WO2009129947A1 - Dispositif à plaque multicouche et à diodes électroluminescents - Google Patents

Dispositif à plaque multicouche et à diodes électroluminescents Download PDF

Info

Publication number
WO2009129947A1
WO2009129947A1 PCT/EP2009/002711 EP2009002711W WO2009129947A1 WO 2009129947 A1 WO2009129947 A1 WO 2009129947A1 EP 2009002711 W EP2009002711 W EP 2009002711W WO 2009129947 A1 WO2009129947 A1 WO 2009129947A1
Authority
WO
WIPO (PCT)
Prior art keywords
plate
layers
layer
light
metal
Prior art date
Application number
PCT/EP2009/002711
Other languages
German (de)
English (en)
Inventor
Christoph Becher
Original Assignee
Alcan Technology & Management Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcan Technology & Management Ltd. filed Critical Alcan Technology & Management Ltd.
Priority to JP2011505404A priority Critical patent/JP2011519155A/ja
Priority to EP09734548A priority patent/EP2272103A1/fr
Priority to CN2009801147532A priority patent/CN102027605A/zh
Publication of WO2009129947A1 publication Critical patent/WO2009129947A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • F21V33/006—General building constructions or finishing work for buildings, e.g. roofs, gutters, stairs or floors; Garden equipment; Sunshades or parasols
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2111/00—Use or application of lighting devices or systems for signalling, marking or indicating, not provided for in codes F21W2102/00 – F21W2107/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/092—Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the invention relates to a multi-layer composite for power and / or signal supply with a plate and arranged at her, connected to a power supply, light emitting diodes, wherein the plate has a plurality of layers, according to the preamble of claim 1.
  • EP 1 423 891 B1 discloses a multilayer composite with an adapter to be mounted in an opening of a sandwich panel. This opening passes through the sandwich panel, which contains a middle insulating layer, an upper conductive layer and a lower conductive layer under the insulating layer.
  • the adapter includes a housing having upper and lower housing parts, guide holes in one of the parts, guide pins in the other of the parts that fit into the guide holes, and a conductive washer between the upper part and the lower part.
  • the conductive disk also has guide holes which allow the passage of the guide pins and hold the conductive disk in a correct position between the upper and lower parts; the conductive disk provides a plurality of outwardly extending first pins for establishing a stable electrical connection with the upper conductive layer and a second pin mounted in the lower portion and extending outwardly for electrical connection to the lower layer ,
  • the adapter may include a light emitting diode.
  • WO 2006/128 447 A1 discloses a metal mesh with luminaires and an arrangement of such a fabric on a building.
  • a Leuchtenaboaufnähme is integrated into the tissue and makes it possible to remove a light carrier without Disintegrierung the light carrier recording from the tissue and reinsert.
  • clips are used.
  • the inventor set himself the goal of creating a new display unit, which can be used in particular in buildings, as a multilayer composite product for use as a lighting and / or information-switching or sensor system.
  • the multilayer plate comprises a plurality of layers of metal, in particular of aluminum or an aluminum alloy, arranged on both sides of a middle layer of a plastic, for example a thermosetting, in particular a thermoplastic, material, and on the other side correspondingly insulating from a further middle layer or a cover layer Material are covered.
  • the multilayer plate should contain at least one - preferably several - recesses, wherein in each case a diode is arranged in the recesses of the plate. These diodes are connected to the current-conducting metal layers-of aluminum or an aluminum alloy-by means of a layer of metal, and layers extending therebetween, for example, of thermoplastic-containing diode body.
