WO2009121222A1

WO2009121222A1 - A new mobile phone card and its realization method

Info

Publication number: WO2009121222A1
Application number: PCT/CN2008/001766
Authority: WO
Inventors: 洪斌; 杨辉峰
Original assignee: 上海长丰智能卡有限公司
Priority date: 2008-04-01
Filing date: 2008-10-20
Publication date: 2009-10-08
Also published as: CN101551871B; CN101551871A

Abstract

A new mobile phone card is provided, which includes a chip, a tape carrier carrying the chip, and circuitry set on the tape carrier. The tape carrier is metallic. A thermal inductive film is stuck on the back side of the tape carrier. The thermal inductive film is used to prevent the molding compound overflows to inverse metallic contacts in the package process. Overflowing can influence the quality of product. The new card can be used in all kinds of mobile phones or wireless communication products widely; solves packaging process used in new mobile phone card effectively, promotes the development of global mobile phone application technology greatly. It also has strong universality, low cost, and high reliability. The new card that has better application future can meet requirements in many kinds of application field, such as SIM cards of china mobile communications, SIM and UIM cards of china united telecommunications, and other mobile communication products, such as wireless network cards, wireless base station, and public telephones.

Description

Novel mobile phone card and implementation method thereof

Technical field

The invention relates to the field of microelectronic semiconductor packaging technology, integrated circuit packaging technology and mobile phone SIM card chip packaging, and particularly relates to a novel mobile phone card and an implementation method thereof. Background technique

With the continuous advancement of integrated circuit packaging technology, the integration of integrated circuits is increasing, and the functions are becoming more and more abundant. For the emergence of new application requirements, integrated circuit packaging companies are required to design new packaging forms to meet new demands. In the field of smart card packaging, especially the use of mobile phone cards is very large, but currently using traditional processes for production, the main raw materials are carrier tape, silver glue, epoxy glue, hot melt adhesive, PVC card base, etc. The cost of materials is relatively high, and the production process is complicated, the production cost is high, and the products produced by the conventional process have the disadvantages of low yield and relatively low reliability in use.

At present, the mobile phone communication industry is developing towards a technological innovation route, new technologies are emerging, new functions are also increasing, and many old functions are continuously improved and strengthened. In the future, mobile phone service applications will continue to expand. At the same time, the enhancement of the function and performance of the mobile phone card is inevitable.

Therefore, a new type of mobile phone card is particularly needed, which is suitable for the development of the mobile communication industry today, and its implementation method can effectively make up for the deficiencies in the existing production process. Summary of the invention

The object of the present invention is to provide a new type of mobile phone card and a method for realizing the same, which can obtain high reliability products at a very low production cost under the premise of using most of the production equipment and processes, and realizes simpler production than conventional mobile phone cards. The production process enables the product to reduce the overall cost while improving the production efficiency and improving the reliability of the product.

The technical problem solved by the present invention can be implemented by the following technical solutions:

A new type of mobile phone card comprising a chip, a carrier tape for carrying the chip, a circuit disposed on the carrier tape, and a molding compound for completing the outer package, wherein the carrier tape is a metal carrier tape, The back of the belt can flatten the surface to prevent the molding compound from overflowing into the reverse metal contact during the packaging process. Quality film.

The carrier tape is made of copper or a copper alloy and has a thickness of 0.06 to 0.2 mm. In order to ensure the mechanical size of the finished product and the accurate alignment of the paste during use, a positioning perforation is provided inside the edge of the carrier tape.

The carrier tape is strip-shaped as a whole, and the internal structure is arranged in an array; the single carrier tape is convexly provided with a chip bearing area and a bonding wire area, and an isolation groove is arranged between the two areas. The isolation groove is an elongated slot, and the wire area is also separated into a plurality of regions; the inner edge of the isolation groove is provided with a semi-etched structure.

A process hole is disposed on the chip bearing area, and a half-etching structure is disposed on an inner edge of the process hole. The film is a heat sensitive film.

On the carrier tape, the remaining area except the chip carrying area and the bonding wire area is provided with a process slot for reducing the weight of the carrier tape and improving the bonding force between the molded body and the carrier tape.

The remaining areas of the carrier tape except the chip carrying area and the bonding wire area are processed by a half etching process.

The remaining area of the carrier tape except the chip bearing area and the twist line area is made by a precision stamping process, which is a high-temperature pressurization using a mold to form a carrier tape.

A fine rib connection is formed between the carrier tape edge and the single carrier tape and between the adjacent two adjacent carrier tapes, and the thin ribs are formed by thin strips formed between the process slots formed in the carrier tape.

