10 can be sufficiently reduced by a ground line described later.

In the present embodiment, each of the first hole 24 and the second hole 25 is a slit formed in parallel with the signal wiring 10. The first hole portion 24 and the second hole portion 25 each have a length along the length direction of the signal wiring 10. The first hole 24 and the second hole 25 are formed along the signal wiring 10. The first hole portion 24 and the second hole portion 25 have a width along the width direction of the signal wiring 10. The widths of the first holes 24 and the second holes 25 become wider from the upper surface of the base 20 toward the lower surface. That is, each of the first hole 24 and the second hole 25 is formed so that the width on the lower surface of the base 20 is larger than the width on the upper surface of the base 20. The angle formed between the inner surface of each first hole 24 and second hole 25 and the upper surface of the base 20 is, for example, 75 degrees, and preferably 45 degrees. The

holes

24 and 25 can be formed by blasting the base 20 from the lower surface of the base 20 (for example, sand blasting). In addition, you may form each 1st hole 24 and the 2nd hole 25 using well-known techniques other than blasting.

The functional unit 30 is made of a semiconductor substrate (for example, a silicon substrate) processed using a semiconductor microfabrication technique. The functional unit 30 is provided (attached) on the upper surface of the base 20 using a metal layer 80 for bonding. In addition, a rectangular first opening 31 is formed in the functional unit 30 so that the entire signal wiring 10 faces the cover 40 side. As described above, the functional unit 30 is provided on the upper surface of the base 20. As a result, the signal wiring 10 is located in the first opening 31.

The cover 40 is made of an insulating material (for example, glass). The cover 40 is provided on the functional unit 30. That is, the cover 40 is placed on the base 20 so as to sandwich the functional unit 30 with the base 20. The cover 40 is formed in a plate shape having a size capable of closing the first opening 31 of the functional unit 30. Thus, the cover 40 is provided on the functional unit 30. Further, the cover 40 faces the signal wiring 10 through the first opening 31.

The wiring structure of the present embodiment includes a base 20, a signal wiring 10 formed on the upper surface of the base 20, a first hole portion 24 and a second hole portion 25 penetrating the base 20 in the thickness direction, and the signal wiring 10. And an electrically insulated ground line 11. The signal wiring 10 is located between the first hole 24 and the second hole 25.

The ground line 11 is formed around the signal wiring 10. The ground line 11 in this embodiment is formed in a shape surrounding the signal line 10 in a plane intersecting the length direction of the signal line 10. More specifically, the ground line 11 of the present embodiment is formed to surround the signal wiring 10 in a plane orthogonal to the length direction of the signal wiring 10.

The ground line 11 is made of a conductor provided on each of the base 20, the functional unit 30, and the cover 40. The base 20 includes a first conductor 110, a second conductor 111, a third conductor 112, a fourth conductor 113, and a fifth conductor 114. The first conductor 110, the second conductor 111, the third conductor 112, the fourth conductor 113, and the fifth conductor 114 cooperate with each other to define a fourth shield. Since the fourth shield is provided on the base 20, the fourth shield covers the lower side of the signal wiring 10. The functional unit 30 includes a sixth conductor 115 and a seventh conductor 116. The sixth conductor 115 and the seventh conductor 116 cooperate with each other to define the fifth shield. The cover 40 includes an eighth conductor 117. The eighth conductor 117 defines a sixth shield. Accordingly, the first conductor 110 to the eighth conductor 117 constitute a ground line.

The first conductor 110 is formed inside the first hole 24 of the base 20.

The second conductor 111 is formed inside the second hole 25 of the base 20.

The third conductor 112 is formed on the lower surface of the base 20. The third conductor 112 is formed between the

slits

24 and 25 on the lower surface of the base 20 and between the pair of external terminals 13. Therefore, the third conductor 112 is located at a position overlapping the signal wiring 10 in the thickness direction of the base 20. The third conductor 112 is directly connected to the first conductor 110 on the left side of the signal wiring 10. The third conductor 112 is directly connected to the second conductor 111 on the right side of the signal wiring 10. The first conductor 110 and the second conductor 111 are electrically connected to each other by the third conductor 112. The third conductor 112 may be electrically connected to the lower surface ground electrode 14 or may be electrically insulated.

The fourth conductor 113 is formed on the right side of the signal wiring 10 in the base 20. The fourth conductor 113 is formed to cover the entire first conductor 110 exposed from the first hole 24 to the upper surface of the base 20. As a result, the fourth conductor 113 is directly connected to the first conductor 110.

The fifth conductor 114 is formed on the right side of the signal wiring 10 in the base 20. The fifth conductor 114 is formed so as to cover the entire second conductor 111 exposed on the upper surface of the base 20 through the second hole 25. As a result, the fifth conductor 114 is directly connected to the second conductor 111.

Here, the metal layer 80 is formed to surround the signal wiring 10 on the upper surface of the base 20. In the present embodiment, the left portion of the signal wiring 10 in the metal layer 80 is used as the fourth conductor 113, and the right portion of the signal wiring 10 in the metal layer 80 is used as the fifth conductor 114. That is, the fourth conductor 113 and the fifth conductor 114 are formed using the metal layer 80. That is, the upper surface ground electrode 16 can be used as the metal layer 80.

The sixth conductor 115 and the seventh conductor 116 are formed on the inner surface of the frame 33 of the functional unit 30. More specifically, the frame 33 has a first edge 331 and a second edge 332 along the length direction of the transmission line, and a third edge 333 along the width direction of the transmission line. And a fourth edge 334. Accordingly, the frame 33 has the first inner surface 33L and the second inner surface 33R along the length direction of the transmission line, and the third inner surface and the fourth inner surface along the width direction of the transmission line. And the inner surface.

The sixth conductor 115 is formed on the first inner surface 33L of the first edge 331. The sixth conductor 115 is electrically connected to the first conductor 110 through the fourth conductor 113.

The seventh conductor 116 is formed on the second inner surface 33R of the second edge 332. The seventh conductor 116 is electrically connected to the second conductor 111 through the fifth conductor 114.

The eighth conductor 117 is formed in the lower surface region 40U facing the opening 31 in the cover 40. More specifically, the cover 40 has a lower surface region 40 U that faces the base 20 through the first opening 31. The eighth conductor 117 is formed in the lower surface region 40U. The eighth conductor 117 is directly connected to each of the sixth conductor 115 and the seventh conductor 116. In other words, the sixth conductor 115 electrically connects the first conductor 110 and the eighth conductor 117 to each other. The seventh conductor 116 electrically connects the second conductor 111 and the eighth conductor 117 to each other.

Note that the dimension of the first opening 31 in the length direction of the signal wiring 10 is larger than that of the signal wiring 10. Further, the dimension of the first opening 31 in the width direction of the signal wiring 10 is such that each of the first hole 24 and the second hole 25 faces the cover 40 side when the metal layer 80 is not provided. It is.

In the ground line 11, the first conductor 110 and the second conductor 111 are electrically connected to each other by the third conductor 112. The fourth conductor 113 is electrically connected to the first conductor 110, and the sixth conductor 115 is electrically connected to the first conductor 110 via the fourth conductor 113. The fifth conductor 114 is electrically connected to the second conductor 111, and the seventh conductor 116 is electrically connected to the second conductor 111 via the fifth conductor 114. The sixth conductor 115 and the seventh conductor 116 are electrically connected to each other by the eighth conductor 117.

As described above, in the grounding line 11, the conductors 110 to 117 are electrically connected to each other. At least one of the conductors 110 to 117 is connected to the ground (reference potential point). Each of the conductors 110 to 117 can be formed by a conventionally known method such as electroplating or sputtering.

As described above, the wiring structure of the present embodiment has the base 20 made of the substrate, the signal wiring 10 formed on the upper surface of the base 20, the periphery of the signal wiring 10, and electrically insulated from the signal wiring 10. And a first hole 24 and a second hole 25 that are provided adjacent to the left and right sides of the signal wiring 10 and penetrate the base 20 in the thickness direction. The ground line 11 is formed on the first conductor 110 formed inside the first hole 24, the second conductor 111 formed inside the second hole 25, and the lower surface of the base 20. A third conductor 112 electrically connected to the first conductor 110 and the second conductor 111. The first hole 24 and the second hole 25 are formed so that the length along the width direction of the signal wiring 10 is larger on the lower surface than on the upper surface.

According to the wiring structure of the present embodiment, since a pseudo coaxial structure is obtained, transmission loss of high frequency signals can be reduced. Further, when the ground line 11 is manufactured, not only the base 20 of the MEMS device but also the functional unit 30 and the cover 40 are used. Therefore, it is not necessary to produce a laminated body such as a semiconductor layer, an insulating layer, or a conductive layer in order to obtain a three-dimensional structure, compared to a case where the ground line 11 is produced using only the base 20. Thereby, the ground line 11 can be easily manufactured. Moreover, as compared with the case where the lengths of the first hole 24 and the second hole 25 in the direction along the width direction of the signal wiring 10 are uniform, grounding in a plane intersecting the length direction of the signal wiring 10 is performed. The shape of the line 11 can be brought close to an annular shape, and high frequency characteristics can be improved.

In addition, since each of the first hole 24 and the second hole 25 is a slit formed so as to be parallel to the signal wiring 10, the ripple of the high frequency signal output to the signal wiring 10 is not affected. Generation can be suppressed and high frequency characteristics can be improved.

