WO2010007656A1 - Panneau électroluminescent organique et son procédé de fabrication - Google Patents

Panneau électroluminescent organique et son procédé de fabrication Download PDF

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Publication number
WO2010007656A1
WO2010007656A1 PCT/JP2008/062703 JP2008062703W WO2010007656A1 WO 2010007656 A1 WO2010007656 A1 WO 2010007656A1 JP 2008062703 W JP2008062703 W JP 2008062703W WO 2010007656 A1 WO2010007656 A1 WO 2010007656A1
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WO
WIPO (PCT)
Prior art keywords
sealing
organic
blocking wall
support substrate
wall portion
Prior art date
Application number
PCT/JP2008/062703
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English (en)
Japanese (ja)
Inventor
真滋 中嶋
雄司 齋藤
Original Assignee
パイオニア株式会社
東北パイオニア株式会社
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Publication date
Application filed by パイオニア株式会社, 東北パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2008/062703 priority Critical patent/WO2010007656A1/fr
Publication of WO2010007656A1 publication Critical patent/WO2010007656A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to an organic EL panel and a manufacturing method thereof.
  • An organic EL panel includes an organic EL element as a light emitting element on a panel substrate.
  • an organic EL element as a light emitting element on a panel substrate.
  • a display screen of a mobile phone for example, a monitor screen of a vehicle-mounted or household electronic device, an information display screen of a personal computer or a television receiver,
  • various display devices used in advertising lighting panels, etc. as various light sources used in scanners, printers, etc., as lighting devices used in general illumination, backlights of liquid crystal display devices, etc., or light utilizing a photoelectric conversion function
  • the organic EL element Since the organic EL element has a property that the light emission characteristic deteriorates when exposed to moisture in the atmosphere, the organic EL element is sealed to block the organic EL element from the atmosphere in order to operate the organic EL panel stably for a long time. Structure is indispensable.
  • a sealing structure of an organic EL panel a substrate on which an organic EL element is formed and a metal or glass sealing member are bonded together to form a sealing space surrounding the organic EL element, and the inside of the sealing space
  • a structure (hollow sealing structure) in which a desiccant is disposed on the surface has been adopted.
  • Step (b) a step of immersing the sealing port J20 of the transparent container J2 in the sealing material solution with the vacuum chamber J1 set to a high vacuum (FIG. (B)), Introducing an inert gas that does not contain moisture into J1, and injecting the liquid sealing material into the transparent container J2 by a pressure difference (FIG. (C)), the vacuum chamber J1 is returned to normal pressure, and transparent
  • the process includes taking out the container J2 from the vacuum chamber J1 and sealing the sealing port J20 with a sealing material ((d) in the figure).
  • the resin adhesive has a low function of blocking moisture entry even after curing, so that the adhesive layer Deterioration factors such as moisture enter the organic EL panel through the organic EL element, and the black frame of the organic EL element (a phenomenon in which the non-light-emitting portion spreads from the periphery of the pixel formed of the organic EL element) or dark spot (organic EL element) The phenomenon in which the non-light emitting portions are scattered in the pixels formed in (a) progresses and the panel life is reduced.
  • the outer wall of the panel container can be formed of a material having a high moisture blocking function, and the liquid adhesive is injected from the sealing port formed in a part of the outer wall. Compared with the case of forming with a layer, it is possible to reduce the degree of penetration of deterioration factors such as moisture, and to suppress the lifetime reduction of the organic EL panel.
  • the present invention is an example of a problem to deal with such a problem. That is, by adopting a solid sealing structure that does not have a sealing space, it is possible to reduce the thickness of the panel and improve the panel strength, omitting the step of deploying a desiccant in the sealing space, An object of the present invention is to improve the productivity of the panel, to prevent the deterioration of the organic EL element due to the intrusion of the deterioration factor into the panel, and to extend the life of the organic EL panel.
  • the organic EL panel and the manufacturing method thereof according to the present invention include at least the configurations according to the following independent claims.
  • a light emitting section having a plurality of organic EL elements, a support substrate section on which the light emission section is formed, and a seal disposed so as to face the support substrate section and cover the light emission section.
  • An organic EL panel wherein the inner blocking wall is formed so as to face the opening of the blocking wall, and an adhesive is filled in the gap inside the outer blocking wall.
