KR100555441B1 - Artificial marble using multicolor chip and method for preparing the same - Google Patents
Artificial marble using multicolor chip and method for preparing the same Download PDFInfo
- Publication number
- KR100555441B1 KR100555441B1 KR1020050029786A KR20050029786A KR100555441B1 KR 100555441 B1 KR100555441 B1 KR 100555441B1 KR 1020050029786 A KR1020050029786 A KR 1020050029786A KR 20050029786 A KR20050029786 A KR 20050029786A KR 100555441 B1 KR100555441 B1 KR 100555441B1
- Authority
- KR
- South Korea
- Prior art keywords
- artificial marble
- weight
- parts
- chip
- slurry
- Prior art date
Links
- 239000002928 artificial marble Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims description 7
- 239000000049 pigment Substances 0.000 claims abstract description 36
- 239000002002 slurry Substances 0.000 claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 claims abstract description 34
- 239000002994 raw material Substances 0.000 claims abstract description 26
- 239000006188 syrup Substances 0.000 claims abstract description 23
- 235000020357 syrup Nutrition 0.000 claims abstract description 23
- 239000003086 colorant Substances 0.000 claims abstract description 22
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 10
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 10
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 229920006337 unsaturated polyester resin Polymers 0.000 claims abstract description 7
- 238000000227 grinding Methods 0.000 claims abstract description 5
- 239000011268 mixed slurry Substances 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 239000003431 cross linking reagent Substances 0.000 claims description 9
- 239000011256 inorganic filler Substances 0.000 claims description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 8
- 238000004132 cross linking Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 abstract description 33
- 239000011347 resin Substances 0.000 abstract description 27
- 229920005989 resin Polymers 0.000 abstract description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract description 7
- 239000010438 granite Substances 0.000 abstract description 6
- 229920006305 unsaturated polyester Polymers 0.000 abstract description 4
- 238000004040 coloring Methods 0.000 abstract 1
- 230000004069 differentiation Effects 0.000 abstract 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000004575 stone Substances 0.000 description 6
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 5
- 239000004579 marble Substances 0.000 description 5
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- IFXDUNDBQDXPQZ-UHFFFAOYSA-N 2-methylbutan-2-yl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CC IFXDUNDBQDXPQZ-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- BLKRGXCGFRXRNQ-SNAWJCMRSA-N (z)-3-carbonoperoxoyl-4,4-dimethylpent-2-enoic acid Chemical compound OC(=O)/C=C(C(C)(C)C)\C(=O)OO BLKRGXCGFRXRNQ-SNAWJCMRSA-N 0.000 description 1
- HGDULKQRXBSKHL-UHFFFAOYSA-N 1,1-bis(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(CC)(OC(=O)C(C)=C)OC(=O)C(C)=C HGDULKQRXBSKHL-UHFFFAOYSA-N 0.000 description 1
- AKUNSTOMHUXJOZ-UHFFFAOYSA-N 1-hydroperoxybutane Chemical compound CCCCOO AKUNSTOMHUXJOZ-UHFFFAOYSA-N 0.000 description 1
- WTVAOKOXHCZEDZ-UHFFFAOYSA-N 2-(2-methylphenyl)propane-2-thiol Chemical compound CC1=CC=CC=C1C(C)(C)S WTVAOKOXHCZEDZ-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- FRQQKWGDKVGLFI-UHFFFAOYSA-N 2-methylundecane-2-thiol Chemical compound CCCCCCCCCC(C)(C)S FRQQKWGDKVGLFI-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- JAPMJSVZDUYFKL-LWOQYNTDSA-N C1C2[C@@H]1CCC2 Chemical compound C1C2[C@@H]1CCC2 JAPMJSVZDUYFKL-LWOQYNTDSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical class SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 1
- DHNCFAWJNPJGHS-UHFFFAOYSA-J [C+4].[O-]C([O-])=O.[O-]C([O-])=O Chemical compound [C+4].[O-]C([O-])=O.[O-]C([O-])=O DHNCFAWJNPJGHS-UHFFFAOYSA-J 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- UENWRTRMUIOCKN-UHFFFAOYSA-N benzyl thiol Chemical compound SCC1=CC=CC=C1 UENWRTRMUIOCKN-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001869 cobalt compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- YQHLDYVWEZKEOX-UHFFFAOYSA-N cumene hydroperoxide Chemical compound OOC(C)(C)C1=CC=CC=C1 YQHLDYVWEZKEOX-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229960000969 phenyl salicylate Drugs 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- -1 polybutylene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B5/00—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping
- B28B5/02—Producing shaped articles from the material in moulds or on moulding surfaces, carried or formed by, in or on conveyors irrespective of the manner of shaping on conveyors of the endless-belt or chain type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/14—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length
- B29C39/148—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length characterised by the shape of the surface
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
본 발명은 다색칩을 활용한 인조대리석 및 이의 제조방법에 관한 것으로, 아크릴 수지 시럽 또는 불포화 폴리에스테르 수지 시럽에 서로 다른 안료를 첨가하여 2종 이상의 인조대리석 원료 슬러리(수지 안료 조성물)를 제조한 후, 이를 각각의 투입라인을 통하여 투입 혼합하여 다양한 색상을 가진 인조대리석 제조용 평판을 제조한 다음, 이를 다시 분쇄함으로써 한 개의 칩 내부에 여러가지 안료 색상으로 구성된 다색칩을 제조한 후, 이 다색칩을 아크릴계 또는 불포화 폴리에스테르계 인조대리석의 제조시 조색용 칩으로 적용함으로써, 기존의 단색칩 조합으로 이루어진 인조대리석과의 차별성은 물론 천연 화강석에 더욱 근접한 패턴 및 무늬를 연출할 수 있다.The present invention relates to artificial marble using a multi-color chip and a method of manufacturing the same, by adding different pigments to an acrylic resin syrup or an unsaturated polyester resin syrup to prepare two or more kinds of artificial marble raw material slurry (resin pigment composition) After mixing them through each input line to prepare a flat plate for manufacturing artificial marble with various colors, and then grinding them again to produce a multi-color chip composed of various pigment colors in one chip, the multi-color chip is acrylic-based. Alternatively, when the unsaturated polyester-based artificial marble is applied as a chip for coloring, it is possible to produce a pattern and a pattern closer to the natural granite as well as differentiation from the artificial marble made of a conventional monochromatic chip combination.