Further, the ground line 11 includes a fourth conductor 113 electrically connected to the first conductor 110 and a fifth conductor 114 electrically connected to the second conductor 111 on the upper surface of the base 20. Prepare. Therefore, transmission loss of high frequency signals can be further reduced. The fourth conductor 113 and the fifth conductor 114 are formed using a metal layer 80 for joining the functional unit 30 to the base 20. Therefore, the manufacturing cost can be reduced.

Further, the ground line 11 is formed on the first inner surface 33 L of the frame 33 and is formed on the second inner surface 33 R of the frame 33 and the sixth conductor 115 electrically connected to the first conductor 110. And the seventh conductor 116 electrically connected to the second conductor 111 and the seventh conductor 116 formed in the lower surface region 40U and electrically connected to the sixth conductor 115 and the seventh conductor 116. And an eighth conductor 117. Thereby, the shape of the grounding line 11 in the plane intersecting the length direction of the signal wiring 10 can be brought close to an annular shape, and the high frequency characteristics can be improved.

FIGS. 10A to 10D show modified examples of the wiring structure of FIG.

In the wiring structure of FIG. 10, the metal layer 80 is not used for joining the functional unit 30 and the base 20, and the ground line 11 A does not include the fourth conductor 113 and the fifth conductor 114. That is, the ground line 11A includes first to third, sixth to eighth conductors 110 to 112, 115 to 117. In the ground line 11 A, the sixth conductor 115 is directly connected to the first conductor 110, and the seventh conductor 116 is directly connected to the second conductor 111.

10 can reduce the transmission loss of the high-frequency signal as well as the wiring structure of FIG. 9 and can be easily manufactured. In the wiring structure of FIG. 10, the sixth to eighth conductors 115 to 117 may be omitted.

Embodiment 2-2
In the wiring structure of the present embodiment, as shown in FIGS. 11A to 11D, the ground line 11B and the base 20B are different from the wiring structure of the first embodiment. In addition, the same code | symbol is attached | subjected about the structure which is common in the wiring structure of this embodiment, and the wiring structure of Embodiment 1, and description is abbreviate | omitted.

The base 20B is different from the embodiment 2-1 in each of the first hole 24B and the second hole 25B. That is, the base 20B has a plurality of first holes 24B and a plurality of second holes 25B. Each of the first hole portions 24 B and the second hole portions 25 B is a through-hole formed in a plurality at predetermined intervals along the length direction of the signal wiring 10. In the illustrated example, only five

holes

24B and 25B are shown for simplification.

The width of each

hole

24B, 25B becomes wider from the upper surface to the lower surface of the base 20B as in the case of the embodiment 2-1. For example, the inclination angle formed by the inner surface of each

hole

24B, 25B with the upper surface of the base 20B is 75 degrees, preferably 45 degrees. Each of the

holes

24B and 25B can be formed by blasting (for example, sand blasting) the base 20B from the lower surface of the base 20B.

The ground line 11B includes a plurality of first conductors 110B, a plurality of second conductors 111B, a third conductor 112B, a sixth conductor 115, a seventh conductor 116, and an eighth conductor 117. The ground line 11B may further include a fourth conductor 113 and a fifth conductor 114. The ground line 11B may include only the first conductor 110B, the second conductor 111B, and the third conductor 112B.

Each first conductor 110B is a through-hole wiring formed in each first hole 24B. Each second conductor 111B is a through-hole wiring formed in each second hole 25B. These

conductors

110B and 111B can be formed by a conventionally known method such as electroplating or sputtering.

The third conductor 112B is formed on the upper surface of the base 20B. The third conductor 112B is directly connected to each of the plurality of first conductors 110B on the left side of the signal wiring 10. The third conductor 112B is directly connected to each of the plurality of second conductors 111B on the right side of the signal wiring 10. All the first conductors 110B and all the second conductors 111B are electrically connected to each other by the third conductor 112B.

Such a ground line 11B can suppress the occurrence of ripple with respect to a high-frequency signal having a wavelength that is four times or more the above-mentioned predetermined interval.

Therefore, the above-mentioned predetermined interval, that is, the distance between the centers of the adjacent holes (

respective holes

24B and 25B) is the high-frequency signal output to the signal wiring 10 (that is, the high-frequency signal assumed to be used). The frequency is set to a value less than 1/4 of the wavelength of the highest frequency signal. For example, when the maximum value (upper limit frequency) of the frequency of the high-frequency signal to be passed through the signal wiring 10 is 40 GHz, in order to efficiently suppress the occurrence of ripple at 40 GHz, a slightly higher frequency of 50 GHz is used. Based on the above, the predetermined interval is designed. That is, the predetermined interval may be designed to be less than ¼ of the wavelength of 50 GHz. Hereinafter, the interval less than ¼ will be described more specifically. When the first signal flowing through the signal wiring 10 is 40 GHz, ¼ of the wavelength of the first signal corresponds to 1.875 mm. Therefore, it is preferable that the interval between the buried ground wirings 15a to 15g is 1.5 mm or less.

According to the wiring structure of the present embodiment described above, the transmission loss of high-frequency signals can be reduced as in the case of Embodiment 2-1.

In particular, each of the first hole portions 24B and the second hole portions 25B is formed at a predetermined interval along the length direction of the signal wiring 10, and the predetermined interval is the wavelength of the high-frequency signal output to the signal wiring 10. Is less than ¼. Therefore, it is possible to improve the high frequency characteristics for the high frequency signal output to the signal wiring 10.

Similarly to the embodiment 2-1, each of the first hole 24B and the second hole 25B is formed so as to increase in width from the upper surface of the base 20 toward the lower surface. Therefore, high frequency characteristics can be improved.

(Embodiment 2-3)
In the wiring structure of the present embodiment, as shown in FIGS. 12A to 12D, the ground line 11C and the functional unit 30C are different from the wiring structure of the embodiment 2-1. In addition, about the structure which is common in the wiring structure of this embodiment and Embodiment 2-1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

The functional part 30C includes a first connection hole 37 (hereinafter, denoted by reference numeral 371 as necessary) and a second connection hole 37 (hereinafter, denoted by reference numeral 372 as necessary) penetrating the functional part 30C in the thickness direction. Have A plurality of first connection holes 371 are formed on the first edge 331 of the frame 33. The plurality of first connection holes 371 are arranged at equal intervals along the length direction of the signal wiring 10. A plurality of second connection holes 372 are formed on the second edge 332 of the frame 33. The plurality of second connection holes 372 are arranged at equal intervals along the length direction of the signal wiring 10. That is, a plurality of connection holes 371 and 372 are formed around the first opening 31 of the functional unit 30 C along the length direction of the signal wiring 10.

The ground line 11 C includes a first conductor 110, a second conductor 111, a third conductor 112, a sixth conductor 115 C, a seventh conductor 116 C, and an eighth conductor 117. The ground line 11C may further include a fourth conductor 113 and a fifth conductor 114.

The sixth conductor 115C is formed inside each first connection hole 371, and the seventh conductor 116 is formed inside each second connection hole 372. The eighth conductor 117 is formed so that both end portions in the direction along the width direction of the signal wiring 10 overlap with the first conductor 110 and the second conductor 111 in the thickness direction.

Each first connection hole 371 is provided at a position where the eighth conductor 117 faces the opening on the cover 40 side and the first conductor 110 faces the opening on the base 20 side. Each second connection hole 372 is provided at a position where the eighth conductor 117 faces the opening on the cover 40 side and the second conductor 111 faces the opening on the base 20 side. Therefore, the first conductor 110 and the eighth conductor 117 are electrically connected by the sixth conductor 115, and the second conductor 111 and the eighth conductor 117 are electrically connected by the seventh conductor 116. Is done.

According to the wiring structure of the present embodiment described above, the transmission loss of the high-frequency signal can be reduced and can be easily manufactured as in the wiring structure of the embodiment 2-1.

Furthermore, in the wiring structure of the present embodiment, a plurality of connection holes 37 penetrating the functional part 30C in the thickness direction are formed around the first opening 31 of the functional part 30C along the length direction of the signal wiring 10. The sixth conductor 115C and the seventh conductor 116C of the ground line 11C are formed inside the connection hole 37. Therefore, the sixth conductor 115C and the seventh conductor 116C can be easily formed as compared with the case where the sixth conductor 115 and the seventh conductor 116 are formed on the inner surface of the first opening 31 of the functional unit 30C. . In addition, although the cross section of each connection hole 37 is a perfect circle shape, this is an example to the last. In addition, although each of the connection holes 371 and 372 is formed seven by one, this is only an example.

The characteristic part of the wiring structure of the present embodiment can also be applied to the embodiment 2-2.

Embodiment 2-4
FIG. 13 shows the wiring structure of this embodiment. As shown in FIGS. 13A to 13D, in the wiring structure of the present embodiment, the ground line 11D and the functional unit 30D are different from the wiring structure of the embodiment 2-1. In addition, about the structure which is common in the wiring structure of this embodiment, and the wiring structure of Embodiment 2-1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

The functional unit 30D has two connection slits 38 that penetrate the functional unit 30D in the thickness direction. The first connection slit 38 (hereinafter, denoted by reference numeral 381 as necessary) is formed on the first edge 331 located on the left side of the signal wiring 10. The second connection slit 38 (hereinafter denoted by reference numeral 382 as necessary) is formed at the second edge 332 located on the right side of the signal wiring 10. Each connection slit 38 is formed along the length direction of the signal wiring 10. That is, the connection slit 38 is formed along the length direction of the signal wiring 10 around the first opening 31 of the functional unit 30D.

