KR20180035534A - Resin composition for the transparent artificial marble chips and preparing method thereof - Google Patents

Abstract

The present invention aims to manufacture transparent artificial marble chips of high specific gravity, which is improved in workability and mechanical properties, and a halogenated epoxy acrylate resin is cured by reacting with a starting acrylic monomer using a UV-Fe or UV-Ga lamp. It is possible to improve workability which is a problem of existing peroxide initiator type and to manufacture a transparent chip having a high specific gravity without using any inorganic filler.

Description

Technical Field [0001] The present invention relates to a resin composition for a transparent chip of a UV-curing type artificial marble and a method for producing the same,

The present invention relates to a UV curable resin composition for artificial marble transparent chips and a process for producing the same. More particularly, the present invention relates to a UV curable resin composition for artificial marble transparent chips, which has improved workability and mechanical properties.

Artificial marble chips are blended with acrylic, unsaturated polyester, epoxy resin, etc., and they are transparent, or various additives and pigments are added to realize the texture of natural marble, so that acrylic artificial marble or polyester artificial marble It is used to pay.

The existing artificial marble transparent chips are cracked as compared with the matrix and cracked and cracked when the artificial marble is manufactured or manufactured and transported and post processed, and the original texture of the artificial marble is damaged And the merchantability was significantly lowered.

The reason for the workability and mechanical properties of the artificial marble transparent chip resin is that it shortens the manufacturing time of the chip resin and improves the productivity and increases the merchantability.

When acrylic or unsaturated polyester resin is used alone in artificial marble transparent chips, the specific gravity is remarkably low and halogenated resin is used to increase the specific gravity. However, when the halogenated resin is used alone, it is too brittle, do.

Korean Patent Registration 10-1475788 Korean Patent Publication No. 10-2015-0137587

Accordingly, it is an object of the present invention to provide a resin composition for producing artificial marble transparent chips having a smooth texture while maintaining high voids and a method for producing the same, in order to solve the above problems.

The present invention provides a resin composition for producing artificial marble transparent chips containing a reactive monomer and a specific photoinitiator in a halogenated epoxy acrylate resin for the above purpose.

The present invention relates to a process for producing a halogenated epoxy acrylate resin, which comprises reacting a halogenated epoxy acrylate resin with a reactive monomer selected from the group consisting of methyl methacrylate, trimethylolpropane trimethacrylate, and 1,6-hexanediol dimethacrylate, Artificial marble transparent chip manufacture comprising a photoinitiator selected from the group consisting of trimethylbenzoyl) -phosphine oxide, 1-hydroxy-cyclohexylphenylketone and phenylbis (2,4,6-trimethylbenzoyl) -phosphine oxide monoisocyanate The present invention provides a resin composition comprising

The method for producing a transparent marble of artificial marble of the present invention is characterized in that a halogenated epoxy acrylate resin is mixed with a reactive monomer selected from the group consisting of methyl methacrylate, trimethylolpropane trimethacrylate, and 1,6-hexanediol dimethacrylate, (2,4,6-trimethylbenzoyl) -phosphine oxide, 1-hydroxy-cyclohexyl phenyl ketone and phenyl bis (2,4,6-trimethylbenzoyl) -phosphine oxide monoisocyanate. Is added and UV cured.

The resin composition for a UV curable artificial marble transparent chip of the present invention preferably comprises 70 to 90 parts by weight of a halogenated epoxy acrylate resin, 10 to 30 parts by weight of a reactive monomer, and 0.01 to 2 parts by weight of a photoinitiator.

The halogenated epoxy acrylate resin used in the composition may be prepared by addition reaction of isocyanate, which is a reactive monomer, to the unreacted hydroxy group of the halogenated epoxy acrylate resin skeleton, or 1 to 5 parts by weight of urethane acrylate.

The UV curing type artificial marble transparent chip of the present invention can provide a transparent chip for UV curing artificial marble having a high specific gravity of 1.5 to 1.7 and a high workability and mechanical properties.

The method of preparing the composition of the present invention is as follows.

