WO2010071314A2 - Marble chips for an artificial marble, manufacturing method thereof, and artificial marble comprising same - Google Patents

Marble chips for an artificial marble, manufacturing method thereof, and artificial marble comprising same Download PDF

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Publication number
WO2010071314A2
WO2010071314A2 PCT/KR2009/007275 KR2009007275W WO2010071314A2 WO 2010071314 A2 WO2010071314 A2 WO 2010071314A2 KR 2009007275 W KR2009007275 W KR 2009007275W WO 2010071314 A2 WO2010071314 A2 WO 2010071314A2
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WO
WIPO (PCT)
Prior art keywords
acrylate
meth
marble
chip
resin composition
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Application number
PCT/KR2009/007275
Other languages
French (fr)
Korean (ko)
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WO2010071314A3 (en
Inventor
손창호
Original Assignee
제일모직 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제일모직 주식회사 filed Critical 제일모직 주식회사
Priority to AU2009327752A priority Critical patent/AU2009327752B2/en
Priority to RU2011126658/05A priority patent/RU2488562C2/en
Priority to CN2009801504402A priority patent/CN102245681B/en
Priority to JP2011540602A priority patent/JP5400169B2/en
Priority to EP09833592.0A priority patent/EP2377896B1/en
Publication of WO2010071314A2 publication Critical patent/WO2010071314A2/en
Publication of WO2010071314A3 publication Critical patent/WO2010071314A3/en
Priority to US13/151,713 priority patent/US8759420B2/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/12Powdering or granulating
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/14Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C09J133/16Homopolymers or copolymers of esters containing halogen atoms
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B14/00Use of inorganic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of inorganic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
    • C04B14/02Granular materials, e.g. microballoons
    • C04B14/26Carbonates
    • C04B14/28Carbonates of calcium
    • C04B14/285Marble
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B16/00Use of organic materials as fillers, e.g. pigments, for mortars, concrete or artificial stone; Treatment of organic materials specially adapted to enhance their filling properties in mortars, concrete or artificial stone
    • C04B16/04Macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B26/00Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
    • C04B26/02Macromolecular compounds
    • C04B26/04Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B26/06Acrylates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B26/00Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
    • C04B26/02Macromolecular compounds
    • C04B26/04Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C04B26/08Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds containing halogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/54Substitutes for natural stone, artistic materials or the like
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/54Substitutes for natural stone, artistic materials or the like
    • C04B2111/542Artificial natural stone
    • C04B2111/545Artificial marble

Definitions

  • the present invention relates to a marble chip for artificial marble, a manufacturing method thereof and an artificial marble comprising the same. More specifically, the present invention by applying a binder containing a halogenated alkoxylated diacrylate oligomer to the marble chip expressing the pattern of artificial marble, has excellent bonding strength with the base material and the same or similar specific gravity and the same or similar wear with the base material.
  • the present invention relates to a marble chip having characteristics, high specific gravity, high refractive index, and high transparency, and an artificial marble comprising the same.
  • artificial marble is divided into two types, acrylic and unsaturated polyester, depending on the resin (resin).
  • Acrylic acrylic marble has characteristics such as excellent appearance, soft texture, excellent weather resistance, etc., and the demand for various top plates and interior materials is continuously increasing.
  • Acrylic artificial marble is a syrup mixed with a monomer such as methyl methacrylate and polymethyl methacrylate, and a marble chip that implements an inorganic filler, color, and pattern is mixed with a polymerization initiator. After dissolution, it is usually produced by casting at an appropriate temperature.
  • the marble chip may be hardened into a plate by a method similar to acrylic artificial marble, and then crushed to obtain various particle sizes.
  • An acrylic material which is the same material as the matrix, is usually used.
  • Artificial marble using a transparent marble chip that has been commercialized to date is manufactured using polymethyl methacrylate (PMMA) resin or unsaturated polyester resin as a marble chip.
  • PMMA polymethyl methacrylate
  • the transparent chips made of PMMA-based resins or unsaturated polyester resins have a specific gravity of 1.15 to 1.24, which is lower than the specific gravity of the matrix, so that when the artificial marble is manufactured, all the transparent chips float to the upper layer so that the surface layer is completely absent.
  • a transparent chip does not exist or uniform chip distribution is impossible.
  • to manufacture the artificial marble having a transparent chip distribution on the surface portion has the disadvantage that the amount of use of the chip more than about twice the base material, there is another problem that is difficult to adjust the thickness of the artificial marble.
  • an inorganic filler such as aluminum trihydrate, barium sulfate, silica, or the like should be added.
  • transparency is significantly lowered.
  • engineered stone in the form of engineered stone which can be manufactured using natural silica minerals such as quartz, silica sand, and crystal, or transparent chips such as vitrified silica compounds such as glass or molten glass, Although there is an advantage in chip transparency, it cannot be produced in the production of acrylic artificial marble which is a conventional continuous production method due to problems such as chip settling and chip sanding properties.
  • the reason is that the MOS hardness of the acrylic compound as the base material and the silica and the silica compound as the chip showing the pattern or the pattern is different, so that the smoothness does not come out due to the difference in the sanding properties after the plate is manufactured.
  • the transparent chip of artificial marble should not only have a high refractive index but also adjust specific gravity to the same or similar to the base material so that the chip does not sink without regard to the molding time so that it can have a constant pattern regardless of the hardening time. It is required to have the same abrasiveness and to satisfy both flatness and smoothness after the manufacture of artificial marble.
  • the present inventors harden the binder containing a halogenated alkoxylated diacrylate oligomer, and the resin composition containing a reactive monomer, and are excellent in binding force with a base material, and are the same or similar specific gravity as a base material. Or, it is to develop a marble chip having similar wear characteristics, high specific gravity, high refractive index, and high transparency and artificial marble using the same.
  • An object of the present invention is to provide a marble chip having a specific gravity of 1.45 to 1.75 and a manufacturing method thereof.
  • Another object of the present invention is to provide a marble chip and a method of manufacturing the same which can realize a uniform pattern regardless of curing time or molding time.
  • Still another object of the present invention is to provide a marble chip having excellent transparency and refractive index and a method of manufacturing the same.
  • Still another object of the present invention is to provide a marble chip having excellent bonding force with a base material and a method of manufacturing the same.
  • Another object of the present invention is to provide a marble chip and a method for manufacturing the same that can exhibit a three-dimensional texture.
  • Still another object of the present invention is to provide a marble chip having excellent chemical resistance and a manufacturing method thereof.
  • Still another object of the present invention is to provide an artificial marble that can have the same appearance and texture as the engineered stone by applying the marble chip.
  • Still another object of the present invention is to provide an artificial marble capable of continuous production by applying the marble chip.
  • Still another object of the present invention is to provide an artificial marble having excellent thermal workability by applying the marble chip.
  • Still another object of the present invention is to provide an artificial marble having excellent smoothness by applying the marble chip.
  • the marble chip is formed by curing a resin composition comprising a binder and a reactive monomer, and the binder includes a halogenated alkoxylated di (meth) acrylate oligomer.
  • the resin composition may include 50 to 90 parts by weight of the binder and 10 to 50 parts by weight of the reactive monomer.
  • the binder may further include a halogenated urethane acrylate or a halogenated epoxy acrylate, and a mixture thereof may also be included.
  • the number average molecular weight of the halogenated urethane acrylate may be 900 to 4,000.
  • the number average molecular weight of the halogenated epoxy acrylate may be 600 to 3,500.
  • the reactive monomers are aromatic vinyl monomers, aromatic divinyl monomers, dimers thereof, alkyl or halogen substituted aromatic vinyl monomers, C 1 -C 20 alkyl (meth) acrylates, C 6 -C 20 aryl (meth) Acrylates, hydroxy-containing (meth) acrylates, glycidyl (meth) acrylates, C 6 -C 20 arylphthalates, C 6 -C 20 arylcarbonates, and the like.
  • the reactive monomer may be a styrene monomer, bromo styrene, vinyltoluene, methyl (meth) acrylate, ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, oxyl (meth) acrylate, and dodecyl.
  • the resin composition may further include an additive selected from the group consisting of colorants, antifoaming agents, coupling agents, ultraviolet absorbers, light diffusing agents, polymerization inhibitors, antistatic agents, flame retardants, heat stabilizers, and mixtures thereof.
  • an additive selected from the group consisting of colorants, antifoaming agents, coupling agents, ultraviolet absorbers, light diffusing agents, polymerization inhibitors, antistatic agents, flame retardants, heat stabilizers, and mixtures thereof.
  • the resin composition may further include a second marble chip, and may be in a chip form which is a chip in which a second marble chip is formed inside the marble chip.
  • the resin composition may further include a second resin composition having different colors or transparency.
  • the second resin composition comprises a second binder and a second reactive monomer, wherein the second binder is at least one from the group consisting of halogenated alkoxylated di (meth) acrylate oligomers, halogenated urethaneacrylates, halogenated epoxyacrylates Can be selected.
  • the marble chip has a specific gravity of 1.45 to 1.75.
  • the marble chip has a specific gravity of 1.50 to 1.70.
  • the marble chip may have a refractive index of 1.55 to 1.75 measured by an ABBE refractometer (3T) at a refractive index of 25 ° C.
  • Another aspect of the invention relates to a method of manufacturing the marble chip.
  • the method includes preparing a resin composition by mixing a reactive monomer with a binder comprising a halogenated alkoxylated di (meth) acrylate oligomer; Curing the resin composition to prepare a cured product; And crushing the cured product.
  • the cured product may be crushed to a diameter or the maximum diagonal length of 0.1 to 30 mm.
  • the metal may be crushed after being deposited on the cured product.
  • the binder may further include a binder selected from the group consisting of halogenated urethane acrylates, halogenated epoxy acrylates and mixtures thereof.
  • an additive selected from the group consisting of a colorant, an antifoaming agent, a coupling agent, an ultraviolet absorber, a light diffusing agent, a polymerization inhibitor, an antistatic agent, a flame retardant, a heat stabilizer, and a mixture thereof may be further added to the resin composition.
  • the second marble chip may be further added to the resin composition to manufacture the chip in the form of a chip in which the second marble chip is formed inside the marble chip.
  • the second marble chip may be selected from the group consisting of a marble chip, an acrylic artificial marble chip, and an unsaturated ester artificial marble marble chip of the present invention.
  • the resin composition may further include a second resin composition having different colors or transparency to form a flow pattern or a multilayer structure.
  • the second resin composition comprises a second binder and a second reactive monomer, wherein the second binder is at least one from the group consisting of halogenated alkoxylated di (meth) acrylate oligomers, halogenated urethaneacrylates, halogenated epoxyacrylates Can be selected.
  • the second resin composition having different colors or transparency may be included in plural.
  • an artificial marble comprising a marble chip of the present invention.
  • the artificial marble is made of marble chips dispersed in a matrix.
  • the specific gravity of the matrix may be 1.52 to 1.83
  • the specific gravity of the marble chip may be 1.45 to 1.75
  • the specific gravity difference between the matrix and the marble chip may be 2.0 or less.
  • the matrix may be a cured product of the curable composition comprising an acrylic syrup and an inorganic filler.
  • FIG. 1 is a schematic diagram of an artificial marble using a chip-in-chip marble chip according to the present invention.
  • FIG. 2 is a schematic diagram of artificial marble using a multi-layer marble chip according to the present invention.
  • the marble chip of the present invention is formed by curing a resin composition comprising a binder and a reactive monomer, and the binder comprises a halogenated alkoxylated diacrylate oligomer.
  • the halogenated alkoxylated di (meth) acrylate oligomers include brominated alkoxide bisphenol A diacrylate, brominated alkoxide bisphenol A dimethacrylate, chlorolated alkoxide bisphenol A diacrylate, and chloro alkoxylated. Tide bisphenol A dimethacrylate, etc. are mentioned, It is not necessarily limited to this. In addition, it is possible to use various kinds of halogenated alkoxylated di (meth) acrylates depending on the number of repeating units (-OC 2 H 4- ) and these may be used alone or in combination of two or more thereof. The number average molecular weight of the halogenated alkoxylated di (meth) acrylate oligomer may be 600 to 4,500.
  • the binder may further include a halogenated urethane acrylate or a halogenated epoxy acrylate, and a mixture thereof may also be included.
  • the number average molecular weight of the halogenated urethane acrylate may be 900 to 4,000.
  • the number average molecular weight of the halogenated epoxy acrylate may be 600 to 3,500. If the molecular weight range is less than the cross-linking density per unit volume is high (brittle), the cross-linking density is lowered if it exceeds the molecular weight range is likely to soften and excessively high viscosity may be difficult to handle.
