Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/06—Measuring leads; Measuring probes
  • G01R1/067—Measuring probes
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
  • G01R1/02—General constructional details
  • G01R1/04—Housings; Supporting members; Arrangements of terminals
  • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
  • G01R1/0433—Sockets for IC's or transistors
  • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/26—Testing of individual semiconductor devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Definitions

• the present invention relates to a semiconductor chip test device, and, more particularly, to a semiconductor chip test socket which is configured such that a coupling plate including plungers fitted therein to come into contact with a semiconductor chip is held on a silicone part using a cap.
• test probe In order to check whether or not a semiconductor chip is operating normally, a test probe is mounted in a test socket and is brought into contact with a semiconductor chip so as to apply test current to a test circuit board.
• a test device which is proposed to lessen damage done to a connecting terminal (a solder ball) of a semiconductor, is configured such that metal balls (powder) and the like are vertically disposed in a silicone body to form a conductive silicone portion and test current is applied to a circuit board positioned thereunder through the conductive silicone portion, thus allowing checking of whether or not the semiconductor chip is operating normally.
• FIG. 1 is a schematic cross-sectional view of a conventional semiconductor chip test socket employing silicone rubber.
• conductive silicone portions 20 composed of vertically disposed metal balls 22 are formed in a silicone part 10, and insulating tapes 40, 50 are coupled to the upper and lower surfaces of the silicone part 10, respectively.
• the silicone part 10 is further provided at a lower surface thereof with a support plate 60 attached thereto.
• a solder ball 2 of a semiconductor chip 1 is electrically connected to a contact 72 of a test circuit board 70, so that whether or not the semiconductor chip 1 is operating normally is determined through the test circuit board.
• the conventional test socket has a limited service life because an upper surface of its conductive silicone portion suffers damage after repeated test procedures.
• technologies allowing a test socket to be brought into contact with a solder ball of a semiconductor chip via a metal plate have been proposed, as in disclosed in Korean Utility Model Registration No. 278989 and Korean Patent Application No. 10-2004-0105638.
• FIG. 2 is a schematic cross-sectional view showing another semiconductor chip test socket including conductive silicone portions.
• a ring-shaped metal plunger 30 is fitted on an upper portion of a conductive silicone portion 20, so as to solve the problem of the conductive silicone portion becoming broken during the contacting procedure with the semiconductor chip.
• an object of the present invention is to provide a semiconductor chip test socket having an extended service life.
• Another object of the present invention is to provide a semiconductor chip test socket having a structure which is easy to manufacture.
• a semiconductor chip test socket includes: a support plate having a fitting hole formed in the center thereof; a silicone part fitted in the fitting hole of the support plate and having a protruded part which protrudes upwards; a plurality of conductive silicone portions composed of metal balls vertically disposed in the protruded part; a coupling plate placed on the protruded part which has a plurality of plungers for coming into contact with solder balls of a semiconductor chip; and a cap having through-holes formed at positions corresponding to the plurality of plungers and having a reception space thereunder to receive the protruded part, the cap being coupled to the silicone part to hold the coupling plate.
• the coupling plate may include: a plunger plate having fitting holes formed at positions corresponding to the plurality of conductive silicone portion; and plungers fitted in the fitting holes.
• Each of the plungers may include; probe protrusions provided on the plunger for coming into contact with a solder ball of a semiconductor chip; and a recessed groove formed in a circumferential surface thereof.
• the probe protrusions may be disposed in one of the through-holes formed in the cap.
• Each of the fitting holes of the plunger plate may be provided with slits at predetermined angular intervals.
• Each of the conductive silicone portions may have a conical recess to receive a lower protrusion formed on a lower surface of the plunger.
• the cap may be adhered at a lower surface to the silicone part by means of a silicone adhesive applied between the lower surface of the cap and an upper surface of the silicone part, and the cap may be made of polyetherimide.
• the semiconductor chip test socket according to the present invention is configured such that a coupling plate including plungers fitted therein to come into contact with a semiconductor chip is coupled to an upper end of a silicone part so as to prevent wear of conductive silicone portions and thus to extend a service life of the test socket.
• the present invention adopts a simple structure in which a cap having a lower reception space is coupled to a silicone part using an adhesive, thus making the manufacture of the test socket easy.