A step of preparing a first halogenated epoxy acrylate resin, a step of reacting a reactive monomer with an unreacted hydroxy group of a halogenated epoxy acrylate resin skeleton, and a step of adding a third reactive monomer and other additives.

In the first step, the halogenated epoxy acrylate resin preparation step, a halogenated epoxy resin having an epoxy equivalent of 300-1,000 is placed in a reaction tank equipped with a stirrer, a thermometer, a cooling condenser and a dropping device. Then, when the flow is confirmed by heating and melting while supplying nitrogen or air, the temperature of the reactor contents is raised to 100-125 ° C.

After the halogenated epoxy resin is completely melted and the reaction tank is confirmed to be smooth, the reaction catalyst is added to the molten halogenated epoxy resin. The reaction catalyst is added in an amount of 0.1-3.0 wt% based on the amount of acrylic acid or methacrylic acid, An antioxidant can be added. It is preferable to add 0.005 to 0.02% by weight of the reaction color improving agent and the antioxidant, respectively.

Examples of the reaction catalyst include triethylamine, ethyltrimethylammonium bromide, dimethylbenzylamine, dinormalbutylamine, dimethylphenylbenzylamine, tetramethylammonium chloride, chromium acetylacetate, triphenylstinine, dimethylphenylbenzylammonium chloride, triphenylphosphine Pin, ethylmethylimidazole and dimethylimidazole are used. As the reaction color improving agent, it is preferable to use phosphorous acid or phosphorus compounds.

After all of the halogenated epoxy resin and other additives were put into the reactor and it was confirmed that the temperature had risen, acrylic acid or methacrylic acid and the polymerization inhibitor were well mixed with the dropping apparatus so that the equivalent ratio of the halogenated epoxy resin / acrylic acid (or methacrylic acid) And dropping. At this time, make sure that the polymerization inhibitor is completely dissolved in acrylic acid. The polymerization inhibitor is preferably 0.001-0.04% by weight based on the total amount of the halogenated epoxy resin, and examples of the polymerization inhibitor include hydroquinone, toluoquinone, hydroquinone monomethyl ether, parabenquoquinone, dimethylparabenquoquinone, Select one or more from the group.

The reaction catalyst must be added to the molten resin in advance and mixed, and the polymerization inhibitor is dissolved in the dropping vessel together with acrylic acid and reacted dropwise. At this time, the reaction should be carried out over 1-3 hours and the temperature of the reaction vessel should be 100-120 ° C.

After completion of the dropwise addition, the reactor temperature is raised to raise the temperature of the reaction product to 105-125 ° C., and the reaction is carried out while maintaining the isothermal temperature to prepare a halogenated epoxy acrylate resin having an acid value of 5-15 and a number average molecular weight of 1,000-5,000.

In the step of reacting the reactive monomer to the unreacted hydroxy group in the second stage halogenated epoxy acrylate resin skeleton, 1 to 5 parts by weight of monoisocyanate is added to 65 to 89 parts by weight of the halogenated epoxy acrylate resin prepared in the first step. The reactor temperature is maintained at 30-50 ° C. After the addition, the temperature is raised to 60-100 ° C, and the reaction is maintained for 1-3 hours. The reaction is terminated when the isocyanate content after the maintenance reaction becomes 0.1% or less. Specific examples of the monoisocyanate include 2-isocyanatoethyl (meth) acrylate, 1,1-bis (acryloyloxymethyl) ethyl isocyanate, (meth) acryloyloxyethyl isocyanate, -α, α-dimethylbenzyl isocyanate, methacryloyl isocyanate; Vinyl isocyanate; One or more of allyl isocyanates can be used.

As a further step of the third reactive monomer and the other additives, 10 to 30 parts by weight of the reactive monomer is added to 70 to 90 parts by weight of the halogenated epoxy acrylate resin prepared in the second step. 1 to 5 parts by weight of urethane acrylate may further be added.

The halogenated epoxyacrylate resin binder obtained above is cooled to 105-100 ° C and 10-30 parts by weight of a reactive monomer is added at 90-100 ° C while stopping the supply of nitrogen or air, 0.00005-0.0002 parts by weight of metal soap salt may be used for controlling the hardenability.

