WO2016082056A1

WO2016082056A1 - Encapsulated chip component of chip card, sheet-like encapsulation plate for forming thereof, and forming method

Info

Publication number: WO2016082056A1
Application number: PCT/CN2014/001046
Authority: WO
Inventors: 璩泽明; 宋大崙
Original assignee: 璩泽明
Priority date: 2014-11-25
Filing date: 2014-11-25
Publication date: 2016-06-02

Abstract

An encapsulated chip component of a chip card, a sheet-like encapsulation plate for forming thereof, and a forming method, using a sheet-like carrier layer (10) to prepare a plurality of chip modules (20) disposed at intervals, each chip module (20) contains a chip circuit layer pattern (21) formed on a first surface of the sheet-like carrier layer (10) and crystalline grains (22) assembled at an opposing side second surface and able to correspondingly communicate with the chip circuit layer pattern (21); forming at least a plastic encapsulation layer (30) on the second surface of the sheet-like carrier layer (10) and integrating the same; performing monomeric cutting to prepare a plurality of encapsulated chip components (40). Chip module (20) forms a sheet-shaped crystal matrix and can be easily inserted into a slot of a chip card in order to form a chip card; at a manufacturing end, manufacturing processes can be separated, and the chip encapsulation component and the chip card can be mass-produced separately, facilitating the integration thereof, avoiding the drawbacks of using a dedicated machine, and reducing a material cost of the carrier layer, meeting the demands of mass production and improving the economic benefits of smart card technology.

Description

Chip package for wafer card and sheet package board therefor and molding method thereof

Technical field

The present invention relates to a chip package for a wafer card and a sheet package board and a molding method therefor, and more particularly to a wafer module used for a wafer card as a one-piece chip package to serve as a wafer substrate. It is easily embedded in an open slot provided on a wafer card body to form a wafer card to improve the economic efficiency of the wafer card process.

Background technique

Generally speaking, a wafer card refers to a card embedded with a chip module, such as a smart card (SIM card), a financial card or a credit card, etc., wherein the smart card refers to a Subscriber Identity Module (SIM), which is used to save a mobile phone. The smart card of the user identification data of the service is generally referred to as a SIM card. At present, the SIM card can be divided into a Mini (mini) SIM card, a Micro (micro) SIM card and a Nano (Nai) SIM card, which are respectively provided with a predetermined size. For example, the Mini SIM card is a 15mmx25mm rectangular small card body, the Micro SIM card is a 15mmx12mm rectangular small card body, and the Nano SIM card is a 8.8mmx12.3mm rectangular small card body. Although the above rectangular card bodies are not complete. The rectangular shape, such as its corners on the corners, but because of the focus of the case and does not affect the technology of the case, it will not be repeated here. In the case of the existing SIM card structure, it utilizes a rectangular plastic small card body having the above-mentioned predetermined size, such as a 15mm x 25mm (Mini SIM card), a 15mm x 12mm (Micro SIM card) or a 8.8mm x 12.3mm (Nano SIM card). And a concave recessed groove is defined on the rectangular small card body for embedding a chip module conforming to the function of the SIM card; according to the related technology of the current SIM card, whether it is a Mini SIM card or a Micro SIM card Or a Nano SIM card, the size of the wafer modules embedded thereon can be designed to be the same or about the same, which is advantageous for the manufacturing process of the SIM card wafer module or the wafer card, but is not intended to limit the present invention.

The wafer card described below is exemplified by a smart card (SIM card), but is not intended to limit the present invention. Referring to Figures 1 and 2, respectively, a perspective view of a combination and decomposition of a chip module and a card body of a SIM card in a conventional one-card one-core card. The one-card one-core card 100 includes a smart card (wafer card) 200 and a card body 300 for carrying. The card body 300 is generally a rectangular plastic chip card of 85.6 mm x 53.98 mm. Since the chip card such as a financial card or a credit card has been a large number of articles manufactured and used for a long time, the card body 300 has become recognized by the industry related to the chip card. The standardized chip card, in other words, the mechanical device for making the 85.6mmx53.98mm rectangular card body and its manufacturing process or related technology, etc. The card body 300 is also used by the related industry to make and/or store a SIM card having a smaller size. As shown in FIG. 1 and FIG. 2, the smart card 200 can be used as well. Use the existing SIM card type as required. For example, the size of the Mini SIM card is 15mmx25mm, the size of the Micro SIM card is 15mmx12mm, or the size of the Nano SIM card is 8.8mmx12.3mm, as shown in Figure 1. 2 shows a Mini SIM card as an example, but not limited. Since the manufacturing end is only a single smart card 200 on a card body 300 when it is manufactured, it is called a card and a core, but can also be made. One card is multi-core without limitation (refer to Figure 12-16).