  • the binder is used in an amount of 2 to 98% by weight of halogenated alkoxylated di (meth) acrylate oligomer and 2 to 98% by weight of halogenated urethane acrylate. Can be used. In another embodiment, the binder may be used in 2 to 98% by weight of halogenated alkoxylated di (meth) acrylate oligomer and 2 to 98% by weight of halogenated epoxyacrylate.
  • the binder may be used in an amount of 1 to 98% by weight of halogenated alkoxide di (meth) acrylate oligomer, 1 to 98% by weight of halogenated urethane acrylate and 1 to 98% by weight of halogenated epoxy acrylate.
  • the binder is 50 to 90 parts by weight, preferably 60 to 90 parts by weight, more preferably 70 to 90 parts by weight.
  • the reactive monomer is 10 to 50 parts by weight, preferably 10 to 40 parts by weight, more preferably 10 to 30 parts by weight.
  • the content of the binder is less than 50 parts by weight, the high specific neutralization effect is lowered, and when used in excess of 90 parts by weight, the viscosity may be too high, resulting in poor workability.
  • the reactive monomers are aromatic vinyl monomers, aromatic divinyl monomers, dimers thereof, alkyl or halogen substituted aromatic vinyl monomers, C 1 -C 20 alkyl (meth) acrylates, C 6 -C 20 aryl (meth) Acrylates, hydroxy-containing (meth) acrylates, glycidyl (meth) acrylates, C 6 -C 20 arylphthalates, C 6 -C 20 arylcarbonates, and the like.
  • the reactive monomers include styrene monomer, bromo styrene, vinyltoluene, methyl (meth) acrylate, ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, oxyl (meth) acrylate, and dode Sil (meth) acrylate, octadecyl (meth) acrylate, methylcyclohexyl (meth) acrylate, isobornyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, chlorophenyl (meth ) Acrylate, methoxyphenyl (meth) acrylate, bromophenyl (meth) acrylate, ethylene glycol di (meth) acrylate, 1,2-propylene glycol (meth) acrylate, 1,3-butanediol di ( Meta) acrylate,
  • the marble chip of the present invention may further include additives such as a colorant, an antifoaming agent, a coupling agent, an ultraviolet absorber, a light diffusing agent, a polymerization inhibitor, an antistatic agent, a flame retardant, and a heat stabilizer. These additives may be included alone or in combination of two or more.
  • FIG. 1 is a schematic diagram of an artificial marble using a marble chip of the chip-in-chip form according to the present invention. As shown in FIG. 1, a relatively small marble chip 11A is embedded in the marble chip 1A of the present invention.
  • a flow pattern or a multilayer structure may be formed on the marble chip.
  • Figure 2 is a schematic diagram of artificial marble using a marble chip of a multi-layer structure according to the present invention. As shown in FIG. 2, a plurality of layers 21A, 21B, 21C ,, and different in color or transparency may be formed on the marble chip 2A having a multilayer structure.
  • the marble chip of the present invention has a specific gravity of 1.45 to 1.75.
  • the marble chip has a specific gravity of 1.50 to 1.70. In embodiments it may be 1.51 to 1.67.
  • the marble chip of the present invention may have a refractive index of 1.55 to 1.75 measured by an ABBE refractometer (3T) at 25 ° C.
  • Another aspect of the invention relates to a method for manufacturing a marble chip.
  • the method includes preparing a resin composition by mixing a reactive monomer with a binder comprising a halogenated alkoxylated di (meth) acrylate oligomer; Curing the resin composition to prepare a cured product; And crushing the cured product.
  • the resin composition may include a binder and a reactive monomer, and may further include conventional additives such as colorants, antifoaming agents, coupling agents, ultraviolet absorbers, light diffusing agents, polymerization inhibitors, antistatic agents, flame retardants, and heat stabilizers.
  • the colorant includes an inorganic or organic pigment, a dye and the like, and is 0.0001 to 10.0 parts by weight based on 100 parts by weight of the resin composition. In embodiments, it may be used in an amount of 1.0 to 5.0 parts by weight, and in other embodiments, it may be used in an amount of 0.001 to 0.05 parts by weight. In another embodiment may be used in 0.05 to 2.5 parts by weight.
  • a curing agent may be used when curing the resin composition.
  • the curing agent may be benzoyl peroxide, dicumyl peroxide, butylhydro peroxide, cumylhydro peroxide, butyl butyl peroxymaleic acid, butyl butyl hydroperoxide, acetyl peroxide, lauroyl peroxide, azobisiso A single or a mixture of two or more selected from butylonitrile, azobis dimethylvaleronitrile, a mixture of peroxides with amines or sulfonic acid compounds, saponified salts of peroxides with copper, cobalt, potassium, calcium, zirconium, and zinc. Can be used.
  • the curing agent may be added to 0.03 to 2.5 parts by weight, preferably 0.05 to 2.0 parts by weight based on 100 parts by weight of the resin composition.
  • the curing method is not particularly limited, and may be cured in a heat source condition of 50 to 180 °C.
  • an amine or sulfonic acid compound may be added together with the curing agent or a saponified salt of copper, cobalt, potassium, calcium, zirconium, and zinc may be added.
  • the cured product is crushed to an average diameter of 0.1 to 30 mm, preferably 0.1 to 20 mm.
  • the shredding method can be easily carried out by those skilled in the art.
  • the present invention can be broken after depositing a metal such as aluminum or silver on the cured product.
  • a metal such as aluminum or silver
  • the metal chip is deposited and the crushed marble chip is added to the artificial marble, it can be more three-dimensional and produce a jewelry-like effect.
  • the second marble chip may be further added to the resin composition.
  • the second marble chip may be transparent, translucent, or opaque, and a mixture thereof may be used.
  • the second marble chip may use a marble chip manufactured in the present invention, and may use a marble chip obtained by grinding a conventional acrylic or unsaturated ester artificial marble. In this way, the marble chip obtained by further adding the marble chip to the resin composition, curing and pulverizing is in the form of a chip-in-chip, and can produce more various patterns.
  • the resin composition may further include a second resin composition having different colors or transparency.
  • the second resin composition comprises a second binder and a second reactive monomer, wherein the second binder is at least one from the group consisting of halogenated alkoxylated di (meth) acrylate oligomers, halogenated urethaneacrylates, halogenated epoxyacrylates Can be selected.
  • the second resin composition having different colors or transparency may be included in plural.
  • the second resin composition may be transparent or opaque.
  • a cured product having a flow pattern is formed, and when the powder is pulverized, a flow pattern is formed.
  • Marble chips can be manufactured.
  • an artificial marble comprising a marble chip of the present invention.
  • the artificial marble is prepared by curing the curable composition mixed with the marble chip and the resin syrup prepared in a conventional manner.
  • the resin syrup an acrylic resin or an unsaturated polyester type may be used, and preferably, an acrylic resin.
  • the curable composition may further include inorganic fillers or conventional additives such as calcium carbonate, aluminum hydroxide, silica, alumina, barium lactate, magnesium hydroxide, and the like. It can be easily carried out by a person who has.
  • the artificial marble of the present invention uses a marble chip having a specific gravity of 1.45 to 1.75, a uniform pattern can be realized regardless of curing time or molding time, and continuous production is possible.
  • the specific gravity of the matrix may be 1.52 to 1.83
  • the specific gravity of the marble chip may be 1.45 to 1.75
  • the specific gravity difference between the matrix and the marble chip may be 2.0 or less.
  • the said specific gravity difference is 1.7 or less, More preferably, it is 1.5 or less, Most preferably, it is 1.0 or less.
  • the artificial marble of the present invention has a structure in which the marble chip is uniformly dispersed in the matrix since the specific gravity difference between the marble chip and the matrix of the marble chip is small.
  • the matrix may be a cured product of the curable composition comprising an acrylic syrup and an inorganic filler.
  • the artificial marble has a structure in which a chip in chip type marble chip is dispersed using a chip in chip type marble chip.
  • 1 is a schematic view of the artificial marble 10 using the chip-in-chip marble chip 1A.
  • a relatively small marble chip 11A is irregularly distributed, and such a chip-in-chip marble chip 1A is dispersed in the matrix 3.
  • the artificial marble has a structure in which a marble chip having a multilayer structure is dispersed using a marble chip having a multilayer structure.
  • 2 is a schematic diagram of the artificial marble 20 using the multi-layer marble chip 2A. As shown in FIG. 2, a plurality of layers 21A, 21B, 21C, ..., which are different in color or transparency, are formed in the marble chip 2A having a multilayer structure, and the marble chip is dispersed in the matrix 3. have.
  • the surface texture of the artificial marble using the marble chip can produce a surface texture similar to that of the engineered stone and has excellent workability. Therefore, the countertop of the sink countertop of the kitchen, the countertop of the vanity table, the reception desk of a bank and a general store can be used. It can be applied to a wide range of tops and decorative articles.
  • the artificial marble may be pulverized and used as a chip-type marble chip having a transparent chip formed therein.
  • Example 2 The same procedure as in Example 1 was carried out except that 0.01 part by weight of phthalocyanine green was added as a color imparting agent.
  • the specific gravity of the manufactured marble chip was 1.609.
  • Example 2 It carried out similarly to Example 1 except having mixed 100 weight part of unsaturated polyester resins (Aekyung Chemical Co., Ltd., TP-145X) and 1.0 weight part of benzoyl peroxides.
  • the specific gravity of the manufactured marble chip was 1.203.
  • Example 1 except 100 parts by weight of vinyl ester resin (DION-9120, manufactured by Aekyung Chemical Co., Ltd.) and 1.0 part by weight of benzoyl peroxide, prepared by mixing 60 parts by weight of epoxy acrylate oligomer and 40 parts by weight of styrene monomer. Was performed in the same manner.
  • the specific gravity of the manufactured marble chip was 1.194.
  • Example 4 The same procedure as in Example 4 was carried out except that the colored transparent chip prepared in Example 2 was used.
  • Example 4 The same procedure as in Example 4 was carried out except that the chip prepared in Example 3 was used.
  • Example 4 The same procedure as in Example 4 was performed except that the chip prepared in Comparative Example 1 was used.
  • Example 4 The same procedure as in Example 4 was carried out except that the chip prepared in Comparative Example 2 was used.
  • Example 4 The same procedure as in Example 4 was carried out except that the chip prepared in Comparative Example 3 was used.
  • Refractive index It measured by ABBE refractometer (3T) on 25 degreeC temperature conditions.
  • Examples 4 to 6 were good in all the physical properties evaluation, and even in the heat workability was good to the curved surface of the radius 150MM.
  • Comparative Example 4 had the best result in the thermal workability, but the transparent chip distribution was not constant at the shear plane.
  • the refractive index was low, the texture such as quartz could not be represented, and thus it was impossible to produce the engineered stone.
  • Comparative Example 5 the chip distribution was poor, the occurrence of concave phenomenon and the thermal processing were found to be the lowest, and the chip was poor in chemical resistance. Comparative Example 6 is not applicable to continuous production because the shear chip distribution is not constant.

Abstract

The present invention provides marble chips produced by hardening resin compositions containing binders and reactive monomers, wherein said binders contain halogenated alkoxylated diacrylate oligomers. The marble chips of the present invention can be formed into a uniform pattern, regardless of the time taken for hardening or molding. Therefore, an artificial marble using the marble chips of the present invention may have an outer appearance and texture the same as those of engineered stone, and also present thermoformability and workability characteristics which are advantages of an artificial acrylic marble.

Description

인조대리석용 마블칩, 그 제조방법 및 이를 포함하는 인조대리석Marble chip for artificial marble, its manufacturing method and artificial marble comprising the same
본 발명은 인조대리석용 마블칩, 그 제조방법 및 이를 포함하는 인조대리석에 관한 것이다. 보다 구체적으로 본 발명은 인조대리석의 무늬를 발현하는 마블칩에 할로겐화 알콕시레이티드 디아크릴레이트 올리고머를 포함하는 바인더를 적용함으로서, 모재와의 결합력이 우수하고 모재와 동일 또는 유사한 비중과 동일 또는 유사한 마모특성과 고비중, 고굴절율, 고투명성을 갖는 마블칩 및 이를 포함하는 인조대리석에 관한 것이다. The present invention relates to a marble chip for artificial marble, a manufacturing method thereof and an artificial marble comprising the same. More specifically, the present invention by applying a binder containing a halogenated alkoxylated diacrylate oligomer to the marble chip expressing the pattern of artificial marble, has excellent bonding strength with the base material and the same or similar specific gravity and the same or similar wear with the base material The present invention relates to a marble chip having characteristics, high specific gravity, high refractive index, and high transparency, and an artificial marble comprising the same.