  • the diodes may be disposed on or above a surface of the multilayer board, and the control functions as well as power and voltage supply may be tapped by at least one conductive layer and correspondingly dissipated through at least one other layer.
  • a multilayer sandwich construction - consisting of at least three, ideally four electrically conductive layers (such as metal, especially light metal such as aluminum) and intervening electrically insulating layers - such as the mentioned plastics - plates can be produced which as Carrier for electronic components - z.
  • electrically conductive layers such as metal, especially light metal such as aluminum
  • intervening electrically insulating layers - such as the mentioned plastics - plates
  • ICs integrated circuits
  • LEDs light emitting diodes
  • connectors or sensors - serve to be used assets.
  • Typical thicknesses of the electrically conductive layers range from 20 nanometers for chemically or physically deposited layers to 200 microns for metal foils.
  • electrically conductive layers and electrically conductive plastic layers can be inserted.
  • Electrically insulating layers such as polyolefin sheets or films - for example, polyethylene or polypropylene, polyvinylchloride, polyamide, etc. - may have a thickness of, for example, 7 to 300 ⁇ m and more (up to 1000 ⁇ m).
  • the conductive layers of the plate serve as bus system and / or power supply. As a result, arbitrarily designable large-area monitors or illuminated surfaces can be produced.
  • conductive film webs for connecting components such as diodes are provided on a free surface of a cover layer of a plate; the latter are placed on those layers.
  • the layers of metal of the diode body used with the layers of metal of the plate must be aligned cross-sectionally according to the invention.
  • the lower edge of the diode body used is to sit on a continuous layer of metal of the plate.
  • the diode body is covered by a lens canopy whose lens edge projects laterally beyond the diode body and thereby rests in the installed position of the adjacent cover layer of the plate.
  • a support rod which preferably extends in the central axis of the diode or the diode body, and for connecting to the latter / latter contains a fixing plate for resting on the lens canopy.
  • a panel plate in the panel surface a plurality of recesses are arranged for / with light emitting diodes. It is up to the respective designer to select a particular pattern for the arrangement of the recesses.
  • a box-like shaped panel whose box wall contains several recesses for / with light emitting diodes.
  • Another inventive variation of a panel plate includes a plurality of groups of patterns each of a larger number of recesses for / with light-emitting diodes.
  • a panel plate with wave-like longitudinal section is also within the scope of the invention.
  • the positioning and connection technology (hermetic sealing) of the components on / with the plate can be done, for example, by friction welding, thermoplastic or duroplastic injection molding or other joining technologies.
  • Possible applications are in the field of architecture (eg media facades, interior and exterior lighting), transport (such as traffic control systems, road and tunnel lighting, train and ferry lighting), industry (including machine lighting, light barrier systems, curing systems), security technology (3D Light barrier systems) and display applications (signs, interactive signs, advertising space od. Like.).
  • Fig. 1 the top view of three after the
  • FIG. 2 shows the side view of a device according to FIG. 1 with this underrunning support plate
  • FIG. 3 shows a section through a multilayer printed circuit board with layer elements for light-emitting diodes arranged on its surface;
  • FIG. 4 shows the sectional side view of a multilayer plate with recess for receiving a light-emitting diode
  • Fig. 5 is a side view of a portion of another multilayer panel
  • FIG. 6 shows a sectional side view of a light-emitting diode as an insert element
  • FIG. 7 one of FIG. 6 corresponding
  • FIG. 10 the top view of the detail of FIG. 9; FIG.