The existing smart card 200 includes a card body 201 and a smart card chip module 202 embedded and fixed in a predetermined slot (blind slot) 203 on a chip card body (200) disposed on the card body 201. As shown in FIG. 2, the wafer module 202 further includes a carrier layer 204, a wafer circuit layer pattern 205 disposed on the first surface of the carrier layer 204 (as shown above) and a die 206 assembly. On the opposite second side of the carrier layer 204 (the bottom surface as shown), the wafer circuit layer pattern 205 can be correspondingly communicated.

In the current processing technology of a smart card (SIM card), a card-core card shown in FIG. 1 and FIG. 2 is taken as an example, and the manufacturing end of the chip module 202 generally uses a continuous strip-shaped flexible circuit. The board (FPC) is used as a carrier board (not shown), which is generally referred to as a Roll to Roll FPC or Reel to Reel FPC (reel mode) production method, and the long strip FPC is along its length direction (ie, the feeding direction). A plurality of wafer modules (202) (including a wafer circuit layer pattern 205 and a die 206) arranged in a predetermined interval are sequentially formed; and then, a known special machine is used in conjunction with the manufacturing end of the card body 300 for carrying The device performs the subsequent process of the smart card, comprising: taking out the singulated card chip module (202) from the long strip FPC, and assembling each wafer module (202) one by one on the mating card body 300 as shown in the figure. 2 is shown to make the one-card one-core card 100.

In the process of the existing one-card one-core card 100, the break line 207 of the smart card 200 must be punched out on each card body 300 for the user to conveniently take out the smart card 200 from the card-core card 100, and The surface of the card layer 201 of the smart card 200 is required to be raked by a router to allow the smart card chip module 202 to be embedded therein, and the recess 203 is further configured to form a center. The chamber 208 is configured to receive the die 206 and the stepped trench 209 disposed on the bottom surface of the wafer module 202 for the peripheral edge of the bottom surface of the wafer module 202 to be adhered to the recess 203 by means of adhesive; moreover, the above process is currently They are all made with specially designed special machine equipment.

As can be seen from the above, the process technology of the existing one-card one-core card 100 (or one-card multi-core) is limited by the special machine equipment, so that the manufacturing process of the wafer module 202 manufacturing end and the card body 300 manufacturing end is also limited, for example, In the manufacturing process, the fabrication of the slave wafer module 202 includes each of the wafer circuit layer patterns 205. The forming operation and the mounting operation of each of the crystal grains 206, and the subsequent processing operations such as assembling the wafer module 202 on the card body 300, are performed by a Roll to Roll FPC or a Reel to Reel FPC (reel method). Since it is sequentially performed on a long strip of flexible circuit board (FPC), the structure of the machine is not only cumbersome, but also the process is relatively slow, it is difficult to achieve mass production benefits, and the flexible circuit board (FPC) As a carrier board, the process and material costs are relatively increased, and the production control between the manufacturing end of the wafer module 202 and the manufacturing end of the card body 300 is further caused; in addition, the surface of the card layer 201 of the smart card 200 must be supported by 刳The router is used to plan a special slot 203 for the wafer module 202 to be embedded, which further increases the difficulty and cost of the planing process. Therefore, the existing process technology can not only achieve the mass production demand, but also the manufacturing cost is relatively improved, which does not meet the economic benefits of producing smart cards.

Summary of the invention

It can be seen from the above that, for the process of the chip card (smart card), how to develop a wafer card process which can meet the demand for mass production and improve economic benefits is a problem to be solved by the present invention, and the present invention is directed to the above problem. The subject of the proposal, and propose a technical solution with novelty and progress.

To achieve the above object, the technical solution adopted by the present invention includes:

A method for molding a sheet-like package sheet for forming a chip package of a wafer card, comprising the steps of:

Step 1: using a sheet-like carrier layer to form a plurality of wafer modules forming spaced wafer cards, wherein a plurality of spaced-apart wafer circuit layer patterns are formed on the first surface of the sheet-like carrier layer. And assembling a die on the second surface opposite to the first surface of the first surface on each of the wafer circuit layer patterns on the first surface to pass through the chip carrier layer to communicate with the corresponding wafer circuit layer pattern, So that a plurality of wafer modules are formed, and each of the wafer modules includes a chip circuit layer pattern disposed on the first surface and a die disposed on the second surface and in pattern communication with the wafer circuit layer;

Step 2: forming at least one plastic encapsulation layer on the second surface of the sheet-like carrier layer, the at least one plastic encapsulation layer being integrated with the second surface of the sheet-like carrier layer and held in each smart card chip module The connection and function between the die and the corresponding chip circuit layer pattern are such that a sheet-like package board for molding having a plurality of spaced-apart wafer packages is fabricated.

Among them, after the step 2, the following steps are also included:

Step 3: singulating and cutting the sheet-like packaging board for molding to complete a plurality of smart card chip packages, wherein each smart card chip package is a smart card chip module and at least one plastic sealing layer The combined molded body is combined.