일반적으로 인조 대리석은 구성하는 레진(resin)에 따라 크게 아크릴계와 불포화 폴리에스터계의 두 종류로 구분된다. 이중 아크릴계 인조 대리석은 우수한 외관, 부드러운 감촉, 우수한 내후성 등과 같은 특성을 지녀 각종 상판 및 인테리어 소재로서 수요가 계속 증가하고 있다. In general, artificial marble is divided into two types, acrylic and unsaturated polyester, depending on the resin (resin). Acrylic acrylic marble has characteristics such as excellent appearance, soft texture, excellent weather resistance, etc., and the demand for various top plates and interior materials is continuously increasing.
아크릴계 인조 대리석은 메틸 메타아크릴레이트(Methyl methacrylate)와 같은 모노머와 폴리메틸 메타아크릴레이트(Polymethyl methacrylate)를 혼합한 시럽(syrub)에 무기 충전제, 색깔 및 패턴을 구현하는 마블칩을 혼합하고 중합 개시제를 용해시킨 후, 이를 적정한 온도에서 캐스팅(casting)하여 제조되는 것이 일반적이다. Acrylic artificial marble is a syrup mixed with a monomer such as methyl methacrylate and polymethyl methacrylate, and a marble chip that implements an inorganic filler, color, and pattern is mixed with a polymerization initiator. After dissolution, it is usually produced by casting at an appropriate temperature.
인조대리석의 다양한 색깔 및 패턴을 구현하기 위해 다양한 종류의 마블칩이 투입된다. 특히 인조대리석은 용도의 특성상 마블칩에 의해 구현되는 외관이 상품 가치에 큰 영향을 미친다.Various kinds of marble chips are put to realize various colors and patterns of artificial marble. In particular, the appearance of artificial marble has a big influence on the value of the product due to the nature of the marble chip.
마블칩은 아크릴계 인조대리석과 비슷한 방법에 의해 판상으로 경화한 다음, 파쇄하여 다양한 입도로 얻을 수 있으며, 통상 매트릭스와 동일한 재질인 아크릴계가 사용된다.The marble chip may be hardened into a plate by a method similar to acrylic artificial marble, and then crushed to obtain various particle sizes. An acrylic material, which is the same material as the matrix, is usually used.
최근에는 투박한 인조대리석에 경쾌하고 세련된 느낌을 주거나 보석과 같은 느낌을 부여하기 위해 투명한 마블칩이 사용되고 있으며, 최근 그 수요가 늘고 있는 추세이다. In recent years, transparent marble chips have been used to give a crude artificial marble a light and refined feel or a jewel-like feel, and the demand is increasing recently.
현재까지 상업화되어 있는 투명한 마블칩을 사용한 인조대리석은 폴리메틸메타크릴레이트(PMMA)계 수지나 불포화 폴리에스테르 수지를 마블칩으로 사용하여 제조된 것이다. 그런데, 상기 PMMA계 수지나 불포화 폴리에스테르 수지로 제조된 투명칩들은 비중이 1.15∼1.24로서, 모재(matrix)의 비중보다 낮아 인조대리석 제조시, 투명칩이 모두 상층부로 뜨는 현상이 발생하여 전혀 표층부에 투명칩이 존재하지 않거나, 균일한 칩 분포가 불가능한 문제점이 있다. 또한 표면부에 투명한 칩 분포를 갖는 인조대리석을 제조하려면 칩의 사용량을 모재의 약 2배 이상 투입해야 하는 단점이 있으며, 이로 인해 인조대리석의 두께를 조정하기 어려운 또 다른 문제점이 있다.Artificial marble using a transparent marble chip that has been commercialized to date is manufactured using polymethyl methacrylate (PMMA) resin or unsaturated polyester resin as a marble chip. However, the transparent chips made of PMMA-based resins or unsaturated polyester resins have a specific gravity of 1.15 to 1.24, which is lower than the specific gravity of the matrix, so that when the artificial marble is manufactured, all the transparent chips float to the upper layer so that the surface layer is completely absent. There is a problem that a transparent chip does not exist or uniform chip distribution is impossible. In addition, to manufacture the artificial marble having a transparent chip distribution on the surface portion has the disadvantage that the amount of use of the chip more than about twice the base material, there is another problem that is difficult to adjust the thickness of the artificial marble.
따라서, 비중을 모재의 수준으로 높이기 위해서는 알미늄트리하이드레이트, 황산바륨, 실리카 등의 무기 충진제를 첨가하여야 하는데, 이러한 무기 충진제가 첨가될 경우, 투명성이 현저히 떨어지는 문제점이 있다. Therefore, in order to increase specific gravity to the level of the base metal, an inorganic filler such as aluminum trihydrate, barium sulfate, silica, or the like should be added. However, when such an inorganic filler is added, transparency is significantly lowered.
한편, 석영 및 규사, 그리고 수정등과 같은 천연실리카 광물이나 유리나 용융유리 등의 유리질화한 실리카화합물과 같은 투명한 성상의 칩을 이용하여 제조할 수 있는 엔지니어드 스톤(e-stone) 형태의 인조대리석은 칩 투명성에서는 장점이 있으나, 칩의 침강성 및 칩 샌딩성 등의 문제로 기존의 연속생산방식인 아크릴계 인조대리석 생산에서는 생산을 할 수가 없다. Meanwhile, engineered stone in the form of engineered stone, which can be manufactured using natural silica minerals such as quartz, silica sand, and crystal, or transparent chips such as vitrified silica compounds such as glass or molten glass, Although there is an advantage in chip transparency, it cannot be produced in the production of acrylic artificial marble which is a conventional continuous production method due to problems such as chip settling and chip sanding properties.
그 이유는 모재인 아크릴화합물과 무늬나 패턴을 나타내는 칩인 실리카 및 실리카화합물의 모오스 경도가 달라서 판재 제조후 샌딩성의 차이로 인해 평활도가 나오지 않는 문제를 가지고 있다. The reason is that the MOS hardness of the acrylic compound as the base material and the silica and the silica compound as the chip showing the pattern or the pattern is different, so that the smoothness does not come out due to the difference in the sanding properties after the plate is manufactured.
따라서 인조대리석의 투명 칩은 고굴절율 뿐만 아니라, 비중을 모재와 동일 또는 유사하게 조정하여 성형시간에 구애없이 칩이 가라앉지 않도록 조절하여 경화시간과는 상관없이 일정한 패턴을 가질 수 있어야 하고, 모재와 동일한 연마성을 가져 인조대리석으로 제조후 평탄성과 평활성이 동시에 만족해야 할 것이 요구된다. Therefore, the transparent chip of artificial marble should not only have a high refractive index but also adjust specific gravity to the same or similar to the base material so that the chip does not sink without regard to the molding time so that it can have a constant pattern regardless of the hardening time. It is required to have the same abrasiveness and to satisfy both flatness and smoothness after the manufacture of artificial marble.
본 발명자는 상기의 문제점을 해소하기 위하여, 할로겐화 알콕시레이티드 디아크릴레이트 올리고머를 포함하는 바인더와 반응성 모노머를 포함하는 수지 조성물을 경화시킴으로써, 모재와의 결합력이 우수하고 모재와 동일 또는 유사한 비중과 동일 또는 유사한 마모특성과 고비중, 고굴절율, 고투명성을 갖는 마블칩 및 이를 이용한 인조대리석을 개발하기에 이른 것이다.MEANS TO SOLVE THE PROBLEM In order to solve the said problem, the present inventors harden the binder containing a halogenated alkoxylated diacrylate oligomer, and the resin composition containing a reactive monomer, and are excellent in binding force with a base material, and are the same or similar specific gravity as a base material. Or, it is to develop a marble chip having similar wear characteristics, high specific gravity, high refractive index, and high transparency and artificial marble using the same.
본 발명의 목적은 1.45 내지 1.75의 비중을 가지는 마블칩 및 그 제조방법을 제공하기 위한 것이다.An object of the present invention is to provide a marble chip having a specific gravity of 1.45 to 1.75 and a manufacturing method thereof.
본 발명의 다른 목적은 경화시간이나 성형시간에 구애없이 균일한 패턴을 구현할 수 있는 마블칩 및 그 제조방법을 제공하기 위한 것이다.Another object of the present invention is to provide a marble chip and a method of manufacturing the same which can realize a uniform pattern regardless of curing time or molding time.
본 발명의 또 다른 목적은 투명성 및 굴절율이 우수한 마블칩 및 그 제조방법을 제공하기 위한 것이다.Still another object of the present invention is to provide a marble chip having excellent transparency and refractive index and a method of manufacturing the same.
본 발명의 또 다른 목적은 샌딩성 및 모오스경도가 모재(matrix)와 동일한 마블칩 및 그 제조방법을 제공하기 위한 것이다.It is still another object of the present invention to provide a marble chip and a method of manufacturing the same having a sanding property and a hardness of the matrix.
본 발명의 또 다른 목적은 모재와의 결합력이 우수한 마블칩 및 그 제조방법을 제공하기 위한 것이다.Still another object of the present invention is to provide a marble chip having excellent bonding force with a base material and a method of manufacturing the same.
본 발명의 또 다른 목적은 입체적 질감을 나타낼 수 있는 마블칩 및 그 제조방법을 제공하기 위한 것이다.Another object of the present invention is to provide a marble chip and a method for manufacturing the same that can exhibit a three-dimensional texture.
본 발명의 또 다른 목적은 안료 분산성과 매트릭스와의 결합성이 우수하여 컨케이브 현상이 없는 마블칩 및 그 제조방법을 제공하기 위한 것이다.It is still another object of the present invention to provide a marble chip and a method of manufacturing the same, which are excellent in pigment dispersibility and bondability with a matrix.
본 발명의 또 다른 목적은 내약품성이 우수한 마블칩 및 그 제조방법을 제공하기 위한 것이다.Still another object of the present invention is to provide a marble chip having excellent chemical resistance and a manufacturing method thereof.
본 발명의 또 다른 목적은 상기 마블칩을 적용함으로써, 엔지니어드 스톤과 동일한 외관과 질감을 가질 수 있는 인조대리석을 제공하기 위한 것이다.Still another object of the present invention is to provide an artificial marble that can have the same appearance and texture as the engineered stone by applying the marble chip.
본 발명의 또 다른 목적은 상기 마블칩을 적용함으로써, 연속 생산이 가능한 인조대리석을 제공하기 위한 것이다.Still another object of the present invention is to provide an artificial marble capable of continuous production by applying the marble chip.
본 발명의 또 다른 목적은 상기 마블칩을 적용함으로써, 열가공성이 우수한 인조대리석을 제공하기 위한 것이다.Still another object of the present invention is to provide an artificial marble having excellent thermal workability by applying the marble chip.
본 발명의 또 다른 목적은 상기 마블칩을 적용함으로써, 평활성이 우수한 인조대리석을 제공하기 위한 것이다.Still another object of the present invention is to provide an artificial marble having excellent smoothness by applying the marble chip.
본 발명의 상기 및 기타의 목적들은 하기 설명되는 본 발명에 의하여 모두 달성될 수 있다.The above and other objects of the present invention can be achieved by the present invention described below.
본 발명의 하나의 관점은 마블칩에 관한 것이다. 상기 마블칩은 바인더와 반응성 모노머를 포함하는 수지 조성물을 경화시켜 형성된 것으로, 상기 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머를 포함하는 것을 특징으로 한다. One aspect of the invention relates to a marble chip. The marble chip is formed by curing a resin composition comprising a binder and a reactive monomer, and the binder includes a halogenated alkoxylated di (meth) acrylate oligomer.
한 구체예에서, 상기 수지 조성물은 바인더 50 내지 90 중량부 및 반응성 모노머 10 내지 50 중량부를 포함할 수 있다. 다른 구체예에서, 상기 바인더는 할로겐화 우레탄아크릴레이트 또는 할로겐화 에폭시아크릴레이트를 더 포함할 수 있으며, 이들의 혼합물도 포함될 수 있다. 상기 할로겐화 우레탄 아크릴레이트의 수평균분자량은 900 내지 4,000일 수 있다. 또한 상기 할로겐화 에폭시 아크릴레이트의 수평균분자량은 600 내지 3,500일 수 있다. In one embodiment, the resin composition may include 50 to 90 parts by weight of the binder and 10 to 50 parts by weight of the reactive monomer. In another embodiment, the binder may further include a halogenated urethane acrylate or a halogenated epoxy acrylate, and a mixture thereof may also be included. The number average molecular weight of the halogenated urethane acrylate may be 900 to 4,000. In addition, the number average molecular weight of the halogenated epoxy acrylate may be 600 to 3,500.
