WO2009125921A3 - 패터닝 장치 및 방법 - Google Patents

패터닝 장치 및 방법 Download PDF

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Publication number
WO2009125921A3
WO2009125921A3 PCT/KR2009/000556 KR2009000556W WO2009125921A3 WO 2009125921 A3 WO2009125921 A3 WO 2009125921A3 KR 2009000556 W KR2009000556 W KR 2009000556W WO 2009125921 A3 WO2009125921 A3 WO 2009125921A3
Authority
WO
WIPO (PCT)
Prior art keywords
pattern
way
patterning device
allow
hollow tube
Prior art date
Application number
PCT/KR2009/000556
Other languages
English (en)
French (fr)
Other versions
WO2009125921A2 (ko
Inventor
이형진
양남열
정수화
김범수
차상환
Original Assignee
엘지전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Publication of WO2009125921A2 publication Critical patent/WO2009125921A2/ko
Publication of WO2009125921A3 publication Critical patent/WO2009125921A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

본 발명은 정전 흡인 방식을 이용한 액상 재료의 분사를 통해 대상체에 원하는 패턴을 형성시키는 패터닝 장치 및 방법에 관한 것으로서, 패터닝할 대상체가 패턴 형성을 위해 수평이동하는 과정에서 중공관과의 사이 간격이 변경되지 않도록 조절가능하고, 패턴 형성을 위해 상기 중공관으로부터 대상체로 분사된 액상 재료를 신속히 경화시킴으로써 정밀한 패턴 형성의 균일성 및 반복성을 확보할 수 있고, 또한 형성하고자 하는 패턴의 다양한 이미지 데이터를 사용자의 요구에 맞도록 변환시키고, 그 변환된 데이터를 기반으로 패턴 형성의 신속성 및 정밀성을 향상시킬 수 있도록 액상 재료 주입유닛, 고전압 발생유닛, 구동 스테이지를 정밀하게 제어할 수 있는 패터닝 장치 및 방법을 제공한다.
PCT/KR2009/000556 2008-04-07 2009-02-05 패터닝 장치 및 방법 WO2009125921A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080032242A KR101403744B1 (ko) 2008-04-07 2008-04-07 패터닝 장치 및 방법
KR10-2008-0032242 2008-04-07

Publications (2)

Publication Number Publication Date
WO2009125921A2 WO2009125921A2 (ko) 2009-10-15
WO2009125921A3 true WO2009125921A3 (ko) 2009-12-03

Family

ID=41162353

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/000556 WO2009125921A2 (ko) 2008-04-07 2009-02-05 패터닝 장치 및 방법

Country Status (2)

Country Link
KR (1) KR101403744B1 (ko)
WO (1) WO2009125921A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010029939A1 (de) * 2010-06-10 2011-12-15 Robert Bosch Gmbh Verfahren und Vorrichtung zum Kontaktieren eines Halbleitersubstrates mittels eines Strahldruckverfahrens

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384464A (en) * 1989-09-22 1995-01-24 Sim (Societe D'investissement Dans La Microscopie) S.A. Process and apparatus for optical near field microlithography
JP2002082215A (ja) * 1999-08-03 2002-03-22 Canon Inc カラーフィルタの製造方法及び製造装置、表示装置の製造方法、表示装置を備えた装置の製造方法、表示装置用パネルの製造方法及び製造装置
US20030047729A1 (en) * 2001-09-05 2003-03-13 Konica Corporation Organic thin-film semiconductor element and manufacturing method for the same
KR100453589B1 (ko) * 2001-10-19 2004-10-20 세이코 엡슨 가부시키가이샤 얼라인먼트용 피인식 부재, 이것을 구비한 헤드 유닛과전자 기기, 액정 표시 장치의 제조 방법, 유기 ｅｌ장치의 제조 방법, 전자 방출 장치의 제조 방법, ｐｄｐ장치의 제조 방법, 전기 영동 표시 장치의 제조 방법,컬러 필터의 제조 방법, 유기 ｅｌ의 제조 방법, 스페이서형성 방법, 금속 배선 형성 방법, 렌즈 형성 방법,레지스트 형성 방법 및 광확산체 형성 방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3444015B2 (ja) * 1994-04-21 2003-09-08 株式会社日立製作所 電子回路基板上への液体材料の局所供給方法及びその装置
JP2000127409A (ja) * 1998-10-23 2000-05-09 Shinten Sangyo Kk 電気感応作動媒体を用いた記録方法および記録装置
JP2005138013A (ja) * 2003-11-05 2005-06-02 Seiko Epson Corp 液滴吐出装置の制御方法及び液滴吐出装置
JP2006204991A (ja) * 2005-01-26 2006-08-10 Seiko Epson Corp 膜パターン形成方法、膜パターン、レジスト膜、及び絶縁膜、並びに回路基板、半導体装置、表面弾性波デバイス、表面弾性波発振装置、電気光学装置、及び電子機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5384464A (en) * 1989-09-22 1995-01-24 Sim (Societe D'investissement Dans La Microscopie) S.A. Process and apparatus for optical near field microlithography
JP2002082215A (ja) * 1999-08-03 2002-03-22 Canon Inc カラーフィルタの製造方法及び製造装置、表示装置の製造方法、表示装置を備えた装置の製造方法、表示装置用パネルの製造方法及び製造装置
US20030047729A1 (en) * 2001-09-05 2003-03-13 Konica Corporation Organic thin-film semiconductor element and manufacturing method for the same
KR100453589B1 (ko) * 2001-10-19 2004-10-20 세이코 엡슨 가부시키가이샤 얼라인먼트용 피인식 부재, 이것을 구비한 헤드 유닛과전자 기기, 액정 표시 장치의 제조 방법, 유기 ｅｌ장치의 제조 방법, 전자 방출 장치의 제조 방법, ｐｄｐ장치의 제조 방법, 전기 영동 표시 장치의 제조 방법,컬러 필터의 제조 방법, 유기 ｅｌ의 제조 방법, 스페이서형성 방법, 금속 배선 형성 방법, 렌즈 형성 방법,레지스트 형성 방법 및 광확산체 형성 방법

Also Published As

Publication number Publication date
KR20090106853A (ko) 2009-10-12
KR101403744B1 (ko) 2014-06-03
WO2009125921A2 (ko) 2009-10-15

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