The peripheral edges of the carrier tape are symmetrically disposed with a plurality of graphic positioning holes, and the positioning holes include a "T"-shaped positioning hole for positioning of the longitudinal cutting position, a triangular positioning hole for positioning in the feeding direction, and a single positioning hole. The circular positioning hole with the central positioning position of the carrier tape, the elliptical positioning hole for positioning the upper and lower positions of the carrier tape, and the oblong positioning hole for positioning the lateral cutting position.

After the carrier tape is finished, the single carrier tape on the finished tape is separated by cutting, and the width, the longitudinal and the transverse width of the carrier tape are both 0.3 mm.

The carrier tape is made by a process of first electroplating nickel, then electroplating palladium, and finally electroplating gold.

The new type of mobile phone card has a nominal length of 25.0 ± 0.1 mm, a width of 15.0 ± 0.1 mm, and a thickness of 0.7 to 0.92 mm.

An equilateral chamfer is provided on one corner of the new type of mobile phone card, and the side length of the equilateral chamfer is 3.0±0.1 mm.

The molding compound can be made to have a corresponding functional distinguishing color according to different uses of the smart card. The work The distinguishing color can be three primary colors of red, green and blue, or any mixed color formed by combining the three primary colors, and different color gradations based on different colors.

The smart card is provided with a groove for facilitating the user to insert or remove the card from the card slot on the surface without the contact.

A method for implementing a novel mobile phone card, characterized in that it comprises the following steps:

(1) Mount the phone card chip to the carrier tape with an automatic chip loading device (Die Bonder);

(2) Using the Wire Bonder to ultrasonically connect the function pads of the phone card chip and the corresponding pin pads on the carrier tape;

(3) encapsulating the mobile phone card chip;

(4) affix the product of step (3) to the standard frame, and then cut the horizontal and vertical straight lines as required by special cutting equipment;

(5) Test, tape and package the product of step (4).

In the step (1), the mobile phone card chip is bonded to the carrier tape by an adhesive, and the mobile phone card chip and the carrier tape are firmly connected together by high temperature baking.

The binder is made of a conductive silver paste or a non-conductive silver paste.

In the step (2), the ultrasonic method is to form a bump on the lead pad of the carrier tape by ultrasonic waves, and the function of the mobile phone card chip and the bump on the carrier tape are convex. The points are directly connected by ultrasound. .

The ultrasonic method can also use the ultrasonic or chemical process to form a bump on the solder joint of the mobile phone card chip, and use the conductive adhesive for flip-chip welding to achieve the thinnest package thickness requirement.

In the step (3), the mobile phone card adopts a packaging process as a molding and packaging process, and the high-temperature and high-pressure molding compound is melted in the molding and packaging device, and then ejected into the molding cavity, and the mobile phone card chip and the lead wire are etc. The package is encapsulated in a molded body, and the mold is formed by cooling and solidifying the mold, and the excess molding compound is automatically removed by the molding and packaging device, and the heat sensitive film attached to the back of the mobile phone card is removed.

In the step (5), during the test, the arranging and sorting device arranges the mobile phone cards in the order and direction, passes through the testing device, first detects the appearance of the bottom package of the mobile phone card through the infrared probe, and then enters the laser marking Then, the infrared image of the front side of the mobile phone card is detected by an infrared probe, and after the appearance of the mobile phone card is passed, the electrical performance test is performed; after the test is passed, the automatic sorting device is loaded into the packaging box or the packaging tape to complete the whole The process of packaging. The invention discloses a novel mobile phone card and an implementation method thereof, and the mobile phone card produced by the above packaging process can be widely used in various mobile phones or wireless communication products, and has the advantages of strong versatility, low overall cost and high reliability. Effectively solve the packaging process of new mobile phone cards, and greatly promote the development of global mobile phone application technology. The invention is suitable for the needs of different fields of use, such as China Mobile's SIM card and China Unicom's SIM card and UIM card, etc., and can also be used in other mobile communication products, such as wireless network cards, wireless base stations, public telephones, etc. Better application prospects. DRAWINGS

1 is a front elevational view of a new type of mobile phone card of the present invention;

2 is a front view of another new type of mobile phone card of the present invention;

2A is a front elevational view showing another novel mobile phone card of the present invention;

3 is a schematic view of the reverse side of the new type of mobile phone card of the present invention;

Figure 4 is a side cross-sectional view of the new type of mobile phone card of the present invention;

Figure 5 is a cross-sectional view showing the internal structure of a novel mobile phone card of the present invention;

5A is a schematic structural view of a carrier tape according to the present invention;