다색칩, 인조대리석 Multicolor Chip, Artificial Marble
Description
도 1은 본 발명에 따른 다색칩용 평판의 제조공정도이다.1 is a manufacturing process chart of a flat plate for a multi-color chip according to the present invention.
도 2는 본 발명에 따른 다색칩용 평판의 분쇄공정도이다.2 is a crushing process chart of a flat plate for a multi-color chip according to the present invention.
도 3은 본 발명에 따라 다색칩을 이용하여 제조한 인조대리석의 사진이다.3 is a photograph of artificial marble prepared using a multi-color chip according to the present invention.
도 4는 도 3의 요부 확대사진이다.4 is an enlarged view illustrating main parts of FIG. 3.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
1a, 1b: 공급라인 2: 배치1a, 1b: supply line 2: batch
3: 임펠러 4: 토출구3: impeller 4: discharge port
5: 흐름판 6: 스틸벨트5: flow plate 6: steel belt
7: 경화전 평판 8: 경화후 평판7: Plate before curing 8: Plate after curing
9: 분쇄기 10: 다색칩9: grinder 10: multi-color chip
11: 혼합된 다색칩 12: 제1색상부11: Mixed Multicolor Chip 12: First Color Part
13: 제2색상부 14: 제3색상부13: second color part 14: third color part
본 발명은 본 발명은 다색칩을 활용한 인조대리석 및 이의 제조방법에 관한 것으로, 더욱 상세하게는 한 개의 칩 내부에 여러가지 안료 색상으로 구성된 다색칩을 제조한 후, 이 다색칩을 아크릴계 또는 불포화 폴리에스테르계 인조대리석의 제조시 조색용 칩으로 적용함으로써, 기존의 단색칩 조합으로 이루어진 인조대리석과의 차별성은 물론 천연 화강석에 더욱 근접한 패턴 및 무늬를 연출할 수 있는 인조대리석 및 이의 제조방법에 관한 것이다.The present invention relates to an artificial marble using a multi-color chip and a method for manufacturing the same. More particularly, after producing a multi-color chip composed of various pigment colors in one chip, the multi-color chip is acrylic or unsaturated poly The present invention relates to artificial marbles that can produce patterns and patterns that are closer to natural granite as well as differentiating from artificial marbles made of conventional monochromatic chip combinations by applying them as color chips in the manufacture of ester-based artificial marble.
일반적으로 아크릴계 수지로 제조된 인조대리석은 미려한 외관 및 우수한 가공성의 장점과 더불어, 천연대리석에 비하여 가볍고 우수한 강도의 장점으로 인하여, 카운터 테이블 및 각종 인테리어 재료로서 널리 사용되고 있으나, 일반적으로 알려진 단색 위주의 칩 조합으로는 천연대리석 또는 화강석에 비하여 다양한 패턴을 표현하기에는 기술적 한계가 있었다.In general, artificial marble made of acrylic resin is widely used as a counter table and various interior materials due to the advantages of beautiful appearance and excellent processability, and light and superior strength compared to natural marble, but is generally known as a monochromatic chip. The combination had technical limitations to express various patterns compared to natural marble or granite.
아크릴계 인조대리석 제조방법은 일반적으로 메틸메타크릴레이트(Methyl methacrylate)와 같은 모노머와 폴리메틸메타크릴레이트(Polymethyl methacrylate)를 혼합한 시럽(Syrub)에 수산화알루미늄, 탄산칼숨, 실리카 등과 같은 충진제, 기타 안료 및 경화제를 혼합한 후 성형틀 및 연속 스틸벨트에서 주형하여 경화시켜 제조하는 것이다.In general, acrylic artificial marble manufacturing method is a syrup mixed with a monomer such as methyl methacrylate and polymethyl methacrylate, and fillers such as aluminum hydroxide, carbon carbonate, silica, and other pigments. And a curing agent is mixed and then molded in a mold and a continuous steel belt to harden.
이때, 형상 및 색상을 나타내는 수단으로는 안료 및 칩(Chip)이라는 원료가 사용되며, 칩의 주성분은 통상 인조대리석과 동일하며, 단색의 안료를 투입하여 인조대리석과 동일 공정으로 제조한 후 분쇄하여 다양한 색상 및 입자크기를 가진다.In this case, as a means of displaying the shape and color, raw materials such as pigment and chip are used, and the main component of the chip is usually the same as that of artificial marble. It has a variety of colors and particle sizes.
종래기술은 상기의 칩으로 인조대리석을 제조시 단색칩을 기준으로 여러가지 색 상으로 제조한 후 베이스 원료에 혼합 투입하여 천연 화강암 무늬를 연출하려는 것이나, 이와 같이 제조한 인조대리석의 무늬는 천연 화강석 무늬와는 달리 패턴이 단조롭고 인위적인 경향이 많으며, 따라서 기존의 한가지 색상의 칩의 조합으로는 천연석 무늬를 보다 현실감 있게 재현하기에는 기술적 한계가 있었다.The prior art is to produce a natural granite pattern by producing a variety of colors based on a single color chip when manufacturing the artificial marble with the above-mentioned chip, and then mixed into the base raw material, the pattern of the artificial marble is a natural granite pattern Unlike the pattern, the pattern tends to be monotonous and artificial, and therefore, there is a technical limitation in reproducing the natural stone pattern more realistically with a combination of chips of one color.
