WO2009142427A3 - 유기발광소자 및 이의 제작 방법 - Google Patents

유기발광소자 및 이의 제작 방법 Download PDF

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Publication number
WO2009142427A3
WO2009142427A3 PCT/KR2009/002634 KR2009002634W WO2009142427A3 WO 2009142427 A3 WO2009142427 A3 WO 2009142427A3 KR 2009002634 W KR2009002634 W KR 2009002634W WO 2009142427 A3 WO2009142427 A3 WO 2009142427A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
organic light
spacers
emitting layer
sealant
Prior art date
Application number
PCT/KR2009/002634
Other languages
English (en)
French (fr)
Other versions
WO2009142427A2 (ko
Inventor
강창호
남궁성태
이태성
Original Assignee
에스엔유 프리시젼 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스엔유 프리시젼 주식회사 filed Critical 에스엔유 프리시젼 주식회사
Publication of WO2009142427A2 publication Critical patent/WO2009142427A2/ko
Publication of WO2009142427A3 publication Critical patent/WO2009142427A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/80053—Bonding environment
    • H01L2224/80054—Composition of the atmosphere
    • H01L2224/80075—Composition of the atmosphere being inert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
    • H01L2224/808—Bonding techniques
    • H01L2224/8085—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/80855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/80862—Heat curing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

본 발명에 따른 유기발광소자 제작 방법은 기판상에 상호 이격되도록 복수의 스페이서와 유기발광층을 형성하는 단계와, 상기 스페이서 및 유기발광층이 형성된 기판을 진공 상태의 챔버에 인입하는 단계와, 상기 유기발광층을 피복하도록 충진제를 충진한 후 경화시키는 단계와, 상기 복수의 스페이서가 상호 이격되어 형성된 상기 복수의 스페이서 사이의 공간 중 충진제가 충진되지 않은 영역에 실런트를 도포하는 단계와, 상기 복수의 스페이서, 실런트 및 충진제 상면에 봉지부를 배치하는 단계와, 상기 실런트를 경화시켜 봉지하는 단계와, 상기 봉지공정이 진행된 진공 상태의 챔버를 서서히 벤트시켜. 스페이서, 실런트 및 충진제의 상면과 봉지부 사이의 공극을 제거하는 단계를 포함한다. 상술한 바와 같이 본 발명은 보호막을 포함한 유기발광층을 피복하도록 충진된 충진제를 이용하여 1차 봉지하고, 유기발광층이 형성되지 않은 기판 영역을 실런트를 이용하여 2차 봉지함으로써, 수분 및 산소가 유기발광층으로 유입되는 것을 억제하여 소자의 수명을 향상시킬 수 있다.
PCT/KR2009/002634 2008-05-19 2009-05-19 유기발광소자 및 이의 제작 방법 WO2009142427A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080046162A KR20090120227A (ko) 2008-05-19 2008-05-19 유기발광소자 및 이의 제작 방법
KR10-2008-0046162 2008-05-19

Publications (2)

Publication Number Publication Date
WO2009142427A2 WO2009142427A2 (ko) 2009-11-26
WO2009142427A3 true WO2009142427A3 (ko) 2010-02-18

Family

ID=41340671

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/002634 WO2009142427A2 (ko) 2008-05-19 2009-05-19 유기발광소자 및 이의 제작 방법

Country Status (2)

Country Link
KR (1) KR20090120227A (ko)
WO (1) WO2009142427A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101649757B1 (ko) * 2008-09-26 2016-08-19 코오롱인더스트리 주식회사 유기전계발광소자 및 그 제조방법
KR101084179B1 (ko) 2009-12-28 2011-11-17 삼성모바일디스플레이주식회사 유기 발광 디스플레이 소자의 봉지 방법
JP2013109836A (ja) * 2011-11-17 2013-06-06 Mitsubishi Heavy Ind Ltd 有機ｅｌパネルの製造方法及び有機ｅｌパネルの封止装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040008847A (ko) * 2002-07-19 2004-01-31 엘지.필립스 엘시디 주식회사 유기전계 발광소자와 그 제조방법
JP2005019300A (ja) * 2003-06-27 2005-01-20 Canon Inc 有機ｅｌ素子
KR100648167B1 (ko) * 2005-08-01 2006-11-27 주식회사 대우일렉트로닉스 유기 전계 발광 소자 패널
JP2007073459A (ja) * 2005-09-09 2007-03-22 Seiko Epson Corp 有機エレクトロルミネッセンス装置、その製造方法、及び電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040008847A (ko) * 2002-07-19 2004-01-31 엘지.필립스 엘시디 주식회사 유기전계 발광소자와 그 제조방법
JP2005019300A (ja) * 2003-06-27 2005-01-20 Canon Inc 有機ｅｌ素子
KR100648167B1 (ko) * 2005-08-01 2006-11-27 주식회사 대우일렉트로닉스 유기 전계 발광 소자 패널
JP2007073459A (ja) * 2005-09-09 2007-03-22 Seiko Epson Corp 有機エレクトロルミネッセンス装置、その製造方法、及び電子機器

Also Published As

Publication number Publication date
WO2009142427A2 (ko) 2009-11-26
KR20090120227A (ko) 2009-11-24

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