The ground line 11D includes a first conductor 110, a second conductor 111, a third conductor 112, a sixth conductor 115D, a seventh conductor 116D, and an eighth conductor 117. The ground line 11D may further include a fourth conductor 113 and a fifth conductor 114.

The sixth conductor 115D is formed inside the first connection slit 381, and the seventh conductor 116D is formed on the second connection slit 382 side. The eighth conductor 117 is formed in such a manner that both end portions in the direction along the width direction of the signal wiring 10 overlap with the first conductor 110 and the second conductor 111 in the thickness direction.

The first connection slit 381 is provided at a position where the eighth conductor 117 faces the opening on the cover 40 side and the first conductor 110 faces the opening on the base 20 side. The second connection slit 382 is provided at a position where the eighth conductor 117 faces the opening on the cover 40 side and the second conductor 111 faces the opening on the base 20 side. Therefore, the first conductor 110 and the eighth conductor 117 are electrically connected by the sixth conductor 115, and the second conductor 111 and the eighth conductor 117 are electrically connected by the seventh conductor 116. Is done.

Furthermore, in the wiring structure of the present embodiment, a connection slit 38 that penetrates the functional portion 30D in the thickness direction is formed around the first opening 31 of the functional portion 30D along the length direction of the signal wiring 10. The sixth conductor 115D and the seventh conductor 116D of the ground line 11D are formed inside the connection slit 38. Therefore, according to the wiring structure of the present embodiment, the sixth conductor 115 and the seventh conductor 115 are compared with the case where the sixth conductor 115 and the seventh conductor 116 are formed on the inner surface of the first opening 31 of the functional unit 30. The seventh conductor 116 can be easily formed. Further, as in the wiring structure of the embodiment 2-2, the connection hole 37 is formed around the first opening 31 of the functional unit 30C, and the sixth conductor 115C and the seventh conductor 116C are formed in the connection hole 37. Compared with the case, the high frequency characteristics can be improved.

Embodiment 2-5
In the wiring structure of the present embodiment, as shown in FIGS. 14A to 14D, the ground line 11E and the functional unit 30E are different from the wiring structure of the embodiment 2-1. In addition, about the structure which is common in the wiring structure of this embodiment and the wiring structure of Embodiment 2-1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

The functional unit 30E includes a rectangular recess 39 instead of the first opening 31. The recess 39 is formed on the lower surface of the functional unit 30E. The recess 39 is formed so that its width is larger than the width of the signal wiring 10. The recess 39 is formed such that its length is larger than the length of the signal wiring 10. The length direction of the recess 39 is along the length direction of the signal wiring. In particular, the width of the signal wiring 10 is set such that a part of the first hole 24 and the second hole 25 faces the recess 39.

The ground line 11E is configured by a fourth shield and a fifth shield provided in the base 20 and the functional unit 30E, respectively. More specifically, the base 20 includes a first conductor 110, a second conductor 111, a third conductor 112, a fourth conductor 113, and a fifth conductor 114. The functional unit 30E includes a sixth conductor 115E, a seventh conductor 116E, and an eighth conductor 117E. The first conductor 110E to the eighth conductor 117E constitute the ground line 11E.

The concave portion 39 has a left inner side surface 39L, a right inner side surface 39R, and a bottom surface along the length direction of the signal wiring 10.

The sixth conductor 115E is formed on the left inner surface 39L of the recess 39. The sixth conductor 115E is electrically connected to the first conductor 110 through the fourth conductor 113.

The seventh conductor 116E is formed on the right inner surface 39R of the recess 39. The seventh conductor 116E is electrically connected to the second conductor 111 through the fifth conductor 114.

8th conductor 117 is formed in the bottom face of crevice 39 of functional part 30E. The eighth conductor 117 is directly electrically connected to the sixth conductor 115E and the seventh conductor 116E. In other words, the sixth conductor 115E electrically connects the first conductor 110 and the eighth conductor 117E to each other. The seventh conductor 116E electrically connects the second conductor 111 and the eighth conductor 117E to each other.

In the ground line 11E, the conductors 110 to 114 and 115E to 117E are electrically connected to each other. Further, at least one of the conductors 110 to 114 and 115E to 117E is connected to the ground (reference potential point). Each of the conductors 110 to 114 and 115E to 117E can be formed by a conventionally known method such as electroplating or sputtering.

Furthermore, in the wiring structure of the present embodiment, the distance between the eighth conductor 117E and the signal wiring 10 can be determined by changing the depth of the recess 39. Therefore, the distance between the eighth conductor 117E and the signal wiring 10 can be set to a distance suitable for improving the high frequency characteristics.

Note that the ground line 11E does not necessarily include the fourth conductor 113 and the fifth conductor 114.

15A and 15B show a modification of the wiring structure of the present embodiment.

15, the functional unit 30F includes a second recess 390F on the bottom surface of the recess 39F. The second recess 390F is formed at the center of the bottom surface of the recess 39F (the center of the bottom surface in the width direction of the signal wiring 10). The second recess 390F has a length along the length direction of the recess 39F. Therefore, the bottom surface of the recess 39F is formed in a shape in which a portion facing the signal wiring 10 (a central portion in the width direction of the signal wiring 10) is recessed.

In the wiring structure of FIG. 15, the ground line 11F includes the first conductor 110, the second conductor 111, the third conductor 112, the sixth conductor 115E, the seventh conductor 116E, and the eighth conductor. A body 117F. The ground line 11F may further include a fourth conductor 113 and a fifth conductor 114.

The eighth conductor 117F is formed on the entire bottom surface of the recess 39. That is, the eighth conductor 117F is also formed on the inner surface of the second recess 390F.

15 can reduce the transmission loss of the high-frequency signal and can be easily manufactured, similarly to the wiring structure of FIG.

In addition, the shape of the ground line 11F in the plane intersecting the length direction of the signal wiring 10 can be made closer to an annular shape as compared with the case where the bottom surface of the recess 39 is flat as in the wiring structure of FIG. . Therefore, high frequency characteristics can be improved.

Embodiment 2-6
In the wiring structure of the present embodiment, as shown in FIGS. 16A and 16B, the base 20G is different from the wiring structure of the embodiment 2-5. Note that components common to the wiring structure of the present embodiment and the wiring structure of Embodiment 2-5 are denoted by the same reference numerals and description thereof is omitted. 16A and 16B, the functional unit 30E and the sixth to eighth conductive units 115E to 117E are not shown.

The base 20G includes a recess 281 on the upper surface. The opening size of the recessed part 281 is substantially equal to the opening size of the recessed part 39 of the functional part 30E. Further, the recess 281 is formed in such a manner that the dimension of the recess 281 in the direction along the width direction of the signal wiring 10 becomes smaller as it goes from the upper surface to the lower surface of the base 20G. The recess 281 has a left inner surface and a right inner surface along the length direction of the signal wiring 10. The recess 281 can be formed by blasting the one surface side of the base 20G. The concave portion 281 can be formed using a photolithography technique, an etching technique, and the like.

The support 29 is attached to the upper surface of the base 20G. The support 29 is a thin plate such as a silicon plate or a glass plate that is thinner than the base 20G. For example, when the thickness of the base 20G is about 500 μm, the thickness of the support 29 is set to about 5 to 50 μm (preferably about 20 μm). The outer size of the support 29 is larger than the opening size of the recess 281. The support 29 is bonded to the upper surface of the base 20G so as to cover (close) the recess 281.

The signal wiring 10 is formed on the upper surface of the support 29. The signal wiring 10 is formed so as to straddle the recess 281. Therefore, the portions on both ends in the width direction of the signal wiring 10 in the base 20 G are located on the upper surface than the signal wiring 10. Both end portions of the signal wiring 10 in the length direction are electrically connected to the external terminals 13 through the through wiring 12.

The ground line 11G includes a first conductor 110, a second conductor 111, a third conductor 112, a sixth conductor 115E, a seventh conductor 116E, an eighth conductor 117F, and a ninth conductor. A body 118 and a tenth conductor 119. The ninth conductor 118 and the tenth conductor 119 are provided on the left side surface and the right side surface of the recess 281, respectively.

In the ground line 11G, the first conductor 110 and the sixth conductor 115E are electrically connected to each other using a through-hole wiring (not shown) or a surface wiring (not shown) formed in the support 29. Connected. Similarly, the second conductor 111 and the seventh conductor 116E are electrically connected to each other using a through-hole wiring (not shown) or a surface wiring (not shown) formed in the support 29. Connected. The ground line 11G may further include a fourth conductor 113 and a fifth conductor 114.

According to the wiring structure of the present embodiment described above, the transmission loss of the high-frequency signal can be reduced and can be easily manufactured as in the wiring structure of the embodiment 2-5.

In particular, according to the wiring structure of the present embodiment, the concave portion 281 exists between the signal wiring 10 and the base 20G. Therefore, the high frequency characteristics can be improved as compared with the case where the signal wiring 10 is directly formed on the upper surface of the base 20.