Example 1

And 70.0 parts by weight of a halogenated epoxy resin (KODO CHEMICAL YDB-410P) are placed in a reaction tank equipped with a stirrer, a thermometer, a cooling condenser and a dropping device. Then, the temperature of the contents of the reaction vessel is raised to 100-125 ° C when the flow is confirmed by supplying nitrogen or air while heating, and then 0.005 part by weight of the polymerization inhibitor parabenzoquinone 0.005 part by weight of hydroquinone and 0.1 parts by weight of triethylamine of the reaction catalyst After the addition, 13.89 parts by weight of methacrylic acid was added to the dropping funnel and reacted while dropping the solution. After addition reaction of 1.0 part by weight of toluene diisocyanate at an acid value of 30 or less, 13.0 parts by weight of methyl methacrylate and 2.0 parts by weight of 1,6-hexanediol dimethacrylate were diluted to obtain a halogenated epoxy acrylate resin binder having a number average molecular weight of 5,000 .

Example 2

35.0 parts by weight of a halogenated epoxy resin (KODO CHEMICAL YDB-406) and 35.0 parts by weight of a halogenated epoxy resin (Woojin Polymer CXB-700S) are placed in a reaction vessel equipped with a stirrer, a thermometer, a cooling condenser and a dropping device. Next, when the flow is confirmed by heating and melting while supplying nitrogen or air, the temperature of the contents of the reactor is raised to 100-125 ° C., 0.01 part by weight of a polymerization inhibitor hydroquinone monomethyl ether and 0.15 part by weight of reaction catalyst dinormal butylamine are added Then, 13.84 parts by weight of acrylic acid was added to the dropping funnel and reacted while dropping the solution. After addition reaction of 1.0 part by weight of hexamethylene diisocyanate at an acid value of 25 or less, 14.0 parts by weight of methyl methacrylate and 1.0 part by weight of trimethylolpropane trimethacrylate were diluted to prepare a halogenated epoxyacrylate resin binder having a number average molecular weight of 6,500 Respectively.

Example 3

And 68.0 parts by weight of a halogenated epoxy resin (Woojin Polymer CXB-600S) are placed in a reaction tank equipped with a stirrer, a thermometer, a cooling condenser and a dropping device. Next, the temperature of the contents of the reactor was raised to 100-125 ° C. when the flow was confirmed by heating and melting while supplying nitrogen or air, and then 0.005 part by weight of dimethylparabenquoquinone, 0.005 part by weight of toluene hydroquinone and 0.005 part by weight of the polymerization catalyst ethyl trimethylammonium 0.1 part by weight of bromide was added, and then 9.0 parts by weight of acrylic acid and 9.0 parts by weight of methacrylic acid were added to the dropping funnel and reacted while dropping the solution. After reacting 3.89 parts by weight of isophorone diisocyanate at an acid value of 35 or less, 14.0 parts by weight of a reactive monomer methylmethacrylate and 1.0 part by weight of 1,6-hexanediol dimethacrylate were diluted to obtain a halogenated epoxy acrylate having a number average molecular weight of 5,500 To prepare a resin binder.

Example 4

And 69.0 parts by weight of a halogenated epoxy resin (Dow Chemical DER 560) are placed in a reaction tank equipped with a stirrer, a thermometer, a cooling condenser and a dropping device. Then, when the flow is confirmed by heating and melting while supplying nitrogen or air, the temperature of the contents of the reactor is raised to 100-125 ° C, then 0.005 part of the polymerization inhibitor para-t-butyl catechol, 0.005 part of hydroquinone, And 0.12 parts by weight of acetyl acetate were added. Then, 14.0 parts by weight of methacrylic acid was added to the dropping funnel, and the solution was allowed to react while dropping the solution. After adding 1.87 parts by weight of a urethane acrylate resin at an acid value of 15 or less, 13.0 parts by weight of methyl methacrylate and 2.0 parts by weight of trimethylolpropane trimethacrylate were diluted to prepare a halogenated epoxy acrylate resin binder having a number average molecular weight of 7,500.

