WO2010021528A3 - 계층화 구조물 및 그 제조 방법 - Google Patents

계층화 구조물 및 그 제조 방법 Download PDF

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Publication number
WO2010021528A3
WO2010021528A3 PCT/KR2009/004702 KR2009004702W WO2010021528A3 WO 2010021528 A3 WO2010021528 A3 WO 2010021528A3 KR 2009004702 W KR2009004702 W KR 2009004702W WO 2010021528 A3 WO2010021528 A3 WO 2010021528A3
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WO
WIPO (PCT)
Prior art keywords
hierarchical structure
manufacturing
scale
nano
relates
Prior art date
Application number
PCT/KR2009/004702
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English (en)
French (fr)
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WO2010021528A2 (ko
Inventor
김재현
이학주
현승민
최현주
최병익
김기돈
최대근
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한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Priority to JP2011522015A priority Critical patent/JP5575766B2/ja
Priority to US12/995,204 priority patent/US8551353B2/en
Priority to CN200980129153.3A priority patent/CN102105391B/zh
Publication of WO2010021528A2 publication Critical patent/WO2010021528A2/ko
Publication of WO2010021528A3 publication Critical patent/WO2010021528A3/ko

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K17/00—Safety valves; Equalising valves, e.g. pressure relief valves
    • F16K17/02—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side
    • F16K17/04—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side spring-loaded
    • F16K17/0406—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side spring-loaded in the form of balls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00095—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/06—Construction of housing; Use of materials therefor of taps or cocks
    • F16K27/067—Construction of housing; Use of materials therefor of taps or cocks with spherical plugs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/05—Arrays
    • B81B2207/056—Arrays of static structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24851—Intermediate layer is discontinuous or differential

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Analytical Chemistry (AREA)
  • Composite Materials (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Reinforced Plastic Materials (AREA)
  • Powder Metallurgy (AREA)
  • Taps Or Cocks (AREA)
  • Safety Valves (AREA)

Abstract

본 발명은 계층화 구조물의 형상, 그 형상에 따른 계층화 구조물의 공학적 효과, 그 공학적 효과의 증대 방법, 신규 소재 또는 부품에 대한 계층화 구조물의 응용 방법, 계층화 구조물의 대량 제조 방법에 관한 것이다. 본 발명은 계층화 구조물 및 그 제조 방법에 관한 것으로서, 내부의 기지에 나노 스케일 영역의 특성 길이를 가지는 적어도 하나 이상의 나노 오브젝트가 일정한 패턴에 의해 배열된 것을 특징으로 하는 계층화 구조물을 포함한다. 본 발명에 따르면, 나노 스케일 영역에서 발생하는 우수한 특성을 거시적인 스케일 영역의 구조물에서도 활용할 수 있으며, 스케일이 서로 다른 구조물들을 상이한 스케일에 무관하게 간편히 연계할 수 있다.
PCT/KR2009/004702 2008-08-19 2009-08-24 계층화 구조물 및 그 제조 방법 WO2010021528A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011522015A JP5575766B2 (ja) 2008-08-19 2009-08-24 階層化構造物の製造方法
US12/995,204 US8551353B2 (en) 2008-08-19 2009-08-24 Hierarchical structure and manufacturing method thereof
CN200980129153.3A CN102105391B (zh) 2008-08-19 2009-08-24 分级结构及其制备方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0081026 2008-08-19
KR1020080081026A KR101002683B1 (ko) 2008-08-19 2008-08-19 이중시트링과 릴리프밸브를 내장하는 고압력 볼밸브

Publications (2)

Publication Number Publication Date
WO2010021528A2 WO2010021528A2 (ko) 2010-02-25
WO2010021528A3 true WO2010021528A3 (ko) 2010-06-24

Family

ID=41707581

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/004702 WO2010021528A2 (ko) 2008-08-19 2009-08-24 계층화 구조물 및 그 제조 방법

Country Status (5)

Country Link
US (1) US8551353B2 (ko)
JP (1) JP5575766B2 (ko)
KR (1) KR101002683B1 (ko)
CN (1) CN102105391B (ko)
WO (1) WO2010021528A2 (ko)

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WO2008039372A2 (en) * 2006-09-22 2008-04-03 Carnegie Mellon University Assembling and applying nano-electro-mechanical systems
WO2009117456A2 (en) 2008-03-17 2009-09-24 Avery Dennison Corporation Functional micro-and/or nano-structure bearing constructions and/or methods for fabricating same
KR20140005854A (ko) * 2010-07-19 2014-01-15 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 습윤 특징을 제어하기 위한 계층적으로 구조화된 표면
KR101822500B1 (ko) * 2011-09-06 2018-01-29 삼성전자주식회사 양자점층 제조 방법 및 양자점층을 포함한 양자점 광전자소자
KR101338234B1 (ko) * 2013-05-21 2013-12-10 주식회사 신정기공 볼 밸브의 이중 실링 메탈시트
DE102013105803A1 (de) * 2013-06-05 2014-08-07 Cascade Microtech, Inc. Träger zur Halterung von Halbleitersubstraten und Prober zu deren Testung
KR20170083554A (ko) * 2014-11-11 2017-07-18 더 차레스 스타크 드레이퍼 래보레이토리, 인코포레이티드 2차원 및 3차원 구조체에 있어서의 나노스케일 및 마이크로스케일 물체의 조립 방법
KR101871582B1 (ko) * 2016-08-09 2018-06-27 국방과학연구소 회전형 밸브와 노즐 조립체
KR102492533B1 (ko) * 2017-09-21 2023-01-30 삼성전자주식회사 지지 기판, 이를 이용한 반도체 패키지의 제조방법 및 이를 이용한 전자 장치의 제조 방법
US20210390813A1 (en) * 2018-10-31 2021-12-16 Korea Institute Of Machinery & Materials Structural coloration substrate, method for manufacturing structural coloration substrate, and security verification system using structural coloration substrate manufactured thereby

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Also Published As

Publication number Publication date
JP5575766B2 (ja) 2014-08-20
KR101002683B1 (ko) 2010-12-20
CN102105391A (zh) 2011-06-22
CN102105391B (zh) 2014-08-20
JP2011530416A (ja) 2011-12-22
WO2010021528A2 (ko) 2010-02-25
US20110081521A1 (en) 2011-04-07
KR20100022379A (ko) 2010-03-02
US8551353B2 (en) 2013-10-08

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