WO2009110367A1 - 表示パネル、アレイ基板、カラーフィルタ基板、および表示パネルの製造方法 - Google Patents
表示パネル、アレイ基板、カラーフィルタ基板、および表示パネルの製造方法 Download PDFInfo
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- WO2009110367A1 WO2009110367A1 PCT/JP2009/053515 JP2009053515W WO2009110367A1 WO 2009110367 A1 WO2009110367 A1 WO 2009110367A1 JP 2009053515 W JP2009053515 W JP 2009053515W WO 2009110367 A1 WO2009110367 A1 WO 2009110367A1
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- display panel
- recess
- substrate
- spacer
- array substrate
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13392—Gaskets; Spacers; Sealing of cells spacers dispersed on the cell substrate, e.g. spherical particles, microfibres
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
Definitions
- the present invention relates to a display panel, an array substrate, a color filter substrate, and a method for manufacturing a display panel. More specifically, the present invention relates to a display panel provided with a spacer for defining a cell gap, and is suitably applied to this display panel. The present invention relates to an array substrate or a color filter substrate that can be formed, and a method of manufacturing a display panel having a spacer for defining a cell gap.
- a general liquid crystal display panel has a configuration in which a pair of substrates are arranged to face each other with a minute interval, and liquid crystal is filled between the pair of substrates. And it is necessary to maintain the space
- a configuration for maintaining the cell gap at a predetermined uniform dimension for example, a configuration in which a protruding structure is formed on at least one of a pair of substrates, or a pair of spherical spacer beads (hereinafter simply referred to as spacers).
- the structure interposed between the substrates is used.
- a method is used in which the spacer is arranged in an arbitrary pattern at an arbitrary position by discharging a spacer dispersion liquid in which the spacer is dispersed in the liquid onto the substrate by an inkjet method. (See JP 2005-321540 A, JP 2006-208728 A and JP 2006-227590 A).
- the configuration in which the spacers are arranged on the substrate by the conventional inkjet method has the following problems.
- the spacer dispersion liquid is discharged from a plurality of inkjet nozzles onto one substrate.
- the amount of spacers discharged from each of the inkjet nozzles varies due to manufacturing errors of each inkjet nozzle.
- the spacer is dropped from a predetermined location and does not contribute to the definition of the cell gap of the liquid crystal display panel. Will occur.
- the distribution density of the spacers that can contribute to the definition of the cell gap of the liquid crystal display panel is biased on the same substrate.
- Such a deviation causes a deviation in the size of the cell gap in a region where there are many spacers and a region where the spacers do not exist, so that the thickness of the liquid crystal layer of the liquid crystal display panel becomes non-uniform and so-called display unevenness occurs.
- a problem to be solved by the present invention is a display panel that prevents the occurrence of a so-called display unevenness defect by reducing the unevenness of the dispersion density of spacers that contributes to the definition of the cell gap and making the cell gap uniform.
- An object of the present invention is to provide an array substrate or a color filter substrate that can be suitably applied to a panel, and a method for manufacturing a display panel.
- a display panel according to the present invention has a recess formed on one of a pair of substrates facing each other with a predetermined cell gap, and on the other substrate.
- a gist is that a convex portion is formed at a position facing the concave portion, and a spacer is interposed between the bottom surface of the concave portion and the front end surface of the convex portion.
- the interval between the periphery of the recess and the periphery of the protrusion may be configured to be larger than the interval between the bottom surface of the recess and the tip surface of the protrusion.
- the recess is formed in at least one of a conductor film or an insulating film formed on the one substrate.
- the conductor film may be a gate signal line
- the insulating film may be a gate insulating film or a passivation film.
- the convex portion is formed of the same material as at least one of the alignment control protrusion, the light shielding film, and the colored layer.
- a protruding portion is formed so as to surround the concave portion.
- the projecting portion may be formed of the same material as that of the source signal line or the semiconductor layer.
- a plurality of the concave portions are formed at equal intervals, each having the same size, and a plurality of the convex portions are formed at equal intervals, each having the same size. Is preferred.