Example 5

34.5 parts by weight of a halogenated epoxy resin (KODO CHEMICAL YDB-408) and 34.5 parts by weight of a halogenated epoxy resin (Woojin Polymer CXB-400S) are placed in a reaction vessel equipped with a stirrer, a thermometer, a cooling condenser and a dropping device. Then, the temperature of the contents of the reaction vessel was raised to 100-125 ° C. when the flow was confirmed by heating and melting while supplying nitrogen or air. Then, 0.01 part by weight of the polymerization inhibitor hydroquinone and 0.10 part by weight of the reaction catalyst chromium acetyl acetate were added, 12.0 parts by weight are put into a dropping device and subjected to dropping reaction. After adding 12.0 parts by weight of urethane acrylate resin at an acid value of 10 or less, 14.5 parts by weight of methyl methacrylate and 0.5 part by weight of 1,6-hexanediol dimethacrylate were diluted, and a halogenated epoxyacrylate resin binder having a number average molecular weight of 6,500 .

Production Example 1

After feeding 99.89 g of the binder prepared in Example 1, 0.01 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide and 0.1 g of 1-hydroxy-cyclohexyl-phenyl-ketone into a reaction tank, And stirred for 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 2

99.94 g of the binder prepared in Example 1 and 0.06 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide were added to the reaction vessel, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 3

In a reaction tank, 99.0 g of the binder prepared in Example 1, 0.3 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.2 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, and the mixture was stirred for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 4

To the reaction tank, 99.45 g of the binder prepared in Example 2, 0.05 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.1 g of 1-hydroxy-cyclohexylphenyl- 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 5

To the reaction tank were added 99.5 g of the binder prepared in Example 2, 0.1 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.1 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 6

In a reaction tank, 99.0 g of the binder prepared in Example 2, 0.25 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.25 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, and the mixture was stirred for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 7

In a reaction tank, 99.39 g of the binder prepared in Example 3, 0.01 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.1 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, and the mixture was stirred for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 8

To the reaction tank, 99.5 g of the binder prepared in Example 3, 0.1 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.1 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 9

In a reaction tank, 99.25 g of the binder prepared in Example 3, 0.25 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.25 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide (0.25 g) was added thereto, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 10

In a reaction tank, 99.69 g of the binder prepared in Example 4, 0.01 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.1 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 11

To the reaction tank were added 99.5 g of the binder prepared in Example 4, 0.1 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.1 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 12

In a reaction tank, 99.0 g of the binder prepared in Example 4, 0.3 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.2 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, and the mixture was stirred for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 13

In a reaction tank, 99.49 g of Example 5, 0.01 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.1 g of 1-hydroxy-cyclohexylphenyl-ketone, Trimethylbenzoyl) -phosphine oxide was added thereto, and the mixture was stirred for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 14

In a reaction tank, 99.4 g of the binder prepared in Example 5, 0.15 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.15 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 15

In the reaction tank, 99.45 g of the binder prepared in Example 5, 0.25 g of diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide, 0.25 g of 1-hydroxy-cyclohexylphenyl-ketone, 4,6-trimethylbenzoyl) -phosphine oxide was added thereto, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 16

99.89 g of the binder prepared in Example 1, 0.01 g of?,? -Dimethoxy-? -Phenylacetophenone and 0.1 g of methylbenzoylformate were added to the reaction tank, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 17

99.94 g of the binder prepared in Example 1 and 0.06 g of?,? -Dimethoxy-? -Phenylacetophenone were added to the reaction tank and stirred for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 18

99.89 g of the binder prepared in Example 2, 0.01 g of?,? -Dimethoxy-? -Phenylacetophenone and 0.1 g of methylbenzoylformate were added to the reaction tank, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 19

99.94 g of the binder prepared in Example 2 and 0.06 g of?,? -Dimethoxy-? -Phenylacetophenone were added to the reaction tank and stirred for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production example 20

