WO2011098325A3 - Lithographic apparatus and device manufacturing method - Google Patents

Lithographic apparatus and device manufacturing method Download PDF

Info

Publication number
WO2011098325A3
WO2011098325A3 PCT/EP2011/050600 EP2011050600W WO2011098325A3 WO 2011098325 A3 WO2011098325 A3 WO 2011098325A3 EP 2011050600 W EP2011050600 W EP 2011050600W WO 2011098325 A3 WO2011098325 A3 WO 2011098325A3
Authority
WO
WIPO (PCT)
Prior art keywords
optical column
lithographic apparatus
substrate
target portion
optical
Prior art date
Application number
PCT/EP2011/050600
Other languages
French (fr)
Other versions
WO2011098325A2 (en
Inventor
Erwin Van Zwet
Pieter De Jager
Johannes Onvlee
Erik Fritz
Original Assignee
Asml Netherlands B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands B.V. filed Critical Asml Netherlands B.V.
Priority to CN201180017276.5A priority Critical patent/CN102822749B/en
Priority to US13/577,560 priority patent/US9134630B2/en
Priority to KR1020127023223A priority patent/KR101366600B1/en
Priority to SG2012057469A priority patent/SG183147A1/en
Priority to EP11701374A priority patent/EP2534538A2/en
Priority to JP2012551569A priority patent/JP5576509B2/en
Publication of WO2011098325A2 publication Critical patent/WO2011098325A2/en
Publication of WO2011098325A3 publication Critical patent/WO2011098325A3/en
Priority to US14/839,663 priority patent/US9372412B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G03F7/70366—Rotary scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2008—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the reflectors, diffusers, light or heat filtering means or anti-reflective means used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/70391—Addressable array sources specially adapted to produce patterns, e.g. addressable LED arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

A lithographic apparatus comprising an optical column capable of creating a pattern on a target portion of a substrate is disclosed. The optical column has a self emissive contrast device (906) configured to emit a beam, and a projection system configured to project the beam onto the target portion. The apparatus has an actuator to move the optical column or a part thereof with respect to the substrate. The apparatus is constructed to reduce the optical effect of density variation in a medium around the moving part of the optical column on the beam by using a compartment (936) which provides a substantially closed environment around the moving part.
PCT/EP2011/050600 2010-02-09 2011-02-02 Lithographic apparatus and device manufacturing method WO2011098325A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN201180017276.5A CN102822749B (en) 2010-02-09 2011-02-02 Lithographic equipment and device making method
US13/577,560 US9134630B2 (en) 2010-02-09 2011-02-02 Lithographic apparatus and device manufacturing method
KR1020127023223A KR101366600B1 (en) 2010-02-09 2011-02-02 Lithographic apparatus and device manufacturing method
SG2012057469A SG183147A1 (en) 2010-02-09 2011-02-02 Lithographic apparatus and device manufacturing method
EP11701374A EP2534538A2 (en) 2010-02-09 2011-02-02 Lithographic apparatus and device manufacturing method
JP2012551569A JP5576509B2 (en) 2010-02-09 2011-02-02 Lithographic apparatus and device manufacturing method
US14/839,663 US9372412B2 (en) 2010-02-09 2015-08-28 Lithographic apparatus and device manufacturing method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US30265510P 2010-02-09 2010-02-09
US61/302,655 2010-02-09
US30732610P 2010-02-23 2010-02-23
US61/307,326 2010-02-23

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US13/577,560 A-371-Of-International US9134630B2 (en) 2010-02-09 2011-02-02 Lithographic apparatus and device manufacturing method
US14/839,663 Continuation US9372412B2 (en) 2010-02-09 2015-08-28 Lithographic apparatus and device manufacturing method

Publications (2)

Publication Number Publication Date
WO2011098325A2 WO2011098325A2 (en) 2011-08-18
WO2011098325A3 true WO2011098325A3 (en) 2011-10-13

Family

ID=44276004

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2011/050600 WO2011098325A2 (en) 2010-02-09 2011-02-02 Lithographic apparatus and device manufacturing method

Country Status (8)