- an auxiliary recess having a depth larger than the recess by a predetermined amount is further formed, and on the other substrate, the protrusion is further formed at a position facing the auxiliary recess, It is preferable that the spacer is interposed between the bottom surface of the auxiliary concave portion and the front end surface of the convex portion.
- the gist of the array substrate according to the present invention is that a recess in which a spacer that defines a cell gap with the opposing substrate is disposed is formed.
- the recess is formed in at least one of a conductor film and an insulating film.
- the conductor film may be a gate signal line
- the insulating film may be a gate insulating film or a passivation film.
- a protruding portion is formed so as to surround the concave portion.
- the projecting portion may be formed of the same material as that of the source signal line or the semiconductor layer.
- a plurality of the concave portions are formed at equal intervals, and each of them is formed in the same size.
- the gist of the color filter substrate according to the present invention is that a convex portion that abuts against a spacer that defines a cell gap with the opposing substrate is formed.
- the convex portion may be formed of the same material as at least one of the alignment control protrusion, the light shielding film, and the coloring layer.
- a plurality of the convex portions are formed at equal intervals, and each is formed in the same size.
- the display panel manufacturing method is a method of manufacturing a display panel facing each other with a predetermined cell gap, and the spacer is in the liquid with respect to the recess formed on one substrate.
- a spacer discharge step for discharging the dispersed spacer dispersion liquid, a drying step for drying the discharged spacer dispersion liquid, and the other substrate on which the convex portion is formed at a position facing the concave portion is bonded to the one substrate.
- a substrate bonding step is a method of manufacturing a display panel facing each other with a predetermined cell gap, and the spacer is in the liquid with respect to the recess formed on one substrate.
- the liquid in which the spacer is dispersed is suitable if it has a property that the spacer dispersed in the liquid aggregates when dried.
- the number of the spacers included in the spacer dispersion liquid discharged to the recesses in the spacer discharging step is larger than the number of the spacers that can be arranged in the recesses.
- a protrusion is provided on the one substrate so as to surround the recess, and the spacer dispersion liquid may be discharged within a range surrounded by the protrusion in the spacer discharging step.
- the concave portion in which the spacer is arranged and the convex portion that contacts the spacer arranged in the concave portion are provided at the position facing the concave portion, the number of spacers that contribute to the definition of the cell gap of the display panel Variations, that is, uneven distribution density, can be reduced, and the cell gap can be made uniform. Thereby, problems such as display unevenness are prevented, and the image quality of the image displayed by the display panel is improved.
- the spacer overflowing from the recess should not contribute to the regulation of the cell gap. It becomes.
- the spacers arranged in the recesses contribute to the definition of the cell gap, it is possible to reduce the uneven distribution density of the spacers that contribute to the definition of the cell gap.
- the said recessed part can be formed in the conductor film etc. which are formed on a board
- a plurality of the concave portions and the convex portions are formed at equal intervals, and each has the same size, so that the other substrate is attached to one substrate constituting the display panel. In doing so, it is possible to prevent unevenness in stress between the substrates caused by pressing the other substrate.
- an auxiliary recess having a predetermined depth larger than the recess is provided on one substrate, and the protrusion is further formed on the other substrate at a position facing the auxiliary recess.
- the support interposed between the bottom surface of the auxiliary recess and the tip end surface of the auxiliary recess works only when a predetermined pressure is applied to the display panel from the outside. Since it works as a member, the mechanical strength of the display panel can be improved.
- the spacer since the spacer is disposed using the spacer dispersion liquid that has the property that the spacer dispersed in the liquid aggregates when dried, it is only necessary to discharge the spacer dispersion liquid toward the concave portion. Even if there is a part of the spacer landed outside the recess, the spacer is collected in the recess. That is, the spacer can be reliably arranged in the recess formed in the substrate.
- FIG. 2A and 2B are diagrams for explaining the configuration of the array substrate according to the first embodiment.
- FIG. 2A is a schematic configuration diagram of the entire array substrate
- FIG. 2B is an enlarged view of a picture element portion (FIG. 2).