99.89 g of the binder prepared in Example 3, 0.01 g of?,? -Dimethoxy-? -Phenylacetophenone and 0.1 g of methylbenzoylformate were added to the reaction tank, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 21

99.94 g of the binder prepared in Example 3 and 0.06 g of?,? -Dimethoxy-? -Phenylacetophenone were added to the reaction tank, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 22

99.89 g of the binder prepared in Example 4, 0.01 g of?,? -Dimethoxy-? -Phenylacetophenone and 0.1 g of methylbenzoylformate were added to the reaction tank, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 23

99.94 g of the binder prepared in Example 4 and 0.06 g of?,? -Dimethoxy-? -Phenylacetophenone were added to the reaction tank, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production Example 24

99.89 g of the binder prepared in Example 5, 0.01 g of?,? -Dimethoxy-? -Phenylacetophenone and 0.1 g of methylbenzoylformate were added to the reaction tank, followed by stirring for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Production example 25

99.94 g of the binder prepared in Example 5 and 0.06 g of?,? -Dimethoxy-? -Phenylacetophenone were added to the reaction tank and stirred for 10 to 30 minutes. The prepared resin was poured into a certain wooden mold and cured using UV-Fe and UV-Ga to prepare a resin for artificial marble chips.

Experimental Example

The curability and impact resistance of the resins for artificial marble chips prepared in Preparation Examples 1 to 20 were measured and reported in Tables 1 to 4 below.

Manufacturing example
One Manufacturing example
One Manufacturing example
2 Manufacturing example
2 Manufacturing example
3 Manufacturing example
3 Manufacturing example
4 Manufacturing example
4 Curing condition UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga Hardening thickness
1.5cm Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening thickness
2.0cm Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardenability
result Good Great Good Great Good Great Good Great Impact resistance
Condition Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Drop height
50cm Good Great Good Great Good Great Good Great Drop height
70cm Good Great Good Great Good Great Good Great Drop height
80cm Good Great Good Great Good Great Good Great Impact resistance
result Good Great Good Great Good Great Good Great

Manufacturing example
5 Manufacturing example
5 Manufacturing example
6 Manufacturing example
6 Manufacturing example
7 Manufacturing example
7 Manufacturing example
8 Manufacturing example
8 Curing condition UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga Hardening thickness
1.5cm Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening thickness
2.0cm Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardenability
result Good Great Good Great Good Great Good Great Impact resistance
Condition Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Drop height
50cm Good Great Good Great Good Great Good Great Drop height
70cm Good Great Good Great Good Great Good Great Drop height
80cm Good Great Good Great Good Great Good Great Impact resistance
result Good Great Good Great Good Great Good Great

Manufacturing example
9 Manufacturing example
9 Manufacturing example
10 Manufacturing example
10 Manufacturing example
11 Manufacturing example
11 Manufacturing example
12 Produce
Example 12 Curing condition UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga Hardening thickness
1.5cm Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening thickness
2.0cm Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardenability
result Good Great Good Great Good Great Good Great Impact resistance
Condition Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Drop height
50cm Good Great Good Great Good Great Good Great Drop height
70cm Good Great Good Great Good Great Good Great Drop height
80cm Good Great Good Great Good Great Good Great Impact resistance
result Good Great Good Great Good Great Good Great

Production Example 13 Production Example 13 Production Example 14 Production Example 14 Production Example 15 Production Example 15 Curing condition UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga Hardening thickness
1.5cm Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening thickness
2.0cm Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardening
Good Hardening
Great Hardenability
result Good Great Good Great Good Great Impact resistance
Condition Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Drop height
50cm Good Great Good Great Good Great Drop height
70cm Good Great Good Great Good Great Drop height
80cm Good Great Good Great Good Great Impact resistance
result Good Great Good Great Good Great