Figure 6 is a plan view showing the reverse side of the new type of mobile phone card of the present invention;

7 is a front plan view showing a new type of mobile phone card of the present invention;

Figure 8 is a front plan view showing another new type of mobile phone card of the present invention;

8A is a front plan view showing another novel mobile phone card of the present invention;

9 is a three-dimensional effect diagram of the reverse side of the novel mobile phone card of the present invention;

10 is a front perspective view of a new type of mobile phone card of the present invention;

Figure 11 is a front perspective view of another novel mobile phone card of the present invention;

Figure UA is a front three-dimensional rendering of another new type of mobile phone card of the present invention;

12 is a front elevational view of the new mobile phone card of the present invention after continuous packaging;

FIG. 13 is a schematic view of the reverse side of the novel mobile phone card of the present invention after continuous packaging. detailed description

In order to make the technical means, creative features, achievement goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations. As shown in FIG. 5, a new type of mobile phone card includes a chip 1, a carrier tape 2 for carrying the chip 1, and a line 3 disposed on the carrier tape 2. The carrier tape 2 is prepared by using copper or copper alloy material. The metal carrier tape can be attached with a heat-sensitive film on the back surface of the carrier tape 2 to prevent the surface from being flattened to prevent the mold plastic from overflowing during the packaging process and affecting the quality of the product. The carrier tape 2 has a thickness of 0.06 mm to 0.2 mm; the finished product has a thickness of 0.065 mm to 0.155 mm. The outer shape of the carrier tape 2 is formed by chemical etching or precision stamping.

Referring to Fig. 5A, the carrier tape 2 is strip-shaped as a whole, and the internal structure is arranged in an array; a single carrier tape 2 is convexly provided with a chip bearing region 21 and a bonding wire region 22, and an isolation groove 23 is provided between the two regions. The isolation groove 23 is an elongated slot, and also separates the wire region 22 into a plurality of regions; the inner groove wall edge of the isolation groove 23 is provided with a half etching structure. A process hole 211 is disposed on the chip carrying region 21, and a half-etched structure is disposed at an inner edge of the process hole 211.

On the carrier tape 2, the remaining area except the chip carrying area 21 and the twisted line area 22 is provided with a process slot for reducing the weight of the carrier tape and improving the bonding force between the molded body and the carrier tape. The remaining area of the carrier tape 1 except the chip carrying region 21 and the bonding wire region 22 is processed by a half etching process. The remaining area of the carrier tape 2 except the core carrying area 21 and the bonding line area 22 is made by a precision stamping process, which is a high-temperature pressurization of the carrier tape by a mold. .

A fine rib connection is formed between the edge of the carrier tape 2 and the single carrier tape and between the individual carrier tapes, and the ribs are formed by thin strips 25 formed between the process slots 24 formed in the carrier tape.

a plurality of patterned positioning holes are provided on the peripheral edges of the carrier tape 2, the positioning holes include a "T" shaped positioning hole 26 for longitudinal cutting position positioning, and a triangular positioning hole 27 for positioning in the feeding direction, A circular positioning hole 28 for centrally positioning the single carrier tape 2, an elliptical positioning hole 29 for positioning the upper and lower positions of the carrier tape 2, and a flat elongated positioning hole 29a for positioning the lateral cutting position.

After the carrier tape 2 is finished, the single carrier tape on the finished tape is divided by cutting. The width, vertical and horizontal width of the carrier tape 2 are 0.3 mm. The carrier tape 2 is first plated with nickel, then palladium plated, and finally plated with gold. Made of craftsmanship.

An equilateral chamfer is provided on one corner of the new type of mobile phone card, and the side length of the equilateral chamfer is 3.0±0.1 mm. The molding compound can be made according to the different uses of the smart card to have the corresponding function distinguishing color; the function distinguishing color can be three primary colors of red, green and blue, or can be any mixed color formed by combining the three primary colors, and more different Different color gradations based on color.

On the face of the smart card that has no contacts, a recess 7 is provided for the user to insert or remove the card from the card slot.

A method for implementing a new type of mobile phone card, comprising the following steps:

(1) Mount the mobile phone card chip 1 to the carrier tape 2 with an automatic chip loading device (Die Bonder);

(2) The function of the mobile phone card chip 1 and the corresponding pin pads on the carrier tape 2 are firmly connected by ultrasonic wire bonding device (Wire Bonder);

(3) packaging the mobile phone card chip 1 with a molding compound;

(5) Test, tape and package the product of step (4).

In the step (1), the mobile phone card chip 1 is bonded to the carrier tape 2 by the adhesive 5, and the mobile phone card chip 1 and the carrier tape 2 are firmly connected together by high-temperature baking.