  • FIG. 8 shows one of the illustrations in Fig. 8,
  • Fig. 12 an oblique view of a plate almost square plan as a blank
  • Fig. 13 four oblique views on production forms of light-emitting diodes equipped plates from the blank of Fig. 12;
  • Fig. 14 an oblique view of a three-dimensional plate box-like configuration
  • FIGS. 15 and 16 show two oblique views of two-dimensional plates of different shapes
  • FIG. 18 is an oblique view of a building with installed plates, which are created in accordance with FIG. 17;
  • FIG. Fig. 19 the front view of a building with a comparison with FIG 18 differently shaped plate;
  • Fig. 20 an enlarged section of
  • Fig. 1, 2 The sketches of Fig. 1, 2, the position of three light-emitting diodes 10 at center distances n of about 350 mm from each other on a strand 12 with two lines 14, 15 can be seen, the latter ends at both ends in connecting elements 16, l ⁇ a . These are located from the center of the nearest light-emitting diode 10 at a distance ni of 250 mm here.
  • the length a of the LEDs 10 is here 15.5 mm, their height i 7.5 mm.
  • the strand 12 is shown in Fig. 2 on a commercial support plate 17 of thickness h from two on both sides of a plastic plate 18 fixed light metal plates 19 launched.
  • a clarified in Fig. 3 PCB 20 of a thickness h of here, for example, 10 mm has two mutually parallel layers of light metal plates 22 made of aluminum or aluminum alloys each having a thickness hi of about 0.5 mm here, between which they a separating center layer 24 a Thickness h 2 from here about 0.2 mm from PE (polyethylene) is arranged.
  • Each of the aluminum plates 22 formed here from Al 99 is covered to the outside with another polymer layer as cover layer 26, the thickness h 3 of which measures approximately 4.4 mm in each case.
  • the length and the width of the circuit board 20, which are not designated in Fig. 3, amount to, for example, about 300 mm and 400 mm.
  • conductive layer webs for connecting components such as light emitting diodes, ie LED (light-emitting diodes). These are connected to the current-carrying aluminum layers 22 by lines (not visible in FIG. 3).
  • the plate 21 partly shown in FIG. 4 of four aluminum layers 22 and these each on both sides covering PE layers 24 or PE cover layers 26 serves, for example, for receiving the units of FIG. 3 and has for their LEDs 30 recesses 28 whose width di the diameter d of the LEDs 30 corresponds.
  • FIG. 7 shows that the depth ii of the recess 28 corresponds to a height i of the diode body 31 of the light-emitting diode 30 to be lowered into it and to be fixed in it.
  • the plate 21 of FIG. 5 offers three PE layers 24 and two PE cover layers 26, between which four aluminum layers 22 are stored isolated from each other. Not shown here are the blind hole-like recesses 28 for the diode body 31; For this purpose, reference is made in particular to FIGS. 7 to 9.
  • the diode body 31 of the light-emitting diode 30 of FIG. 6 is composed of four current-carrying aluminum layers 32 of thickness hi and four insulating PE layers 36 of thickness h 3 . Its lower edge 34 is determined by an aluminum layer 32 and its upper edge 35 by a PE layer 36.
  • a diffusing, UV-resistant lens 40 with quer4.000lieh to its edge 42 toward curved surface 39; whose diameter d 2 is greater than the length or the diameter d of the diode body 31, so that between this and that lens edge 42, a protruding Kragbau k is present.
  • Fig. 6 in the interior 33 of the diode body 31 oblique views of the lens 40 with six RGB LED 37 and a four-wire bus / driver IC 38 symbolically outlined.
  • the lens canopy 40 of the light emitting diode 30 is attached to a fixing plate 44 of a running in its central axis M support rod 46, thanks to which they can be easily inserted into the recess 28 of the plate 21 as shown in FIG.
  • the support rod 46 is already released from the light emitting diode 30, and the latter is surrounded in the region of the recess 28 by a sealing layer 48, which according to Fig. 9, 10 and between the surface 27 of the plate 21 and the projecting lower surface of the lens canopy 40 is provided. 8, 9 also make it clear that in the installed position, the layers 22 and 24, 26 of the plates 21 are aligned with the respective material corresponding layers 32 and 36 of the diode body 31.