이에 본 발명자들은 아크릴 수지 혹은 불포화 폴리에스테르 수지, 충진제 및 여러가지 안료를 주원료로 적용한 수지 안료 조성물을 이용하여 한 개의 칩에 2가지 이상의 색상으로 구성된 인조대리석 제조용 다색칩을 제조하고, 이를 활용하여 기존의 단색칩을 적용한 인조대리석 대비 천연석 무늬 및 패턴에 현저히 근접한 인조대리석을 제조함으로써, 본 발명을 완성하기에 이르렀다.Accordingly, the present inventors manufacture a multi-color chip for manufacturing artificial marble composed of two or more colors in one chip by using an acrylic pigment or an unsaturated polyester resin, a filler, and a resin pigment composition applied with various pigments as a main raw material, and utilizing the existing The present invention has been completed by manufacturing artificial marble remarkably close to natural stone patterns and patterns compared to artificial marble applied with a single color chip.
따라서, 본 발명의 첫번째 목적은 인조대리석용 칩 제조시 각각 두가지 이상의 색상으로 구성된 수지 안료 조성물을 혼합하여 원판을 제조한 후, 이를 일정 크기로 분쇄하여 한 개의 칩에 각각 다른 색상의 안료에 의하여 두가지 이상의 색상을 연출할 수 있는 인조대리석 제조용 다색칩 및 이의 제조방법을 제공하는 것이다.Therefore, the first object of the present invention is to prepare a disc by mixing a resin pigment composition composed of two or more colors each for the manufacture of artificial marble chips, and then pulverized it to a predetermined size by two different pigments on one chip each It is to provide a multi-color chip for manufacturing artificial marble and a method for manufacturing the same that can produce the above color.
본 발명이 이루고자 하는 두번째 기술적 과제는 상기에서 만들어진 두 가지 이상의 수지 안료 조성물로 구성된 다색칩을 인조대리석 제조에 적용함으로써, 기존의 여러가지 단색칩으로 구성된 인조대리석과 무늬 및 색상에 있어서 현저히 차별화되고 천연석에 근접한 인조대리석 및 이의 제조방법을 제공하는 것이다.The second technical problem to be achieved by the present invention is to apply a multi-color chip composed of two or more resin pigment compositions made in the above-mentioned artificial marble production, significantly differentiating in natural marble and patterns and colors composed of a variety of existing monochromatic chips To provide a close artificial marble and a method of manufacturing the same.
본 발명은 상기한 목적을 달성하기 위하여, (a) 인조대리석 원료에 안료를 첨가 하여 색상이 서로 다른 2종 이상의 슬러리를 제조하는 단계; (b) 2종 이상의 슬러리를 배치에 투입한 후 분산시키는 단계; (c) 분산된 혼합 슬러리를 평판으로 제조하는 단계; (d) 평판을 경화시킨 후 분쇄하여 다색칩을 제조하는 단계; 및 (e) 인조대리석 원료 슬러리에 다색칩을 혼합한 후 주형 및 경화를 거쳐 연마하여 인조대리석을 제조하는 단계를 포함하는 인조대리석의 제조방법을 제공한다.The present invention to achieve the above object, (a) adding a pigment to the artificial marble raw material to prepare two or more kinds of slurry different in color; (b) adding at least two slurries to the batch and then dispersing; (c) preparing the dispersed mixed slurry into a flat plate; (d) hardening the plate and then grinding to prepare a multicolor chip; And (e) mixing the multicolored chip with the artificial marble raw material slurry, followed by polishing through a mold and hardening to produce the artificial marble.
상기 (b)의 슬러리 분산단계에서 2종 이상의 슬러리를 각각 다른 공급라인을 통하여 믹서배치에 투입한 후, 임펠러를 이용하여 분당 60회 이하의 저속으로 2종 이상의 슬러리를 부분적으로 혼합하여 분산시킴으로써, 혼합 슬러리 내에서 서로 다른 색상이 번지거나 경계를 이루게 하는 것을 특징으로 한다.In the slurry dispersing step of (b), by putting two or more kinds of slurry into the mixer batch through different supply lines, and partially dispersing the two or more kinds of slurry at a low speed of 60 times per minute or less using an impeller, It is characterized by the fact that different colors bleed or border within the mixed slurry.
상기 (c)의 평판 제조단계에서는 분산된 혼합 슬러리를 연속 이동식 스틸벨트에 공급하여 평판 형태로 주형한 후 경화시키는 것을 특징으로 한다.In the step (c) of producing a flat plate, the dispersed mixed slurry is supplied to a continuously movable steel belt, and then molded into a flat plate, and then cured.
또한, 본 발명은 아크릴계 수지 시럽 또는 불포화 폴리에스테르계 수지 시럽 100 중량부에 대하여 무기충진물 50 내지 250 중량부, 가교제 0.2 내지 5 중량부, 가교촉진제 0.2 내지 3 중량부를 포함하는 인조대리석 원료 슬러리 100 중량부에 다색칩 0.1 내지 50 중량부를 혼합하여 제조한 인조대리석을 제공한다.In addition, the present invention 100 to 100 parts by weight of the artificial marble raw material slurry containing 50 to 250 parts by weight of inorganic filler, 0.2 to 5 parts by weight of crosslinking agent, 0.2 to 3 parts by weight of crosslinking accelerator with respect to 100 parts by weight of acrylic resin syrup or unsaturated polyester resin syrup It provides an artificial marble prepared by mixing 0.1 to 50 parts by weight of the multi-color chip in the part.
상기 다색칩은 아크릴계 수지 시럽 또는 불포화 폴리에스테르계 수지 시럽 100 중량부에 대하여 무기충진물 50 내지 250 중량부, 가교제 0.2 내지 5 중량부, 가교촉진제 0.2 내지 3 중량부를 포함하는 인조대리석 원료에 안료 0.1 내지 5 중량부를 첨가하여 색상이 서로 다른 2종 이상의 슬러리를 제조한 후, 이 2종 이상의 슬러리를 배치에 투입하여 분산시킨 다음, 분산된 혼합 슬러리를 평판으로 제조한 후, 이 평판을 경화시키 고 분쇄시킴으로써, 한개의 칩에 2가지 이상의 색상을 연출한 것을 특징으로 한다.The multi-color chip is 0.1 to pigment in the artificial marble raw material comprising 50 to 250 parts by weight of inorganic filler, 0.2 to 5 parts by weight of crosslinking agent, 0.2 to 3 parts by weight of crosslinking accelerator with respect to 100 parts by weight of acrylic resin syrup or unsaturated polyester resin syrup. After adding 5 parts by weight to prepare two or more slurries of different colors, the two or more slurries are added to the batch to disperse, and then the dispersed mixed slurry is prepared into a flat plate, and then the flat plate is cured and pulverized. By doing so, two or more colors are produced on one chip.