The adhesive 5 is made of a conductive silver paste or a non-conductive silver paste, and the silver paste is dropped into the chip carrying area 21 of the carrier tape 2 by an automatic precision dispensing device. The chip 1 to be packaged is loaded into the chip carrying area 21 by the chip loading device, the chip 1 is fixed by the adhesive force of the silver glue, the silver glue is solidified by the infrared curing device, and the mobile phone card chip 1 and the carrier tape 2 are firmly adhered. Hehe.

In the step (2), the ultrasonic method is to form a bump on the lead pad of the carrier tape 2 by ultrasonic waves, and the function pad of the mobile phone card chip 1 and the pin of the carrier tape 2 are mounted on the disk. The upper bumps are directly connected by ultrasound. The disc of the mobile phone card chip 1 and the soldering pad of the carrier tape 2 are welded by a gold wire by an ultrasonic welding device to form a passage, and are used as components for the next process.

The ultrasonic method can also use the ultrasonic or chemical process to grow the bumps on the solder joints of the mobile phone card chip 1, and use the conductive adhesive to perform flip-chip bonding to achieve the thinnest package thickness requirement.

In the step (3), the mobile phone card adopts a packaging process as a molding and packaging process, and in the molding and packaging device, the high-temperature and high-pressure molding compound is melted and then ejected into the molded body 6, and the mobile phone card chip 1 and The lead wire 3 and the like are enclosed in the molded body 6, and the packaged product formed by the release of the mold plastic after cooling and solidification is passed through the mold. The plastic packaging device automatically removes excess molding compound and removes the thermal sensing film attached to the back of the mobile phone card. The processed component is packaged by injection molding by a molding and packaging device to protect the internal chip 1 and the lead 3.

In the step (5), during the test, the arranging and sorting device arranges the mobile phone cards in the order and direction, passes through the testing device, first detects the appearance of the bottom package of the mobile phone card through the infrared probe, and then performs laser marking. Then, the infrared image of the front side of the mobile phone card is detected by an infrared probe, and after the appearance of the mobile phone card is passed, the electrical performance test is performed; after the test is passed, the automatic sorting device is loaded into the packaging box or the packaging tape to complete the whole In the process of packaging, a new type of mobile phone card as shown in FIG. 1, FIG. 2, FIG. 3 and FIG. 4 is finally obtained.

The basic principles and main features of the present invention and the advantages of the present invention are shown and described above. It should be understood by those skilled in the art that the present invention is not limited by the foregoing embodiments, and that the present invention is only described in the foregoing embodiments and the description of the present invention, without departing from the spirit and scope of the invention. Various changes and modifications are intended to be included within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and their equivalents.

Claims

Rights request

A new type of mobile phone card comprising a chip, a carrier tape for carrying the chip, a circuit disposed on the carrier tape, and a molding compound for completing the outer package, wherein the carrier tape is a metal carrier tape, The back side of the tape can be used to flatten the surface to prevent the mold plastic from overflowing during the packaging process to the film whose reverse metal contact affects the quality of the product.

2. The new type of mobile phone card according to claim 1, wherein: said carrier tape is made of a copper material.

3. The new type of mobile phone card according to claim 1, wherein: said carrier tape is made of a copper alloy material.

A new type of mobile phone card according to claim 1, wherein said carrier tape has a thickness of 0.06 to 0.2 mm.

The new type of mobile phone card according to claim 1, characterized in that: on the inner side of the edge of the carrier tape, positioning holes for ensuring the mechanical size of the finished product and the accurate alignment in the use are provided.

6. The new type of mobile phone card according to claim 1, wherein: the carrier tape is strip-shaped as a whole, and the internal structure is arranged in an array; the single carrier tape is convexly provided with a chip bearing area and a twisted line area. There are isolation slots between the two areas.

7. The new type of mobile phone card according to claim 6, wherein: the isolation groove is an elongated slot, and the wire area is also separated into a plurality of areas; Semi-etched structure.

8. The new type of mobile phone card according to claim 6, wherein: the chip carrying area is provided with a process hole, and the inner side edge of the process hole is provided with a half etching structure.

9. The new type of mobile phone card according to claim 1, wherein: said film is a heat sensitive film.

10. The new type of mobile phone card according to claim 6, wherein: the carrier tape is provided with a belt carrier area and a wire bonding area for reducing the weight of the carrier tape and improving the molded body and the carrier tape. Bonding process slots.

11. The new type of mobile phone card according to claim 6, wherein: the remaining area of the carrier tape except the chip carrying area and the bonding wire area is processed by a half etching process.