  • a sealing cell in a gap between the support substrate portion and the sealing substrate portion by forming an inner blocking wall portion that shields the inner side from the outer side so as to partially surround the light emitting portion. And a method of filling the sealing cell with an adhesive, and a step of curing the adhesive filled in the sealing cell.
  • FIG. 2 is an explanatory view showing the structure of an organic EL panel according to an embodiment of the present invention.
  • FIG. 2 (a) is a sectional view taken along line XX in FIG. 2 (b), and FIG. The YY sectional view in (a) is shown.
  • An organic EL panel 1A includes a light emitting unit 10 having a plurality of organic EL elements, a support substrate unit 20 having the light emitting unit 10 formed on one surface, and light emission facing the support substrate unit 20.
  • the sealing substrate portion 21 is disposed so as to cover the portion 10, and is formed along the outer edge of the supporting substrate portion 20 and the sealing substrate portion 21.
  • the sealing substrate portion 21 has at least one opening portion 22 A and is supported by other than the opening portion 22 A.
  • An outer blocking wall portion 22 that blocks the gap G between the substrate portion 20 and the sealing substrate portion 21 from the outside, and is formed so as to partially surround the light emitting portion 10 inside the outer blocking wall portion 22,
  • An inner blocking wall portion 23 for blocking the outer side, the inner blocking wall portion 23 is formed so as to face the opening 22A of the outer blocking wall portion 22, and an adhesive 24 is provided in the gap G inside the outer blocking wall portion 22. Is filled.
  • the outer blocking wall portion 22 has one opening 22 ⁇ / b> A along one side 20 a in the support substrate portion 20, and the inner blocking wall portion 23 faces the one side 20 a in the support substrate portion 20.
  • One opening 23A is provided along the side 20b.
  • the opening 22A may be provided anywhere and any number, but it is a requirement that the inner blocking wall 23 be formed so as to face the opening 22A.
  • the inner blocking wall portion 23 may be one in which the light emitting portion 10 is partially surrounded, and both ends thereof may be widely opened (for example, see the embodiment shown in FIG. 6).
  • a deterioration factor such as moisture that tries to enter the gap G from the opening 22A of the outer blocking wall 22 is blocked by the inner blocking wall 23 and reaches the light emitting unit 10 directly. Therefore, the deterioration of the organic EL element in the light emitting unit 10 can be suppressed.
  • the outer blocking wall portion 22 and the inner blocking wall portion 23 need to prevent deterioration factors such as moisture from entering the inside, and the blocking performance of the deterioration factors such as moisture is higher than that of the adhesive layer. It is preferably formed of an inorganic material such as a high glass material. Deterioration factors that have entered the inside of the outer blocking wall portion 22 from the opening 22 ⁇ / b> A must be diverted along the inner blocking wall portion 23, and thus directly reach the light emitting unit 10 surrounded by the inner blocking wall portion 23. Can not do it.
  • a sealing cell for sealing the light emitting unit 10 is formed in the gap G between the support substrate unit 20 and the sealing substrate unit 21 by the outer blocking wall unit 22.
  • an inflow path from the opening 22A to the inner gap of the inner blocking wall 23 is necessary. Form a pathway.
  • the detour paths R1 and R2 can prevent the deterioration factor such as moisture from reaching the light emitting unit 10 after the adhesive 24 is cured while allowing the adhesive 24 to be filled.
  • FIG. 3 is an explanatory view showing the structure of an organic EL panel according to another embodiment of the present invention.
  • FIG. 3 (a) is a sectional view taken along line XX in FIG. 3 (b), and FIG. A YY cross-sectional view in FIG.
  • the organic EL panel 1B includes a light emitting unit 10 having a plurality of organic EL elements, and a support substrate unit on which the light emitting unit 10 is formed on one surface. 20, a sealing substrate portion 21 disposed so as to face the support substrate portion 20 so as to cover the light emitting portion 10, and an opening 22 ⁇ / b> A ⁇ b> 1, formed along the outer edge of the support substrate portion 20 and the sealing substrate portion 21.
  • the outer blocking wall portion 22 having 22A2 and blocking the gap G between the support substrate portion 20 and the sealing substrate portion 21 outside the openings 22A1 and 22A2, and the light emitting portion 10 inside the outer blocking wall portion 22.