상기 슬러리의 점도는 300 내지 70,000 cps, 바람직하게는 500 내지 30,000 cps이다. 점도가 너무 높으면 자연스러운 무늬의 번짐이나 퍼짐이 없고 작업 자체가 힘들어지며, 점도가 너무 낮게 되면 반대로 무늬가 완전히 섞여버리게 되므로, 슬러리의 점도는 상기 범위가 바람직하다.The viscosity of the slurry is 300 to 70,000 cps, preferably 500 to 30,000 cps. If the viscosity is too high, there is no spreading or spreading of the natural pattern, and the work itself becomes difficult. If the viscosity is too low, the pattern is mixed completely, and the viscosity of the slurry is preferably in the above range.
상기 다색칩의 크기는 0.1 내지 10 ㎜인 것이 바람직하다. 다색칩의 크기가 10 ㎜보다 클 경우 너무 커서 사용하기 곤란하며, 그 이유는 제품이 보통 두께 14 ㎜ 정도의 평판으로 제작되어 두께상으로도 문제가 생기고, 칩과 베이스 사이에 균열이 생길 우려가 있으며, 배치의 임펠러에도 끼일 우려가 있기 때문이다. 또한 원료의 흐름성에도 영향을 주며, 이러한 이유로 10 ㎜를 초과하는 칩은 사용하지 못한다. 10 ㎜ 이하의 칩이라 할지라도 큰 칩 보다는 작은 칩이 사용하기가 여러모로 좋으나, 제품의 무늬에 있어서는 큰 칩이 좋다. 따라서 다색칩을 다양한 크기별로 제조한 후 인조대리석의 제조시에 이들을 혼합하여 사용하는 것이 바람직하다.The size of the multicolor chip is preferably 0.1 to 10 mm. If the size of the multi-color chip is larger than 10 mm, it is too difficult to use. The reason is that the product is usually made of a flat plate with a thickness of about 14 mm, which causes problems in terms of thickness, and there is a risk of cracking between the chip and the base. This is because there is a risk of being caught in the impeller of the arrangement. It also affects the flowability of raw materials, and for this reason, chips larger than 10 mm cannot be used. Even if the chip of 10 mm or less, small chips are better to use than large chips, but large chips are preferable for the pattern of the product. Therefore, it is preferable to use a mixture of them in the manufacture of artificial marble after manufacturing the multi-color chips in various sizes.
이하 첨부된 도면을 참고하여 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
도 1 및 도 2는 본 발명에 따른 다색칩(10)의 제조공정도로서, 상기 제조공정은 다색칩(10)의 원료 슬러리를 2종 이상으로 제조하는 원료 슬러리 제조공정; 2종 이상의 원료 슬러리를 각각 다른 공급라인(1a, 1b)을 통하여 배치(2)에 투입하는 투입공정; 배치(2) 내에서 임펠러(3)로 2종 이상의 슬러리를 부분적으로 혼합하는 슬러리 분산공정; 분산된 혼합 슬러리를 토출구(4)로 토출시켜 흐름판(5)을 거쳐 스틸벨트(6)에 일정 두께로 공급하는 슬러리 토출공정; 혼합 슬러리를 스틸벨트(6)에서 판상 형태로 주형하는 평 판(7) 제조공정; 경화시킨 평판(8)을 분쇄기(9)에 투입하여 일정 크기로 분쇄하는 분쇄공정으로 이루어진다.1 and 2 is a manufacturing process diagram of the
먼저, 두가지 이상의 색상을 표현하도록 수지 안료 조성물(원료 슬러리)을 2종 이상으로 제조한다.First, two or more kinds of resin pigment compositions (raw material slurries) are prepared to express two or more colors.
상기 수지 안료 조성물은 인조대리석 원료에 안료를 첨가한 것으로, 아크릴계 수지 시럽 또는 불포화 폴리에스테르계 수지 시럽 100 중량부에 대하여 무기충진물 50 내지 250 중량부, 가교제로서 다관능성 아크릴계 단량체 0.2 내지 5 중량부, 가교촉진제 0.2 내지 3 중량부, 안료 0.1 내지 5 중량부를 포함한다.The resin pigment composition is obtained by adding a pigment to the artificial marble raw material, 50 to 250 parts by weight of the inorganic filler with respect to 100 parts by weight of the acrylic resin syrup or unsaturated polyester resin syrup, 0.2 to 5 parts by weight of the polyfunctional acrylic monomer as a crosslinking agent, 0.2 to 3 parts by weight of crosslinking accelerator and 0.1 to 5 parts by weight of pigment.
본 발명에서 사용되는 아크릴 수지 시럽의 중합가능한 단량체로는 아크릴 단량체가 좋다. 구체적으로 상기 아크릴 수지 시럽은 메틸메타크릴레이트, 에틸메타크릴레이트, 부틸메타크릴레이트, 2-에틸헥실메타크릴레이트, 벤질메타크릴레이트 및 글리시딜메타크릴레이트 중에서 선택되는 메타크릴레이트 단량체 단독 또는 2종 이상의 혼합물이며, 메타크릴레이트 단량체 및 그 일부가 중합된 중합체의 혼합물을 사용할 수도 있다. 이들 중에서 메틸메타크릴레이트가 특히 바람직하다. 시럽내의 중합체의 함량은 10 내지 50 중량%인 것이 바람직하다.As the polymerizable monomer of the acrylic resin syrup used in the present invention, an acrylic monomer is preferable. Specifically, the acrylic resin syrup is a methacrylate monomer selected from methyl methacrylate, ethyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate, benzyl methacrylate and glycidyl methacrylate alone or It is also a mixture of two or more kinds, and a mixture of a polymer in which a methacrylate monomer and a portion thereof are polymerized may be used. Of these, methyl methacrylate is particularly preferred. The content of the polymer in the syrup is preferably 10 to 50% by weight.
