WO2010015489A3 - Verfahren für die abscheidung von nickel und edelmetall aus demselben bad - Google Patents

Verfahren für die abscheidung von nickel und edelmetall aus demselben bad Download PDF

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Publication number
WO2010015489A3
WO2010015489A3 PCT/EP2009/058953 EP2009058953W WO2010015489A3 WO 2010015489 A3 WO2010015489 A3 WO 2010015489A3 EP 2009058953 W EP2009058953 W EP 2009058953W WO 2010015489 A3 WO2010015489 A3 WO 2010015489A3
Authority
WO
WIPO (PCT)
Prior art keywords
noble metal
same bath
depositing nickel
nickel
substrate
Prior art date
Application number
PCT/EP2009/058953
Other languages
English (en)
French (fr)
Other versions
WO2010015489A2 (de
Inventor
Frank Brenner
Original Assignee
Nanogate Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanogate Ag filed Critical Nanogate Ag
Publication of WO2010015489A2 publication Critical patent/WO2010015489A2/de
Publication of WO2010015489A3 publication Critical patent/WO2010015489A3/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1689—After-treatment
    • C23C18/1691—Cooling, e g. forced or controlled cooling
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1678—Heating of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)

Abstract

Die vorliegende Erfindung betrifft ein Verfahren zum abwechselnden stromlosen Abscheiden von Nickel und Edelmetall in demselben Bad, ein so beschichtetes Substrat sowie die Verwendung des Substrates im Sanitärbereich, Schmuckbereich oder Elektrobereich.
PCT/EP2009/058953 2008-08-02 2009-07-14 Verfahren für die abscheidung von nickel und edelmetall aus demselben bad WO2010015489A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008036211.5 2008-08-02
DE200810036211 DE102008036211A1 (de) 2008-08-02 2008-08-02 Verfahren für die Abscheidung von Nickel und Edelmetall aus demselben Bad

Publications (2)

Publication Number Publication Date
WO2010015489A2 WO2010015489A2 (de) 2010-02-11
WO2010015489A3 true WO2010015489A3 (de) 2010-04-01

Family

ID=41461031

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/058953 WO2010015489A2 (de) 2008-08-02 2009-07-14 Verfahren für die abscheidung von nickel und edelmetall aus demselben bad

Country Status (2)

Country Link
DE (1) DE102008036211A1 (de)
WO (1) WO2010015489A2 (de)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007128702A1 (de) * 2006-05-04 2007-11-15 Nanogate Ag Edelmetallhaltige nickelschicht
WO2009059917A2 (de) * 2007-11-07 2009-05-14 Nanogate Ag Silberhaltige nickelschicht
DE102007053457A1 (de) * 2007-11-07 2009-05-14 Nanogate Ag Goldhaltige Nickelschicht

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1129984A (en) 1964-10-30 1968-10-09 Usa Electroless deposition of nickel-phosphorus alloys
US3978271A (en) 1975-04-15 1976-08-31 Ppg Industries, Inc. Thin metallic nickel-silver films by chemical replacement
JPS6324072A (ja) 1986-03-04 1988-02-01 Ishihara Yakuhin Kk 無電解パラジウム−ニツケル合金メツキ液
JPH05214551A (ja) 1991-06-19 1993-08-24 Ishihara Chem Co Ltd パラジウム系無電解メツキ液
US6123589A (en) 1998-04-23 2000-09-26 Murata Manufacturing Co., Ltd. High-frequency connector with low intermodulation distortion
US6828898B2 (en) 2003-04-03 2004-12-07 Cts Corporation Fuel tank resistor card having improved corrosion resistance

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007128702A1 (de) * 2006-05-04 2007-11-15 Nanogate Ag Edelmetallhaltige nickelschicht
WO2009059917A2 (de) * 2007-11-07 2009-05-14 Nanogate Ag Silberhaltige nickelschicht
DE102007053457A1 (de) * 2007-11-07 2009-05-14 Nanogate Ag Goldhaltige Nickelschicht

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
N. SHAIGAN ET AL: "Elimination of the corrosion of Ni-P substrates during electroless gold plating", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 152, no. 4, 10 February 2005 (2005-02-10), pages C173 - C178, XP002563560 *

Also Published As

Publication number Publication date
WO2010015489A2 (de) 2010-02-11
DE102008036211A1 (de) 2010-02-04

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