  • An inner blocking wall portion 23 is formed so as to partially surround the inner blocking wall portion 23 to block the inner side thereof from the outer side thereof, and the inner blocking wall portion 23 is formed to face the openings 22A1 and 22A2 of the outer blocking wall portion 22.
  • the outer barrier wall 22 It is obtained by filling the adhesive 24 in the gap G in the side.
  • the outer blocking wall portion 22 has openings 22 ⁇ / b> A ⁇ b> 1 and 22 ⁇ / b> A ⁇ b> 2 along the opposing sides 20 a and 20 b of the support substrate portion 20, respectively. Openings 23A1 and 23A2 are provided along sides 20c and 20d different from the opposing sides 20a and 20b.
  • the deterioration factor such as moisture that tries to enter the gap G from the openings 22A1 and 22A2 of the outer blocking wall portion 22 is removed.
  • the light emitting unit 10 cannot be directly reached by blocking, so that deterioration of the organic EL element in the light emitting unit 10 can be suppressed.
  • an inflow path in which the adhesive 24 is opened from the opening 22A1 to the opening 23A1 and from the opening 23A2 to the opening 22A2 can be formed.
  • the natural adhesive 24 can be filled using the capillary action in the atmosphere.
  • the sealed cell is filled with the adhesive 24 after the sealed cell is depressurized. .
  • detour paths such as R11, R12, R13, and R14 shown in the figure are formed in the inflow path of the adhesive 24.
  • the detour paths R11 to R14 allow the adhesive 24 to be filled, while suppressing deterioration factors such as moisture from reaching the light emitting unit 10 after the adhesive 24 is cured.
  • the detour paths R11 to R14 do not necessarily have a long distance, and a black frame or dark spot is generated in the organic EL element only by preventing the intrusion of the deterioration factor that linearly reaches the light emitting unit 10 from the openings 22A1 and 22A2. And has the effect of slowing the progression.
  • FIG. 4 is an explanatory diagram (manufacturing flow diagram) showing a method for manufacturing an organic EL panel according to an embodiment of the present invention.
  • the manufacturing method of the organic EL panel according to the embodiment of the present invention includes a supporting substrate unit side process applied to the supporting substrate unit 20 alone and a sealing substrate unit side process applied to the sealing substrate unit 21 and support. It consists of a bonding / sealing process by the substrate part 20 and the sealing substrate part 21.
  • the support substrate part side process and the sealing substrate part side process can be executed in different lines or in different time series.
  • a light emitting part (organic EL element) forming step S10 for forming a light emitting part having an organic EL element on one surface on the supporting substrate part 20, and a protective film on the organic EL element as necessary.
  • a protective film forming step S11 to be formed is performed.
  • FIG. 5 is an explanatory view showing a configuration example of an organic EL element to be formed.
  • FIG. 4A shows an example of an active drive element having independent pixel electrodes
  • FIG. 4B shows an example of a passive drive element in which elements are formed at the intersections of stripe-shaped electrodes. ing.
  • a planarizing film 31 is formed on the support substrate portion 20 on which the driving element (TFT or the like) 30 is formed so as to cover the driving element 30, and the pixel electrode is formed on the planarizing film 31.
  • a lower electrode 32 is formed.
  • the lower electrode 32 can be formed by forming an electrode material on the planarizing film 31 and then patterning it by a photolithography process.
  • a connection line 30A for connecting the lower electrode 32 and the driving element 30 is formed, an insulating film 33 is formed in the peripheral portion thereof, and an opening pattern of the insulating film 33 on the lower electrode 32 is formed.
  • the organic layer 34 including the light emitting layer 34A is formed so as to cover it.
  • the organic layer 34 can be obtained by mask vapor deposition in which the mask opening is combined with the opening of the insulating film 33. Thereafter, the upper electrode 34 is formed so as to cover the entire organic layer 34.
  • the lower electrode 40 is formed in a stripe shape on the support substrate portion 20, and the insulating film 41 is formed thereon to form a stripe pattern so as to intersect the lower electrode 40.
  • stripe-shaped partition walls 42 are formed on the insulating film 41 as necessary. More preferably, the partition wall 42 has a side wall with a reverse taper inclined downward.
  • the organic layer 43 including the light emitting layer 43A is formed along the stripe-shaped opening portions of the insulating film 41 and the partition wall 42, and the stripe-shaped upper electrode 44 is formed thereon.