본 발명에서 사용가능한 불포화 폴리에스테르는 특별히 제한되지 않으며, 일반적인 불포화 폴리에스테르는 거의 아무거나 사용하여도 무방하다. 예를 들어 포화 및/또는 불포화 이염기산과 다가 알콜의 축합반응에 의해 수득되는 산가 5 내지 40, 분자량 1,000 내지 5,000 정도 범위를 갖는 불포화 폴리에스테르를 사용할 수 있다.Unsaturated polyesters usable in the present invention are not particularly limited, and any general unsaturated polyester may be used. For example, unsaturated polyesters having an acid value of 5 to 40 and a molecular weight of about 1,000 to 5,000 obtained by condensation of saturated and / or unsaturated dibasic acids with polyhydric alcohols can be used.
본 발명에서 사용되는 무기충진물은 수산화 알루미늄, 수산화 마그네슘, 알루민 산 칼슘, 탄산칼슘, 실리카 분말, 알루미나 등 동 분야에서 통상적으로 사용되는 무기분말 중 어느 것을 사용해도 무방하며, 단독 또는 2종 이상 혼합하여 사용 가능하다. 상기 무기충진물의 입자크기가 10 내지 200 ㎛인 것이 바람직하며, 수지와의 분산성, 제품의 기계적 강도 향상 및 침전방지 등을 위해 실란계 커플링제, 티타네이트계 커플링제 또는 스테아린산으로 처리된 표면을 갖는 것이 바람직하다. 상기 무기충진물의 바람직한 함량은 수지 시럽 100 중량부에 대하여 50 내지 250 중량부이다.Inorganic fillers used in the present invention may be any of inorganic powders commonly used in the same field, such as aluminum hydroxide, magnesium hydroxide, calcium aluminate, calcium carbonate, silica powder, alumina, or a mixture of two or more kinds. It can be used. The particle size of the inorganic filler is preferably 10 to 200 ㎛, the surface treated with a silane coupling agent, titanate coupling agent or stearic acid for dispersibility with the resin, improving the mechanical strength of the product and preventing precipitation, etc. It is desirable to have. The preferred content of the inorganic filler is 50 to 250 parts by weight based on 100 parts by weight of the resin syrup.
본 발명에서 사용되는 가교제는 분자내 공중합 가능한 이중결합을 포함하여 상기 아크릴 수지 시럽과 가교결합하는 다관능성 아크릴 단량체로서, 에틸렌 글리콜 디메타크릴레이트, 디에틸렌 글리콜 디메타크릴레이트, 트리에틸렌 글리콜 디메타크릴레이트, 테트라에틸렌 글리콜 디메타크릴레이트, 트리메티롤 프로판 트리메타크릴레이트, 1,6-헥산 디올 디메타크릴레이트, 폴리부틸렌 글리콜 디메타크릴레이트 및 네오펜틸 글리콜 디메타크릴레이트 중에서 선택되는 단독 또는 2종 이상의 혼합물이며, 이들 중에서 에틸렌 글리콜 디메타크릴레이트가 특히 바람직하다.The crosslinking agent used in the present invention is a polyfunctional acrylic monomer which crosslinks with the acrylic resin syrup including an intramolecular copolymerizable double bond, and is ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimetha Selected from methacrylate, tetraethylene glycol dimethacrylate, trimethol propane trimethacrylate, 1,6-hexane diol dimethacrylate, polybutylene glycol dimethacrylate and neopentyl glycol dimethacrylate It is single or a mixture of 2 or more types, Among these, ethylene glycol dimethacrylate is especially preferable.
상기 가교제들을 사용하지 않거나 너무 적게 사용할 경우에는 표면의 요철이 발생하고, 인조대리석의 상부와 하부에 기포가 발생하는 등 원료들간의 결합력이 떨어지게 되고, 내열성 및 내열 변색성이 나빠진다. 가교제를 너무 많이 사용할 경우에는 칩들의 상분리가 일어나게 되어서 인조대리석 패턴에 많은 문제점을 나타낸다. 따라서 가교제의 사용량은 수지 시럽 100 중량부에 대하여 0.2 내지 5 중량부가 바람직하다.If the crosslinking agents are not used or are used too little, unevenness of the surface is generated, bubbles are generated in the upper and lower portions of the artificial marble, and thus the bonding strength between the raw materials is reduced, and the heat resistance and heat discoloration resistance are deteriorated. If too much crosslinking agent is used, phase separation of chips occurs, which causes many problems in artificial marble pattern. Therefore, the amount of the crosslinking agent is preferably 0.2 to 5 parts by weight based on 100 parts by weight of the resin syrup.
