WO2010038949A3 - 격리 저항을 구비하는 프로브 카드용 스페이스 트랜스포머 및 그 제조 방법 - Google Patents

격리 저항을 구비하는 프로브 카드용 스페이스 트랜스포머 및 그 제조 방법 Download PDF

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Publication number
WO2010038949A3
WO2010038949A3 PCT/KR2009/005441 KR2009005441W WO2010038949A3 WO 2010038949 A3 WO2010038949 A3 WO 2010038949A3 KR 2009005441 W KR2009005441 W KR 2009005441W WO 2010038949 A3 WO2010038949 A3 WO 2010038949A3
Authority
WO
WIPO (PCT)
Prior art keywords
resistor
probe card
space transformer
manufacturing same
isolation resistor
Prior art date
Application number
PCT/KR2009/005441
Other languages
English (en)
French (fr)
Other versions
WO2010038949A2 (ko
Inventor
김민수
윤성만
Original Assignee
(주)아이엠텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)아이엠텍 filed Critical (주)아이엠텍
Priority to US13/121,826 priority Critical patent/US20110254578A1/en
Priority to JP2011528934A priority patent/JP2012504234A/ja
Publication of WO2010038949A2 publication Critical patent/WO2010038949A2/ko
Publication of WO2010038949A3 publication Critical patent/WO2010038949A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

본 발명의 격리 저항을 구비하는 프로브 카드용 스페이스 트랜스포머 제조 방법는, 웨이퍼에 형성된 복수의 DUT(Device Under Test)를 한번에 검사할 수 있도록 인접하는 채널 간의 전기적인 영향을 격리하기 위한 격리 저항(isolation resistor)을 구비하는 스페이스 트랜스포머를 제조하는 방법에 있어서, 세라믹 시트에 상기 격리 저항을 형성하도록 저항체를 인쇄하는 저항체 인쇄 단계; 상기 저 항체가 세라믹 시트들의 사이에 배치되도록 상기 저항체가 인쇄된 세라믹 시트 위에 다른 세라믹 시트를 적층하는 세라믹 시트 적층 단계; 및 상기 적층된 세라믹 시트를 소결하는 소결 단계;를 포함하는 점에 특징이 있다.
PCT/KR2009/005441 2008-09-30 2009-09-24 격리 저항을 구비하는 프로브 카드용 스페이스 트랜스포머 및 그 제조 방법 WO2010038949A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/121,826 US20110254578A1 (en) 2008-09-30 2009-09-24 Space transformer comprising an isolation resistor for a probe card, and method for manufacturing same
JP2011528934A JP2012504234A (ja) 2008-09-30 2009-09-24 隔離抵抗を備えるプローブカード用スペーストランスフォーマ及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0096085 2008-09-30
KR1020080096085A KR100907864B1 (ko) 2008-09-30 2008-09-30 격리 저항을 구비하는 프로브 카드용 스페이스 트랜스포머 및 그 제조 방법

Publications (2)

Publication Number Publication Date
WO2010038949A2 WO2010038949A2 (ko) 2010-04-08
WO2010038949A3 true WO2010038949A3 (ko) 2010-07-15

Family

ID=41337631

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/005441 WO2010038949A2 (ko) 2008-09-30 2009-09-24 격리 저항을 구비하는 프로브 카드용 스페이스 트랜스포머 및 그 제조 방법

Country Status (4)

Country Link
US (1) US20110254578A1 (ko)
JP (1) JP2012504234A (ko)
KR (1) KR100907864B1 (ko)
WO (1) WO2010038949A2 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018021216A1 (ja) * 2016-07-28 2019-05-09 日本電産リード株式会社 検査治具、基板検査装置、及び検査治具の製造方法
WO2019017515A1 (ko) * 2017-07-21 2019-01-24 주식회사 기가레인 프로브 카드용 박막 저항기

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100415245B1 (ko) * 2000-08-16 2004-01-16 (주)에이펙스 프로브 카드, 그에 사용되는 프로브 기판 및 스페이스 트랜스포머, 이들의 제조 방법
KR100682172B1 (ko) * 1999-02-17 2007-02-12 어플라이드 머티어리얼스, 인코포레이티드 다중층 전극을 가진 적층 세라믹 및 그 제조방법
KR20070065450A (ko) * 2002-12-27 2007-06-22 티디케이가부시기가이샤 적층형 전자 부품의 제조 방법
KR100815137B1 (ko) * 2006-11-22 2008-03-19 세크론 주식회사 프로브 카드 및 그 제조 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7108546B2 (en) * 2001-06-20 2006-09-19 Formfactor, Inc. High density planar electrical interface
US7307433B2 (en) * 2004-04-21 2007-12-11 Formfactor, Inc. Intelligent probe card architecture
US7180315B2 (en) * 2004-06-28 2007-02-20 Sv Probe, Ltd. Substrate with patterned conductive layer
US8033012B2 (en) * 2008-03-07 2011-10-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method for fabricating a semiconductor test probe card space transformer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100682172B1 (ko) * 1999-02-17 2007-02-12 어플라이드 머티어리얼스, 인코포레이티드 다중층 전극을 가진 적층 세라믹 및 그 제조방법
KR100415245B1 (ko) * 2000-08-16 2004-01-16 (주)에이펙스 프로브 카드, 그에 사용되는 프로브 기판 및 스페이스 트랜스포머, 이들의 제조 방법
KR20070065450A (ko) * 2002-12-27 2007-06-22 티디케이가부시기가이샤 적층형 전자 부품의 제조 방법
KR100815137B1 (ko) * 2006-11-22 2008-03-19 세크론 주식회사 프로브 카드 및 그 제조 방법

Also Published As

Publication number Publication date
KR100907864B1 (ko) 2009-07-14
US20110254578A1 (en) 2011-10-20
JP2012504234A (ja) 2012-02-16
WO2010038949A2 (ko) 2010-04-08

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