상기 반응성 모노머는 방향족 비닐계 모노머, 방향족 디비닐계 모노머, 이들의 다이머, 알킬 또는 할로겐 치환된 방향족 비닐계 모노머, C1-C20 알킬(메타)아크릴레이트, C6-C20 아릴(메타)아크릴레이트, 하이드록시 함유(메타)아크릴레이트, 글리시딜(메타)아크릴레이트, C6-C20 아릴프탈레이트, C6-C20 아릴카르보네이트 등을 포함할 수 있다. 구체예에서는 상기 반응성 모노머는 스티렌 모노머, 브로모 스티렌, 비닐톨루엔, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 옥실(메타)아크릴레이트, 도데실(메타)아크릴레이트, 옥타데실(메타)아크릴레이트, 메틸사이클로헥실(메타)아크릴레이트, 이소보닐(메타)아크릴레이트, 페닐(메타)아크릴레이트, 벤질(메타)아크릴레이트, 클로로페닐(메타)아크릴레이트, 메톡시페닐(메타)아크릴레이트, 브로모페닐(메타)아크릴레이트, 에틸렌글리콜디(메타)아크릴레이트, 1,2-프로필렌글리콜(메타)아크릴레이트, 1,3-부탄디올디(메타)아크릴레이트, 1,3-프로필렌글리콜(메타)아크릴레이트, 1,4-부탄디올디(메타)아크릴레이트, 1,5-펜탄디올디(메타)아크릴레이트, 네오펜틸글리콜디(메타)아크릴레이트, 디에틸렌글리콜디(메타)아크릴레이트, 트리에틸렌글리콜디(메타)아크릴레이트, 디프로필렌글리콜디(메타)아크릴레이트, 디알릴테레프탈레이트, 이알릴프탈레이트, 디알릴카르보네이트, 디비닐벤젠, 알파메틸렌스티렌, 알파메틸렌스티렌다이머, 트리메틸올프로판트리(메타)아크릴레이트, 펜타에리스리톨트리(메타)아크릴레이트, 펜타에리스리톨테트라(메타)아크릴레이트, 디펜타에이스리톨헥사(메타)아크릴레이트, 에톡시에틸아크릴레이트, 글리시딜(메타)아크릴산의 에폭시아크릴레이트, 1,6-헥산디올디(메타)아크릴레이트, 글리세린트리(메타)아크릴레이트, 메틸프로판디올디(메타)아크릴레이트, 폴리에틸렌글리콜디(메타)아크릴레이트 및 이들의 혼합물로 이루어진 군으로부터 하나 이상 선택될 수 있다. The reactive monomers are aromatic vinyl monomers, aromatic divinyl monomers, dimers thereof, alkyl or halogen substituted aromatic vinyl monomers, C 1 -C 20 alkyl (meth) acrylates, C 6 -C 20 aryl (meth) Acrylates, hydroxy-containing (meth) acrylates, glycidyl (meth) acrylates, C 6 -C 20 arylphthalates, C 6 -C 20 arylcarbonates, and the like. In specific embodiments, the reactive monomer may be a styrene monomer, bromo styrene, vinyltoluene, methyl (meth) acrylate, ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, oxyl (meth) acrylate, and dodecyl. (Meth) acrylate, octadecyl (meth) acrylate, methylcyclohexyl (meth) acrylate, isobonyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, chlorophenyl (meth) Acrylate, methoxyphenyl (meth) acrylate, bromophenyl (meth) acrylate, ethylene glycol di (meth) acrylate, 1,2-propylene glycol (meth) acrylate, 1,3-butanedioldi (meth ) Acrylate, 1,3-propylene glycol (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,5-pentanediol di (meth) acrylate, neopentylglycol di (meth) acrylate , Diethylene glycol di (meta) Acrylate, triethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, diallyl terephthalate, allyl phthalate, diallyl carbonate, divinylbenzene, alpha methylene styrene, alpha methylene styrene dimer , Trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, ethoxyethyl acrylate, glycidyl ( Epoxyacrylate of meta) acrylic acid, 1,6-hexanediol di (meth) acrylate, glycerin tri (meth) acrylate, methylpropanedioldi (meth) acrylate, polyethyleneglycol di (meth) acrylate, and these One or more may be selected from the group consisting of mixtures.
상기 수지 조성물은 착색제, 소포제, 커플링제, 자외선흡수제, 광확산제, 중합억제제, 대전방지제, 난연제, 열안정제 및 이들의 혼합으로 이루어진 군으로부터 선택된 첨가제를 더 포함할 수 있다. The resin composition may further include an additive selected from the group consisting of colorants, antifoaming agents, coupling agents, ultraviolet absorbers, light diffusing agents, polymerization inhibitors, antistatic agents, flame retardants, heat stabilizers, and mixtures thereof.
다른 구체예에서는 상기 수지 조성물은 제2 마블칩을 더 포함하여 마블칩 내부에 제2 마블칩이 형성된 칩인칩 형태일 수 있다. In another embodiment, the resin composition may further include a second marble chip, and may be in a chip form which is a chip in which a second marble chip is formed inside the marble chip.
또 다른 구체예에서는 상기 수지 조성물은 색상 또는 투명성이 다른 제2 수지 조성물을 더 포함할 수 있다. 상기 제2 수지 조성물은 제2 바인더와 제2 반응성 모노머를 포함하고, 상기 제2 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머, 할로겐화 우레탄아크릴레이트, 할로겐화 에폭시아크릴레이트로 이루어진 군으로부터 하나 이상 선택될 수 있다. In another embodiment, the resin composition may further include a second resin composition having different colors or transparency. The second resin composition comprises a second binder and a second reactive monomer, wherein the second binder is at least one from the group consisting of halogenated alkoxylated di (meth) acrylate oligomers, halogenated urethaneacrylates, halogenated epoxyacrylates Can be selected.
한 구체예에서 상기 마블칩은 비중이 1.45 내지 1.75이다. 바람직하게는 상기 마블칩은 비중이 1.50 내지 1.70이다. In one embodiment, the marble chip has a specific gravity of 1.45 to 1.75. Preferably, the marble chip has a specific gravity of 1.50 to 1.70.
상기 구체예에서 상기 마블칩은 굴절률이 25 ℃에서 ABBE 굴절계 (3T)로 측정한 굴절률이 1.55∼1.75일 수 있다. In the above embodiment, the marble chip may have a refractive index of 1.55 to 1.75 measured by an ABBE refractometer (3T) at a refractive index of 25 ° C.
본 발명의 다른 관점은 상기 마블칩을 제조하는 방법에 관한 것이다. 상기 방법은 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머를 포함하는 바인더에 반응성 모노머를 혼합하여 수지 조성물을 제조하는 단계; 상기 수지 조성물을 경화시켜 경화물을 제조하는 단계; 및 상기 경화물을 파쇄하는 단계를 포함하여 이루어진다. Another aspect of the invention relates to a method of manufacturing the marble chip. The method includes preparing a resin composition by mixing a reactive monomer with a binder comprising a halogenated alkoxylated di (meth) acrylate oligomer; Curing the resin composition to prepare a cured product; And crushing the cured product.
한 구체예에서, 상기 경화물을 직경 또는 최대 대각선길이를 0.1 내지 30 mm로 파쇄할 수 있다. 이 경우에는 상기 경화물에 금속을 증착시킨 후 파쇄할 수 있다.In one embodiment, the cured product may be crushed to a diameter or the maximum diagonal length of 0.1 to 30 mm. In this case, the metal may be crushed after being deposited on the cured product.
상기 바인더는 할로겐화 우레탄아크릴레이트, 할로겐화 에폭시아크릴레이트 및 이들의 혼합물로 이루어진 군으로부터 선택된 바인더를 더 포함할 수 있다. The binder may further include a binder selected from the group consisting of halogenated urethane acrylates, halogenated epoxy acrylates and mixtures thereof.
또한, 상기 수지 조성물에 착색제, 소포제, 커플링제, 자외선흡수제, 광확산제, 중합억제제, 대전방지제, 난연제, 열안정제 및 이들의 혼합으로 이루어진 군으로부터 선택된 첨가제를 더 첨가할 수 있다. In addition, an additive selected from the group consisting of a colorant, an antifoaming agent, a coupling agent, an ultraviolet absorber, a light diffusing agent, a polymerization inhibitor, an antistatic agent, a flame retardant, a heat stabilizer, and a mixture thereof may be further added to the resin composition.
한 구체예에서는 상기 수지 조성물에 제2 마블칩을 더 첨가하여 마블칩 내부에 제2 마블칩이 형성된 칩인칩 형태로 제조할 수 있다. In one embodiment, the second marble chip may be further added to the resin composition to manufacture the chip in the form of a chip in which the second marble chip is formed inside the marble chip.
다른 구체예에서는 상기 제2 마블칩은 본 발명의 마블칩, 아크릴계 인조대리석 마블칩, 불포화 에스테르계 인조대리석 마블칩으로 이루어진 군으로부터 하나 이상 선택될 수 있다. In another embodiment, the second marble chip may be selected from the group consisting of a marble chip, an acrylic artificial marble chip, and an unsaturated ester artificial marble marble chip of the present invention.
또 다른 구체예에서는 상기 수지 조성물은 색상 또는 투명성이 다른 제2 수지 조성물을 더 포함하여 흐름무늬 또는 다층구조를 형성할 수 있다. 상기 제2 수지 조성물은 제2 바인더와 제2 반응성 모노머를 포함하고, 상기 제2 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머, 할로겐화 우레탄아크릴레이트, 할로겐화 에폭시아크릴레이트로 이루어진 군으로부터 하나 이상 선택될 수 있다. 상기 색상 또는 투명성이 다른 제2 수지 조성물은 복수로 포함할 수 있다. In another embodiment, the resin composition may further include a second resin composition having different colors or transparency to form a flow pattern or a multilayer structure. The second resin composition comprises a second binder and a second reactive monomer, wherein the second binder is at least one from the group consisting of halogenated alkoxylated di (meth) acrylate oligomers, halogenated urethaneacrylates, halogenated epoxyacrylates Can be selected. The second resin composition having different colors or transparency may be included in plural.
본 발명의 또 다른 관점은 본 발명의 마블칩을 포함하는 인조대리석에 관한 것이다. 상기 인조대리석은 매트릭스에 마블칩이 분산되어 이루어진다. 구체예에서 상기 매트릭스는 비중이 1.52 내지 1.83이며, 마블칩은 비중이 1.45 내지 1.75이며, 매트릭스와 마블칩의 비중차는 2.0 이하일 수 있다. 상기 매트릭스는 아크릴계 시럽 및 무기충진제를 포함하는 경화성 조성물의 경화물일 수 있다. Another aspect of the present invention relates to an artificial marble comprising a marble chip of the present invention. The artificial marble is made of marble chips dispersed in a matrix. In embodiments, the specific gravity of the matrix may be 1.52 to 1.83, the specific gravity of the marble chip may be 1.45 to 1.75, and the specific gravity difference between the matrix and the marble chip may be 2.0 or less. The matrix may be a cured product of the curable composition comprising an acrylic syrup and an inorganic filler.
이하 본 발명의 구체적인 내용을 하기에 상세히 설명한다.Hereinafter, specific contents of the present invention will be described in detail below.
제1도는 본 발명에 따른 칩인칩 형태의 마블칩을 사용한 인조대리석의 개략도이다. 1 is a schematic diagram of an artificial marble using a chip-in-chip marble chip according to the present invention.
제2도는 본 발명에 따른 다층구조의 마블칩을 사용한 인조대리석의 개략도이다.2 is a schematic diagram of artificial marble using a multi-layer marble chip according to the present invention.
마블칩Marble Chip
본 발명의 마블칩은 바인더와 반응성 모노머를 포함하는 수지 조성물을 경화시켜 형성된 것으로, 상기 바인더는 할로겐화 알콕시레이티드 디아크릴레이트 올리고머를 포함하는 것을 특징으로 한다. The marble chip of the present invention is formed by curing a resin composition comprising a binder and a reactive monomer, and the binder comprises a halogenated alkoxylated diacrylate oligomer.
상기 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머로는 브롬화 알콕시레이티드 비스페놀 A 디아크릴레이트, 브롬화 알콕시레이티드 비스페놀 A 디메타크릴레이트, 클로로화 알콕시레이티드 비스페놀 A 디아크릴레이트, 클로로화 알콕시레이티드 비스페놀 A 디메타크릴레이트 등을 예로 들 수 있으며, 반드시 이에 제한되는 것을 아니다. 또한, 반복단위(-OC2H4-) 개수에 따라 존재하는 다양한 종류의 할로겐화 알콕시레이티드 디(메타)아크릴레이트를 사용하는 것이 가능하며 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다. 상기 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머의 수평균분자량은 600 내지 4,500일 수 있다.The halogenated alkoxylated di (meth) acrylate oligomers include brominated alkoxide bisphenol A diacrylate, brominated alkoxide bisphenol A dimethacrylate, chlorolated alkoxide bisphenol A diacrylate, and chloro alkoxylated. Tide bisphenol A dimethacrylate, etc. are mentioned, It is not necessarily limited to this. In addition, it is possible to use various kinds of halogenated alkoxylated di (meth) acrylates depending on the number of repeating units (-OC 2 H 4- ) and these may be used alone or in combination of two or more thereof. The number average molecular weight of the halogenated alkoxylated di (meth) acrylate oligomer may be 600 to 4,500.