본 발명에서 사용되는 가교촉진제는 유기 과산화물으로서 벤조일 퍼옥사이드, 디쿠밀(Dicumyl) 퍼옥사이드와 같은 디아실 퍼옥사이드, 부틸하이드로 퍼옥사이드, 쿠 밀하이드로 퍼옥사이드와 같은 하이드로 퍼옥사이드, t-부틸 퍼옥시 말레인산, t-부틸하이드로 퍼옥사이드, t-부틸 하이드로 퍼옥시부틸레이트, 아세틸 퍼옥사이드, 라우로일 퍼옥사이드, 아조비스이소부티로니트릴, 아조비스디메틸발레로(valero)니트릴, t-부틸 퍼옥시 네오데카노에이트(Neodecanoate), t-아밀 퍼옥시 2-에틸 헥사노에이트 중에서 선택되는 단독 또는 2종 이상의 혼합물을 사용한다. 아울러, 아민의 퍼옥사이드와 술폰산의 혼합물 또는 퍼옥사이드와 코발트 화합물의 혼합물을 사용하여 중합과 경화가 실온에서 수행되도록 할 수 있다. 상기 가교촉진제의 함량은 수지 시럽 100 중량부에 대하여 0.2 내지 3 중량부인 것이 바람직하며, 중합촉진제와 함께 사용하는 것이 일반적이다.Crosslinking accelerators used in the present invention are organic peroxides such as benzoyl peroxide, diacyl peroxides such as dicumyl peroxide, butylhydro peroxide, hydroperoxides such as cumylhydro peroxide, t-butyl peroxy Maleic acid, t-butylhydro peroxide, t-butyl hydroperoxybutylate, acetyl peroxide, lauroyl peroxide, azobisisobutyronitrile, azobisdimethylvaleronitrile, t-butyl peroxy Neodecanoate, t-amyl peroxy 2-ethyl hexanoate, or a mixture of two or more thereof is used. In addition, a mixture of peroxides and sulfonic acids of amines or mixtures of peroxides and cobalt compounds can be used to allow polymerization and curing to be carried out at room temperature. The content of the crosslinking accelerator is preferably 0.2 to 3 parts by weight based on 100 parts by weight of the resin syrup, and is generally used together with the polymerization accelerator.
또한, 노르말도데실메르캅탄, 터어셔리도데실메르캅탄, 벤질메르캅탄 및 트리메칠벤칠메르캅탄 등의 메르캅탄 화합물과 같은 라디칼 운반체를 사용할 수 있다. 라디칼 운반체의 함량은 수지 시럽 100 중량부에 대하여 0.1 내지 5 중량부가 바람직하다.Moreover, radical carriers, such as mercaptan compounds, such as a normal dodecyl mercaptan, a tertiary dodecyl mercaptan, a benzyl mercaptan, and a trimethyl benzyl mercaptan, can be used. The content of the radical carrier is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the resin syrup.
본 발명에서 사용되는 발색수단은 특별히 한정되는 것은 아니며, 통상적으로 알려진 인조대리석 첨가성분으로 유기 또는 무기 안료나 염료 등이 사용될 수 있다.The color developing means used in the present invention is not particularly limited, and organic or inorganic pigments or dyes may be used as the artificial marble additive.
이외에도 상기 조성물은 통상적으로 알려진 인조대리석의 첨가성분으로 실리콘계 또는 비실리콘계 소포제; 트리메톡시실란(Trimethoxysilane)을 주성분으로 하는 실란계, 산계 또는 티타네이트계 커플링제; 페닐 살리실레이트(Phenyl Salicylate)계, 벤조페논(Benzophenone)계, 벤조트리아졸(Benzotriazole)계, 니켈 유도체계 또는 라디칼 제거제(Radical Scavenger)계 자외선 흡수제; 할로겐계, 인계 또는 무기금속계 난연제; 스테아린산계 또는 실리콘계 이형제; 카테콜(Catechol)계 또는 하이드로퀴논류계 중합 억제제; 페놀계, 아민계, 퀴논계, 유황계 또는 인계 산화방지제 중에서 선택되는 1종 이상의 첨가제를 추가로 포함할 수 있다.In addition, the composition is conventionally known as an additive component of artificial marble, a silicone-based or non-silicone-based antifoaming agent; Silane-based, acid-based or titanate-based coupling agents mainly composed of trimethoxysilane; Phenyl salicylate-based, benzophenone-based, benzotriazole-based, nickel derivative-based or radical scavenger-based ultraviolet absorbers; Halogen-based, phosphorus- or inorganic metal-based flame retardants; Stearic acid type or silicone type release agent; Catechol-based or hydroquinone-based polymerization inhibitors; It may further include one or more additives selected from phenolic, amine, quinone, sulfur or phosphorus antioxidants.
다음, 각각 다른 색상을 가진 수지 안료 조성물을 각각의 공급라인(1a, 1b)을 통하여 배치(2)에 공급한다. 이때, 공급량은 5 내지 100 ㎏/hr가 적절하며, 각각의 수지 안료 조성물의 점도는 300 내지 70,000 cps 범위가 바람직하다.Next, a resin pigment composition having a different color is supplied to the
다음, 배치(2)에 투입된 2종 이상의 수지 안료 조성물을 저속의 무교반형 임펠러(3)로 분산시킨다. 이때 임펠러(3)의 회전속도는 고속으로 회전시 각 수지안료 조성물의 색상별 경계면이 분산되어 외관효과가 저하되므로, 분당 60회를 초과하지 않는 것이 바람직하다.Next, the 2 or more types of resin pigment compositions put into the
여기서, 무교반형이라는 말은 조성물이 완전히 섞여버리면 색이 단색이 되어 버리고 아주 섞이지 않으면 원료의 일부에만 색이 있게 되므로, 배치(2) 내에 있는 원료의 구석구석에 색이 존재하면서 섞여버리게 되지는 않을 정도로 서서히 교반함을 의미한다.Here, the term “stirrer-free” means that when the composition is completely mixed, the color becomes a solid color, and if it is not very mixed, only a part of the raw material will have a color, and thus the color will not be mixed with the color present in every corner of the raw material in the batch (2). It means to stir slowly.