Wherein, in the step 2, the at least one plastic encapsulating layer is formed on the second surface of the sheet-like carrier layer by a lamination method or an injection molding method to form an integrally molded body.

Wherein, in the step 2, when the lamination method is used, a double-sided adhesive layer, a first plastic layer and a second plastic layer are stacked one on another on the second surface of the sheet-like carrier layer. The at least one plastic encapsulation layer is formed by lamination by lamination and integrated with the second side of the sheet-like carrier layer.

Wherein a plurality of chambers are preset on the double-sided adhesive layer and the first plastic layer, wherein each of the chambers respectively corresponds to each of the crystal grains assembled on the second surface of the sheet-like carrier layer for each crystal grain Can be accommodated in each chamber.

The material of the first plastic layer and the second plastic layer comprises PVC and ABS resin.

Wherein, in the step 2, the injection molding method is used, which is to embed the sheet-like carrier layer in the injection molding die, and then use a material for forming the plastic encapsulation layer as an injection material. The injection molding die directly molds and forms the plastic encapsulation layer on the second surface of the sheet-like carrier layer and is integrated with the second surface of the sheet-like carrier layer.

The wafer module includes a wafer module that is compatible with a Mini SIM card, a Micro SIM card, or a Nano SIM card.

Wherein, the chip package comprises a chip package for use with a Mini SIM card, a Micro SIM card or a Nano SIM card.

The chip package has a thickness of 0.3-0.85 mm formed by a wafer module and at least one plastic package layer.

In order to achieve the above object, the technical solution adopted by the present invention further includes:

A sheet-like package board for molding a chip package of a wafer card, which is produced by the above-mentioned molding method, characterized in that the sheet-like package board comprises:

a sheet-like carrier layer having a plurality of spaced apart wafer modules thereon, wherein each of the smart card wafer modules further comprises: a wafer circuit layer pattern formed on the first side of the sheet-like carrier layer; and a die mounted on a second side opposite the first face and at a position corresponding to the pattern of the circuit layer of the wafer to pass through the chip carrier layer to be in conductive with the corresponding chip circuit layer pattern;

At least one plastic encapsulation layer formed on the second surface of the sheet-like carrier layer and integrated with the second surface of the sheet-like carrier layer, and maintaining the corresponding crystal grains in each smart card chip module The function of the chip circuit layer pattern.

A chip package for a wafer card, which is a wafer-type wafer substrate formed by singulating and cutting a sheet-like package sheet for molding, wherein the chip package comprises:

a wafer module comprising: a wafer circuit layer pattern formed on a first side of a sheet-like carrier layer; and a die mounted on a second side opposite the first surface and located in a corresponding wafer circuit At a relative position of the layer pattern, energy is supplied through the sheet-like carrier layer to be electrically connected to the corresponding chip circuit layer pattern;

At least one plastic encapsulation layer formed on the second surface of the sheet-like carrier layer and integrated with the second surface of the sheet-like carrier layer, and maintaining the corresponding crystal grains in each smart card chip module The connection between the chip circuit layer patterns and the function of the function;

Wherein the chip package is formed by the at least one plastic encapsulation layer and bonded to the second surface of the sheet-like carrier layer, so that the chip package has sufficient mechanical strength to be tightly embedded in the chip package. An open slot formed in the mating wafer card body.

Wherein, the wafer card body is a card body having a size of one of a Mini SIM card, a Micro SIM card or a Nano SIM card.

The wafer card body is disposed on a rectangular card body having a size of 85.6 mm x 53.98 mm.

The manufacturing end can separately mass-produce the chip package and the wafer card body (or the card body for bearing) in a separate process, and then combine them into a single body, thereby avoiding the special machine necessary for the existing process technology. The limitation of the platform and the reduction of the material cost of the carrier layer can meet the mass production requirements and improve the economic benefits of the wafer card process.

DRAWINGS

1 to 2 are respectively a schematic and exploded perspective view of a wafer module and a card body in a conventional one-card one-core card;

3 is a plan view showing an embodiment of a first surface (provided with a plurality of wafer circuit layer patterns) of a plurality of spaced apart wafer modules on a sheet-like carrier layer of the present invention;

Figure 4 is a plan view showing the second surface (provided with a plurality of crystal grains) of the sheet-like carrier layer of Figure 3;

5 to FIG. 7 are schematic diagrams showing the steps of a method for molding a chip package for forming a chip package of a wafer card (smart card) according to the present invention;

Figure 8 is a schematic view showing the at least one plastic encapsulation layer formed on the second side of the sheet-like carrier layer by a lamination method in the present invention;

9 is a schematic view showing the at least one plastic encapsulation layer formed on the second surface of the sheet-like carrier layer by an injection molding method in the present invention;

10 to FIG. 11 are respectively exploded and assembled perspective views of an embodiment of a chip card (smart card) of a wafer card (smart card) embedded in a card body for use as a card and a core card;

12 to FIG. 16 are respectively the chip package of the present invention embedded in a carrier card body to form a card two-core card, a card four-core card, a card four-core card, a card six-core card and a A combined perspective view of a card core card embodiment.