다른 구체예에서, 상기 바인더는 할로겐화 우레탄아크릴레이트 또는 할로겐화 에폭시아크릴레이트를 더 포함할 수 있으며, 이들의 혼합물도 포함될 수 있다. 상기 할로겐화 우레탄 아크릴레이트의 수평균분자량은 900 내지 4,000일 수 있다. 또한 상기 할로겐화 에폭시 아크릴레이트의 수평균분자량은 600 내지 3,500일 수 있다. 상기 분자량 범위 미만일 경우 단위부피당 가교밀도가 높아져 딱딱(brittle)해지며, 상기 분자량 범위를 초과할 경우 가교밀도가 낮아져서 연질화될 가능성이 크며 지나치게 점도가 높아져 취급이 어려울 수 있다.In another embodiment, the binder may further include a halogenated urethane acrylate or a halogenated epoxy acrylate, and a mixture thereof may also be included. The number average molecular weight of the halogenated urethane acrylate may be 900 to 4,000. In addition, the number average molecular weight of the halogenated epoxy acrylate may be 600 to 3,500. If the molecular weight range is less than the cross-linking density per unit volume is high (brittle), the cross-linking density is lowered if it exceeds the molecular weight range is likely to soften and excessively high viscosity may be difficult to handle.
할로겐화 우레탄아크릴레이트나 할로겐화 에폭시아크릴레이트를 혼용하여 사용할 경우, 하나의 구체예에서 상기 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머 2 내지 98 중량% 및 할로겐화 우레탄아크릴레이트 2 내지 98 중량%로 사용할 수 있다. 다른 구체예에서는 상기 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머 2 내지 98 중량% 및 할로겐화 에폭시아크릴레이트 2 내지 98 중량%로 사용할 수 있다. 또 다른 구체예에서는 상기 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머 1 내지 98 중량%, 할로겐화 우레탄아크릴레이트 1 내지 98 중량% 및 할로겐화 에폭시아크릴레이트 1 내지 98 중량%로 사용할 수 있다. When a mixture of halogenated urethane acrylates or halogenated epoxy acrylates is used in combination, in one embodiment the binder is used in an amount of 2 to 98% by weight of halogenated alkoxylated di (meth) acrylate oligomer and 2 to 98% by weight of halogenated urethane acrylate. Can be used. In another embodiment, the binder may be used in 2 to 98% by weight of halogenated alkoxylated di (meth) acrylate oligomer and 2 to 98% by weight of halogenated epoxyacrylate. In another embodiment, the binder may be used in an amount of 1 to 98% by weight of halogenated alkoxide di (meth) acrylate oligomer, 1 to 98% by weight of halogenated urethane acrylate and 1 to 98% by weight of halogenated epoxy acrylate.
상기 바인더는 50 내지 90 중량부, 바람직하게는 60 내지 90 중량부, 더 바람직하게는 70 내지 90 중량부이다. 상기 반응성 모노머 10 내지 50 중량부, 바람직하게는 10 내지 40 중량부, 더 바람직하게는 10 내지 30 중량부이다. 바인더의 함량이 50 중량부 미만일 경우 고비중화 효과가 떨어지게 되며, 90 중량부를 초과하여 사용할 경우 너무 점도가 높아져 작업성이 떨어질 수 있다. The binder is 50 to 90 parts by weight, preferably 60 to 90 parts by weight, more preferably 70 to 90 parts by weight. The reactive monomer is 10 to 50 parts by weight, preferably 10 to 40 parts by weight, more preferably 10 to 30 parts by weight. When the content of the binder is less than 50 parts by weight, the high specific neutralization effect is lowered, and when used in excess of 90 parts by weight, the viscosity may be too high, resulting in poor workability.
상기 반응성 모노머는 방향족 비닐계 모노머, 방향족 디비닐계 모노머, 이들의 다이머, 알킬 또는 할로겐 치환된 방향족 비닐계 모노머, C1-C20 알킬(메타)아크릴레이트, C6-C20 아릴(메타)아크릴레이트, 하이드록시 함유(메타)아크릴레이트, 글리시딜(메타)아크릴레이트, C6-C20 아릴프탈레이트, C6-C20 아릴카르보네이트 등을 포함할 수 있다. 구체예에서는 상기 반응성 모노머로는 스티렌 모노머, 브로모 스티렌, 비닐톨루엔, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 옥실(메타)아크릴레이트, 도데실(메타)아크릴레이트, 옥타데실(메타)아크릴레이트, 메틸사이클로헥실(메타)아크릴레이트, 이소보닐(메타)아크릴레이트, 페닐(메타)아크릴레이트, 벤질(메타)아크릴레이트, 클로로페닐(메타)아크릴레이트, 메톡시페닐(메타)아크릴레이트, 브로모페닐(메타)아크릴레이트, 에틸렌글리콜디(메타)아크릴레이트, 1,2-프로필렌글리콜(메타)아크릴레이트, 1,3-부탄디올디(메타)아크릴레이트, 1,3-프로필렌글리콜(메타)아크릴레이트, 1,4-부탄디올디(메타)아크릴레이트, 1,5-펜탄디올디(메타)아크릴레이트, 네오펜틸글리콜디(메타)아크릴레이트, 디에틸렌글리콜디(메타)아크릴레이트, 트리에틸렌글리콜디(메타)아크릴레이트, 디프로필렌글리콜디(메타)아크릴레이트, 디알릴테레프탈레이트, 이알릴프탈레이트, 디알릴카르보네이트, 디비닐벤젠, 알파메틸렌스티렌, 알파메틸렌스티렌다이머, 트리메틸올프로판트리(메타)아크릴레이트, 펜타에리스리톨트리(메타)아크릴레이트, 펜타에리스리톨테트라(메타)아크릴레이트, 디펜타에이스리톨헥사(메타)아크릴레이트, 에톡시에틸아크릴레이트, 글리시딜(메타)아크릴산의 에폭시아크릴레이트, 1,6-헥산디올디(메타)아크릴레이트, 글리세린트리(메타)아크릴레이트, 메틸프로판디올디(메타)아크릴레이트, 폴리에틸렌글리콜디(메타)아크릴레이트 등이다. 이들은 단독 또는 2종 이상 혼합하여 사용할 수 있다. The reactive monomers are aromatic vinyl monomers, aromatic divinyl monomers, dimers thereof, alkyl or halogen substituted aromatic vinyl monomers, C 1 -C 20 alkyl (meth) acrylates, C 6 -C 20 aryl (meth) Acrylates, hydroxy-containing (meth) acrylates, glycidyl (meth) acrylates, C 6 -C 20 arylphthalates, C 6 -C 20 arylcarbonates, and the like. Specific examples of the reactive monomers include styrene monomer, bromo styrene, vinyltoluene, methyl (meth) acrylate, ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, oxyl (meth) acrylate, and dode Sil (meth) acrylate, octadecyl (meth) acrylate, methylcyclohexyl (meth) acrylate, isobornyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, chlorophenyl (meth ) Acrylate, methoxyphenyl (meth) acrylate, bromophenyl (meth) acrylate, ethylene glycol di (meth) acrylate, 1,2-propylene glycol (meth) acrylate, 1,3-butanediol di ( Meta) acrylate, 1,3-propylene glycol (meth) acrylate, 1,4-butanedioldi (meth) acrylate, 1,5-pentanedioldi (meth) acrylate, neopentyl glycoldi (meth) acrylic Rate, diethylene glycol di (meta ) Acrylate, triethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, diallyl terephthalate, allyl phthalate, diallyl carbonate, divinylbenzene, alpha methylene styrene, alpha methylene styrene Dimer, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, ethoxyethyl acrylate, glycidyl Epoxy acrylate, 1,6-hexanediol di (meth) acrylate, glycerin tri (meth) acrylate, methylpropanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate, and the like of (meth) acrylic acid. . These can be used individually or in mixture of 2 or more types.
본 발명의 마블칩은 착색제, 소포제, 커플링제, 자외선흡수제, 광확산제, 중합억제제, 대전방지제, 난연제, 열안정제 등의 첨가제를 더 포함할 수 있다. 이들 첨가제는 단독 또는 2종 이상 포함할 수 있다. The marble chip of the present invention may further include additives such as a colorant, an antifoaming agent, a coupling agent, an ultraviolet absorber, a light diffusing agent, a polymerization inhibitor, an antistatic agent, a flame retardant, and a heat stabilizer. These additives may be included alone or in combination of two or more.
본 발명의 다른 구체예에서는 마블칩 내부에 제2 마블칩이 형성된 칩인칩 형태일 수 있다. 도 1은 본 발명에 따른 칩인칩 형태의 마블칩을 사용한 인조대리석의 개략도이다. 도 1에 도시된 바와 같이 본 발명의 마블칩(1A) 내부에는 상대적으로 크기가 작은 마블칩(11A)가 박혀있는 구조를 갖는다. In another embodiment of the present invention may be in the form of a chip which is a chip in which a second marble chip is formed inside the marble chip. 1 is a schematic diagram of an artificial marble using a marble chip of the chip-in-chip form according to the present invention. As shown in FIG. 1, a relatively small marble chip 11A is embedded in the marble chip 1A of the present invention.
본 발명의 또 다른 구체예에서는 마블칩에 흐름무늬 또는 다층구조가 형성될 수 있다. 도 2는 본 발명에 따른 다층구조의 마블칩을 사용한 인조대리석의 개략도이다. 도 2에 도시된 바와 같이 다층구조의 마블칩(2A)에는 색상이나 투명도가 다른 복수의 층(21A, 21B, 21C,,,)가 형성될 수 있다. In another embodiment of the present invention, a flow pattern or a multilayer structure may be formed on the marble chip. Figure 2 is a schematic diagram of artificial marble using a marble chip of a multi-layer structure according to the present invention. As shown in FIG. 2, a plurality of layers 21A, 21B, 21C ,, and different in color or transparency may be formed on the marble chip 2A having a multilayer structure.
본 발명의 마블칩은 비중이 1.45 내지 1.75이다. 바람직하게는 상기 마블칩은 비중이 1.50 내지 1.70이다. 구체예에서는 1.51 내지 1.67일 수 있다. 또한 본 발명의 마블칩은 25 ℃에서 ABBE 굴절계 (3T)로 측정한 굴절률이 1.55∼1.75일 수 있다. The marble chip of the present invention has a specific gravity of 1.45 to 1.75. Preferably, the marble chip has a specific gravity of 1.50 to 1.70. In embodiments it may be 1.51 to 1.67. In addition, the marble chip of the present invention may have a refractive index of 1.55 to 1.75 measured by an ABBE refractometer (3T) at 25 ° C.
마블칩 제조방법Marble Chip Manufacturing Method
본 발명의 다른 관점은 마블칩의 제조방법에 관한 것이다. 상기 방법은 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머를 포함하는 바인더에 반응성 모노머를 혼합하여 수지 조성물을 제조하는 단계; 상기 수지 조성물을 경화시켜 경화물을 제조하는 단계; 및 상기 경화물을 파쇄하는 단계를 포함하여 이루어진다. Another aspect of the invention relates to a method for manufacturing a marble chip. The method includes preparing a resin composition by mixing a reactive monomer with a binder comprising a halogenated alkoxylated di (meth) acrylate oligomer; Curing the resin composition to prepare a cured product; And crushing the cured product.
상기 수지 조성물은 바인더 및 반응성 모노머를 포함하며, 선택적으로 착색제, 소포제, 커플링제, 자외선흡수제, 광확산제, 중합억제제, 대전방지제, 난연제, 열안정제 등의 통상의 첨가제를 더 포함할 수 있다. 상기 착색제로는 무기 또는 유기 안료, 염료 등을 포함하며, 수지 조성물 100 중량부에 대하여 0.0001 내지 10.0 중량부이다. 구체예에서는 1.0 내지 5.0 중량부로 사용할 수 있으며, 다른 구체예에서는 0.001 내지 0.05 중량부로 사용할 수 있다. 또 다른 구체예에서는 0.05 내지 2.5 중량부로 사용할 수 있다. The resin composition may include a binder and a reactive monomer, and may further include conventional additives such as colorants, antifoaming agents, coupling agents, ultraviolet absorbers, light diffusing agents, polymerization inhibitors, antistatic agents, flame retardants, and heat stabilizers. The colorant includes an inorganic or organic pigment, a dye and the like, and is 0.0001 to 10.0 parts by weight based on 100 parts by weight of the resin composition. In embodiments, it may be used in an amount of 1.0 to 5.0 parts by weight, and in other embodiments, it may be used in an amount of 0.001 to 0.05 parts by weight. In another embodiment may be used in 0.05 to 2.5 parts by weight.