Country Link
US (2) US9134630B2 (en)
EP (1) EP2534538A2 (en)
JP (1) JP5576509B2 (en)
KR (1) KR101366600B1 (en)
CN (1) CN102822749B (en)
SG (1) SG183147A1 (en)
TW (1) TWI448830B (en)
WO (1) WO2011098325A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9041911B2 (en) * 2010-02-25 2015-05-26 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN102893217B (en) * 2010-05-18 2016-08-17 Asml荷兰有限公司 Lithographic equipment and device making method
US9229332B2 (en) * 2013-09-18 2016-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Systems and methods for high-throughput and small-footprint scanning exposure for lithography
KR102240655B1 (en) * 2014-02-13 2021-04-16 삼성디스플레이 주식회사 Exposure apparatus and exposure method using the same
NL2014645A (en) * 2014-04-16 2015-11-02 Asml Netherlands Bv Lithographic apparatus, method for positioning an object in a lithographic apparatus and device manufacturing method.
CN105527795B (en) * 2014-09-28 2018-09-18 上海微电子装备（集团）股份有限公司 Exposure device and defocus tilt error compensation method
TWI753865B (en) * 2015-11-03 2022-02-01 以色列商奧寶科技有限公司 Stitchless direct imaging for high resolution electronic patterning
US10712669B2 (en) 2015-12-30 2020-07-14 Asml Netherlands B.V. Method and apparatus for direct write maskless lithography
KR102135316B1 (en) 2015-12-30 2020-09-17 에이에스엠엘 네델란즈 비.브이. Method and apparatus for direct write maskless lithography
WO2017114653A1 (en) 2015-12-30 2017-07-06 Asml Netherlands B.V. Method and apparatus for direct write maskless lithography
US10684555B2 (en) * 2018-03-22 2020-06-16 Applied Materials, Inc. Spatial light modulator with variable intensity diodes
US10983444B2 (en) * 2018-04-26 2021-04-20 Applied Materials, Inc. Systems and methods of using solid state emitter arrays
US10788762B2 (en) * 2019-02-25 2020-09-29 Applied Materials, Inc. Dynamic cooling control for thermal stabilization for lithography system

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4844568A (en) * 1987-05-27 1989-07-04 Matsushita Electric Industrial Co., Ltd. Scanning type projection exposure system
US5216247A (en) * 1992-02-07 1993-06-01 Ying Wang Optical scanning method with circular arc scanning traces
US5589973A (en) * 1994-05-16 1996-12-31 Agfa Division, Bayer Corporation Optical enclosure for high speed rotating beam deflector
US6765647B1 (en) * 1998-11-18 2004-07-20 Nikon Corporation Exposure method and device
WO2010032224A2 (en) * 2008-09-22 2010-03-25 Asml Netherlands B.V. Lithographic apparatus, programmable patterning device and lithographic method