  • a plate 21 a is sketched with a lower translucent cover layer 23, the latter being connected to the lower edge 34 of a diode body 31 a of a diode 30 a inserted into the corresponding recess 28 of the plate 21 a .
  • the latter shines through that cover layer 23.
  • FIG. 12 shows a tabular plate 50 of approximately square outline of length z, which, according to FIG. 13, has different patterns with light-emitting diodes 30b is fitted, for example in the form of an "F" or with four or seven parallel rows of light-emitting diodes 30 b .
  • the right in Fig. 13 plate 50 a is transformed into a U-shaped base plate in plan view, ie at her is a median strip partially It is provided with thirty four LEDs 30b.
  • Fig. 14 illustrates a designed as a box plate 52 with the inside of the box walls 54 arranged light-emitting diodes 30 b .
  • a plate 50 b is shown in Fig. 15, the longitudinal section S-shaped bent and equipped with fifty-four LEDs 30 b .
  • the plate 50 c rectangular plan view of FIG. 16 offers three fields 56, each with thirty-seven LEDs 30 b .
  • Fig. 17 illustrates a rectangular plate 50a with side lengths y, z.
  • a first step A twelve recesses 28a are introduced during a manufacturing process, in which then - step B - LEDs 30 b are inserted and so a mounting plate 50 e is formed.
  • a drainage string 58 is attached to the latter.
  • step D the plate 50 e according to the specifications of FIG. 15 longitudinally deformed S-shaped.
  • FIG. 18 a building 60 is symbolized on the facade 62 below the roof 64 plates 50 e are arranged; For the sake of clarity, only three of the printed circuit boards 50 e are sketched in this FIG. 18.
  • a plate 51 of a length e of 1150 mm and a width f of 850 mm is attached, the three hundred receiving apertures 70 square outline here about 15 mm side length for each one LED 30 c square Outline offers.
  • These are - as especially the Fig. 20 to take - arranged in a grid-like pattern in each case a distance c of 50 mm from each other.
  • the pattern field is provided at a distance q of 75 mm to the longitudinal edge 51 3 of the plate 51 and at a distance qi of 100 mm to its transverse edge 51 b .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne un composite multicouche pour assurer l'alimentation en courant et/ou en signaux, comportant une plaque multicouche (21), ainsi que des diodes électroluminescentes (30) montées sur ladite plaque et raccordées à une amenée de courant.La plaque multicouche (21) comprend plusieurs couches (22) en métal, de préférence en aluminium ou en alliage d'aluminium, qui sont disposées dans chaque cas de part et d'autre d'une couche médiane(24) en matière plastique et sont en outre recouvertes par une autre couche médiane ou une couche de recouvrement (26) en matière plastique appropriée. Les diodes (30) disposées dans chaque cas dans une cavité (28) de la plaque (21) sont reliées aux couches (22) en métal de la plaque, qui conduisent le courant, par l'intermédiaire d'un corps de diode (31) contenant plusieurs couches (32) en métal ainsi que des couches (36) en matière plastique s'étendant entre les précédentes couches. Il est prévu trois, de préférence quatre couches (22, 32) conductrices de courant isolées les unes des autres dans chaque cas par une couche (24, 36) en matière plastique.
PCT/EP2009/002711 2008-04-25 2009-04-14 Dispositif à plaque multicouche et à diodes électroluminescents WO2009129947A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011505404A JP2011519155A (ja) 2008-04-25 2009-04-14 多層基板と発光ダイオードを有する装置
EP09734548A EP2272103A1 (fr) 2008-04-25 2009-04-14 Dispositif à plaque multicouche et à diodes électroluminescents
CN2009801147532A CN102027605A (zh) 2008-04-25 2009-04-14 具有多层板以及发光二极管的装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008021014A DE102008021014A1 (de) 2008-04-25 2008-04-25 Vorrichtung mit einer Mehrschichtplatte sowie Licht emittierenden Dioden
DE102008021014.5 2008-04-25