  • the partition wall 42 becomes a mask pattern when the upper electrode 44 is formed.
  • the organic material deposition layer 43R and the upper electrode material deposition layer 44R are deposited on the upper surface of the partition wall 42.
  • the lower electrodes 32 and 40 can be formed of a transparent electrode such as ITO.
  • a hole injection layer such as copper phthalocyanine (CuPc) is formed on the lower electrodes 32 and 40, and, for example, NPB (N, N-di (naphtalence) -N, N-dipheneyl-benzidene) is deposited as a hole transport layer.
  • the hole transport layer has a function of transporting holes injected from the lower electrodes 32 and 40 to the light emitting layers 34A and 43A.
  • the hole transport layer may be a single layer or a stack of two or more layers.
  • the hole transport layer is not formed by a single material, but a single layer may be formed by a plurality of materials, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. Doping may be performed.
  • red (R), green (G), and blue (B) light emitting layers 34A and 43A are formed in the respective film formation regions by using a resistance masking method by using a coating mask.
  • red (R) an organic material that emits red light such as a styryl dye such as DCM1 (4- (dicyanomethylene) -2-methyl-6- (4′-dimethylaminostyryl) -4H-pyran) is used.
  • An organic material that emits green light such as an aluminum quinolinol complex (Alq 3 ) is used as green (G).
  • an organic material emitting blue light such as a distyryl derivative or a triazole derivative is used.
  • a distyryl derivative or a triazole derivative is used.
  • other materials or a host-guest layer structure may be used, and the emission form may be a fluorescent material or a phosphorescent material.
  • the electron transport layer formed on the light emitting layers 34A and 43A is formed using various materials such as an aluminum quinolinol complex (Alq 3 ) by various film forming methods such as resistance heating vapor deposition.
  • the electron transport layer has a function of transporting electrons injected from the upper electrodes 35 and 44 to the light emitting layers 34A and 43A.
  • This electron transport layer may have a multilayer structure in which only one layer is stacked or two or more layers are stacked.
  • the electron transport layer may be formed of a plurality of materials instead of a single material, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. It may be formed by doping.
  • the insulating films 33 and 41 and the partition wall 42 are made of polyimide or a resist material.
  • a material having a work function lower than that of the anode is used so as to have an electron injection function.
  • ITO indium gallium
  • Al aluminum
  • Mg—Ag magnesium alloy
  • Al since Al has a low electron injection capability, it is preferable to provide an electron injection layer such as LiF between Al and the electron transport layer.
  • a moisture-proof inorganic film or organic film is formed on the organic EL element by a method such as vapor deposition, coating, or chemical vapor deposition (CD).
  • a method such as vapor deposition, coating, or chemical vapor deposition (CD).
  • an organic material film containing CaO or the like can be formed by vapor deposition, and a metal oxide film such as SiO 2 can be formed by CVD or the like.
  • a wall pattern is formed on the sealing substrate portion 21.
  • the pattern of the outer blocking wall portion 22 is formed so as to have at least an opening 22A1 along the outer edge of the sealing substrate portion 21.
  • the pattern of the inner blocking wall portion 23 is formed so as to partially surround the light emitting unit 10 inside the outer blocking wall portion 22.
  • the inner side blocking wall part 23 is formed so that all the opening parts of the outer side blocking wall part 22 may be opposed.
  • a glass paste can be used as a material for forming the wall, and pattern formation techniques such as screen printing can be used for pattern formation.
  • wall pattern formation process S20 by glass welding using glass paste is explained.
  • the glass paste is a general glass welding material, and is V 2 O 5 or SnO-based glass.
  • the glass paste is uniformly formed to a predetermined size, and heated to dry and remove the solvent of the glass paste. Thereafter, the binder component of the glass paste is removed in a degreasing and firing furnace, and the glass paste is baked and hardened on the sealing substrate portion 21 and calcined. Thereafter, the sealing substrate portion 21 is cleaned as necessary.
  • the material for forming the wall portion is not limited to glass paste, and a resin material having a high blocking property against deterioration factors such as moisture can also be used.
  • the bonding / sealing step includes a sealing cell forming step S30 in which a sealing cell is formed by the support substrate portion 20 and the sealing substrate portion 21, an adhesive filling step S31 in which an adhesive is filled in the sealing cell, sealing An adhesive curing step S32 for curing the adhesive filled in the stop cell is included.