본 발명의 구체예에서는 상기 수지 조성물을 경화시 경화제를 사용할 수 있다. 상기 경화제로는 벤조일 퍼옥사이드, 디쿠밀 퍼옥사이드, 부틸하이드로 퍼옥사이드, 쿠밀하이드로 퍼옥사이드, 텨셔리부틸 퍼옥시말레인산, 텨셔리부틸하이드로 퍼옥사이드, 아세틸 퍼옥사이드, 라우로일 퍼옥사이드, 아조비스이소부틸로니트릴, 아조비스 디메틸발레로니트릴 중 선택되는 단독 혹은 2종 이상의 혼합물, 그리고 퍼옥사이드와 아민 또는 술폰산화합물의 혼합물, 퍼옥사이드와 구리, 코발트, 칼륨, 칼슘, 지르코늄, 아연의 비누화염 등을 사용할 수 있다. 상기 경화제는 수지 조성물 100 중량부에 대하여, 0.03 내지 2.5 중량부, 바람직하게는 0.05 내지 2.0 중량부를 투입할 수 있다. 상기 경화방법은 특별한 제한이 없으며, 50 내지 180 ℃의 열원조건에서 경화시킬 수 있다. 경화성을 조절하기 위해 상기 경화제와 함께 아민 또는 술폰산화합물을 추가하여 사용하거나 구리, 코발트, 칼륨, 칼슘, 지르코늄, 아연의 비누화염을 추가하여 사용할 수도 있다.In an embodiment of the present invention, a curing agent may be used when curing the resin composition. The curing agent may be benzoyl peroxide, dicumyl peroxide, butylhydro peroxide, cumylhydro peroxide, butyl butyl peroxymaleic acid, butyl butyl hydroperoxide, acetyl peroxide, lauroyl peroxide, azobisiso A single or a mixture of two or more selected from butylonitrile, azobis dimethylvaleronitrile, a mixture of peroxides with amines or sulfonic acid compounds, saponified salts of peroxides with copper, cobalt, potassium, calcium, zirconium, and zinc. Can be used. The curing agent may be added to 0.03 to 2.5 parts by weight, preferably 0.05 to 2.0 parts by weight based on 100 parts by weight of the resin composition. The curing method is not particularly limited, and may be cured in a heat source condition of 50 to 180 ℃. In order to control the curability, an amine or sulfonic acid compound may be added together with the curing agent or a saponified salt of copper, cobalt, potassium, calcium, zirconium, and zinc may be added.
본 발명의 구체예에서는 상기 경화물은 평균직경 0.1 내지 30 mm, 바람직하게는 0.1 내지 20 mm로 파쇄한다. 파쇄 방법은 본 발명이 속하는 분야의 통상의 지식을 가진 자에 의해 용이하게 실시될 수 있다. In an embodiment of the present invention, the cured product is crushed to an average diameter of 0.1 to 30 mm, preferably 0.1 to 20 mm. The shredding method can be easily carried out by those skilled in the art.
본 발명의 다른 구체예에서는 상기 경화물에 알루미늄이나 은과 같은 금속을 증착시킨 후 파쇄할 수 있다. 이와 같이 금속을 증착시킨 후 파쇄된 마블칩을 인조대리석에 첨가할 경우 더욱 입체적이며, 보석과 같은 효과를 연출할 수 있다. In another embodiment of the present invention can be broken after depositing a metal such as aluminum or silver on the cured product. Thus, when the metal chip is deposited and the crushed marble chip is added to the artificial marble, it can be more three-dimensional and produce a jewelry-like effect.
본 발명의 또 다른 구체예에서는 상기 수지 조성물에 제2 마블칩을 더 첨가할 수 있다. 상기 제2 마블칩은 투명이거나 반투명, 불투명일 수 있으며, 이들을 혼합하여 사용할 수 있다. 구체예에서 상기 제2 마블칩은 본 발명에서 제조되는 마블칩을 사용할 수 있으며, 통상의 아크릴계 혹은 불포화에스테르계 인조대리석을 분쇄하여 얻은 마블칩을 사용할 수 있다. 이와 같이 수지 조성물에 마블칩을 더 첨가시킨 후, 경화, 분쇄하여 얻은 마블칩은 칩인칩 형태이며, 보다 다양한 패턴을 연출할 수 있는 것이다. In another embodiment of the present invention, the second marble chip may be further added to the resin composition. The second marble chip may be transparent, translucent, or opaque, and a mixture thereof may be used. In a specific embodiment, the second marble chip may use a marble chip manufactured in the present invention, and may use a marble chip obtained by grinding a conventional acrylic or unsaturated ester artificial marble. In this way, the marble chip obtained by further adding the marble chip to the resin composition, curing and pulverizing is in the form of a chip-in-chip, and can produce more various patterns.
본 발명의 또 다른 구체예에서는 상기 수지 조성물은 색상 또는 투명성이 다른 제2 수지 조성물을 더 포함할 수 있다. 상기 제2 수지 조성물은 제2 바인더와 제2 반응성 모노머를 포함하고, 상기 제2 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머, 할로겐화 우레탄아크릴레이트, 할로겐화 에폭시아크릴레이트로 이루어진 군으로부터 하나 이상 선택될 수 있다. 상기 색상 또는 투명성이 다른 제2 수지 조성물은 복수로 포함할 수 있다. 또한 상기 제2 수지 조성물은 투명하거나 불투명할 수 있다. 이와 같이 색상이나 투명성이 다른 2종 이상의 수지 조성물을 사용함으로서, 고비중 마블칩에 흐름무늬 또는 다층구조를 형성시키는 것이 가능하다. 구체예에서는 서로 색상이 다른 2종 이상의 수지 조성물을 제조한 후, 경화용 컨베이어 벨트에 상기 2종 이상의 수지 조성물을 동시에 주입하면, 흐름무늬가 형성된 경화물이 형성되고, 이를 분쇄하면 흐름무늬가 형성된 마블칩이 제조될 수 있는 것이다. In another embodiment of the present invention, the resin composition may further include a second resin composition having different colors or transparency. The second resin composition comprises a second binder and a second reactive monomer, wherein the second binder is at least one from the group consisting of halogenated alkoxylated di (meth) acrylate oligomers, halogenated urethaneacrylates, halogenated epoxyacrylates Can be selected. The second resin composition having different colors or transparency may be included in plural. In addition, the second resin composition may be transparent or opaque. By using two or more kinds of resin compositions having different colors or transparency as described above, it is possible to form a flow pattern or a multilayered structure on a high specific gravity chip. In a specific embodiment, after preparing two or more kinds of resin compositions having different colors from each other, and simultaneously injecting the two or more kinds of resin compositions into a curing conveyor belt, a cured product having a flow pattern is formed, and when the powder is pulverized, a flow pattern is formed. Marble chips can be manufactured.
인조대리석Artificial Marble
본 발명의 또 다른 관점은 본 발명의 마블칩을 포함하는 인조대리석에 관한 것이다. 상기 인조대리석은 상기에서 제조된 마블칩 및 수지 시럽을 혼합한 경화성 조성물을 통상의 방법으로 경화시켜 제조된다. 상기 수지 시럽으로는 아크릴계 수지 또는 불포화 폴리에스테르계가 사용될 수 있으며, 바람직하기로는 아크릴계 수지이다. 상기 경화성 조성물은 탄산칼슘, 수산화 알루미늄, 실리카, 알루미나, 유산바륨, 수산화 마그네슘 등과 같은 무기충진제나 통상의 첨가제를 더 포함할 수 있으며, 투입비율 및 투입 방법은 본 발명이 속하는 분야의 통상의 지식을 가진 자에 의해 용이하게 실시될 수 있다.Another aspect of the present invention relates to an artificial marble comprising a marble chip of the present invention. The artificial marble is prepared by curing the curable composition mixed with the marble chip and the resin syrup prepared in a conventional manner. As the resin syrup, an acrylic resin or an unsaturated polyester type may be used, and preferably, an acrylic resin. The curable composition may further include inorganic fillers or conventional additives such as calcium carbonate, aluminum hydroxide, silica, alumina, barium lactate, magnesium hydroxide, and the like. It can be easily carried out by a person who has.
본 발명의 인조대리석은 1.45 내지 1.75의 비중을 가지는 마블칩을 사용하므로 경화시간이나 성형시간에 구애없이 균일한 패턴을 구현할 수 있으며, 연속생산이 가능하다. Since the artificial marble of the present invention uses a marble chip having a specific gravity of 1.45 to 1.75, a uniform pattern can be realized regardless of curing time or molding time, and continuous production is possible.
구체예에서 상기 매트릭스는 비중이 1.52 내지 1.83이며, 마블칩은 비중이 1.45 내지 1.75이며, 매트릭스와 마블칩의 비중차는 2.0 이하일 수 있다. 바람직하게는 상기 비중차는 1.7 이하이며, 더 바람직하게는 1.5 이하이고, 가장 바람직하게는 1.0 이하이다. In embodiments, the specific gravity of the matrix may be 1.52 to 1.83, the specific gravity of the marble chip may be 1.45 to 1.75, and the specific gravity difference between the matrix and the marble chip may be 2.0 or less. Preferably the said specific gravity difference is 1.7 or less, More preferably, it is 1.5 or less, Most preferably, it is 1.0 or less.
본 발명의 인조대리석은 매트릭스와 마블칩의 매트릭스에 마블칩의 비중차가 작으므로 마블칩이 매트릭스에 균일하게 분산된 구조를 갖는다. The artificial marble of the present invention has a structure in which the marble chip is uniformly dispersed in the matrix since the specific gravity difference between the marble chip and the matrix of the marble chip is small.
상기 매트릭스는 아크릴계 시럽 및 무기충진제를 포함하는 경화성 조성물의 경화물일 수 있다. The matrix may be a cured product of the curable composition comprising an acrylic syrup and an inorganic filler.
하나의 구체예에서는 상기 인조대리석은 칩인칩형태의 마블칩을 사용하여 칩인칩 형태의 마블칩이 분산된 구조를 갖는다. 도 1에는 칩인칩 형태의 마블칩(1A)을 사용한 인조대리석(10)의 개략도이다. 본 발명의 마블칩(1A) 내부에는 상대적으로 크기가 작은 마블칩(11A)이 불규칙하게 분산되어 있으며, 이러한 칩인칩 형태의 마블칩(1A)은 매트릭스(3)에 분산되어 있다. In one embodiment, the artificial marble has a structure in which a chip in chip type marble chip is dispersed using a chip in chip type marble chip. 1 is a schematic view of the artificial marble 10 using the chip-in-chip marble chip 1A. In the marble chip 1A of the present invention, a relatively small marble chip 11A is irregularly distributed, and such a chip-in-chip marble chip 1A is dispersed in the matrix 3.
다른 구체예에서는 상기 인조대리석은 다층구조의 마블칩을 사용하여 다층구조의 마블칩이 분산된 구조를 갖는다. 도 2에는 다층구조의 마블칩(2A)을 사용한 인조대리석(20)의 개략도이다. 도 2에 도시된 바와 같이 다층구조의 마블칩(2A)에는 색상이나 투명도가 다른 복수의 층(21A, 21B, 21C,,,)가 형성되어 있으며, 이러한 마블칩은 매트릭스(3)에 분산되어 있다. In another embodiment, the artificial marble has a structure in which a marble chip having a multilayer structure is dispersed using a marble chip having a multilayer structure. 2 is a schematic diagram of the artificial marble 20 using the multi-layer marble chip 2A. As shown in FIG. 2, a plurality of layers 21A, 21B, 21C, ..., which are different in color or transparency, are formed in the marble chip 2A having a multilayer structure, and the marble chip is dispersed in the matrix 3. have.
상기 마블칩을 사용한 인조대리석의 표면질감은 엔지니어드 스톤과 유사한 표면 질감을 연출할 수 있는 것과 동시에, 우수한 가공성을 가지므로, 주방의 씽크대 상판, 세면 화장대의 상판, 은행 및 일반 매장의 접수대 등 각종 카운터의 상판 및 장식용품 등에 광범위하게 적용될 수 있다. The surface texture of the artificial marble using the marble chip can produce a surface texture similar to that of the engineered stone and has excellent workability. Therefore, the countertop of the sink countertop of the kitchen, the countertop of the vanity table, the reception desk of a bank and a general store can be used. It can be applied to a wide range of tops and decorative articles.
또한 상기 인조대리석을 분쇄하여 내부에 투명칩이 형성된 칩인칩 형태의 마블칩으로 사용할 수 있다. In addition, the artificial marble may be pulverized and used as a chip-type marble chip having a transparent chip formed therein.