FIGS. 17A and 17B show a modification of the wiring structure of the present embodiment.

17A and 17B, the support 29 includes a frame portion 290 having a rectangular frame shape and a cross bar 291. The cross bar 291 is separated from both edges in the width direction of the frame portion 290. The cross bar 291 has both ends connected to both ends in the length direction of the frame portion 290. Thereby, the support 29 has openings 292 on both sides of the cross bar 291. Therefore, the opening 292 of the support 29 communicates with the recess 281.

The signal wiring 10 is formed so as to cross the opening of the frame part 290 through the cross bar 291. Further, the signal wiring 10 is provided on the cross bar 291 so as to be located on the opposite side to the recess 281.

In the support 29, the space surrounded by the cross bar 291 and the frame portion 290 constitutes an opening 292 that penetrates the support 29 in the thickness direction. The opening 292 is formed in parallel with the signal wiring 10.

As described above, in the wiring structure shown in FIG. 17A, since the opening 292 is formed in the support 29, the insulation between the signal wiring 10 and the base 20 is further improved. Therefore, the high frequency characteristics can be further improved. In particular, since the opening 292 is parallel to the signal wiring 10, the wiring structure becomes closer to the coaxial structure. Therefore, the high frequency characteristics can be further improved.

By the way, in the support body 29 of FIG. 17A, when the cross bar 291 becomes longer, the mechanical strength of the cross bar 291 becomes lower. Therefore, the cross bar 291 may be damaged.

Therefore, in the modification shown in FIG. 17B, the support 29 includes a pair of auxiliary cross bars 293. In the support body 29 of FIG. 17B, the pair of auxiliary cross bars 293 integrally connect the center portion of the cross bar 291 and the inner edge portions on both ends in the width direction of the frame portion 290. In such a support 29, the auxiliary cross bar 293 can prevent the cross bar 291 from being damaged. Further, a plurality of pairs of auxiliary cross bars 293 may be provided.

The characteristic part of the wiring structure of this embodiment can be applied not only to the wiring structure of the embodiment 2-5 but also to the wiring structures of the embodiments 2-1 to 2-4.

Embodiment 2-7
In the wiring structure of this embodiment, as shown in FIGS. 18A to 18D, the ground line 11H and the base 20H are different from the wiring structure of the embodiment 2-1. In addition, the same code | symbol is attached | subjected about the structure which is common in the wiring structure of this embodiment, and the wiring structure of Embodiment 1, and description is abbreviate | omitted.

The base 20H is formed not by a glass substrate but by a low temperature co-fired ceramic substrate (LTCC substrate). Here, if a low-temperature co-fired ceramic substrate is used for the base 20H, unlike the case where a glass substrate is used, holes having a uniform diameter can be easily formed.

Utilizing such characteristics of the low-temperature co-fired ceramic substrate, the through hole 22H is formed in a shape having a constant diameter in the thickness direction of the base 20H, as shown in FIGS. 18 (a) and 18 (c). . Therefore, the through wiring 12H is formed in a shape having a constant diameter in the thickness direction of the base 20H, like the through hole 22H.

As shown in FIGS. 18B and 18D, each of the first hole portion 24 and the second hole portion 25 is formed in a shape in which the width gradually increases from the upper surface to the lower surface of the base 20H. In the illustrated example, each of the

holes

24 and 25 has three types of widths. The rate at which the widths of the

holes

24 and 25 are widened is not constant, and may be increased from the upper surface to the lower surface of the base 20H. In this way, the shape of the ground line 11H in the plane intersecting the length direction of the signal wiring 10 can be made closer to an annular shape.

Also in the wiring structure of the present embodiment, the first conductor 110H is formed inside the first hole 24, and the second conductor 111H is formed inside the second hole 25.

The ground line 11H includes a first conductor 110H, a second conductor 111H, a third conductor 112, a sixth conductor 115, a seventh conductor 116, and an eighth conductor 117. The ground line 11H may further include a fourth conductor 113 and a fifth conductor 114.

Furthermore, in the wiring structure of the present embodiment, each

hole

24, 25 is formed in a shape in which the width gradually increases from the upper surface to the lower surface of the base 20H. Therefore, the shape of the ground line 11H in the plane intersecting the length direction of the signal wiring 10 can be made closer to an annular shape as compared with the case where the widths of the

holes

24 and 25 are uniform. Therefore, high frequency characteristics can be improved.

Further, in the wiring structure of the present embodiment, the through hole 22H is formed in a shape having a constant diameter in the thickness direction of the base 20H. Therefore, the high frequency characteristics can be improved as compared with the case where the diameter of the through hole 22H increases from the upper surface to the lower surface of the base 20H.

The characteristic part of the wiring structure of this embodiment can be applied not only to the embodiment 2-1, but also to the wiring structures of the embodiments 2-2 to 2-5.

Embodiment 2-8
In the wiring structure of the present embodiment, as shown in FIGS. 19A and 19B, the ground line 11I and the base 20I are different from the wiring structure of the embodiment 2-1. Note that components common to the wiring structure of the present embodiment and the wiring structure of Embodiment 2-1 are denoted by the same reference numerals and description thereof is omitted.

The base 20I has a hole 282 on the upper surface. The opening size of the hole 282 and the opening size of the first opening 31 of the functional unit 30 are substantially equal. The width of the hole 282 is formed so as to decrease from the upper surface to the lower surface of the base 20I. The hole 282 can be formed by blasting or the like from the upper surface of the base 20I.

The signal wiring 10 is formed on the bottom surface of the hole 282. More specifically, the entire signal wiring 10 is disposed on the bottom surface of the hole 282. Therefore, a through hole 22 is formed in the base 20I so as to penetrate between the bottom surface of the hole 282 and the upper surface of the base 20I in the thickness direction. The signal wiring 10 is electrically connected to the external terminal 13 through the through wiring 12 formed in the through hole 22.

Further, each

hole

24, 25 is formed in a shape penetrating between the bottom surface of the hole 282 and the lower surface of the base 20I in the thickness direction.

The ground line 11I includes two conductors 118I and 119I in addition to the conductors 110 to 112 and 115 to 117. The ground line 11I may further include a fourth conductor 113 and a fifth conductor 114.

The two conductors 118I and 119I are formed on the inner surface of the hole 282.

The ninth conductor 118I is formed on the left inner surface of the signal wiring 10 in the hole 282, and electrically connects the first conductor 110 and the sixth conductor 115 to each other.

The tenth conductor 119I is formed on the inner surface on the right side of the signal wiring 10 in the hole 282, and electrically connects the second conductor 111 and the seventh conductor 116 to each other.

According to the wiring structure of the present embodiment described above, the transmission loss of high-frequency signals can be reduced and can be easily manufactured as in the case of Embodiment 2-1.

Furthermore, according to the wiring structure of this embodiment, the signal wiring 10 is formed on the bottom surface of the hole 282 formed on the top surface of the base 20I. Therefore, compared with the case where there is no hole 282, the length of the through hole 22 can be shortened, so that the high frequency characteristics can be improved. In addition, the dimension of the hole 282 in the direction along the width direction of the signal wiring 10 becomes smaller from the upper surface to the lower surface of the base 20I. Therefore, the shape of the ground line 11I in the plane intersecting the length direction of the signal wiring 10 can be brought close to an annular shape, and high frequency characteristics can be improved.

20A and 20B show another modification of the wiring structure of the present embodiment. In the wiring structure of FIG. 20, the ground line 11J and the base 20J are different from the wiring structure of the embodiment 2-1. Note that components common to the wiring structure of FIG. 20 and the wiring structure of Embodiment 2-1 are denoted by the same reference numerals and description thereof is omitted.

The base 20J is made of a low temperature co-fired ceramic substrate. The base 20J includes a hole 282 on the upper surface. In the example shown in FIG. 20, the opening size of the hole 282 is uniform with respect to the thickness direction of the base 20J. In the base 20J, holes 24H and 25H similar to those in the embodiment 2-6 are formed.

The ground line 11J includes a ninth conductor 118J in addition to the first conductor 110H, the second conductor 111H, the third conductor 112, the sixth conductor 115, the seventh conductor 116, and the eighth conductor 117. And a tenth conductor 119. The ground line 11J may further include a fourth conductor 113 and a fifth conductor 114.

According to the wiring structure of FIG. 20 described above, the transmission loss of the high-frequency signal can be reduced and can be easily manufactured as in the case of the wiring structure of FIG. In addition, according to the wiring structure of FIG. 20, since the base 20J is made of a low-temperature co-fired ceramic substrate, the hole 282 can be easily formed as compared with the case where the base 20J is made of a glass substrate, thereby improving workability.

Thus, the hole 282 can be similarly provided when the base 20 is made of a low-temperature co-fired ceramic substrate.

The characteristic portions of the wiring structure shown in FIGS. 19 and 20 can be applied not only to the embodiment 2-1, but also to the wiring structures of the embodiments 2-2 to 2-5.

Embodiment 2-9
In the wiring structure of the present embodiment, as shown in FIG. 21, the base 20K is different from the wiring structure of the embodiment 2-1. In addition, about the structure which is common in the wiring structure of this embodiment and the wiring structure of Embodiment 2-1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

The base 20K is formed of a glass substrate similarly to the embodiment 2-1, but the through hole 22K and the through wiring 12K are different from the base 20 of the embodiment 2-1.