Production Example 16 Production Example 16 Production Example 17 Production Example 17 Production Example 18 Production Example 18 Production Example 19 Production Example 19 Curing condition UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga Hardening thickness
1.5cm Hardening
Bad Bottom hardening
Bad Hardening
Bad Bottom hardening
Bad Hardening
Bad Bottom hardening
Bad Hardening
Bad Bottom hardening
Bad Hardening thickness
2.0cm Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardenability
result Bad Bad Bad Bad Bad Bad Bad Bad Impact resistance
Condition Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Drop height
50cm Bad Bad Bad Bad Bad Bad Bad Bad Drop height
70cm Bad Bad Bad Bad Bad Bad Bad Bad Drop height
80cm Bad Bad Bad Bad Bad Bad Bad Bad Impact resistance
result Bad Bad Bad Bad Bad Bad Bad Bad

Manufacturing example
20 Production example 20 Manufacturing example
21 Manufacturing example
21 Manufacturing example
22 Manufacturing example
22 Manufacturing example
23 Manufacturing example
23 Curing condition UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga UV-Fe UV-Ga Hardening thickness
1.5cm Hardening
Bad Bottom hardening
Bad Hardening
Bad Bottom hardening
Bad Hardening
Bad Bottom hardening
Bad Hardening
Bad Bottom hardening
Bad Hardening thickness
2.0cm Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardening
Bad Hardenability
result Bad Bad Bad Bad Bad Bad Bad Bad Impact resistance
Condition Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Iron ball
(500 g) Drop height
50cm Bad Bad Bad Bad Bad Bad Bad Bad Drop height
70cm Bad Bad Bad Bad Bad Bad Bad Bad Drop height
80cm Bad Bad Bad Bad Bad Bad Bad Bad Impact resistance
result Bad Bad Bad Bad Bad Bad Bad Bad

According to the present invention, when a halogenated epoxy resin is cured using a UV lamp using a specific photoinitiator, artificial marble transparent chips having high workability, mechanical properties, compatibility, processability, chemical resistance, A resin for chips can be obtained.

The most distinguishing characteristic of the artificial marble chip of the present invention is that it improves the impact resistance, thereby preventing artificial marble from being cracked and cracked due to the brittle surface during processing.

Claims (10)

(2,4,6-trimethylbenzoyl) acrylate and a reactive monomer selected from the group consisting of methyl methacrylate, trimethylolpropane trimethacrylate, and 1,6-hexanediol dimethacrylate, A resin for the production of artificial marble transparent chips comprising a photoinitiator selected from the group consisting of phosphine oxide, 1-hydroxy-cyclohexyl phenyl ketone and phenyl bis (2,4,6-trimethylbenzoyl) -phosphine oxide monoisocyanate Composition. The resin composition according to claim 1, wherein 70 to 90 parts by weight of the halogenated epoxy acrylate resin comprises 10 to 30 parts by weight of a reactive monomer and 0.01 to 2 parts by weight of a photoinitiator. The resin composition according to claim 1, wherein the halogenated epoxy acrylate resin is a brominated epoxy acrylate resin. The resin composition according to claim 1, further comprising 1-5 parts by weight of urethane acrylate. A halogenated epoxy acrylate resin is prepared and a reactive monomer selected from the group consisting of methyl methacrylate, trimethylolpropane trimethacrylate, and 1,6-hexanediol dimethacrylate and diphenyl (2,4,6-trimethyl Benzoyl) -phosphine oxide, 1-hydroxy-cyclohexyl phenyl ketone, and phenyl bis (2,4,6-trimethylbenzoyl) -phosphine oxide monoisocyanate is added and UV cured Wherein the transparent chip is made of a transparent material. 6. The method of claim 5, wherein 10 to 30 parts by weight of the reactive monomer and 0.01 to 2 parts by weight of a photoinitiator are added to 70 to 90 parts by weight of the halogenated epoxy acrylate resin. 6. The method of claim 5, wherein the halogenated epoxy acrylate resin is a brominated epoxy acrylate resin. 6. The method of claim 5, wherein 1-5 parts by weight of urethane acrylate is further added in the reactive monomer addition step. 6. The method of claim 5, wherein the UV curing is cured using a UV-Fe or UV-Ga lamp. 6. The method of claim 5, wherein the step of preparing the halogenated epoxy acrylate resin comprises reacting the halogenated epoxy resin with acrylic acid and then reacting with the isocyanate.





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