• FIG. 1 is a schematic cross-sectional view of a conventional semiconductor chip test socket employing silicone rubber
• FIG. 2 is a schematic cross-sectional view showing another semiconductor chip test socket including conductive silicone portions
• FIG. 3 is a plan view showing a semiconductor chip test socket according to a preferred embodiment of the present invention
• FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;
• FIG. 5 is an enlarged view of circle B of FIG. 4;
• FIG. 6 is a plan view showing the coupling plate according to a preferred embodiment of the present invention.
• FIG. 7 is an exploded perspective view showing the assembled relationships of the semiconductor chip test socket according to the preferred embodiment of the present invention.
• protruded part 20 conductive silicone portion
• FIG. 3 is a plan view showing a semiconductor chip test socket according to a preferred embodiment of the present invention.
• the semiconductor chip test socket 100 according to the preferred embodiment of the present invention is configured such that a silicone part
• the support plate 60 is typically made of stainless steel, and the silicone part 10 is held on the support plate through the fitting hole formed at the center.
• the silicone part 10 is produced through insert molding, and coupling holes 62 are formed in the support plate 60 around the fitting hole such that silicone firmly adheres to the support plate 60 through the coupling holes 62 during the insert molding process, thus imparting a higher coupling force (this technology is also employed in related arts relating to a test socket).
• the test socket according to the preferred embodiment of the present invention will now be described in greater detail. [51] FIG.
• FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3, and FIG. 5 is an enlarged view of circle B of FIG. 4.
• an insulating tape 50 is attached to a lower surface of the support plate 60 so as to isolate the support plate from a test circuit board, and the silicone part 10, which is fitted at the center of the support plate, is provided with the protruded part which protrudes upwards.
• the silicone part 10 includes a plurality of conductive silicone portions
• FIG. 5 is a plan view showing the coupling plate according to a preferred embodiment of the present invention.
• each of the plunger plate 92 is configured to allow the plungers to be easily fitted in the fitting holes 94 in such a way that each of the fitting holes 94 has slits 96 which are formed on a peripheral edge of the fitting hole at predetermined angular intervals.
• each of the plungers 30 includes a plurality of probe protrusions 32, which is formed on an upper surface of the plunger 30 to come into contact with solder balls of a semiconductor chip, and further includes a recessed groove 34 formed in a circumferential surface thereof.
• the plungers 30 are securely coupled to the conductive silicone portions 20 in such a way that each of the plungers 30 is provided at a lower surface with a lower protrusion 36 and each of the silicone parts 20 is provided at an upper surface with a conical recess 21.
• the cap 80 which functions to hold the coupling plate 90, has through-holes 82 at positions corresponding to the fitting holes 94 and has a reception space 86 to receive the protruded part 12.
• the cap 80 is fixed to the silicone part 10 by means of silicone adhesive 3 applied between a lower surface of the cap 80 and an upper surface of the silicone part 10, and is made of engineering plastics, and preferably polyetherimide resin.
• the through-holes 82 are vertically formed such that the plungers
• each of the through-holes 82 is provided at a peripheral edge with a countersink 84 having a predetermined slope such that the plunger 30 comes into easy contact with a solder ball.
• the probe protrusions 32 of the plunger 30 are inserted into the through-hole 82 such that the probe protrusions come into reliable contact with the solder balls of a semiconductor chip.
• FIG. 7 is an exploded perspective view showing the assembled relationships of the semiconductor chip test socket according to the preferred embodiment of the present invention.
• the silicone part 10 is integrally molded on the center of the support plate 60 through an insert molding process, and the conductive silicone portions 20 are vertically formed in the protruded part 12 of the silicone part 10.
• the lower insulating tape 50 is attached to a lower surface of the support plate 60, and is formed with a through-hole 52 such that contacts (electrode pads) of a test circuit board come into contact with the lower surfaces of the conductive silicone portions 20.
• the coupling plate 90 is placed on the upper surface of the protruded part 12, and the cap 80 is adhered on the upper surface of the silicone part 10 using an adhesive, thus adhering the coupling plate 90. At this time, the reception space of the cap 80 receives the protruded part 12.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Power Engineering (AREA)
• Connecting Device With Holders (AREA)
• Testing Of Individual Semiconductor Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=41162028

Family Applications (1)

Country Status (2)

Families Citing this family (2)

Citations (3)

Family Cites Families (1)

• 2008
  • 2008-04-08 KR KR1020080032694A patent/KR100911892B1/ko active IP Right Review Request
  • 2008-07-28 WO PCT/KR2008/004385 patent/WO2009125901A1/en active Application Filing

Patent Citations (3)

Also Published As

Similar Documents

Legal Events