The through hole 22K is formed such that the diameter (hole diameter) of the intermediate portion in the thickness direction of the base 20K is narrower than the opening side. The through hole 22K includes a first through hole portion 220 and a second through hole portion 221 that communicate with each other. The first through-hole portion 220 is formed by blasting (for example, sand blasting) the base 20K from the upper surface to a predetermined depth. The second through-hole portion 221 is formed by blasting the base 20K from the lower surface to a predetermined depth.

The through wiring 12K includes a first wiring part 120 and a second wiring part 121 that are directly and electrically connected to each other. The first wiring part 120 is formed inside the first through hole part 220, and the second wiring part 121 is formed inside the second through hole part 221. Each

wiring part

120, 121 is formed by a conventionally known method such as an electroplating method or a sputtering method.

The through hole 22K and the through wiring 12K are produced as follows, for example. First, the first through hole 220 is formed by blasting the base 20K from the upper surface to a predetermined depth. Thereafter, the first wiring part 120 is formed inside the first through-hole part 220. Next, the second through-hole portion 221 is formed by blasting the base 20K to a predetermined depth from the lower surface until the first wiring portion 120 is exposed. Thereafter, the second wiring part 121 is formed inside the second through hole part 221. Thereby, the through hole 22K and the through wiring 12K shown in FIG. 21 can be obtained.

According to the wiring structure of the present embodiment described above, the transmission loss of the high-frequency signal can be reduced as in the case of Embodiment 2-1, and can be easily manufactured.

Furthermore, according to the wiring structure of the present embodiment, the change width of the diameter of the through hole 22 is smaller than that in the case where the through hole 22 of the base 20 is manufactured by blasting from one direction as in Embodiment 2-1. Can be small. Therefore, high frequency characteristics can be improved.

(Embodiment 3-1)
The wiring structure of the present embodiment is applied to a MEMS device including a base 20, a functional unit 30, and a cover 40 as shown in FIGS. 22 (a) to 22 (c), for example. In FIG. 22, the structure of the MEMS device is shown in a simplified manner in order to briefly explain the main points of the wiring structure of the present embodiment. In addition, the same code | symbol is attached | subjected to the structure same as the above-mentioned embodiment, and description is abbreviate | omitted. In FIGS. 22 to 29, the structure of the MEMS device is shown in a simplified manner in order to briefly explain the main points of the wiring structure of the present embodiment. That is, the base 20, the functional unit 30, the cover 40, and the like described in FIGS. 22 to 29 are applied to a portion surrounded by a dotted line G1 in FIG. The second edge 332 is defined by a pair of restricting protrusions 330 in the micro relay. However, in FIGS. 9 to 21, the pair of restricting protrusions 330 are described as a single unit, thereby representing the second edge 332.

As shown in FIGS. 22A to 22C, the ground line 11 is configured by a fourth shield, a fifth shield, and a sixth shield provided on the base 20, the functional unit 30, and the cover 40, respectively. The More specifically, the base 20 is provided with a first conductive portion 110C and a second conductive portion 111C. The first conductive part 110C and the second conductive part 111C define a fourth shield. The functional unit 30 includes a fourth conductive unit 113C and a fifth conductive unit 114C. The fourth conductive portion 113C and the fifth conductive portion 114C define a fifth shield. The cover 40 is provided with a third conductive portion 112C. The third conductive portion 112C defines a sixth shield.

Here, two grooves 24 C and 25 C are formed on the upper surface of the base 20. The groove 24 C is located on the left side of the signal wiring 10 in the base 20, and the groove 25 C is located on the right side of the signal wiring 10 in the base 20. The

grooves

24C and 25C are formed so as to be parallel to the signal wiring 10.

Such grooves

24C and 25C are formed by blasting the base 20 from the upper surface (for example, sand blasting). By using blasting in this way, the width of the

grooves

24C and 25C can be narrowed from the upper surface of the base 20 toward the lower surface.

The first conductive portion 110C is formed in the groove 24C of the base 20. More specifically, the groove 24C has a right inner surface 24R having a length along the length direction of the signal wiring 10, a left inner surface 24L, and a bottom surface 24B. The left inner surface 24L is located farther from the signal wiring 10 than the right inner surface 24R. In other words, the left inner surface 24L is separated from the signal wiring 10 by a first distance. The right inner surface 24R is separated from the signal wiring 10 by a second distance. The first distance is greater than the second distance. The first conductive portion 110C is provided on the left inner surface 24L and the bottom surface 24B. Similarly, the second conductive portion 111 C is formed in the groove 25 C of the base 20. More specifically, the groove 25C has a left inner side surface 25L having a length along the length direction of the signal wiring 10, a right inner side surface 25R, and a bottom surface 25B. The right inner surface 25R is located farther from the signal wiring 10 than the left inner surface 25L. In other words, the right inner surface 25R is separated from the signal wiring 10 by a first distance. The left inner surface 25L is separated from the signal wiring 10 by a second distance. The first distance is greater than the second distance. The second conductive portion 111C is provided on the right inner surface 25R and the bottom surface 25B.

The third conductive portion 112 C is formed in the lower surface region 40 U of the cover 40 facing the signal wiring 10. That is, the cover 40 has a lower surface region 40 U that faces the transmission line via the signal wiring 10 and the first opening 31. The third conductive portion 112C is provided in the lower surface region 40U. Here, the dimension of the first opening 31 in the length direction of the signal wiring 10 is larger than that of the signal wiring 10. The dimension of the first opening 31 in the width direction of the signal wiring 10 is such that the

grooves

24C and 25 of the base 20 face the cover 40 side.

The fourth conductive portion 113C and the fifth conductive portion 114 are provided on the first edge 331 and the second edge 332, respectively. The fourth conductive portion 113C is provided to electrically connect the first conductive portion 110C and the third conductive portion 112C. The fourth conductive portion 113 C is formed on the side surface of the first edge 331. The fifth conductive portion 114C is provided to electrically connect the second conductive portion 111C and the third conductive portion 112C. The fifth conductive portion 114C is formed on the side surface of the second edge 332. The fourth conductive portion 113C and the fifth conductive portion 114C are connected to the third conductive portion 112C when the cover 40 and the functional portion 30 are joined.

In the ground line 11, the first conductive portion 110C is connected to the third conductive portion 112C via the fourth conductive portion 113C, and the second conductive portion 111C is connected to the third conductive portion 114C via the fifth conductive portion 114C. Each part 112C is electrically connected. That is, the conductive portions 110C to 114C are electrically connected to each other. At least one of the conductive portions 110C to 114C is connected to the ground (reference potential point). Note that each of the conductive portions 110C to 114C can be formed by a conventionally known method such as an electroplating method or a sputtering method, and thus the description thereof is omitted.

As described above, according to the wiring structure of the present embodiment, since the ground line 11 surrounds the signal wiring 10 in a plane intersecting the length direction of the signal wiring 10, a pseudo coaxial structure is formed. can get. Therefore, transmission loss of high frequency signals can be reduced.

Further, as described above, the ground line 11 is constituted by the first to fifth conductive portions 110C to 114C. The first and second conductive portions 110C to 111C are connected to the base 20 and the third conductive portion. 112C is formed in the cover 40, and the fourth and fifth

conductive portions

113C and 114C are formed in the functional portion 30.

As described above, according to the wiring structure of the present embodiment, when the ground line 11 is manufactured, not only the base 20 of the MEMS device but also the functional unit 30 and the cover 40 are used. Therefore, it is not necessary to produce a laminated body such as a semiconductor layer, an insulating layer, or a conductive layer in order to obtain a three-dimensional structure, compared to a case where the ground line 11 is produced using only the base 20. Thus, it can be easily manufactured.

Here, in applying the wiring structure of the present embodiment, the above-described

grooves

24C and 25C are formed on both sides of the signal wiring 10 in the length direction of the base 20.

Then, the conductive portions 110C to 114C constituting the ground line 11 are formed as follows. First, the first conductive portion 110C is formed inside the groove 24C, and the second conductive portion 111C is formed inside the groove 25C. Further, the third conductive portion 112 C is formed in the cover 40. Further, the fourth conductive portion 113 C is formed on the left side of the first opening 31 of the functional unit 30, and the fifth conductive portion 114 is formed on the right side of the signal wiring 10 in the first opening 31.

Such a ground line 11 can be formed corresponding to each of the four signal wirings 10 provided on the base 20.

And according to the microrelay provided with the wiring structure of this embodiment, the transmission loss of the high-frequency signal can be reduced and can be easily manufactured. The operation of this micro relay is well known in the art and will not be described.

Incidentally, in the micro relay described above, the driving device 50 is provided on the cover 40. Therefore, the thickness of the base 20 can be reduced as compared with the case where the driving device 50 is provided on the base 20. Therefore, the through hole 22 for drawing out the signal wiring 10 to the lower surface of the base 20 can be shortened, and high frequency characteristics can be improved. Further, since the distance between the driving device 50 and the signal wiring 10 can be increased, the possibility that the signal wiring 10 is adversely affected by the magnetic field generated by the driving device 50 can be reduced.

Embodiment 3-2
In the wiring structure of the present embodiment, the base 20 is different from that of the embodiment 3-1, as shown in FIG. Since the other configuration of the present embodiment is the same as that of the embodiment 3-1, the description of the same configuration as that of the embodiment 3-1 is omitted.