Family Cites Families (85)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4023126A (en) * 1975-06-26 1977-05-10 Gte Laboratories Incorporated Scanning photographic printer for integrated circuits
DE2631850C2 (en) 1976-07-15 1984-11-22 Agfa-Gevaert Ag, 5090 Leverkusen Method and device for line-by-line exposure of point-like surface elements of a light-sensitive recording medium
JPS57152273A (en) 1981-03-13 1982-09-20 Ricoh Co Ltd Electronic photograph type printer
JPS58145916A (en) 1982-02-24 1983-08-31 Hitachi Ltd Disk type lens optical scanner
US4447126A (en) 1982-07-02 1984-05-08 International Business Machines Corporation Uniformly intense imaging by close-packed lens array
US4520472A (en) 1983-02-07 1985-05-28 Rca Corporation Beam expansion and relay optics for laser diode array
US4525729A (en) 1983-04-04 1985-06-25 Polaroid Corporation Parallel LED exposure control system
US4796038A (en) 1985-07-24 1989-01-03 Ateq Corporation Laser pattern generation apparatus
US4780730A (en) 1986-04-11 1988-10-25 Itek Graphix Corp. Led-array image printer
US5523193A (en) 1988-05-31 1996-06-04 Texas Instruments Incorporated Method and apparatus for patterning and imaging member
US4864216A (en) 1989-01-19 1989-09-05 Hewlett-Packard Company Light emitting diode array current power supply
GB8923709D0 (en) 1989-10-20 1989-12-06 Minnesota Mining & Mfg Production of images using an array of light emmiting diodes
US4952949A (en) 1989-11-28 1990-08-28 Hewlett-Packard Company LED printhead temperature compensation
DE59105735D1 (en) 1990-05-02 1995-07-20 Fraunhofer Ges Forschung EXPOSURE DEVICE.
US5229872A (en) 1992-01-21 1993-07-20 Hughes Aircraft Company Exposure device including an electrically aligned electronic mask for micropatterning
US5216534A (en) 1992-04-24 1993-06-01 E-Systems, Inc. Read-write head for an optical tape recorder
JPH06275936A (en) 1993-03-23 1994-09-30 Oki Electric Ind Co Ltd Forming method of circuit pattern
US5457488A (en) 1993-04-12 1995-10-10 Oki Electric Industry Co., Ltd. Method and apparatus for controlling array of light-emitting elements
DE4315581A1 (en) 1993-05-11 1994-11-17 Fraunhofer Ges Forschung Laser diodes with cooling system
DE4315580A1 (en) 1993-05-11 1994-11-17 Fraunhofer Ges Forschung Arrangement comprising laser diodes and a cooling system, and method for its production
US5705788A (en) 1993-05-19 1998-01-06 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Process for treatment of materials with diode radiation
US5729331A (en) 1993-06-30 1998-03-17 Nikon Corporation Exposure apparatus, optical projection apparatus and a method for adjusting the optical projection apparatus
US5481392A (en) 1993-12-21 1996-01-02 Minnesota Mining And Manufacturing Company Axial mirror scanner system and method
JPH07276706A (en) 1994-03-04 1995-10-24 Xerox Corp Digital printer and method of correcting ununiformity of ledpixel in led printing bar
US5610754A (en) 1994-08-09 1997-03-11 Gheen; Gregory Method and apparatus for photolithography by rotational scanning
US5568320A (en) 1994-11-30 1996-10-22 Xerox Corporation Multiple row lens array alignable with multiple row image bar
IL115864A (en) 1995-11-02 1999-05-09 Orbotech Ltd Method and apparatus for delivering laser energy to an object
JP3318171B2 (en) 1995-11-10 2002-08-26 株式会社リコー Light emitting diode array and optical writing device
US6133986A (en) 1996-02-28 2000-10-17 Johnson; Kenneth C. Microlens scanner for microlithography and wide-field confocal microscopy
US5840451A (en) 1996-12-04 1998-11-24 Advanced Micro Devices, Inc. Individually controllable radiation sources for providing an image pattern in a photolithographic system
EP0956516B1 (en) 1997-01-29 2002-04-10 Micronic Laser Systems Ab Method and apparatus for the production of a structure by focused laser radiation on a photosensitively coated substrate
SE509062C2 (en) 1997-02-28 1998-11-30 Micronic Laser Systems Ab Data conversion method for a multi-beam laser printer for very complex microcolytographic designs
DE19813127A1 (en) 1997-03-27 1998-10-01 Fraunhofer Ges Forschung Laser device with several laser light emitting diodes
DE59803072D1 (en) 1997-05-14 2002-03-21 Luescher Ursula SYSTEM FOR EXPOSING PRINTING PLATES AND THE USE THEREOF
US6235438B1 (en) 1997-10-07 2001-05-22 Nikon Corporation Projection exposure method and apparatus
US6137105A (en) 1998-06-02 2000-10-24 Science Applications International Corporation Multiple parallel source scanning device
US6268613B1 (en) 1999-03-02 2001-07-31 Phormax Corporation Multiple-head phosphor screen scanner
US6204875B1 (en) 1998-10-07 2001-03-20 Barco Graphics, Nv Method and apparatus for light modulation and exposure at high exposure levels with high resolution
ES2184703T3 (en) 1999-03-31 2003-04-16 Fraunhofer Ges Forschung OPTICAL DSIPOSITIVE TO MAKE THE RADIATIONS OF BIDIMENSIONAL NETWORKS OF LASER DIODES SIMETRIC.
US6466352B1 (en) 1999-04-23 2002-10-15 Arie Shahar High-resolution reading and writing scan system for planar and cylindrical surfaces
US6310710B1 (en) 1999-04-23 2001-10-30 Arie Shahar High-resolution reading and writing using beams and lenses rotating at equal or double speed
US6531681B1 (en) 2000-03-27 2003-03-11 Ultratech Stepper, Inc. Apparatus having line source of radiant energy for exposing a substrate
US7453486B2 (en) 2000-12-13 2008-11-18 Orbotech Ltd Pulse light pattern writer
US20020115021A1 (en) 2001-02-01 2002-08-22 Advanced Micro Devices, Inc. Configurable patterning device and a method of making integrated circuits using such a device