DESCRIPTION OF REFERENCE NUMERALS: 10 sheet carrier layer; 10a sheet package board; 11 first side; 12 second side; 20 wafer module; 21 wafer circuit layer pattern; 22 die; 30 plastic package layer; Adhesive layer; 311 chamber cavity; 32 first plastic layer; 321 chamber cavity; 33 second plastic layer; 40 wafer card chip package; 50 injection molding die; 51 upper die; 52 lower die; 53 cavity; 54 injection port 60 card body; 60a card body; 60b card body; 60c card body; 60d card body; 60e card body; 61 break line; 70 mini SIM card; 71 first open slot; 72 break line; 80 micro SIM card; 81 second open slot; 82 break line; 90 nano SIM card; (prior art); 100 card one core card; 200 smart card; 201 card body; 202 smart card chip module; 203 slot; 204 carrier layer; Wafer circuit layer pattern; 206 die; 207 break line; 208 central chamber cavity; 209 step groove; 300 card body.

detailed description

In order to make the present invention clearer and more detailed, the technical features of the present invention will be described in detail below with reference to the preferred embodiments.

The wafer card described below is exemplified by a smart card (SIM card), but is not intended to limit the present invention. A method for molding a sheet-like package sheet for molding a chip package of a wafer card according to the present invention comprises the following steps:

Step 1: Using a sheet-like carrier layer 10 to form a plurality of spaced-apart wafer modules 20 as shown in FIGS. 1 and 2, the sheet-like carrier layer 10 may be a rectangular sheet-shaped carrier, but is not limited thereto. Formed using a general standard printed circuit board (PCB), unlike conventional flexible circuit boards (FPC), the material and fabrication cost of the carrier 10 is reduced; wherein on the first side 11 of the sheet-like carrier layer 10 Forming a plurality of spaced-apart wafer circuit layer patterns 21, wherein the spaced arrangement can be designed as a 12x24 array as shown in FIG. 1 to share a total of 280 wafer circuit layer patterns 21, but not to limit the invention; On the second face 12 of the first face 11 at a relative position of each of the wafer circuit layer patterns 21 on the corresponding first face 11 Each of the die 22 is assembled such that the die 22 can pass through a circuit (not shown) provided in the chip carrier layer 10 to communicate with the corresponding chip circuit layer pattern 21, such that the chip carrier is A plurality of wafer modules 20 are formed on the layer 10, and each of the wafer modules 20 includes a wafer circuit layer pattern 21 disposed on the first surface 11 and a die 22 disposed on the second surface 12 and the wafer circuit layer pattern 21 In the present embodiment, the wafer module 20 includes card chip modules conforming to various SIM card usages such as a Mini SIM card, a Micro SIM card, and a Nano SIM card, and the size of the wafer modules 20 of the various SIM cards is considered to be the same. However, it is not intended to limit the present invention; and then proceeds to the next step 2.

Step 2: forming at least one plastic encapsulation layer 30 on the second surface 12 of the sheet-like carrier layer 10 (as shown in FIG. 5), as shown in FIGS. 5 and 6, wherein the at least one plastic encapsulation layer 30 is formed. In the process, the second surface 12 of the sheet-like carrier layer 10 can be integrated, but the die 22 and the circuit layer pattern 21 in each of the wafer modules 20 disposed on the chip carrier layer 10 can be maintained. The connection and function between the two are thus formed into the sheet-like package sheet 10a for molding of the present invention, and the chip package 10a for molding is formed with a plurality of wafer packages 40 arranged at intervals. Taking the sheet-like carrier layer 10 of FIGS. 3 and 4 as an example, the sheet-like package board 10a for molding has a 280 chip package (smart card) wafer package 40 arranged in an array of 12×24 arrays. However, it is not intended to limit the invention.

After the second step, the next step 3 is performed: the singulation cutting of the sheet-like packaging sheet 10a for molding is performed by dicing and cutting the cutting sheet A as shown in FIG. The chip package 40 for inventing the wafer card is as shown in FIG. 7; taking the sheet-like carrier layer 10 of FIGS. 3 and 4 as an example, the 280 chip package 40 can be fabricated through the step 3, but is not limited. In the present invention, the chip package 40 is a chip structure formed by combining a wafer module 20 and at least one plastic package layer 30 and having a suitable thickness, as shown in FIGS. The increased thickness and rigidity of the at least one plastic encapsulation layer 30 allows the chip package 40 to have sufficient mechanical strength to be embedded in a mating carrier card body 60 or a wafer thereon with a certain degree of tightness. The open slot 81 provided in the card body (shown as 70 or 80 in the figure) is as shown in Figs. 10 and 11, that is, the chip package 40 of the wafer card (smart card) can be firmly embedded in the card for carrying The opening groove 81 on the body 60 is not easily detached, but the user can open the card by the slight force of the finger. The chip package 40 is taken out from the wafer body 60.