The base 20 in this embodiment is formed of a glass substrate as in the embodiment 3-1. Further, the external terminal 13, the through hole 22, and the through wiring 12 are formed in the base 20 as in the case of the embodiment 3-1. However, in the base 20 in the present embodiment, as shown in FIG. 23, the through hole 22 and the through wiring 12 are different from those in the embodiment 3-1.

The through hole 22 in the present embodiment is formed such that the diameter (hole diameter) of the intermediate portion in the thickness direction of the base 20 is narrower than the opening side. Such a through hole 22 is composed of a first hole 220 and a second hole 221. Here, the first hole 220 is formed by blasting the base 20 from the one surface side to a predetermined depth. On the other hand, the second hole 221 is formed by blasting the base from the other surface side to a predetermined depth. In addition, as a blasting process, a sandblasting process is employable, for example.

Further, the through wiring 12 in the present embodiment includes a first wiring part 230 and a second wiring part 231. The first wiring part 230 is formed inside the first hole part 220, and the second wiring part 231 is formed inside the second hole part 221. In addition, each wiring part 230,231 can be formed by conventionally well-known methods, such as an electroplating method and a sputtering method.

For example, the through hole 22 and the through wiring 12 are manufactured as follows. First, the first hole 220 is formed by blasting the base 20 from the upper surface to a predetermined depth. Thereafter, the first wiring part 230 is formed inside the first hole part 220. Thereafter, the second hole 221 is formed by blasting the base 20 to a predetermined depth from the other surface side until the first wiring part 230 is exposed. Thereafter, the second wiring part 231 is formed inside the second hole part 221. Thereby, the through hole 22 and the through wiring 12 shown in FIG. 23 can be obtained.

As described above, according to the wiring structure of the present embodiment, transmission loss of high-frequency signals can be reduced as in the case of Embodiment 3-1. Further, it can be easily manufactured.

Furthermore, according to the wiring structure of the present embodiment, compared to the case where the through hole 22 of the base 20 is manufactured by blasting from one direction as in Embodiment 3-1, the change width of the diameter of the through hole 22 is reduced. Can be small. Therefore, high frequency characteristics can be improved. Since the wiring structure of the present embodiment has the same ground line 11 as that of Embodiment 3-1, the transmission loss of the high-frequency signal can be reduced and can be easily manufactured.

Embodiment 3-3
24A to 24C show the wiring structure of this embodiment. In the wiring structure of the present embodiment, the base 20 and the ground line 11 are mainly different from the embodiment 3-1. Since the other configuration of the present embodiment is the same as that of the embodiment 3-1, the description of the same configuration as that of the embodiment 3-1 is omitted.

The base 20 in this embodiment is not a glass substrate, but is formed of a low temperature co-fired ceramic substrate (LTCC substrate). Here, unlike the glass substrate, the internal wiring can be easily formed on the low-temperature co-fired ceramic substrate. Therefore, the sixth conductive portion 115C is provided on the ground line 11 by utilizing the characteristics of such a low-temperature co-fired ceramic substrate.

That is, the ground line 11 in this embodiment includes a sixth conductive portion 115C in addition to the first to fifth conductive portions 110C to 114C described above. The sixth conductive portion 115C is disposed inside the base 20 so as to electrically connect the first conductive portion 110C and the second conductive portion 111C. That is, the sixth conductive portion 115 C is an internal wiring of the base 20. Note that the sixth conductive portion 115C can be formed using a conventionally known method, and thus detailed description thereof is omitted.

Also, if a low-temperature co-fired ceramic substrate is used for the base 20, unlike the case where a glass substrate is used, holes having a uniform diameter can be easily formed. Utilizing such characteristics of the low-temperature co-fired ceramic substrate, the through hole 22 in the present embodiment has a constant diameter in the thickness direction of the base 20, as shown in FIGS. 24 (a) and 24 (c). Is formed. Therefore, the through wiring 12 in the present embodiment is formed in a shape having a constant diameter in the thickness direction of the base 20, similarly to the through hole 22. In the present embodiment, the signal wiring 10 is electrically connected to the external terminal 13 through such a through wiring 12.

As described above, according to the wiring structure of the present embodiment, transmission loss of high-frequency signals can be reduced as in the first embodiment. Further, it can be easily manufactured.

Furthermore, by providing the sixth conductive portion 115C in the ground line 11, the shape of the ground line 11 in the plane intersecting the length direction of the signal wiring 10 can be brought close to an annular shape. Therefore, the high frequency characteristics can be further improved. Moreover, since the base 20 is formed of a low-temperature co-fired ceramic substrate, the workability can be improved as compared with the case where the base 20 is made of a glass substrate. Therefore, the sixth conductive portion 115C made of the internal wiring as described above can be easily formed. Furthermore, in the wiring structure of the present embodiment, the through hole 22 is formed in a shape having a constant diameter in the thickness direction of the base 20. Therefore, the high frequency characteristics can be improved as compared with the case where the diameter of the through hole 22 increases from the upper surface to the lower surface of the base 20.

Embodiment 3-4
FIG. 25 shows the wiring structure of this embodiment. In the wiring structure of the present embodiment, the base 20 is mainly different from the embodiment 3-1. Since the other configuration of the present embodiment is the same as that of the embodiment 3-1, the description of the same configuration as that of the embodiment 3-1 is omitted.

In the base 20 in this embodiment, as shown in FIGS. 25A and 25B, one recess 28 is formed instead of the two

grooves

24C and 25C. The recess 28 is formed in a rectangular shape. Such a recess 28 can be formed using a known technique such as blasting, for example.

Also, a support 29 is attached to the upper surface of the base 20. The support 29 is, for example, a thin plate such as a silicon plate or a glass plate formed to have a thickness of about 5 to 50 μm (preferably about 20 μm). The outer size of the support 29 is larger than the opening size of the recess 28. Such a support 29 is bonded to the upper surface of the base 20 so as to cover (close) the recess 28.

The signal wiring 10 in the present embodiment is formed on the opposite side of the support 29 from the recess 28 side. Further, the signal wiring 10 is formed so as to straddle the recess 28, and the portions on both ends in the width direction of the signal wiring 10 in the base 20 are located on the other surface side than the signal wiring 10. Both end portions of the signal wiring 10 in the length direction are electrically connected to the external terminals 13 through the through wiring 12.

Further, the ground line 11 in the present embodiment includes the first to sixth conductive portions 110C to 115C as in the embodiment 3-3. The first conductive portion 110 C, the second conductive portion 111 C, and the sixth conductive portion 115 C in the present embodiment are formed in the recess 28 of the base 20. More specifically, the first conductive portion 110 C is formed on the left inner surface and bottom surface of the recess 28. On the other hand, the second conductive portion 111 C is formed on the right inner surface and bottom surface of the recess 28. The sixth conductive portion 115 C is formed on the bottom surface of the recess 28. By the sixth conductive portion 115C, the first conductive portion 110C and the second conductive portion 111C are electrically connected. In addition, in FIG. 25 (a), (b), illustration of the function part 30 and the cover 40 is abbreviate | omitted. Also, the first conductive portion 110C and the fourth conductive portion 113C are electrically connected using a through-hole wiring (not shown), a surface wiring (not shown), etc. formed in the support 29. The The same applies to the second conductive portion 111C and the fifth conductive portion 114.

As described above, according to the wiring structure of the present embodiment, transmission loss of high-frequency signals can be reduced as in the case of Embodiment 3-1. Further, it can be easily manufactured. In particular, according to the wiring structure of this embodiment, a space is formed between the signal wiring 10 and the base 20. Therefore, the high frequency characteristics can be improved as compared with the case where the signal wiring 10 is formed directly on the upper surface of the base 20.

The support 29 described above may be formed in a shape as shown in FIGS. 26 (a) and 26 (b), for example. A support 29 shown in FIG. 26 includes a frame portion 290 having a rectangular frame shape and a cross bar 291. The frame part 290 has a length along the length direction of the signal wiring 10. Thereby, the support body 29 has an opening window having a length along the length direction of the cross bar 291. The support 29 is joined to the upper surface of the base 20 so that the opening window of the frame portion 290 communicates with the recess 28. In addition, the cross bar 291 integrally connects the inner edge portions on both ends in the longitudinal direction of the frame portion 290 at the center portion. The cross bar 291 is separated from both edges in the width direction of the frame 290. In the example shown in FIG. 26, the signal wiring 10 is formed so as to straddle the opening of the frame portion 290 through the cross bar 291. Therefore, the signal wiring 10 is provided along the length direction of the cross bar 291.

26, the space surrounded by the cross bar 291 and the frame portion 290 constitutes a hole 292 that penetrates the support 29 in the thickness direction. The hole 292 is formed in parallel with the signal wiring 10.

In the example shown in FIG. 26 described above, the insulating property between the signal wiring 10 and the base 20 is further improved by forming the hole 292. Therefore, the high frequency characteristics can be further improved. In particular, since the hole 292 is formed in parallel with the signal wiring 10, the wiring structure becomes closer to the coaxial structure. Therefore, the high frequency characteristics can be further improved.