본 발명은 하기의 실시예에 의하여 보다 더 잘 이해될 수 있으며, 하기의 실시예는 본 발명의 예시목적을 위한 것이며 첨부된 특허청구범위에 의하여 한정되는 보호범위를 제한하고자 하는 것은 아니다.The invention can be better understood by the following examples, which are intended for the purpose of illustration of the invention and are not intended to limit the scope of protection defined by the appended claims.
실시예Example
실시예 1∼3: 마블칩 제조Examples 1-3: Marble Chip Manufacturing
실시예 1Example 1
브롬화 알콕시레이티드 디아크릴레이트 80 중량부, 메틸메타아크릴레이트 20 중량부로 이루어진 수지조성물 100 중량부에 벤조일퍼옥사이드 0.2 중량부 및 비스(4-터셔리부틸사이클로헥실)퍼록시디카르보네이트 0.5 중량부를 혼합하고, 50 ℃에서 경화시킨 후 파쇄하여 비중 1.608의 고비중칩을 제조하였다.0.2 part by weight of benzoyl peroxide and 0.5 part by weight of bis (4-tertarybutylcyclohexyl) peroxydicarbonate in 100 parts by weight of a resin composition consisting of 80 parts by weight of alkoxylated diacrylate and 20 parts by weight of methyl methacrylate. The mixture was cured at 50 ° C. and then crushed to prepare a high specific gravity chip having a specific gravity of 1.608.
실시예 2Example 2
색상부여제로 프탈로시아닌그린을 0.01 중량부를 첨가한 것을 제외하고는 상기 실시예 1과 동일하게 수행하였다. 제조된 마블칩의 비중은 1.609이었다. The same procedure as in Example 1 was carried out except that 0.01 part by weight of phthalocyanine green was added as a color imparting agent. The specific gravity of the manufactured marble chip was 1.609.
실시예 3Example 3
브롬화 알콕시레이티드 디아크릴레이트 90 중량부, 스티렌모노머 10 중량부로 이루어진 수지조성물 100 중량부에 벤조일퍼옥사이드 0.2 중량부 및 비스(4-터셔리부칠사이클로헥실)퍼록시디카르보네이트 0.5 중량부를 혼합하고, 50 ℃에서 경화시킨 후 파쇄하여 비중 1.691의 고비중칩을 제조하였다.To 100 parts by weight of a resin composition consisting of 90 parts by weight of alkoxylated diacrylate and 10 parts by weight of styrene monomer, 0.2 parts by weight of benzoyl peroxide and 0.5 parts by weight of bis (4-tertoxycyclohexyl) peroxydicarbonate were mixed. , And cured at 50 ℃ and then crushed to prepare a high specific gravity chip of specific gravity 1.691.
비교실시예 1Comparative Example 1
폴리메틸메타아크릴레이트를 메틸메타아크릴레이트에 용해하여 만든 용액 100 중량부에 트리메틸프로판트리아크릴레이트 2 중량부, 노르말도데실메르캡탄 0.1 중량부, 벤조일퍼옥사이드 1.0 중량부를 혼합하고, 50 ℃에서 경화시킨 후 파쇄하여 비중 1.183의 PMMA칩을 제조하였다.2 parts by weight of trimethylpropanetriacrylate, 0.1 part by weight of normaldodecyl mercaptan, and 1.0 part by weight of benzoyl peroxide are mixed with 100 parts by weight of a solution prepared by dissolving polymethylmethacrylate in methyl methacrylate and cured at 50 ° C. After crushing, PMMA chips having a specific gravity of 1.183 were prepared.
비교실시예 2Comparative Example 2
불포화 폴리에스테르 수지 (애경화학(주), TP-145X) 100 중량부 및 벤조일퍼옥사이드 1.0 중량부를 혼합한 것을 제외하고는 상기 실시예 1과 동일하게 수행하였다. 제조된 마블칩의 비중은 1.203이었다. It carried out similarly to Example 1 except having mixed 100 weight part of unsaturated polyester resins (Aekyung Chemical Co., Ltd., TP-145X) and 1.0 weight part of benzoyl peroxides. The specific gravity of the manufactured marble chip was 1.203.
비교실시예 3Comparative Example 3
에폭시아크릴레이트 올리고머 60 중량부, 스티렌모노머 40 중량부로 제조된 비닐에스테르 수지(애경화학(주) 제조, DION-9120) 100 중량부 및 벤조일퍼옥사이드 1.0 중량부를 혼합한 것을 제외하고는 상기 실시예 1과 동일하게 수행하였다. 제조된 마블칩의 비중은 1.194이었다. Example 1 except 100 parts by weight of vinyl ester resin (DION-9120, manufactured by Aekyung Chemical Co., Ltd.) and 1.0 part by weight of benzoyl peroxide, prepared by mixing 60 parts by weight of epoxy acrylate oligomer and 40 parts by weight of styrene monomer. Was performed in the same manner. The specific gravity of the manufactured marble chip was 1.194.
실시예 4∼6: 인조대리석 제조Examples 4 to 6: Preparation of artificial marble
실시예 4Example 4
폴리메틸메타아크릴레이트를 메틸메타아크릴레이트에 용해하여 만든 시럽 100 중량부에 수산화 알루미늄 180 중량부, 트리메틸프로판트리아크릴레이트 2 중량부, 노르말도데실메르캡탄 0.1 중량부, 소포제와 분산제 각각 0.1 중량부 및 벤조일퍼옥사이드 1.0 중량부를 혼합한 조성물에 상기 실시예 1에서 제조된 마블칩을 50 중량부를 첨가하고, 잘 교반시킨후 연속성형 공법으로 60 ℃의 온도에서 경화하여 인조대리석을 제조하였다. 180 parts by weight of aluminum hydroxide, 2 parts by weight of trimethylpropanetriacrylate, 0.1 part by weight of normaldodecyl mercaptan, 0.1 part by weight of an antifoaming agent and a dispersant, respectively, in 100 parts by weight of a syrup made by dissolving polymethylmethacrylate in methyl methacrylate. And 50 parts by weight of the marble chip prepared in Example 1 was added to the composition mixed with 1.0 parts by weight of benzoyl peroxide, and stirred well, followed by curing at a temperature of 60 ° C. by a continuous molding method to prepare artificial marble.
실시예 5Example 5
실시예 2에서 제조된 유색투명칩을 사용한 것을 제외하고는 상기 실시예 4와 동일하게 수행하였다. The same procedure as in Example 4 was carried out except that the colored transparent chip prepared in Example 2 was used.
실시예 6Example 6
실시예 3에서 제조된 칩을 사용한 것을 제외하고는 상기 실시예 4와 동일하게 수행하였다. The same procedure as in Example 4 was carried out except that the chip prepared in Example 3 was used.
비교실시예 4Comparative Example 4
비교실시예 1에서 제조된 칩을 사용한 것을 제외하고는 상기 실시예 4와 동일하게 수행하였다. The same procedure as in Example 4 was performed except that the chip prepared in Comparative Example 1 was used.
비교실시예 5Comparative Example 5
비교실시예 2에서 제조된 칩을 사용한 것을 제외하고는 상기 실시예 4와 동일하게 수행하였다. The same procedure as in Example 4 was carried out except that the chip prepared in Comparative Example 2 was used.
비교실시예 6Comparative Example 6
비교실시예 3에서 제조된 칩을 사용한 것을 제외하고는 상기 실시예 4와 동일하게 수행하였다. The same procedure as in Example 4 was carried out except that the chip prepared in Comparative Example 3 was used.
상기 실시예 1∼3의 마블칩으로 제조된 실시예 4∼6 인조대리석과 비교실시예 1∼3의 칩으로 제조된 비교실시예 4∼6의 인조대리석의 평가를 하기 표 1에 나타내었다.Evaluation of the artificial marbles of Examples 4 to 6 manufactured from the marble chips of Examples 1 to 3 and the comparative marbles of Comparative Examples 4 to 6 prepared from the chips of Comparative Examples 1 to 3 is shown in Table 1 below.
표 1
Figure PCTKR2009007275-appb-T000001
Table 1
Figure PCTKR2009007275-appb-T000001
상기에서 물성 평가방법은 하기와 같은 방법으로 수행하였다.Property evaluation method in the above was carried out in the following manner.
(1) 내약품성: 1.0 N농도 염산, 1.0 N농도의 암모니아수로 25 ℃ 환경에서 48 시간 침적 후 표면을 평가한 것이다.(1) Chemical resistance: 1.0 N concentration of hydrochloric acid and 1.0 N concentration of ammonia was evaluated for the surface after immersion for 48 hours in a 25 ℃ environment.
(2) 굴절률: 25 ℃ 온도조건 하에서 ABBE 굴절계 (3T)로 측정하였다.(2) Refractive index: It measured by ABBE refractometer (3T) on 25 degreeC temperature conditions.
(3) 평활성: 샌딩후 칩과 모재와의 경계면의 평활성을 육안으로 평가하였다. (3) Smoothness: The smoothness of the interface between the chip and the base metal after sanding was visually evaluated.
(4) 샌딩성: 샌드페이퍼로 샌딩후 칩의 외관을 육안으로 평가하였다. (4) Sanding property: The appearance of the chip after sanding with sandpaper was visually evaluated.
(5) 컨케이브: 칩과 매트릭스간의 계면이 갈라지거나, 칩의 함몰현상을 말하며 이를 육안으로 평가하였다. (5) Concave: The interface between the chip and the matrix is cracked, or the chip is decayed and evaluated visually.
(6) 열가공성: 인조대리석을 180 ℃에서 20분간 가열하여 곡면가공을 실시했을 때 칩의 돌출현상이 발생하거나 크랙이 발생되지 않는 최소 반경을 측정하였다.(6) Thermal processability: When the artificial marble was heated at 180 ° C. for 20 minutes and the curved surface was processed, the minimum radius that the chip was not protruded or cracked was measured.
상기 표 1에서 보는 바와 같이, 실시예 4∼6은 모든 물성평가에서 양호하고 열가공성에서도 반지름 150 MM의 곡면까지 양호하였다. 비교실시예 4는 열가공성에서는 가장 우수한 결과를 가졌으나 투명칩 분포가 전단면에서 일정하지 않았다. 그리고, 굴절율이 낮아서 석영과 같은 질감을 나타낼 수 없어 엔지니어드 스톤의 질감을 내기에는 불가능하였다. 비교실시예 5는 전단면 칩분포가 불량하고 컨케이브 현상 발생과 열가공성이 가장 떨어지는 것으로 나타났으며, 칩의 내약품성이 불량함을 보여준다. 비교실시예 6은 전단면 칩분포가 일정하지 않아 연속생산에는 적용이 불가능하였다.As shown in Table 1, Examples 4 to 6 were good in all the physical properties evaluation, and even in the heat workability was good to the curved surface of the radius 150MM. Comparative Example 4 had the best result in the thermal workability, but the transparent chip distribution was not constant at the shear plane. In addition, since the refractive index was low, the texture such as quartz could not be represented, and thus it was impossible to produce the engineered stone. In Comparative Example 5, the chip distribution was poor, the occurrence of concave phenomenon and the thermal processing were found to be the lowest, and the chip was poor in chemical resistance. Comparative Example 6 is not applicable to continuous production because the shear chip distribution is not constant.
본 발명의 단순한 변형 내지 변경은 이 분야의 통상의 지식을 가진 자에 의하여 용이하게 이용될 수 있으며, 이러한 변형이나 변경은 모두 본 발명의 영역에 포함되는 것으로 볼 수 있다.Simple modifications and variations of the present invention can be readily used by those skilled in the art, and all such variations or modifications can be considered to be included within the scope of the present invention.

Claims (23)

  1. 바인더와 반응성 모노머를 포함하는 수지 조성물을 경화시켜 형성되며, 상기 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머를 포함하는 것을 특징으로 하는 마블칩. A marble chip formed by curing a resin composition comprising a binder and a reactive monomer, wherein the binder comprises a halogenated alkoxylated di (meth) acrylate oligomer.
  2. 제1항에 있어서, 상기 수지 조성물은 바인더 50 내지 90 중량부 및 반응성 모노머 10 내지 50 중량부를 포함하는 것을 특징으로 하는 마블칩.The marble chip of claim 1, wherein the resin composition comprises 50 to 90 parts by weight of the binder and 10 to 50 parts by weight of the reactive monomer.
  3. 제2항에 있어서, 상기 바인더는 할로겐화 우레탄아크릴레이트, 할로겐화 에폭시아크릴레이트 및 이들의 혼합물로 이루어진 군으로부터 선택된 바인더를 더 포함하는 것을 특징으로 하는 마블칩. The marble chip of claim 2, wherein the binder further comprises a binder selected from the group consisting of halogenated urethane acrylates, halogenated epoxy acrylates, and mixtures thereof.