Taking the SIM card shown in FIG. 7, 10, and 11 as an example, the main feature of the present invention is to specify a SIM card such as a Mini SIM card (70), a Micro SIM card (80), and a Nano SIM card (90). For example, the wafer module 20 used in the SIM card is formed as a wafer package 40 as a wafer substrate, so that the chip package 40 (wafer substrate) can be easily embedded in a carrier card body 60. An open slot 81 is defined to form a desired SIM card, that is, when the wafer module When the chip module is designed to conform to one of the Mini SIM card, the Micro SIM card, and the Nano SIM card, the formed chip package 40 is a Mini SIM card, a Micro SIM card, or a Nano SIM card. One of the chip packages 40 used, so that when the chip package 40 is embedded as a wafer substrate in an open slot provided in a card body 60 for carrying, the open slot shown in FIGS. 10 and 11 81, a SIM card (wafer card) of one of the Mini SIM card, the Micro SIM card, and the Nano SIM card can be constructed as shown in FIGS. 10 and 11 or the Mini SIM card 70 or the Nano SIM card 90.

In the case of the existing SIM card technology, the size of the wafer module used in the Mini SIM card, the Micro SIM card or the Nano SIM card can be designed to be the same or approximately the same as the wafer module 20 shown in FIGS. 3 and 4, thus In the embodiment shown in Figures 10 and 11, the chip package 40 is sized to conform to a chip package for use with a Mini SIM card, a Micro SIM card, or a Nano SIM card. In addition, the size of the currently known SIM card is reduced from 15mm x 25mm for the Mini SIM card to 15mm x 12mm for the Micro SIM card, and further reduced to 8.8 for the SIM card (Nano SIM card). Mmx12.3mm, so in the embodiment shown in Figures 10, 11, the chip package 40 is directly made of a Nano SIM card size of 8.8mm x 12.3mm for use as a wafer substrate, but not for limitation this invention. The thickness of the chip package 40 is preferably equal to the thickness of the mating card body 60 (as shown in FIG. 10), such as 0.3 mm to 0.85 mm, that is, when the card body 60 for carrying is a conventional one. When the card body 300 of the card core card 100 (shown in FIGS. 1 and 2) is formed, the thickness of the smart card chip package 40 is preferably equal to the thickness of the card body 300 (60), and is used for carrying. The size and shape of the open slot 81 (shown in Figures 10 and 11) on the card body 60 (300) also matches the size of the wafer card chip package 40 such that the wafer card chip package 40 is embedded therein. An open slot 81 (shown in Figures 10 and 11) of the card body 60 (300) is securely fitted and does not protrude from the surface of the card body 60 (300) as shown in Figure 11 .

In the first step, the present invention utilizes surface-mount technology (SMT) to assemble the die 22 of each wafer card (SIM card) packaged by WLCSP (Wafer Level Wafer Size Package). The second surface 12 of the sheet-like carrier layer 10 corresponds to each of the wafer circuit layer patterns 21 on the first surface 11 to achieve mass production benefits, but the WLCSP packaging method of each of the crystal grains 22 or the SMT assembly process thereof is not It is used to limit the invention.

In addition, in the step 2, the at least one plastic encapsulation layer 30 is formed on the second side of the sheet-like carrier layer 10 by one of a lamination method or an injection molding method. 12 and combined to form a one-piece wafer substrate (40), but the lamination method and injection molding The work method is not intended to limit the invention, and is further described as follows:

Referring to FIG. 8, when at least one plastic encapsulation layer 30 is formed in the step 2 by a lamination process on the second side 12 of the sheet-like carrier layer 10 and combined to form a one-piece wafer substrate (40) When the second surface 12 of the sheet-like carrier layer 10 is stacked one by one, a double-sided adhesive layer 31, a first plastic layer 32 and a second plastic layer 33 are laminated one by one. The double-sided adhesive layer 31, the first plastic layer 32 and the second plastic layer 33 are integrally joined to form the at least one plastic encapsulation layer 30 and simultaneously with the second side 12 of the sheet-like carrier layer 10 during lamination. Combine into one.

