WO2010021528A2 - 계층화 구조물 및 그 제조 방법 - Google Patents
계층화 구조물 및 그 제조 방법 Download PDFInfo
- Publication number
- WO2010021528A2 WO2010021528A2 PCT/KR2009/004702 KR2009004702W WO2010021528A2 WO 2010021528 A2 WO2010021528 A2 WO 2010021528A2 KR 2009004702 W KR2009004702 W KR 2009004702W WO 2010021528 A2 WO2010021528 A2 WO 2010021528A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hierarchical structure
- manufacturing
- scale
- nano
- relates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K17/00—Safety valves; Equalising valves, e.g. pressure relief valves
- F16K17/02—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side
- F16K17/04—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side spring-loaded
- F16K17/0406—Safety valves; Equalising valves, e.g. pressure relief valves opening on surplus pressure on one side; closing on insufficient pressure on one side spring-loaded in the form of balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00095—Interconnects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K27/00—Construction of housing; Use of materials therefor
- F16K27/06—Construction of housing; Use of materials therefor of taps or cocks
- F16K27/067—Construction of housing; Use of materials therefor of taps or cocks with spherical plugs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/05—Arrays
- B81B2207/056—Arrays of static structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/07—Interconnects
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24851—Intermediate layer is discontinuous or differential
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Analytical Chemistry (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Composite Materials (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Powder Metallurgy (AREA)
- Reinforced Plastic Materials (AREA)
- Taps Or Cocks (AREA)
- Safety Valves (AREA)
Abstract
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200980129153.3A CN102105391B (zh) | 2008-08-19 | 2009-08-24 | 分级结构及其制备方法 |
| JP2011522015A JP5575766B2 (ja) | 2008-08-19 | 2009-08-24 | 階層化構造物の製造方法 |
| US12/995,204 US8551353B2 (en) | 2008-08-19 | 2009-08-24 | Hierarchical structure and manufacturing method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2008-0081026 | 2008-08-19 | ||
| KR1020080081026A KR101002683B1 (ko) | 2008-08-19 | 2008-08-19 | 이중시트링과 릴리프밸브를 내장하는 고압력 볼밸브 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2010021528A2 true WO2010021528A2 (ko) | 2010-02-25 |
| WO2010021528A3 WO2010021528A3 (ko) | 2010-06-24 |
Family
ID=41707581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2009/004702 Ceased WO2010021528A2 (ko) | 2008-08-19 | 2009-08-24 | 계층화 구조물 및 그 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8551353B2 (ko) |
| JP (1) | JP5575766B2 (ko) |
| KR (1) | KR101002683B1 (ko) |
| CN (1) | CN102105391B (ko) |
| WO (1) | WO2010021528A2 (ko) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8945970B2 (en) * | 2006-09-22 | 2015-02-03 | Carnegie Mellon University | Assembling and applying nano-electro-mechanical systems |
| WO2009117456A2 (en) | 2008-03-17 | 2009-09-24 | Avery Dennison Corporation | Functional micro-and/or nano-structure bearing constructions and/or methods for fabricating same |
| EP2595764A1 (en) * | 2010-07-19 | 2013-05-29 | President and Fellows of Harvard College | Hierarchically structured surfaces to control wetting characteristics |