12. The new type of mobile phone card according to claim 6, wherein: the remaining area of the carrier tape except the chip bearing area and the twisted area is made by a precision stamping process, and the precision stamping process is advantageous. The carrier tape is press-formed by high temperature pressurization using a mold.

13. The new type of mobile phone card according to claim 1, wherein: a fine rib connection is formed between an edge of the carrier tape and a single carrier tape and a single internal carrier tape, and the thin rib is a carrier tape. A thin strip formed between the process slots.

14. The new type of mobile phone card according to claim 1, wherein: the peripheral edge of the carrier tape is symmetrically disposed with a plurality of graphic positioning holes, and the positioning holes include a "T" shape for longitudinal cutting position positioning. Positioning hole, triangular positioning hole for positioning in the feeding direction, circular positioning hole for central positioning of single carrier tape, elliptical positioning hole for positioning of the upper and lower positions of the carrier tape, and flat for positioning of the lateral cutting position Long positioning holes.

15. The new type of mobile phone card according to claim 1, wherein: the carrier tape is separated by a cutting method after the finished product is finished, and the width, the vertical and the horizontal width of the carrier tape are 0.3. Mm.

16. The new type of mobile phone card according to claim 1, wherein: the carrier tape is formed by a process of first electroplating nickel, then electroplating palladium, and finally electroplating gold.

17. The new type of mobile phone card according to claim 1, wherein: said new mobile phone card has a nominal length of 25.0 ± 0.1 mm, a width of 15.0 ± 0.1 mm, and a thickness of 0.7 to 0.92 mm.

18. The new type of mobile phone card according to claim 1, wherein: the corner of the new type of mobile phone card is equilateral chamfered, and the side length of the equilateral chamfer is 3.0±0.1 mm.

19. The new type of mobile phone card according to claim 1, wherein: said molding compound is formed to have a corresponding functional distinguishing color according to different uses of the smart card.

The new mobile phone card according to claim 19, wherein: the function distinguishing color may be three primary colors of red, green, and blue, or may be any mixed color formed by combining three primary colors, and further includes Different color levels on different colors.

21. The new type of mobile phone card according to claim 1, wherein: the smart card is provided with a groove for facilitating the user to insert or remove the card from the card slot on the surface without the contact.

22. A method for implementing a new type of mobile phone card, characterized in that it comprises the following steps:

(2) The wire bonder (Wire Bonder) will be used to securely connect the function disk of the phone card chip with the corresponding pin pad on the carrier tape;

(3) packaging the mobile phone card chip with a molding compound; (4) affixing the product of step (3) to the standard frame, and then cutting the horizontal and vertical lines as required by special cutting equipment;

(5) Test, tape and package the product of step (4).

The implementation method according to claim 22, wherein in the step (1), the mobile phone card chip is bonded to the carrier tape by an adhesive, and the mobile phone card chip is baked by high temperature baking. It is firmly connected to the carrier tape.

24. The method according to claim 23, wherein the binder is made of conductive silver paste or non-conductive silver paste.

The implementation method according to claim 22, wherein in the step (2), the ultrasonic mode is to form a bump on the lead pad of the carrier tape by ultrasonic waves, and the mobile phone card is The function pads of the chip and the bumps on the lead pads of the carrier tape are directly connected by ultrasonic waves.

The implementation method of claim 25, wherein: the ultrasonic method can also use a ultrasonic or chemical process to grow a bump on the solder joint of the mobile phone card chip, and use a conductive adhesive to perform flip-chip bonding. Achieve the thinnest package thickness requirements.

The implementation method according to claim 22, wherein in the step (3), the mobile phone card adopts a packaging process as a molding and packaging process, and a high temperature and high pressure molding compound is used in the molding and packaging device. After being melted, it is injected into the molding cavity, and the mobile phone card chip and the lead wire are encapsulated in the molding body, and the packaged product formed by the release molding of the molding compound after cooling and solidification is automatically removed by the molding and packaging device, and The heat sensitive film attached to the back of the mobile phone card is removed.

The implementation method according to claim 22, wherein in the step (5), during the testing, the arranging and sorting device arranges the mobile phone cards in order and direction, passes through the testing device, and passes the infrared ray. The probe first detects the appearance of the bottom package of the mobile phone card, and then performs laser marking, and then performs infrared appearance detection on the front side of the mobile phone card through an infrared probe. After the appearance of the mobile phone card is passed, the electrical performance test is performed; after the test passes, The entire packaging process is completed by loading the automatic sorting equipment into a package or packaging tape.