A plurality of chambers 311 are preset on the double-sided adhesive layer 31, and a plurality of chambers 321 are preset on the first plastic layer 32, and the

chambers

311 and 321 are respectively corresponding to the sheet. Each of the crystal grains 22 assembled on the second surface 12 of the carrier layer 10 is such that each of the crystal grains 22 can be accommodated in each of the

chambers

311 and 321 after being laminated, and is disposed by the second plastic layer 33. At the outermost layer to form a closed state. In addition, the material of the first and second plastic layers 32, 33 may be PVC (polyvinyl chloride) or ABS resin (Acrylonitrile Butadiene Styrene), but is not limited. Since the laminating method used in the present invention includes material selection or temperature and pressure control, etc., which can be achieved by the prior art of the laminating method in the field of machinery, and the lamination method is not the focus of the present invention, it will not be described again. .

Referring to FIG. 9, when in the step 2, the at least one plastic encapsulation layer 30 is formed on the second side 12 of the sheet-like carrier layer 10 by an injecting molding method and combined to form a one-piece wafer. In the case of the substrate (40), the sheet-like carrier layer 10 having the plurality of wafer modules 20 is first positioned and embedded in an injection molding die 50, and is first positioned and embedded in the injection molding die as shown in FIG. In the lower mold 52 of the 50, a matching upper mold 51 is further covered to form a cavity 53 which is the same as the space occupied by the at least one plastic packaging layer 30 between the upper and

lower molds

51, 52, and The second surface 12 of the sheet-like carrier layer 10 faces the cavity 53; a material (30) for forming the plastic encapsulation layer 30 is used as an injection material to be injected from the injection port 54 of the injection molding die 50. The plastic pressure encapsulation layer 30 can be directly formed on the second surface 12 of the sheet-like carrier layer 10 by appropriate pressure injection into the cavity 53 and can be controlled by the temperature and pressure during injection molding. The second face 12 of the carrier layer 10 is integrated into one body. The injection molding method used in the present invention includes material selection or temperature and pressure control, or the like, or another spacer (not shown) is used to cover the respective crystal grains 22 on the second surface 12 to be capable of being formed after injection molding. Forming and having the accommodating effect of the

chambers

311 and 321 as shown in FIG. 8 can be achieved by using the prior art of the injection molding method in the mechanical field, and the injection molding method is not the focus of the present invention, so Let me repeat.

Referring again to FIGS. 10 and 11, FIG. 10 and FIG. 11 are respectively a perspective exploded and assembled schematic view of the embodiment in which the wafer card chip package 40 is embedded in a mating card body 60. As mentioned above, the size of the currently known SIM card is reduced from 15mm x 25mm for the Mini SIM card to 15mm x 12mm for the Micro SIM card, and further reduced to the SIM card (Nano SIM card) 8.8 mm x 12.3 mm, so in the embodiment shown in Figures 10, 11, the chip package 40 is made directly from the size specification of the Nano SIM card 8.8 mm x 12.3 mm, in the wafers of Figures 10, The package 40 is not only used as a wafer substrate but also as a Nano SIM card 90, but is not intended to limit the invention. In the present embodiment, the card body 60 for the carrier is formed by using the existing card body 300 of the existing card-core card 100 (as shown in FIG. 1 and FIG. 2), but is not intended to limit the present invention (ie, it may also be a The card body core card (described in the following), and the manufacturing end of the card body 60 (300) is formed on the card body 60 (300) for carrying by the pre-punched folding line 61 to form a Mini SIM card. Mini SIM card (also known as chip card body for Mini SIM card) 70 in size (15mm x 25mm). In this embodiment, a break line 72 can be further formed in the card range of the mini SIM card 70 to form a reduced first opening slot 71 and a micro SIM card conforming to the size of the micro SIM card (15 mm x 12 mm) (ie, The chip card body 80 of the micro SIM card enables the wafer card body (80) of the micro SIM card to be embedded in the first opening slot 71 with a certain degree of tightness; this embodiment is further on the micro SIM card 80. A break line 82 is further formed in the card range to form a second open slot 81 and a nano SIM card conforming to the size of the SIM card (8.8 mm x 12.3 mm) (that is, the chip card body of the Nano SIM card). 90 is shown in FIG. 10-11, so that the SIM card 90 can be embedded in the second opening slot 81 with a certain degree of tightness. In the embodiment shown in FIGS. 10 and 11, the chip package is 40 is directly made of the size of the Nano SIM card of 8.8 mm x 12.3 mm, so the chip package 40 is simultaneously made into a Nano SIM card 90, but is not intended to limit the present invention.