| KR101822500B1 (ko) * | 2011-09-06 | 2018-01-29 | 삼성전자주식회사 | 양자점층 제조 방법 및 양자점층을 포함한 양자점 광전자소자 |
| KR101338234B1 (ko) * | 2013-05-21 | 2013-12-10 | 주식회사 신정기공 | 볼 밸브의 이중 실링 메탈시트 |
| DE102013105803A1 (de) * | 2013-06-05 | 2014-08-07 | Cascade Microtech, Inc. | Träger zur Halterung von Halbleitersubstraten und Prober zu deren Testung |
| WO2016077318A1 (en) * | 2014-11-11 | 2016-05-19 | The Clarles Stark Draper Laboratory, Inc. | Method of assembling nanoscale and microscale objects in two-and three-dimensional structures |
| KR101871582B1 (ko) * | 2016-08-09 | 2018-06-27 | 국방과학연구소 | 회전형 밸브와 노즐 조립체 |
| KR102492533B1 (ko) * | 2017-09-21 | 2023-01-30 | 삼성전자주식회사 | 지지 기판, 이를 이용한 반도체 패키지의 제조방법 및 이를 이용한 전자 장치의 제조 방법 |
| WO2020091241A1 (ko) * | 2018-10-31 | 2020-05-07 | 한국기계연구원 | 구조색 기판, 구조색 기판의 제조방법 및 이에 의해 제조된 구조색 기판을 이용한 보안 검증시스템 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56155164U (ko) * | 1980-04-21 | 1981-11-19 | ||
| JPS59147172A (ja) * | 1983-02-14 | 1984-08-23 | Kobe Steel Ltd | バルブ |
| CN1212652C (zh) * | 2002-07-19 | 2005-07-27 | 上海华虹(集团)有限公司 | 一种基于自组织的纳米颗粒图案的光刻方法 |
| JP2004314238A (ja) | 2003-04-16 | 2004-11-11 | Canon Inc | ナノ構造体の製造方法及びナノ構造体 |
| KR101260981B1 (ko) * | 2004-06-04 | 2013-05-10 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 인쇄가능한 반도체소자들의 제조 및 조립방법과 장치 |
| AU2005337438B2 (en) | 2005-10-20 | 2010-02-18 | Agency For Science, Technology And Research | Hierarchical nanopatterns by nanoimprint lithography |
| US7826336B2 (en) * | 2006-02-23 | 2010-11-02 | Qunano Ab | Data storage nanostructures |
| US7826174B2 (en) * | 2006-03-31 | 2010-11-02 | Ricoh Company, Ltd. | Information recording method and apparatus using plasmonic transmission along line of ferromagnetic nano-particles with reproducing method using fade-in memory |
| ATE426184T1 (de) * | 2006-05-31 | 2009-04-15 | Suisse Electronique Microtech | Nanostrukturierter diffraktionsfilter nullter ordnung |
| CN101100282B (zh) * | 2006-07-06 | 2010-08-04 | 中国科学院化学研究所 | 一种制备ttf-tcnq纳米材料的方法 |
| KR100814730B1 (ko) | 2006-10-27 | 2008-03-19 | 한국기계연구원 | 나노-매크로 사이즈의 계층적 기공구조를 가지는 다공성 생체활성유리 및 이의 합성방법 |
| JP2008200793A (ja) * | 2007-02-20 | 2008-09-04 | Nitto Denko Corp | 二段の階層を有する柱状構造体の製造方法 |
| CN101024482A (zh) * | 2007-03-27 | 2007-08-29 | 吉林大学 | 一种构筑三维微结构的方法 |
| CN101117730B (zh) * | 2007-06-28 | 2011-08-31 | 复旦大学 | 一种多级有序排列的zsm-5纳米棒束及其制备方法 |
| JP2011507232A (ja) * | 2007-12-05 | 2011-03-03 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー. | ハイブリッドマイクロスケール−ナノスケールニューロモルフィック集積回路 |
| KR101022016B1 (ko) * | 2008-08-25 | 2011-03-16 | 한국기계연구원 | 계층화 구조물 및 그 제조 방법 |
-
2008
- 2008-08-19 KR KR1020080081026A patent/KR101002683B1/ko active Active
-
2009
- 2009-08-24 US US12/995,204 patent/US8551353B2/en not_active Expired - Fee Related
- 2009-08-24 JP JP2011522015A patent/JP5575766B2/ja not_active Expired - Fee Related
- 2009-08-24 WO PCT/KR2009/004702 patent/WO2010021528A2/ko not_active Ceased
- 2009-08-24 CN CN200980129153.3A patent/CN102105391B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20110081521A1 (en) | 2011-04-07 |
| WO2010021528A3 (ko) | 2010-06-24 |
| KR101002683B1 (ko) | 2010-12-20 |
| CN102105391B (zh) | 2014-08-20 |
| CN102105391A (zh) | 2011-06-22 |
| JP2011530416A (ja) | 2011-12-22 |
| JP5575766B2 (ja) | 2014-08-20 |
| KR20100022379A (ko) | 2010-03-02 |
| US8551353B2 (en) | 2013-10-08 |
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