다음, 저속의 무교반형 임펠러(3)로 구성된 배치(2) 내부에서 임펠러(3)의 회전에 의하여 서로 다른 색상의 액상 수지 안료 조성물이 번지거나 경계를 이루게 한 후, 배치(2) 하부에 구비된 토출구(4)를 통하여 혼합 슬러리를 토출한다.Next, the liquid resin pigment compositions of different colors are smeared or bound by the rotation of the
다음, 토출되는 혼합 원료 슬러리를 토출구(4) 하단에 설치된 흐름판(5) 위를 거쳐 연속 스틸벨트(6)에 일정 두께로 공급하면서 주형하여 여러가지 색상의 수지 안료 조성물로 이루어진 다색칩(10) 제조용 평판(7)을 제조한 후 경화시킨다.Next, the
본 발명에 따른 바람직한 성형법은 연속 캐스팅 성형법으로, 배치(2)의 토출구 (4) 노즐로부터 나온 액상 수지 혼합물이 이동식 스틸벨트(6)에 공급되며, 벨트의 구동에 따라 부분 혼합된 액상 수지 혼합물이 이동하면서 경화된다.A preferred molding method according to the present invention is a continuous casting molding method, in which a liquid resin mixture from the
다음, 경화된 평판(8)을 분쇄기(9)에 투입한 후 일정 크기로 분쇄하여 다색칩(10)을 제조한다. 이때, 분쇄기(9)는 통상의 석재 분쇄용 밀(해머 밀 또는 커터밀)을 이용하며, 다색칩(10)의 입자크기는 0.1 내지 10 ㎜, 바람직하게는 2.0 내지 6.0 ㎜ 범위가 적절하다.Next, the cured
다음, 2가지 이상의 수지 안료 조성물로 구성된 인조대리석용 다색칩(10)을 인조대리석용 베이스 슬러리에 0.1 내지 50 중량부로 혼합한 후, 성형틀 또는 연속성형용 스틸벨트(6)에서 일정 두께로 주형, 경화 및 연마하여 본 발명에 따른 인조대리석을 제조한다. 이때, 인조대리석용 베이스 슬러리는 안료를 제외한 다색칩(10) 제조용 수지안료 원료의 주성분과 동일하다.Next, after mixing the
도 3은 본 발명에 따라 다색칩(10)을 이용하여 제조한 인조대리석의 사진으로, 도 4는 도 3의 일부를 확대한 것으로, 제조된 인조대리석을 육안으로 확인해본 결과, 인조대리석에 혼합 경화된 다색칩(11) 내에 제1색상부(12), 제2색상부(13), 제3색상부(14) 등 다양한 색상이 무정형으로 구현됨으로써, 천연 대리석 및 화강석에 근접한 무늬를 연출할 수 있었다.3 is a photograph of artificial marble prepared using the
[실시예]EXAMPLE
1. 다색칩의 제조1. Manufacturing of multicolor chips
1) 원료의 제조1) Manufacture of raw materials
30 중량%의 폴리메틸메타크릴레이트와 70 중량%의 메틸메타크릴레이트의 혼 합물로 이루어진 메틸메타크릴레이트 시럽 100 중량부, 수산화 알루미늄 180 중량부, t-부틸 퍼옥시 네오데카노에이트 0.2 중량부, t-아밀 퍼옥시 2-에틸 헥사노에이트 0.3 중량부, 에틸렌 글리콜 디메타크릴레이트 3 중량부, 노르말도데실메르캅탄 0.2 중량부, 소포제로서 BYK 555(BYK-Chemie사, 독일) 0.2 중량부, 커플링제로서 BYK 900(BYK-Chemie사, 독일) 0.75 중량부, 자외선 안정(흡수)제로서 Hisorp-P(LG화학) 0.2 중량부를 포함하는 원료 슬러리에 안료 0.3 중량부를 혼합하여 서로 색상이 다른 2종 이상의 수지안료 조성물을 제조하였다.100 parts by weight of methyl methacrylate syrup consisting of a mixture of 30% by weight of polymethyl methacrylate and 70% by weight of methyl methacrylate, 180 parts by weight of aluminum hydroxide, 0.2 parts by weight of t-butyl peroxy neodecanoate , 0.3 parts by weight of t-amyl peroxy 2-ethyl hexanoate, 3 parts by weight of ethylene glycol dimethacrylate, 0.2 parts by weight of normaldodecyl mercaptan, 0.2 parts by weight of BYK 555 (BYK-Chemie, Germany) as an antifoaming agent. , By mixing 0.35 parts by weight of pigment in a raw material slurry containing 0.75 parts by weight of BYK 900 (BYK-Chemie, Germany) as a coupling agent, 0.2 parts by weight of Hisorp-P (LG Chem.) Two or more resin pigment compositions were prepared.
2) 다색칩 제조2) Multicolor Chip Manufacturing
상기에서 제조한 2종 이상의 수지 안료 조성물(점도 1,000 cps)을 각각의 공급라인(1a, 1b)을 통하여 배치(2)에 50 ㎏/hr로 공급한 후, 임펠러(3)를 이용하여 30 rpm의 저속으로 혼합 분산시킴으로써, 서로 다른 색상의 액상 수지 안료 조성물이 번지거나 경계를 이루게 한 후, 배치(2) 하부에 구비된 토출구(4)를 통하여 혼합 슬러리를 토출한 다음, 토출되는 혼합 원료 슬러리를 토출구(4) 하단에 설치된 흐름판(5) 위를 거쳐 연속 스틸벨트(6)에 공급하면서 주형하여 여러가지 색상의 수지 안료 조성물로 이루어진 두께 14 ㎜의 다색칩(10) 제조용 평판(7)을 제조한 후 경화시킨 다음, 경화된 평판(8)을 분쇄기(9)에 투입한 후 분쇄하여 입자크기 0.1 내지 10 ㎜의 다색칩(10)을 제조하였다.After supplying two or more kinds of the resin pigment composition (viscosity 1,000 cps) prepared above to the batch (2) 50 kg / hr through each supply line (1a, 1b), 30 rpm using the impeller (3) After mixing and dispersing the liquid resin pigment compositions of different colors by dispersing at a low speed of, the mixed slurry is discharged through the
2. 인조대리석 제조2. Manufacture of artificial marble
28 중량%의 폴리메틸메타크릴레이트와 72 중량%의 메틸메타크릴레이트의 혼합물로 이루어진 메틸메타크릴레이트 시럽 100 중량부, 수산화 알루미늄 160 중량부, t-부틸 퍼옥시 네오데카노에이트 0.2 중량부, t-아밀 퍼옥시 2-에틸 헥사노에이트 0.3 중량부, 에틸렌 글리콜 디메타크릴레이트 3 중량부, 노르말도데실메르캅탄 0.2 중량부, 소포제로서 BYK 555(BYK-Chemie사, 독일) 0.2 중량부, 커플링제로서 BYK 900(BYK-Chemie사, 독일) 0.75 중량부, 자외선 안정(흡수)제로서 Hisorp-P(LG화학) 0.2 중량부, 미리 제조한 다색칩 20 중량부를 혼합하여 인조대리석 슬러리를 제조한 후, 연속성형용 스틸벨트(6)에서 주형 및 경화시켜 14 ㎜ 두께의 판재를 제조한 다음, 상부면을 1 ㎜, 하부면을 2 ㎜ 두께로 연마하여 천연석 질감의 인조대리석을 만들었다.100 parts by weight of methyl methacrylate syrup consisting of a mixture of 28% by weight of polymethyl methacrylate and 72% by weight of methyl methacrylate, 160 parts by weight of aluminum hydroxide, 0.2 parts by weight of t-butyl peroxy neodecanoate, 0.3 parts by weight of t-amyl peroxy 2-ethyl hexanoate, 3 parts by weight of ethylene glycol dimethacrylate, 0.2 parts by weight of normaldodecyl mercaptan, 0.2 part by weight of BYK 555 (BYK-Chemie, Germany) as an antifoaming agent, Artificial marble slurry was prepared by mixing 0.75 parts by weight of BYK 900 (BYK-Chemie Co., Germany) as a coupling agent, 0.2 parts by weight of Hisorp-P (LG Chemical) as a UV stabilizer (absorption), and 20 parts by weight of pre-made polychromatic chips. After that, a 14 mm thick sheet was produced by casting and curing in a