Publications (1)

Publication Number Publication Date
WO2009129947A1 true WO2009129947A1 (fr) 2009-10-29

Family

ID=41021022

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/002711 WO2009129947A1 (fr) 2008-04-25 2009-04-14 Dispositif à plaque multicouche et à diodes électroluminescents

Country Status (7)

Country Link
EP (1) EP2272103A1 (fr)
JP (1) JP2011519155A (fr)
KR (1) KR20110038608A (fr)
CN (1) CN102027605A (fr)
DE (1) DE102008021014A1 (fr)
TW (1) TW201009775A (fr)
WO (1) WO2009129947A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010081445A1 (fr) * 2009-01-15 2010-07-22 Osram Opto Semiconductors Gmbh Procédé de fabrication d'un élément optoélectronique et élément optoélectronique

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011101805B4 (de) 2011-05-17 2016-08-25 Fela Holding Gmbh Schaltungsträger
WO2013117198A1 (fr) * 2012-02-08 2013-08-15 Scanled Ipr Aps Ensemble panneau de construction et diode électroluminescente
CN105789938B (zh) * 2014-12-23 2020-08-04 南京中兴软件有限责任公司 机架内部供电方法、总线式供电板以及通信设备
DE102015006619A1 (de) * 2015-05-24 2016-11-24 Technische Universität Chemnitz Aus einem hybriden Werkstoffverbund bestehendes Achsbauteil in Verbindung mit einem Straßenfahrzeug oder einem Straßenfahrzeug oder einem mobilen Arbeitsgerät
WO2017121430A1 (fr) * 2016-01-11 2017-07-20 Led Ibond International Aps Module d'alimentation électrique
US10535967B2 (en) 2016-10-31 2020-01-14 Led Ibond International Aps Electrical supply system
WO2023041136A1 (fr) 2021-09-20 2023-03-23 LED iBond International A/S Prise mâle de del
DE102022116234A1 (de) 2022-06-29 2024-01-04 Pfanner Schutzbekleidung Gmbh Flächige Anzeigevorrichtung

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1423891B1 (fr) 2001-08-13 2006-04-26 Katholm Invest A/S Adaptateur de transfert de puissance
JP2006128512A (ja) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
US20060113658A1 (en) 2004-11-29 2006-06-01 Tzyy-Jang Tseng Substrate core and method for fabricating the same
JP2006156747A (ja) * 2004-11-30 2006-06-15 Ngk Spark Plug Co Ltd 配線基板
US20060243986A1 (en) * 2005-04-29 2006-11-02 Lumileds Lighting U.S., Llc RGB thermal isolation substrate
WO2006128447A1 (fr) 2005-06-03 2006-12-07 Mediamesh Gbr Tissu metallique, configuration de tissu metallique et procede d'eclairage
US20070018191A1 (en) * 2005-07-22 2007-01-25 Samsung Electro-Mechanics Co., Ltd. Side view LED with improved arrangement of protection device
US20070114555A1 (en) * 2005-11-22 2007-05-24 Sharp Kabushiki Kaisha Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
DE102007029891A1 (de) * 2006-06-30 2008-01-03 Cree, Inc. Nickel/Zinn-Verbindungssystem für Halbleiterscheiben und Bauelemente
US20080029772A1 (en) 2006-08-04 2008-02-07 Cheng-Ting Chiang Lighting structure with light emitting diodes and method of forming same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4039034A1 (de) 1990-12-07 1992-06-11 Heiland Bernd Gross-display

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1423891B1 (fr) 2001-08-13 2006-04-26 Katholm Invest A/S Adaptateur de transfert de puissance
JP2006128512A (ja) * 2004-10-29 2006-05-18 Ngk Spark Plug Co Ltd 発光素子用セラミック基板
US20060113658A1 (en) 2004-11-29 2006-06-01 Tzyy-Jang Tseng Substrate core and method for fabricating the same
JP2006156747A (ja) * 2004-11-30 2006-06-15 Ngk Spark Plug Co Ltd 配線基板
US20060243986A1 (en) * 2005-04-29 2006-11-02 Lumileds Lighting U.S., Llc RGB thermal isolation substrate
WO2006128447A1 (fr) 2005-06-03 2006-12-07 Mediamesh Gbr Tissu metallique, configuration de tissu metallique et procede d'eclairage
US20070018191A1 (en) * 2005-07-22 2007-01-25 Samsung Electro-Mechanics Co., Ltd. Side view LED with improved arrangement of protection device
US20070114555A1 (en) * 2005-11-22 2007-05-24 Sharp Kabushiki Kaisha Light emitting element, production method thereof, backlight unit having the light emitting element, and production method thereof
DE102007029891A1 (de) * 2006-06-30 2008-01-03 Cree, Inc. Nickel/Zinn-Verbindungssystem für Halbleiterscheiben und Bauelemente
US20080029772A1 (en) 2006-08-04 2008-02-07 Cheng-Ting Chiang Lighting structure with light emitting diodes and method of forming same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010081445A1 (fr) * 2009-01-15 2010-07-22 Osram Opto Semiconductors Gmbh Procédé de fabrication d'un élément optoélectronique et élément optoélectronique
US8450847B2 (en) 2009-01-15 2013-05-28 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip fitted with a carrier