US20020126479A1 (en) 2001-03-08 2002-09-12 Ball Semiconductor, Inc. High power incoherent light source with laser array
US20020171047A1 (en) 2001-03-28 2002-11-21 Chan Kin Foeng Integrated laser diode array and applications
DE10293414B4 (en) 2001-07-27 2007-03-01 Tesa Scribos Gmbh Lithograph with moving cylindrical lens system
US20030043582A1 (en) 2001-08-29 2003-03-06 Ball Semiconductor, Inc. Delivery mechanism for a laser diode array
US20030091277A1 (en) * 2001-11-15 2003-05-15 Wenhui Mei Flattened laser scanning system
JP2003220484A (en) 2002-01-23 2003-08-05 Fine Device:Kk Device and method for laser beam machining
GB2389457B (en) 2002-06-07 2006-07-26 Microsaic Systems Ltd Microengineered optical scanner
TWI298825B (en) * 2002-06-12 2008-07-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
WO2004013692A2 (en) 2002-08-02 2004-02-12 Massachusetts Institute Of Technology System and method for maskless lithography using an array of sources and an array of focusing elements
US7175712B2 (en) 2003-01-09 2007-02-13 Con-Trol-Cure, Inc. Light emitting apparatus and method for curing inks, coatings and adhesives
US20050042390A1 (en) 2003-01-09 2005-02-24 Siegel Stephen B. Rotary UV curing method and apparatus
WO2005006082A1 (en) 2003-07-15 2005-01-20 Natalia Viktorovna Ivanova Image producing methods and image producing devices
US6995830B2 (en) * 2003-12-22 2006-02-07 Asml Netherlands B.V. Lithographic projection apparatus and device manufacturing method
US7081947B2 (en) * 2004-02-27 2006-07-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6967711B2 (en) * 2004-03-09 2005-11-22 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060108508A1 (en) 2004-03-12 2006-05-25 Najeeb Khalid Method and apparatus for high speed imaging
US7184123B2 (en) * 2004-03-24 2007-02-27 Asml Netherlands B.V. Lithographic optical system
US7265366B2 (en) * 2004-03-31 2007-09-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2006002668A1 (en) 2004-06-30 2006-01-12 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Light-emitting diode matrix and method for producing a light-emitting diode matrix
US7116404B2 (en) 2004-06-30 2006-10-03 Asml Netherlands B.V Lithographic apparatus and device manufacturing method
WO2006064363A1 (en) 2004-12-14 2006-06-22 Radove Gmbh Process and apparatus for the production of collimated uv rays for photolithographic transfer
WO2006076151A2 (en) 2004-12-21 2006-07-20 Carnegie Mellon University Lithography and associated methods, devices, and systems
KR101240130B1 (en) 2005-01-25 2013-03-07 가부시키가이샤 니콘 Exposure device, exposure method, and micro device manufacturing method
US8163580B2 (en) 2005-08-10 2012-04-24 Philips Lumileds Lighting Company Llc Multiple die LED and lens optical system
US20070182808A1 (en) 2005-10-26 2007-08-09 Lars Stiblert Writing apparatuses and methods
EP1956431A4 (en) 2005-11-15 2009-06-24 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
KR101415313B1 (en) 2006-02-28 2014-07-04 마이크로닉 마이데이터 아베 Platforms, apparatuses, systems and methods for processing and analyzing substrates
US9001028B2 (en) 2006-08-19 2015-04-07 David James Baker Projector pen
DK1892576T3 (en) 2006-08-25 2013-09-16 Luescher Technologies Ag Exposure device to produce screen printing templates
DE102006059818B4 (en) 2006-12-11 2017-09-14 Kleo Ag exposure system
KR101446820B1 (en) 2007-02-06 2014-10-01 칼 짜이스 에스엠테 게엠베하 Method and device for monitoring multiple mirror arrays in an illumination system of a microlithographic projection exposure apparatus
US7969550B2 (en) * 2007-04-19 2011-06-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7768627B2 (en) * 2007-06-14 2010-08-03 Asml Netherlands B.V. Illumination of a patterning device based on interference for use in a maskless lithography system
JP4473297B2 (en) 2007-09-20 2010-06-02 日立ビアメカニクス株式会社 Laser direct drawing system
JP2009128499A (en) * 2007-11-21 2009-06-11 Hitachi Via Mechanics Ltd Laser direct drawing method and laser direct drawing device
WO2010063830A1 (en) 2008-12-05 2010-06-10 Micronic Laser Systems Ab Rotating arm for writing or reading an image on a workpiece
US20100265557A1 (en) 2009-04-21 2010-10-21 Jesper Sallander Optical Systems Configured to Generate More Closely Spaced Light Beams and Pattern Generators Including the Same
US20100283978A1 (en) * 2009-05-07 2010-11-11 Ultratech,Inc. LED-based UV illuminators and lithography systems using same
EP2267534A1 (en) 2009-06-22 2010-12-29 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Illumination system
CN102713759B (en) 2009-09-01 2015-04-29 麦克罗尼克迈达塔有限责任公司 Pattern generation system
US20110164238A1 (en) * 2009-12-02 2011-07-07 Nikon Corporation Exposure apparatus and device fabricating method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4844568A (en) * 1987-05-27 1989-07-04 Matsushita Electric Industrial Co., Ltd. Scanning type projection exposure system
US5216247A (en) * 1992-02-07 1993-06-01 Ying Wang Optical scanning method with circular arc scanning traces
US5589973A (en) * 1994-05-16 1996-12-31 Agfa Division, Bayer Corporation Optical enclosure for high speed rotating beam deflector
US6765647B1 (en) * 1998-11-18 2004-07-20 Nikon Corporation Exposure method and device
WO2010032224A2 (en) * 2008-09-22 2010-03-25 Asml Netherlands B.V. Lithographic apparatus, programmable patterning device and lithographic method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Lithographic apparatus and device manufacturing method", RESEARCH DISCLOSURE, MASON PUBLICATIONS, HAMPSHIRE, GB, vol. 551, no. 29, 1 March 2010 (2010-03-01), pages 322, XP007139689, ISSN: 0374-4353 *