  • Sealing cell formation process S30 bonds together the support substrate part 20 in which the light emission part 10 was formed, and the sealing substrate part 21 in which the wall part was patterned so that a wall part might interpose between both.
  • necessary alignment adjustment is performed, and when the adjustment is completed, the positional relationship between the support substrate portion 20 and the sealing substrate portion 21 is fixed.
  • the wall part is hardened
  • a sealed cell in which the light emitting unit 10 is accommodated in the gap between the support substrate unit 20 and the sealing substrate unit 21 is formed.
  • the wall portion is irradiated with laser through the support substrate portion 20 or the sealing substrate portion 21 to weld the glass paste.
  • a laser welding machine is used.
  • the laser light source a semiconductor laser or a YAG laser is used, and laser light with a wavelength of 800 to 1100 nm is irradiated.
  • the support substrate part 20 and the sealing substrate part 21 needs to be a transparent member.
  • the welded glass paste is cured with a decrease in temperature to join the support substrate part 20 and the sealing substrate part 21, and the sealing cell in which the light emitting part 10 is housed in the gap between the support substrate part 20 and the sealing substrate part 21. Is formed.
  • the sealing cell is filled with an adhesive in a vacuum chamber or in the atmosphere.
  • the process in the vacuum chamber is the same as that of the prior art shown in FIG.
  • the inside of the sealed cell is evacuated and the opening 22A is immersed in the adhesive liquid, and the ambient pressure is increased by increasing the ambient pressure. The pressure difference is used to fill the sealing cell with the adhesive.
  • a third step of introducing an inert gas into the tank and injecting the adhesive into the sealed cell with a pressure difference, and a fourth step of returning the inside of the vacuum tank to normal pressure and filling the sealed cell with the adhesive have.
  • a highly fluid adhesive is suitable.
  • an ultraviolet curable adhesive having a low viscosity can be used.
  • those that do not contain fillers or spacer particles are preferable.
  • a suitable example is an ultraviolet curable epoxy resin.
  • the sealing cell in which an adhesive inflow path from the opening 22A1 to the opening 23A1 and from the opening 23A2 to the opening 22A2 is formed is formed.
  • the adhesive can be injected into the sealed cell even in the atmosphere.
  • the sealing cell is filled with the adhesive while gradually replacing the air in the sealing cell with the adhesive by utilizing capillary action in the atmosphere.
  • the adhesive filled in the sealing cell is cured and the light emitting unit 10 is sealed.
  • the adhesive is cured by irradiating the adhesive with ultraviolet rays through one or both of the support member 20 and the sealing member 21.
  • the adhesive has thermosetting properties, it is cured by applying a heat treatment.
  • the desiccant is not disposed between the support substrate part 20 and the sealing substrate part 21, so that a space in the thickness direction for disposing the desiccant can be omitted, and the panel Thinning is possible.
  • the step of disposing the desiccant itself and the step of disposing the desiccant can be omitted from the manufacturing process, the manufacturing cost of the panel can be reduced, and the productivity can be further improved.
  • the space between the support substrate portion 20 and the sealing substrate portion 21 is filled with an adhesive layer, sufficient panel strength can be ensured even if the thickness of the support substrate portion 20 and the sealing substrate portion 21 is reduced. The desired panel strength can be obtained while reducing the thickness of the panel.
  • the outer blocking wall 22 has one opening 22 ⁇ / b> A along one side of the support substrate 20, and the inner blocking wall 23 has the one side of the support substrate 20.
  • the intrusion detour formed along the inner blocking wall portion 23 Since the path is secured sufficiently long, it is possible to sufficiently delay the deterioration factor from reaching the light emitting unit 10.
  • the outer blocking wall portion 22 has openings 22 ⁇ / b> A ⁇ b> 1 and 22 ⁇ / b> A ⁇ b> 2 along the opposing sides of the support substrate portion 20.
  • the above-described intrusion bypass path is shortened, but the bonding from the opening 22A1 to the opening 23A1 and further from the opening 23A2 to the opening 22A2 is performed. Since the inflow path in which the agent is released can be formed, the adhesive can be quickly filled, and the productivity of the panel can be improved.
  • the outer blocking wall 22 and the inner blocking wall 23 have a reliable blocking function against deterioration factors such as moisture.