기존 인조대리석은 단색으로 구성된 칩의 여러가지 색상의 조합으로 이루어지며, 이와 같이 단색 칩으로 구성된 인조대리석 외관은 천연석에 비하여 단조로운 느낌을 주며, 특히 단색의 칩으로는 그 색상 및 무늬를 표현하는데 한계가 있었다.Existing artificial marble is composed of a combination of various colors of the chip consisting of a single color, the artificial marble made of a single color chip in this way gives a more monotonous feeling than the natural stone, in particular, the color and pattern of a single chip is limited to express there was.
따라서, 본 발명은 위의 문제점을 개선하기 위하여, 인조대리석 베이스 슬러리와 색상이 다른 수지 안료 조성물을 이용하여 한가지 이상의 무늬를 삽입한 인조 대리석용 다색칩을 제조함으로써, 기존 인조대리석용 단색칩과는 달리 두가지 이상의 수지 안료 조성물로 이루어진 다색칩을 얻을 수 있었고, 상기 다색칩을 이용하여 인조대리석을 제조함으로써, 기존의 인조대리석과는 달리 천연석 무늬와 현저히 흡사한 무늬를 얻을 수 있었다.Therefore, the present invention, in order to improve the above problems, by manufacturing a multi-color chip for artificial marble in which one or more patterns are inserted using a resin pigment composition different in color from the artificial marble base slurry, it is different from the conventional solid color chip for artificial marble Alternatively, a multicolor chip composed of two or more resin pigment compositions was obtained, and by manufacturing artificial marble using the multicolor chip, a pattern resembling a natural stone pattern was remarkably similar to that of a conventional marble.
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| KR1020050029786A KR100555441B1 (en) | 2005-04-11 | 2005-04-11 | Artificial marble using multicolor chip and method for preparing the same |
| EP05808996A EP1861231A4 (en) | 2005-03-25 | 2005-10-11 | Artificial marble using multicolor chip and method for preparing the same |
| JP2006523480A JP4550055B2 (en) | 2005-03-25 | 2005-10-11 | Artificial marble using multicolor chips and manufacturing method thereof |
| PCT/KR2005/003373 WO2006101296A1 (en) | 2005-03-25 | 2005-10-11 | Artificial marble using multicolor chip and method for preparing the same |
| US11/263,294 US7500899B2 (en) | 2005-03-25 | 2005-10-31 | Artificial marble using multicolor chip and method for preparing the same |
| US12/209,933 US7935281B2 (en) | 2005-03-25 | 2008-09-12 | Artificial marble using multicolor chip and method for preparing the same |
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| EP1861231A4 (en) * | 2005-03-25 | 2009-06-24 | Lg Chemical Ltd | Artificial marble using multicolor chip and method for preparing the same |
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| KR100938515B1 (en) | 2008-02-14 | 2010-01-25 | 한화엘앤씨 주식회사 | Native rock combined with resin having multi color vein and manufacturing method thereof |
| US8759420B2 (en) | 2008-12-15 | 2014-06-24 | Cheil Industries Inc. | Marble chips for an artificial marble, method of making the same, and artificial marble including the same |
| KR101141023B1 (en) * | 2010-03-22 | 2012-05-02 | 주식회사 에스켐 | Marble chip with marbling pattern and synthetic marble using same, and method of preparing the artificial marble |
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| US9780357B2 (en) | 2012-04-19 | 2017-10-03 | Lg Chem, Ltd. | Silicon-based anode active material and secondary battery comprising the same |
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| US9879344B2 (en) | 2012-07-26 | 2018-01-30 | Lg Chem, Ltd. | Electrode active material for secondary battery |
| KR101596545B1 (en) * | 2013-01-31 | 2016-02-22 | 제일모직주식회사 | Chips for Native Rock Having Multicolor Layer and Native Rock Including Same |
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| KR101770878B1 (en) * | 2014-04-16 | 2017-08-23 | (주)엘지하우시스 | Apparatus for making imitation marble and manufacturing method of imitation marble using the same |
| KR101743804B1 (en) * | 2014-05-30 | 2017-06-05 | 롯데첨단소재(주) | Engineered stone chips with three-dimensional patterns and engineered stone using the same |
| US10086643B2 (en) | 2014-05-30 | 2018-10-02 | Lotte Advanced Materials Co., Ltd. | Chip with stereoscopic texture for resin-based reinforced natural stone and resin-based reinforced natural stone containing the same |
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