By the way, in the support body 29 shown in FIG. 26, when the cross bar 291 becomes longer, the mechanical strength of the cross bar 291 becomes lower. For this reason, the cross bar 291 may be damaged. Therefore, as shown in FIGS. 27A and 27B, the support 29 may be provided with a pair of auxiliary cross bars 293. In the example shown in FIG. 27, the pair of auxiliary cross bars 293 integrally connect the center portion of the cross bar 291 and the inner edge portions of both ends of the frame portion 290 in the short direction. In such a support 29 shown in FIG. 27, the auxiliary crossbar 293 can prevent the crossbar 291 from being damaged.

Embodiment 3-5
In the wiring structure of the present embodiment, the functional unit 30 is mainly different from the embodiment 3-1. Since the other configuration of the present embodiment is the same as that of the embodiment 3-1, the description of the same configuration as that of the embodiment 3-1 is omitted.

As shown in FIGS. 28A to 28C, the functional unit 30 in the present embodiment includes a first hole 37 that penetrates the functional unit 30 in the thickness direction (hereinafter denoted by reference numeral 37A as necessary). And a second hole portion 37 (hereinafter, indicated by reference numeral 38B as necessary). A plurality of first holes 37 A (seven in the illustrated example) are formed on the first edge 331 located on the left side of the transmission line 10. The plurality of first hole portions 37 A are arranged at equal intervals along the length direction of the signal wiring 10. A plurality of second holes 37 B (seven in the illustrated example) are formed on the second edge 332 located on the right side of the signal wiring 10. The plurality of holes 37 B are arranged at equal intervals along the length direction of the signal wiring 10. As described above, a plurality of holes 37 A and 37 B are formed along the length direction of the signal wiring 10 around the opening 31 of the functional unit 30 in the present embodiment.

The ground line 11 in the present embodiment is different from the embodiment 3-1 in the fourth conductive portion 113C and the fifth conductive portion 114. In other words, the fourth conductive portion 113C in the present embodiment is formed inside each of the plurality of hole portions 37A, and the fifth conductive portion 114 is formed inside each of the plurality of hole portions 37B. The third conductive portion 112C is formed such that both end portions in the direction along the width direction of the signal wiring 10 overlap with the first conductive portion 110C and the second conductive portion 111C in the thickness direction. Yes. When the cover 40 and the functional unit 30 are joined, each hole 37A faces the third conductive portion 112C from the opening on the cover 40 side, and the first conductive portion 110C faces from the opening on the base 20 side. Provided in position. In addition, when the cover 40 and the functional unit 30 are joined, each hole portion 37B faces the third conductive portion 112C from the opening on the cover 40 side, and the second conductive portion 111C faces from the opening on the base 20 side. Provided in position. Therefore, when the cover 40 and the functional unit 30 are joined, the first conductive unit 110C and the third conductive unit 112C are electrically connected by the fourth conductive unit 113C, and the second conductive unit 111C. And the third conductive portion 112C are electrically connected by the fifth conductive portion 114.

Furthermore, in the wiring structure of the present embodiment, a plurality of holes 37 that penetrate the functional unit 30 in the thickness direction are formed around the first opening 31 of the functional unit 30 along the length direction of the signal wiring 10. . The fourth conductive portion 113 C and the fifth conductive portion 114 of the ground line 11 are formed inside the hole portion 37. Therefore, according to the wiring structure of the present embodiment, compared with the case where the fourth conductive portion 113C and the fifth conductive portion 114 are formed on the inner surfaces of the first edge 331 and the second edge 332, respectively, The fourth conductive portion 113C and the fifth conductive portion 114 can be easily formed. In addition, although the cross section of the hole part 37 in this embodiment is a perfect circle shape, this is an example to the last. Moreover, although seven each of the

hole portions

37A and 37B are formed, this is only an example. The configuration of the present embodiment can also be applied to the other embodiments 3-2 to 3-4 other than the embodiment 3-1.

Embodiment 3-6
In the wiring structure of the present embodiment, the functional unit 30 is mainly different from the embodiment 3-1. Since the other configuration of the present embodiment is the same as that of the embodiment 3-1, the description of the same configuration as that of the embodiment 3-1 is omitted.

The functional unit 30 in the present embodiment includes a connection slit 38A and a connection slit 38B that penetrate the functional unit 30 in the thickness direction, as shown in FIGS. 29 (a) to 29 (c). The connection slit 38 A is formed on the first edge 331 of the frame 33. The connection slit 38 B is formed on the second edge 332 of the frame 33. Further, each of the connection slits 38 A and 38 B is formed along the length direction of the signal wiring 10. As described above, the functional unit 30 of the present embodiment has the first edge 331, and the first edge 331 is formed with the connection slit 38 A, and the connection slit 38 A is connected to the signal wiring 10. Along the length direction. Similarly, the functional unit 30 of the present embodiment has a second edge 332, and a connection slit 38 B is formed on the second edge 332, and this connection slit 38 B is the length of the signal wiring 10. Along the direction.

The ground line 11 in this embodiment is different from Embodiment 3-1 in the fourth conductive portion 113C and the fifth conductive portion 114C. That is, the fourth conductive portion 113C in the present embodiment is formed inside the connection slit 38A, and the fifth conductive portion 114C is formed inside the connection slit 38B. The third conductive portion 112C is formed such that both end portions in the direction along the width direction of the signal wiring 10 overlap each of the first conductive portion 110C and the second conductive portion 111C in the thickness direction. Yes. The connection slit 38 A is a position where the third conductive portion 112 C faces the opening on the cover 40 side and the first conductive portion 110 C faces the opening on the base 20 side when the cover 40 and the functional portion 30 are joined. Is provided. The connection slit 38B is a position where the third conductive portion 112C faces the opening on the cover 40 side and the second conductive portion 111C faces the opening on the base 20 side when the cover 40 and the functional portion 30 are joined. Is provided. Therefore, when the cover 40 and the functional unit 30 are joined, the first conductive unit 110C and the third conductive unit 112C are electrically connected by the fourth conductive unit 113C, and the second conductive unit 111C. And the third conductive portion 112C are electrically connected by the fifth conductive portion 114.

Furthermore, in the wiring structure of the present embodiment, connection slits 38 A and 38 B that penetrate the functional unit 30 in the thickness direction are formed around the first opening 31 of the functional unit 30 along the length direction of the signal wiring 10. ing. The fourth conductive portion 113C and the fifth conductive portion 114 of the ground line 11 are formed inside the connection slits 38A and 38B. Therefore, according to the wiring structure of the present embodiment, the fourth conductive portion 113 C and the fifth conductive portion 114 are formed on the inner surface of the first opening 31 of the functional unit 30, compared to the case where the fourth conductive portion 113 C is formed. The portion 113C and the fifth conductive portion 114 can be easily formed. Further, as in the embodiment 3-5, the hole 37 is formed around the first opening 31 of the functional unit 30, and the fourth conductive portion 113C and the fifth conductive portion 114 are formed in the hole 37. Compared to the case, the high frequency characteristics can be improved.

The individual features shown in the above embodiments can be arbitrarily combined.