In addition, in the embodiment shown in FIGS. 10 and 11, the card body 60 (300) of the card-core mode has only one second opening slot 81 for embedding a chip package 40. The card body 60 (300) of the card one core mode can be selected by the manufacturing end to carry any one of three different SIM card types, such as a mini SIM card 70, a micro SIM card 80 or a SIM card 90, and also That is, when the manufacturing end of the card body 60 is in the card body 60 (300) of a card-core mode as shown in FIGS. 10 and 11, the above-mentioned mini SIM card 70 and micro SIM can be used according to actual needs. The card 80 or the SIM card 90 is selected and combined. For example, only a mini SIM card (card body) 70 and a second opening slot 81 are formed on the card body 60 (300) for embedding a mini. The chip package 40 used by the SIM card 70 (such as one of the mini SIM cards 70 in FIG. 14); or only formed on the card body 60 (300) A micro SIM card 80 and a second opening slot 81 are provided for embedding a chip package 40 (such as one of the micro SIM cards 80 in FIG. 15) for use with the micro SIM card 80; or in the card body 60 (300) Only one SIM card 90 and a second opening slot 81 are formed on the top for embedding a chip package 40 (such as one of the SIM cards 90 in FIG. 16) used in the SIM card 90, in this embodiment. The chip package 40 is a nano SIM card 90. In other words, regardless of the carrier card body 60 (300) being designated to carry one of the mini SIM card 70, the micro SIM card 80 and the SIM card 90 (40), the card body 60 for the carrier ( The manufacturing end of 300) can open a second open slot 81 of a common size in the card range of the SIM card (such as 70, 80) provided on the card body 60 (300) for mounting. The SIM card uses and can share the size of the chip package 40 (the SIM card 90 shown in FIGS. 10 and 11), and the manufacturing end of the wafer card (smart card) chip package 40 of the present invention can be mass-produced first. The chip package 40 of the wafer card (smart card) is formed so that the chip package 40 can be embedded as a wafer substrate for the SIM card (70, 80, 90) provided in the card body 60 (300). Within the open slot (81) of the card range, a use pattern of the SIM card (70, 80, 90) is thus formed. Therefore, the manufacturing end of the present invention can mass-produce the chip package 40 and the card body 60 for loading by separately manufacturing the two processes, which can not only avoid the limitation of the special machine necessary for the existing process technology, but also can reduce The material cost of the carrier layer is in line with the mass production requirements, so the economic benefit of the smart card process can be effectively improved, which is the advantage of the technology of the present invention.

In addition, as shown in FIGS. 10 and 11, the card body 60 for the carrier is only an embodiment of the card-core mode, but is not intended to limit the present invention, that is, the card body 60 (300) of the card-core can be based on the figure. The technical features shown in 10 and 11 are analogized to one card multi-core card body, respectively, as follows:

As shown in FIG. 12, it is a card two-core card body 60a carrying two SIM cards, wherein the two SIM cards can be one of a mini SIM card 70, a micro SIM card 80, and a SIM card 90. The number of SIM cards carried therein can be set according to the size of the SIM card.

As shown in FIG. 13, it is a card four-core card body 60b carrying four SIM cards, wherein the four SIM cards can be one of a mini SIM card 70, a micro SIM card 80, and a SIM card 90. The number of SIM cards carried therein can be set according to the size of the SIM card.

As shown in FIG. 14, it is a card four-core card body 60c carrying four SIM cards, wherein the four SIM cards can be one of a mini SIM card 70 and a SIM card 90, wherein the SIM carried therein The number of cards can be set according to the size of the SIM card.

As shown in FIG. 15, it is a card six-core card body 60d carrying six SIM cards, wherein the six SIM cards can be one of a micro SIM card 80 and a SIM card 90, wherein the SIM carried therein card's The number can be set according to the size of the SIM card.

As shown in FIG. 16, it is a card six-core card body 60e carrying nine SIM cards, wherein the nine SIM cards are SIM cards 90, wherein the number of SIM cards carried can depend on the size of the SIM card. And set.

The above description is intended to be illustrative, and not restrictive, and many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention. All will fall within the scope of protection of the present invention.

Claims

A method for molding a sheet-like package sheet for forming a chip package of a wafer card, comprising the steps of:

Step 1: using a sheet-like carrier layer to form a plurality of wafer modules forming spaced wafer cards, wherein a plurality of spaced-apart wafer circuit layer patterns are formed on the first surface of the sheet-like carrier layer. And assembling a die on the second surface opposite to the first surface of the first surface on each of the wafer circuit layer patterns on the first surface to pass through the chip carrier layer to communicate with the corresponding wafer circuit layer pattern, So that a plurality of wafer modules are formed, and each of the wafer modules includes a chip circuit layer pattern disposed on the first surface and a die disposed on the second surface and in pattern communication with the wafer circuit layer;

Step 2: forming at least one plastic encapsulation layer on the second surface of the sheet-like carrier layer, the at least one plastic encapsulation layer being integrated with the second surface of the sheet-like carrier layer and held in each smart card chip module The connection and function between the die and the corresponding chip circuit layer pattern are such that a sheet-like package board for molding having a plurality of spaced-apart wafer packages is fabricated.
The method for molding a sheet-like package sheet for forming a chip package of a wafer card according to claim 1, wherein after the step 2, the following steps are further included:

Step 3: performing singulation and dicing of the sheet-like package board for molding to form a plurality of smart card chip packages, wherein each smart card chip package is combined by a smart card chip module and at least one plastic package layer The integrally formed body.
The method for molding a sheet-like package sheet for forming a chip package of a wafer card according to claim 1, wherein in the step 2, the at least one plastic encapsulation layer is formed by a lamination method or an injection molding method. A method is formed on the second surface of the sheet-like carrier layer and joined to form an integrally molded body.
A method of molding a sheet-like package sheet for forming a chip package of a wafer card according to claim 3, wherein when the step 2 is a lamination method, it is on the sheet-like carrier layer Forming a double-sided adhesive layer, a first plastic layer and a second plastic layer one by one on the second surface, and then forming the at least one plastic packaging layer by lamination and the first layer of the sheet-like carrier layer The two sides are combined into one.
The method of forming a chip package board for forming a chip package of a wafer card according to claim 4, wherein a plurality of chambers are preset on the double-sided adhesive layer and the first plastic layer, wherein each The chambers respectively correspond to the respective crystal grains assembled on the second surface of the sheet-like carrier layer, so that the respective crystal grains can be accommodated in the respective chambers.
A molding sheet for molding a chip package of a wafer card according to claim 4 The method is characterized in that the material of the first plastic layer and the second plastic layer comprises PVC and ABS resin.
The method for molding a sheet-like package sheet for forming a chip package of a wafer card according to claim 3, wherein when the step 2 is an injection molding method, the sheet-like carrier layer is first Embedded in the injection molding die, and using a material for forming the plastic encapsulation layer as an injection material to directly form and mold the plastic encapsulation layer on the second surface of the sheet-like carrier layer by means of the injection molding die It is integrated with the second surface of the sheet-like carrier layer.
The method for molding a chip package board for forming a chip package of a wafer card according to claim 1 or 2, wherein the wafer module comprises a wafer module for use with a Mini SIM card, a Micro SIM card or a Nano SIM card. .
A method of molding a chip package board for forming a chip package of a wafer card according to claim 1 or 2, wherein the chip package comprises a wafer for use with a Mini SIM card, a Micro SIM card or a Nano SIM card Package.
The method for molding a chip package for forming a chip package of a wafer card according to claim 1 or 2, wherein the chip package has a thickness of 0.3 by a wafer module and at least one plastic package layer. ~0.85mm.
A sheet-like encapsulating sheet for forming a wafer package of a wafer card, which is produced by the molding method according to any one of claims 1 to 10, characterized in that the sheet-like encapsulating sheet comprises:

a sheet-like carrier layer having a plurality of spaced apart wafer modules thereon, wherein each of the smart card wafer modules further comprises: a wafer circuit layer pattern formed on the first side of the sheet-like carrier layer; and a die mounted on a second side opposite the first face and at a position corresponding to the pattern of the circuit layer of the wafer to pass through the chip carrier layer to be in conductive with the corresponding chip circuit layer pattern;

At least one plastic encapsulation layer formed on the second surface of the sheet-like carrier layer and integrated with the second surface of the sheet-like carrier layer, and maintaining the corresponding crystal grains in each smart card chip module The function of the chip circuit layer pattern.
A chip package for a wafer card, which is a chip wafer substrate formed by singulating and cutting a sheet-like package board according to claim 11, wherein the chip package comprises:

a wafer module comprising: a wafer circuit layer pattern formed on a first side of a sheet-like carrier layer; and a die mounted on a second side opposite the first surface and located in a corresponding wafer circuit At a relative position of the layer pattern, energy is supplied through the sheet-like carrier layer to be electrically connected to the corresponding chip circuit layer pattern;

At least one plastic encapsulation layer formed on the second side of the sheet-like carrier layer and with the sheet-shaped carrier The second side of the layer is integrated and maintains the communication and function between the die and the corresponding chip circuit layer pattern in each smart card chip module;

Wherein the chip package is formed by the at least one plastic encapsulation layer and bonded to the second surface of the sheet-like carrier layer, so that the chip package has sufficient mechanical strength to be tightly embedded in the chip package. An open slot formed in the mating wafer card body.
The chip package of claim 12, wherein the wafer module comprises a wafer module for use with a Mini SIM card, a Micro SIM card or a Nano SIM card.
The chip package of claim 12, wherein the chip package comprises a chip package for use with a Mini SIM card, a Micro SIM card, or a Nano SIM card.
A chip package according to claim 12, wherein the wafer card body is a card body having a size of one of a Mini SIM card, a Micro SIM card or a Nano SIM card.
The chip package of claim 15 wherein the wafer card body is disposed on a rectangular card body having a size of 85.6 mm x 53.98 mm.
The chip package of claim 12, wherein the chip package comprises a wafer module and at least one plastic encapsulation layer having a thickness of 0.3 to 0.85 mm.