  4. 제3항에 있어서, 상기 할로겐화 우레탄 아크릴레이트의 수평균분자량은 900 내지 4,000이고, 상기 할로겐화 에폭시 아크릴레이트의 수평균분자량은 600 내지 3,500인 것을 특징으로 하는 마블칩.The marble chip of claim 3, wherein the number average molecular weight of the halogenated urethane acrylate is 900 to 4,000, and the number average molecular weight of the halogenated epoxy acrylate is 600 to 3,500.
  5. 제1항에 있어서, 상기 반응성 모노머는 스티렌 모노머, 브로모 스티렌, 비닐톨루엔, 메틸(메타)아크릴레이트, 에틸(메타)아크릴레이트, 2-에틸헥실(메타)아크릴레이트, 옥실(메타)아크릴레이트, 도데실(메타)아크릴레이트, 옥타데실(메타)아크릴레이트, 메틸사이클로헥실(메타)아크릴레이트, 이소보닐(메타)아크릴레이트, 페닐(메타)아크릴레이트, 벤질(메타)아크릴레이트, 클로로페닐(메타)아크릴레이트, 메톡시페닐(메타)아크릴레이트, 브로모페닐(메타)아크릴레이트, 에틸렌글리콜디(메타)아크릴레이트, 1,2-프로필렌글리콜(메타)아크릴레이트, 1,3-부탄디올디(메타)아크릴레이트, 1,3-프로필렌글리콜(메타)아크릴레이트, 1,4-부탄디올디(메타)아크릴레이트, 1,5-펜탄디올디(메타)아크릴레이트, 네오펜틸글리콜디(메타)아크릴레이트, 디에틸렌글리콜디(메타)아크릴레이트, 트리에틸렌글리콜디(메타)아크릴레이트, 디프로필렌글리콜디(메타)아크릴레이트, 디알릴테레프탈레이트, 이알릴프탈레이트, 디알릴카르보네이트, 디비닐벤젠, 알파메틸렌스티렌, 알파메틸렌스티렌다이머, 트리메틸올프로판트리(메타)아크릴레이트, 펜타에리스리톨트리(메타)아크릴레이트, 펜타에리스리톨테트라(메타)아크릴레이트, 디펜타에이스리톨헥사(메타)아크릴레이트, 에톡시에틸아크릴레이트, 글리시딜(메타)아크릴산의 에폭시아크릴레이트, 1,6-헥산디올디(메타)아크릴레이트, 글리세린트리(메타)아크릴레이트, 메틸프로판디올디(메타)아크릴레이트, 폴리에틸렌글리콜디(메타)아크릴레이트 및 이들의 혼합물로 이루어진 군으로부터 선택되는 것을 특징으로 하는 마블칩.The method of claim 1, wherein the reactive monomer is a styrene monomer, bromo styrene, vinyl toluene, methyl (meth) acrylate, ethyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, oxyl (meth) acrylate , Dodecyl (meth) acrylate, octadecyl (meth) acrylate, methylcyclohexyl (meth) acrylate, isobonyl (meth) acrylate, phenyl (meth) acrylate, benzyl (meth) acrylate, chlorophenyl (Meth) acrylate, methoxyphenyl (meth) acrylate, bromophenyl (meth) acrylate, ethylene glycol di (meth) acrylate, 1,2-propylene glycol (meth) acrylate, 1,3-butanediol Di (meth) acrylate, 1,3-propylene glycol (meth) acrylate, 1,4-butanedioldi (meth) acrylate, 1,5-pentanedioldi (meth) acrylate, neopentylglycol di (meth ) Acrylate, diethylene glycol di (meta ) Acrylate, triethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, diallyl terephthalate, allyl phthalate, diallyl carbonate, divinylbenzene, alpha methylene styrene, alpha methylene styrene Dimer, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaacetitol hexa (meth) acrylate, ethoxyethyl acrylate, glycidyl Epoxyacrylates of (meth) acrylic acid, 1,6-hexanediol di (meth) acrylate, glycerin tri (meth) acrylate, methylpropanedioldi (meth) acrylate, polyethylene glycol di (meth) acrylate and these Marble chip, characterized in that selected from the group consisting of.
  6. 제1항에 있어서, 상기 수지 조성물은 착색제, 소포제, 커플링제, 자외선흡수제, 광확산제, 중합억제제, 대전방지제, 난연제, 열안정제 및 이들의 혼합으로 이루어진 군으로부터 선택된 첨가제를 더 포함하는 것을 특징으로 하는 마블칩.The method of claim 1, wherein the resin composition further comprises an additive selected from the group consisting of colorants, antifoams, coupling agents, ultraviolet absorbers, light diffusing agents, polymerization inhibitors, antistatic agents, flame retardants, heat stabilizers and mixtures thereof. Marble chip made with.
  7. 제1항에 있어서, 상기 수지 조성물은 제2 마블칩을 더 포함하여 마블칩 내부에 제2 마블칩이 형성된 칩인칩 형태인 것을 특징으로 하는 마블칩. The marble chip of claim 1, wherein the resin composition further comprises a second marble chip, wherein the resin composition is a chip in which a second marble chip is formed inside the marble chip.
  8. 제1항에 있어서, 상기 수지 조성물은 색상 또는 투명성이 다른 제2 수지 조성물을 더 포함하며, 상기 제2 수지 조성물은 제2 바인더와 제2 반응성 모노머를 포함하고, 상기 제2 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머, 할로겐화 우레탄아크릴레이트, 할로겐화 에폭시아크릴레이트로 이루어진 군으로부터 하나 이상 선택되는 것을 특징으로 하는 마블칩. The method of claim 1, wherein the resin composition further comprises a second resin composition of different colors or transparency, the second resin composition comprises a second binder and a second reactive monomer, the second binder is alkoxy halide Marble chip, characterized in that at least one selected from the group consisting of a tide di (meth) acrylate oligomer, halogenated urethane acrylate, halogenated epoxy acrylate.
  9. 제1항에 있어서, 상기 마블칩은 비중이 1.45 내지 1.75인 것을 특징으로 하는 마블칩.The marble chip of claim 1, wherein the marble chip has a specific gravity of 1.45 to 1.75.
  10. 제1항에 있어서, 상기 마블칩은 굴절률이 25 ℃에서 ABBE 굴절계 (3T)로 측정한 굴절률이 1.55∼1.75인 것을 특징으로 하는 마블칩.The marble chip according to claim 1, wherein the marble chip has a refractive index of 1.55 to 1.75 measured by an ABBE refractometer (3T) at a refractive index of 25 ° C.
  11. 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머를 포함하는 바인더에 반응성 모노머를 혼합하여 수지 조성물을 제조하는 단계;Preparing a resin composition by mixing a reactive monomer with a binder including a halogenated alkoxylated di (meth) acrylate oligomer;
    상기 수지 조성물을 경화시켜 경화물을 제조하는 단계; 및Curing the resin composition to prepare a cured product; And
    상기 경화물을 파쇄하는 단계;Crushing the cured product;
    로 이루어지는 것을 특징으로 하는 마블칩 제조방법.Marble chip manufacturing method characterized in that consisting of.
  12. 제11항에 있어서, 상기 경화물을 직경 또는 최대 대각선길이를 0.1 내지 30 mm로 파쇄하는 것을 특징으로 하는 마블칩 제조방법.12. The method of claim 11, wherein the cured product is a marble chip manufacturing method, characterized in that crushing the diameter or the maximum diagonal length of 0.1 to 30 mm.
  13. 제11항에 있어서, 상기 경화물에 금속을 증착시킨 후 파쇄하는 것을 특징으로 하는 마블칩 제조방법.The method of claim 11, wherein the chip is crushed after depositing a metal on the cured product.
  14. 제11항에 있어서, 상기 바인더는 할로겐화 우레탄아크릴레이트, 할로겐화 에폭시아크릴레이트 및 이들의 혼합물로 이루어진 군으로부터 선택된 바인더를 더 포함하는 것을 특징으로 하는 마블칩. The marble chip of claim 11, wherein the binder further comprises a binder selected from the group consisting of halogenated urethane acrylates, halogenated epoxy acrylates, and mixtures thereof.
  15. 제11항에 있어서, 상기 수지 조성물에 착색제, 소포제, 커플링제, 자외선흡수제, 광확산제, 중합억제제, 대전방지제, 난연제, 열안정제 및 이들의 혼합으로 이루어진 군으로부터 선택된 첨가제를 더 첨가하는 것을 특징으로 하는 마블칩 제조방법.12. The additive according to claim 11, further comprising a colorant, an antifoaming agent, a coupling agent, an ultraviolet absorber, a light diffusing agent, a polymerization inhibitor, an antistatic agent, a flame retardant, a heat stabilizer, and a mixture thereof. Marble chip manufacturing method.
  16. 제11항에 있어서, 상기 수지 조성물에 제2 마블칩을 더 첨가하여 마블칩 내부에 제2 마블칩이 형성된 칩인칩 형태로 제조하는 것을 특징으로 하는 마블칩 제조방법.The method of claim 11, wherein the second chip is further added to the resin composition to manufacture the chip as a chip having a second chip formed inside the chip.
  17. 제16항에 있어서, 상기 제2 마블칩은 제1항 내지 제10항 중 어느 한 항의 마블칩, 아크릴계 인조대리석 마블칩, 불포화 에스테르계 인조대리석 마블칩으로 이루어진 군으로부터 하나 이상 선택되는 것을 특징으로 하는 마블칩 제조방법.The method of claim 16, wherein the second marble chip is selected from at least one selected from the group consisting of the marble chip of any one of claims 1 to 10, acrylic artificial marble marble chips, unsaturated ester artificial marble marble chips. Marble chip manufacturing method.
  18. 제11항에 있어서, 상기 수지 조성물은 색상 또는 투명성이 다른 제2 수지 조성물을 더 포함하며, 상기 제2 수지 조성물은 제2 바인더와 제2 반응성 모노머를 포함하고, 상기 제2 바인더는 할로겐화 알콕시레이티드 디(메타)아크릴레이트 올리고머, 할로겐화 우레탄아크릴레이트, 할로겐화 에폭시아크릴레이트로 이루어진 군으로부터 하나 이상 선택되어 흐름무늬 또는 다층구조를 형성시키는 것을 특징으로 하는 마블칩 제조방법.The method of claim 11, wherein the resin composition further comprises a second resin composition having a different color or transparency, the second resin composition comprises a second binder and a second reactive monomer, the second binder is alkoxy halide A method for manufacturing a marble chip, characterized in that at least one selected from the group consisting of a tide di (meth) acrylate oligomer, a halogenated urethane acrylate and a halogenated epoxy acrylate to form a flow pattern or a multilayer structure.
  19. 제18항에 있어서, 상기 색상 또는 투명성이 다른 제2 수지 조성물은 복수로 포함하는 것을 특징으로 하는 마블칩 제조방법.The method of claim 18, wherein the second resin composition having different colors or transparency comprises a plurality of marble chip manufacturing methods.
  20. 제1항 내지 제10항 중 어느 한 항의 마블칩을 포함하는 인조대리석. Artificial marble comprising a marble chip of any one of claims 1 to 10.
  21. 제20항에 있어서, 상기 인조대리석은 매트릭스에 마블칩이 분산되어 이루어지는 것을 특징으로 하는 인조대리석.The artificial marble according to claim 20, wherein the artificial marble is formed by dispersing marble chips in a matrix.
  22. 제21항에 있어서, 상기 매트릭스는 비중이 1.52 내지 1.83이며, 마블칩은 비중이 1.45 내지 1.75이며, 매트릭스와 마블칩의 비중차는 2.0 이하인 것을 특징으로 하는 인조대리석.The artificial marble of claim 21, wherein the matrix has a specific gravity of 1.52 to 1.83, a marble chip having a specific gravity of 1.45 to 1.75, and a specific gravity difference between the matrix and the marble chip of 2.0 or less.
  23. 제22항에 있어서, 상기 매트릭스는 아크릴계 시럽 및 무기충진제를 포함하는 경화성 조성물의 경화물인 것을 특징으로 하는 인조대리석.23. The artificial marble according to claim 22, wherein the matrix is a cured product of a curable composition comprising an acrylic syrup and an inorganic filler.
PCT/KR2009/007275 2008-12-15 2009-12-07 Marble chips for an artificial marble, manufacturing method thereof, and artificial marble comprising same WO2010071314A2 (en)

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CN2009801504402A CN102245681B (en) 2008-12-15 2009-12-07 Marble chips for an artificial marble, manufacturing method thereof, and artificial marble comprising same
JP2011540602A JP5400169B2 (en) 2008-12-15 2009-12-07 Marble chip for artificial marble, manufacturing method thereof and artificial marble including the same
EP09833592.0A EP2377896B1 (en) 2008-12-15 2009-12-07 Marble chips for an artificial marble, manufacturing method thereof, and artificial marble comprising same
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