Claims

A wiring structure of a MEMS device including a transmission line for transmitting a high-frequency signal on an upper surface of a base,
The base has an upper surface ground electrode electrically insulated from the transmission line on the upper surface, and the upper surface ground electrode surrounds the periphery of the transmission line,
The base includes a through wiring disposed inside a through hole formed along the thickness direction, and the through wiring is electrically connected to the transmission line,
The base has, on its lower surface, an external terminal electrically connected to the through wiring and a lower surface ground electrode electrically insulated from the external terminal, and the lower surface ground electrode is the external terminal. Enclose
The base includes a first shield formed along a thickness direction of the base and electrically insulated from the through wiring, and the first shield surrounds the periphery of the through wiring. Are located in
The wiring structure according to claim 1, wherein the first shield is electrically connected to at least one of the upper surface ground electrode and the lower surface ground electrode.
The base has a plurality of the first shields,
The plurality of first shields are arranged along a circle surrounding the through-wiring, and are separated from a neighboring first shield by a predetermined distance,
The high-frequency signal has a first signal having the highest frequency;
The wiring structure according to claim 1, wherein the predetermined distance is a length less than ¼ of the wavelength of the first signal.
The base further includes a second shield, and the second shield is provided inside the base so as to overlap the transmission line in the thickness direction of the base.
The upper end of the second shield is separated from the transmission line, thereby being electrically insulated from the transmission line,
The wiring structure according to claim 1, wherein a lower end of the second shield is electrically connected to the lower surface ground electrode.
The base further has an extraction wiring on the lower surface thereof, and the extraction wiring is electrically connected to the through wiring,
The external terminal is connected to the through wiring through the extraction wiring,
The base further includes a third shield, and the third shield overlaps the extraction wiring in the thickness direction of the base,
The lower end of the third shield is separated from the extraction wiring, and is thereby electrically insulated from the extraction wiring,
The wiring structure according to claim 1, wherein an upper end of the third shield is electrically connected to the upper surface ground electrode.
The wiring structure according to claim 1, wherein the first shield is formed along a circle surrounding the through wiring.
The wiring structure according to claim 1, wherein the base includes a fourth shield that covers a lower portion of the transmission line.
The base has a first hole and a second hole penetrating in the thickness direction of the base, and each of the first hole and the second hole is in the width direction of the transmission line. Has a width along
The transmission line is located between the first hole and the second hole,
The base further includes a first conductor, a second conductor, and a third conductor,
The first conductor and the second conductor are provided in the first hole and the second hole, respectively.
The third conductor is provided on the lower surface of the base so as to overlap the transmission line in the thickness direction of the base, and is electrically connected to each of the first conductor and the second conductor. The first conductor constitutes the fourth shield in cooperation with the second conductor and the third conductor;
The wiring structure according to claim 6, wherein widths of lower ends of the first hole portion and the second hole portion are larger than widths of upper ends of the first hole portion and the second hole portion, respectively. .
The wiring structure according to claim 7, wherein each of the first hole and the second hole is formed in a slit shape and is formed along the transmission line.
The base has a plurality of the first holes and a plurality of the second holes,
Each of the first hole and the second hole is arranged at a predetermined interval along the length direction of the transmission line,
The wiring structure according to claim 7, wherein the predetermined interval is less than ¼ of a wavelength of a signal having the highest frequency among the high frequencies.
The upper surface ground electrode includes a fourth conductor and a fifth conductor formed on the upper surface of the base, and the fourth conductor surrounds the transmission line in cooperation with the fifth conductor,
The wiring structure according to claim 7, wherein the fourth conductor and the fifth conductor are electrically connected to the first conductor and the second conductor.
The MEMS device further includes a functional unit provided on the base, a cover provided on the functional unit, and a fifth shield and a sixth shield provided on each of the functional unit and the cover. And
The wiring structure according to claim 7, wherein the fourth shield surrounds the transmission line in cooperation with the fifth shield and the sixth shield.
The wiring structure according to claim 11, wherein the functional part is joined to the base by the upper surface ground electrode.
The base has a hole formed on the upper surface thereof,
All the said transmission lines are arrange | positioned at the bottom of the said hole, The wiring structure of Claim 6 characterized by the above-mentioned.
The wiring structure according to claim 7, wherein the width of the first hole and the second hole increases stepwise from the upper surface to the lower surface of the base.
The functional part has a frame, thereby having an opening,
The transmission line is arranged to be located inside the frame,
The cover has a lower surface region facing the transmission line through the opening,
The wiring structure according to claim 7, wherein the frame has a first edge and a second edge extending along a length direction of the transmission line.
The frame is provided with a sixth conductor and a seventh conductor at the first edge and the second edge, and the sixth conductor cooperates with the seventh conductor. Defining the fifth shield;
The sixth conductor and the seventh conductor are electrically connected to the first conductor and the second conductor, respectively.
The cover is provided with an eighth conductor in the lower surface region, the eighth conductor defines the sixth shield, and the eighth conductor includes the sixth conductor and the seventh conductor. The wiring structure according to claim 15, wherein the wiring structure is electrically connected to both.
Each of the first edge and the second edge is formed with a connection hole formed penetrating along the thickness direction of the frame,
The wiring structure according to claim 16, wherein the sixth conductor and the seventh conductor are provided in the plurality of connection holes, respectively.
Each of the first edge and the second edge is formed with a connection slit, and the connection slit is formed through the thickness direction of the frame and the transmission line Has a length along the length direction,
The wiring structure according to claim 16, wherein the sixth conductor and the seventh conductor are respectively provided inside the connection slit.
The MEMS device further includes a functional unit provided on the base,
The functional part is provided with a fifth shield, and the fifth shield has a length along the length direction of the transmission line,
The wiring structure according to claim 7, wherein the fourth shield surrounds the periphery of the transmission line in cooperation with the fifth shield.
The functional unit has a first recess having a length along a length direction of the transmission line on a lower surface thereof, and the length of the first recess is larger than the length of the transmission line. big,
The recess has a first inner surface and a second inner surface formed along the length direction of the transmission line, and a bottom surface.
The functional section includes a sixth conductor and a seventh conductor on the first inner surface and the second inner surface, respectively, and an eighth conductor on the bottom surface of the first recess. And
The sixth conductor, the seventh conductor, and the eighth conductor define the fifth shield;
The sixth conductor and the seventh conductor are electrically connected to the first conductor and the second conductor, respectively, and the eighth conductor is the sixth conductor and the seventh conductor, respectively. The wiring structure according to claim 19, wherein the wiring structure is electrically connected to a conductor.
The functional part is further formed with a second recess, and the second recess is formed at the bottom of the first recess,
The wiring structure according to claim 20, wherein the second recess is located at a position facing the transmission line.
The base has a recess formed on the upper surface thereof, and has a support body disposed on the base so as to overlap the recess.
The recess has a width greater than the width of the transmission line;
The transmission line is disposed on the support;
The first hole and the second hole are formed so as to penetrate from the bottom surface of the recess to the lower surface of the base,
The recess has a first inner surface and a second inner surface formed along the length direction of the transmission line,
The base is provided with a ninth conductor and a tenth conductor on the first inner surface and the second inner surface, respectively.
The ninth conductor is electrically connected to the first conductor and the sixth conductor;
The wiring structure according to claim 7, wherein the tenth conductor is electrically connected to the second conductor and the seventh conductor.
The support includes a frame portion and a crossbar,
The frame portion has a length along the length direction of the transmission line,
The crossbar is separated from both edges in the width direction of the frame portion and is connected to both edges in the length direction of the frame portion, whereby opening windows are formed on both sides of the crossbar,
The wiring structure according to claim 22, wherein the transmission line is disposed along the crossbar.
The base has a groove formed on the upper surface thereof, and the groove is provided on each side of the transmission line.
The groove is along the length direction of the transmission line, and has a first inner surface, a second inner surface, and a bottom surface along the length direction of the transmission line. The inner surface of 2 is located away from the first inner surface from the transmission line,
The base is provided with a first conductive portion and a second conductive portion on each of the second inner side surface and the bottom surface, and the first conductive portion and the second conductive portion are configured to connect the fourth shield. The wiring structure according to claim 6, wherein the wiring structure is defined.
The MEMS device further includes a functional unit provided on the base, a cover provided on the functional unit, and a fifth shield and a sixth shield provided on each of the functional unit and the cover. And
The wiring structure according to claim 24, wherein the fourth shield surrounds the transmission line in cooperation with the fifth shield and the sixth shield.
The functional part has a frame, thereby having an opening,
The transmission line is arranged to be located inside the frame,
The cover has a lower surface region facing the transmission line through the opening,
The cover is provided with a third conductive portion in the lower surface region, and the third conductive portion defines the sixth shield,
The frame has a first edge and a second edge extending along a length direction of the transmission line;
The frame is provided with a fourth conductive portion and a fifth conductive portion on the first edge and the second edge, respectively, and the fourth conductive portion and the fifth conductive portion are connected to the fifth shield. Define
The fourth conductive part is electrically connected to the first conductive part and the third conductive part,
26. The wiring structure according to claim 25, wherein the fifth conductive portion is electrically connected to the second conductive portion and the third conductive portion.
The base further includes a sixth conductive portion,
The wiring structure according to claim 24, wherein the sixth conductive portion is disposed inside the base so as to be electrically connected to the first conductive portion and the second conductive portion.
The base has a recess formed on an upper surface thereof, and has a support body disposed on the base so as to overlap the recess.
The recess is provided with a conductive portion on its inner surface,
The recess has a width greater than the width of the transmission line;
The wiring structure according to claim 6, wherein the transmission line is disposed on the support.
The support includes a frame portion and a crossbar,
The frame portion has a length along the length direction of the transmission line,
The crossbar is separated from both edges in the width direction of the frame portion and is connected to both edges in the length direction of the frame portion, whereby opening windows are formed on both sides of the crossbar,
The wiring structure according to claim 28, wherein the transmission line is arranged along the crossbar.
30. The wiring structure according to claim 23 or 29, wherein each opening window has a shape along a length direction of the transmission line.
A plurality of holes penetrating in the thickness direction of the frame are formed in each of the first edge and the second edge, and the plurality of holes extend along the length direction of the transmission line. Are arranged,
27. The wiring structure according to claim 26, wherein the fourth conductive portion and the fifth conductive portion are provided in the hole portion.
A connection slit is formed in each of the first edge and the second edge, and the connection slit is formed through the thickness direction of the frame and the transmission line Has a length along the length direction,
27. The wiring structure according to claim 26, wherein the fourth conductive portion and the fifth conductive portion are provided in the connection slit, respectively.
A micro relay comprising the base, the functional unit, and the cover,
The micro relay has an electromagnet device,
The base has a pair of transmission lines and a pair of fixed contacts, and the pair of fixed contacts are electrically connected to each of the pair of transmission lines,
The functional unit further includes an armature, the armature includes a movable plate, a magnetic plate, and a movable contact, and the magnetic plate is attached to the movable plate, and the movable contact is It is arranged on the movable plate so as to face the pair of fixed contacts,
The armature is disposed inside the frame so that the movable plate can move between a first position and a second position, and when the movable plate is positioned at the first position, the movable arm is A contact is in contact with both fixed contacts, and the blade is moved away from both of the fixed contacts when the movable plate is in the second position;
The electromagnet device is provided on the cover and includes a coil and a pair of coil terminals for supplying current to the coil, and the coil is supplied with current via the coil terminal. 12. The microrelay having a wiring structure according to claim 11, wherein a magnetic field that sometimes moves the magnetic plate is generated, thereby moving the movable plate to the first position or the second position.