  • the adhesive filled in the sealing cell it is preferable to use an ultraviolet curable adhesive having a desired fluidity when uncured. Thereby, filling of the adhesive into the sealing cell and curing of the adhesive after filling the adhesive into the sealing cell can be easily performed.
  • one or both of the support substrate part 20 and the sealing substrate part 21 needs to be a transparent substrate.
  • FIG. 6 is an explanatory view showing the structure of an organic EL panel according to an embodiment of the present invention.
  • FIG. 6 (a) is a YY sectional view of FIG. 6 (b), and FIG. An XX cross-sectional view in FIG.
  • the organic EL panel 1C according to the embodiment of the present invention includes the light emitting unit 10 having a plurality of organic EL elements, the support substrate unit 20 having the light emitting unit 10 formed on one surface, and the support substrate unit 20.
  • the sealing substrate portion 21 is disposed so as to face the light emitting portion 10, and is formed along the outer edge of the support substrate portion 20 and the sealing substrate portion 21, and has at least one opening portion 22 ⁇ / b> A.
  • the outer blocking wall portion 22 that blocks the gap G between the support substrate portion 20 and the sealing substrate portion 21 from the outside, and the light emitting portion 10 is partially enclosed inside the outer blocking wall portion 22.
  • an inner blocking wall portion 23 that blocks the inner side from the outer side, the inner blocking wall portion 23 is formed so as to face the opening 22A of the outer blocking wall portion 22, and a gap inside the outer blocking wall portion 22 is formed.
  • G is filled with an adhesive 24.
  • the light emitting unit 10 is covered with a protective film 11 made of an inorganic material, and the gap 24 on the light emitting unit 10 is filled with the adhesive 24 via the protective film 11.
  • the outgas generated from the adhesive 24 is blocked by the protective layer 11, thereby preventing the light emitting unit 10 from being adversely affected by the outgas.
  • the inner blocking wall portion 23 is formed so as to surround the substantially half circumference of the light emitting portion 10.
  • the filling time of the adhesive 24 injected from the opening 22A is shortened by relatively shortening the length of the inner blocking wall portion 23, thereby shortening the manufacturing process time.

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  • Electroluminescent Light Sources (AREA)

Abstract

Selon l’invention, dans un panneau électroluminescent organique, une partie d'émission de lumière (10) constituée d'éléments électroluminescents organiques est formée dans une cellule d'étanchéité constituée d'une partie de substrat de support (20) et d'une partie de substrat d'étanchéité (21), et un adhésif est rempli à partir d'une partie d'ouverture (22A) de la cellule d'étanchéité et durci. Une partie de paroi de protection interne (23) faisant face à la partie d'ouverture (22A) est formée sur un côté interne d'une partie de paroi de protection externe (22) ayant la partie d'ouverture (22A) afin d'empêcher un facteur de détérioration, tel que de l’humidité pénétrant par l’intermédiaire de la partie d'ouverture (22A), d'atteindre les éléments électroluminescents organiques de la partie d'émission de lumière (10).
PCT/JP2008/062703 2008-07-14 2008-07-14 Panneau électroluminescent organique et son procédé de fabrication WO2010007656A1 (fr)

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WO2017017553A1 (fr) * 2015-07-30 2017-02-02 Semiconductor Energy Laboratory Co., Ltd. Procédé de fabrication de dispositif électroluminescent, dispositif électroluminescent, module, et dispositif électronique
WO2019024591A1 (fr) * 2017-08-01 2019-02-07 京东方科技集团股份有限公司 Plaque d'impression d'écran, procédé d'encapsulation, panneau d'affichage et dispositif d'affichage
US11335879B2 (en) * 2018-12-07 2022-05-17 Boe Technology Group Co., Ltd. Substrate and preparation method thereof, display panel and preparation method thereof, and display device

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WO2017017553A1 (fr) * 2015-07-30 2017-02-02 Semiconductor Energy Laboratory Co., Ltd. Procédé de fabrication de dispositif électroluminescent, dispositif électroluminescent, module, et dispositif électronique
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US10135037B2 (en) 2015-07-30 2018-11-20 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device, light-emitting device, module, and electronic device
US10804503B2 (en) 2015-07-30 2020-10-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of light-emitting device, light-emitting device, module, and electronic device
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