Also Published As

Publication number Publication date
KR20120123543A (en) 2012-11-08
TWI448830B (en) 2014-08-11
US20150370177A1 (en) 2015-12-24
US9372412B2 (en) 2016-06-21
US20120307222A1 (en) 2012-12-06
CN102822749B (en) 2016-07-06
TW201142532A (en) 2011-12-01
JP2013526002A (en) 2013-06-20
KR101366600B1 (en) 2014-02-24
US9134630B2 (en) 2015-09-15
CN102822749A (en) 2012-12-12
SG183147A1 (en) 2012-09-27
WO2011098325A2 (en) 2011-08-18
JP5576509B2 (en) 2014-08-20
EP2534538A2 (en) 2012-12-19

Similar Documents

Publication Publication Date Title
WO2011098325A3 (en) Lithographic apparatus and device manufacturing method
WO2007019118A3 (en) Systems, control subsystems, and methods for projecting an electron beam onto a specimen
WO2014114405A3 (en) Projection system, mirror and radiation source for a lithographic apparatus
EP2555058A3 (en) Environmental Control Subsystem for a Variable Data Lithographic Apparatus
WO2010025061A3 (en) Method for design and manufacture of a reticle using a two-dimensional dosage map and charged particle beam lithography
WO2008008771A3 (en) System and method for gemstone microinscription
TW200617616A (en) Lithographic apparatus and device manufacturing method
WO2012144903A3 (en) Lithography system for processing a target, such as a wafer, a method for operating a lithography system for processing a target, such as a wafer and a substrate for use in such a lithography system
EP2343749A3 (en) Method of manufacturing high resolution organic thin film pattern
WO2007072286A3 (en) Method for movement compensation of image data
WO2008005129A3 (en) Four-dimensional target modeling and radiation treatment
WO2009029570A3 (en) Laser patterning of a carbon nanotube layer
WO2011020599A3 (en) Method and device for producing a three-dimensional object
WO2010149027A8 (en) Light-emitting unit array, method for fabricating the same and projection apparatus
TW200717470A (en) Method and apparatus for manufacturing of magneto-resistance effect element
WO2007081927A3 (en) Display system
WO2010032224A3 (en) Lithographic apparatus, programmable patterning device and lithographic method
JP2010130013A5 (en)
WO2008087597A3 (en) Device manufacturing method and lithographic apparatus
JP2012513896A5 (en)
SG164330A1 (en) Lithographic apparatus and device manufacturing method
WO2008058671A3 (en) Projection apparatus having improved projection properties
EP2689292A4 (en) Resist pattern forming method, resist pattern, crosslinkable negative chemical amplification resist composition for organic solvent development, resist film and resist-coated mask blanks
GR1006042B (en) Method for making a mikroarray.
BR112013015879A2 (en) moving x-ray unit, and method for controlling the dosimetry of an x-ray beam emanating from a moving x-ray unit.

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 201180017276.5

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11701374

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2011701374

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2012551569

Country of ref document: JP

Ref document number: 13577560

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20127023223

Country of ref document: KR

Kind code of ref document: A