Also Published As

Publication number Publication date
CN102027605A (zh) 2011-04-20
JP2011519155A (ja) 2011-06-30
KR20110038608A (ko) 2011-04-14
EP2272103A1 (fr) 2011-01-12
DE102008021014A1 (de) 2009-10-29
TW201009775A (en) 2010-03-01

Similar Documents

Publication Publication Date Title
WO2009129947A1 (fr) Dispositif à plaque multicouche et à diodes électroluminescents
EP3140097A2 (fr) Corps multicouche et procédé de fabrication de celui-ci
DE69914184T2 (de) Elektrolumineszente lampvorrichtungen und ihre herstellung
EP1446985B1 (fr) Affichage electroluminescent tridimensionnel
DE202017007378U1 (de) Leuchtdiodenstreifen und Leuchtdiodenband
DE102005024838A1 (de) Beleuchtung für den Innen- oder Außenbereich eines Fahrzeuges mit einer OLED
DE102007046639A1 (de) Dreidimensionale bestückte elektrische Leiterplattenanordnungen, insbesondere LED-Beleuchtungseinrichtungen, und Verfahren zu deren Herstellung
DE19926746B4 (de) Mehrfachanordnung von mit LEDs bestückten Leiterplatten und Steckverbinder für die Verbindung von Leiterplatten
DE112020005978T5 (de) Fenster oder oberfläche eines fahrzeugs mit mindestens einem optoelektronischen bauelement
DE10350913B4 (de) Leuchtdioden-Modul und Verfahren zu dessen Herstellung
DE202007018552U1 (de) Verformbares Beleuchtungsmodul
DE102016121047A1 (de) Beleuchtungseinrichtung für ein fahrzeug sowie herstellungsverfahren für eine beleuchtungseinrichtung
EP1514731A2 (fr) Feu de véhicule
DE102010025315A1 (de) Elektronisches Bauelement
DE202020000304U1 (de) Fahrzeug-Karosseriebauteil
DE202008008181U1 (de) Trägerplatte für Leuchtpunkte sowie Fassadensystem dazu
WO2007147278A2 (fr) Source de lumière del et son procédé
DE20004992U1 (de) Bodenbelagelement
DE102018117805A1 (de) Verfahren zur Herstellung eines mindestens eine elektronische Komponente aufweisenden Extrusionsprofils
DE10238054A1 (de) Schild
DE102018118478A1 (de) Verfahren zur Herstellung einer beleuchtbaren Baugruppe und beleuchtbare Baugruppe
DE10001796C2 (de) Mehrlagig aufgebaute Schaltungsstruktur
DE102017106734A1 (de) Trägeranordnung für wenigstens ein elektrisches und/oder elektronisches Bauteil, Verfahren zu deren Herstellung sowie Leuchtenbaugruppe mit einer Trägeranordnung
EP3854633A1 (fr) Composant de carrosserie de véhicule et procédé de fabrication d'un composant de carrosserie de véhicule et procédé de commande d'un agencement de moyen d'éclairage
EP4103017A1 (fr) Système de support de marchandises

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200980114753.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09734548

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2011505404

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 20107023773

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2009734548

Country of ref document: EP