- FIG. 3A shows a cross section of the TFT (cross section BB in FIG. 2B), and
- FIG. 3B shows a cross section taken along the center in the extending direction of the gate signal line (FIG. 2B
- FIG. 6 is a diagram schematically showing a (C-C cross section) in FIG. 4A is a schematic configuration diagram of the entire color filter substrate
- FIG. 4B is an enlarged view of a portion D in FIG. 4A.
- FIG. 5A is a cross section cut along a plane passing through the colored layer (the EE cross section in FIG. 4B), and
- FIG. 5B is a cross section cut along the light shielding film between the colored layers.
- FIG. 5 is a diagram schematically showing (cross section FF in FIG. 4B). It is the figure which showed typically the cross section (cross section of a recessed part and a convex part) which cut
- FIGS. 7A to 7F are cross-sectional views schematically showing a manufacturing process of an array substrate constituting a display panel, and FIGS. 7G to 7L are gates of the array substrate.
- FIGS. 8A to 8E are cross-sectional views schematically showing a manufacturing process of a color filter substrate.
- FIGS. 8A to 8E are cross sections cut along a plane passing through the colored layer, and FIGS. 8F to 8J are colored layers. It is the figure which showed typically the cross section cut
- FIG. 9A is a diagram schematically showing a cross-section of the display panel according to the second embodiment of the present invention.
- FIG. 9B is a pressure applied to the display panel from the outside. It is the figure which showed the case where it was done typically.
- FIG. 10A is a diagram schematically showing a cross section of the display panel according to the first modification, and FIG. 10B is a schematic cross section of the display panel according to the second modification.
- FIG. 1 is a perspective view schematically showing the appearance of the display panel 1 according to the first embodiment of the present invention.
- the display panel 1 includes an array substrate 10 (hereinafter sometimes referred to as the array substrate 10 according to the first embodiment) and a color filter substrate 30 (hereinafter referred to as the first embodiment). A color filter substrate 30 according to the embodiment). Then, liquid crystal is filled between these substrates facing each other with a predetermined cell gap.
- a source driver 95 that generates a source signal
- a gate driver 96 that generates a gate signal
- the configuration of the array substrate 10 and the color filter substrate 30 included in the display panel 1 will be described in detail.
- FIG. 2A and 2B are diagrams for explaining the configuration of the array substrate 10 according to the first embodiment.
- FIG. 2A is a schematic configuration diagram of the entire array substrate 10, and
- FIG. 2B is a picture element portion.
- 18 is an enlarged view (an enlarged view of a portion A in FIG. 2A).
- the array substrate 10 has an active region 12 and a panel frame region 13 formed on a glass substrate 90.
- a plurality of source signal lines 14 may be provided substantially in parallel with each other.
- a plurality of gate signal lines 16 may be provided substantially parallel to each other so as to be substantially orthogonal to the source signal lines 14.
- a region partitioned in a matrix by the source signal line 14 and the gate signal line 16 becomes a picture element portion 18.
- the source signal line 14 and the gate signal line 16 intersect at the intersection so that the source signal line 14 is on the upper side and the gate signal line 16 is on the lower side.
- a pixel electrode 181 transparent conductive film
- the storage capacitor wiring for forming the storage capacitor is omitted for the sake of simplicity.
- FIG. 3A is a view schematically showing a cross section of the TFT 20 (BB cross section in FIG. 2B).
- a gate electrode 22, a gate insulating film 23, a semiconductor layer 24 (first semiconductor layer 241 and second semiconductor layer 242), a source electrode 25, a drain electrode 26, and a passivation film 27 are stacked on a glass substrate 90. Is formed. Further, a contact hole 28 reaching the drain electrode 26 from the surface of the passivation film 27 is formed, and the pixel electrode 181 is electrically connected to the drain electrode 26 through the contact hole 28.
- the gate signal line 16 is formed with a recess 161a which becomes a recess 161 in which a spherical spacer 92 for defining a cell gap with the color filter substrate 30 is disposed.
- FIG. 3B is a diagram schematically showing a cross section (a CC cross section in FIG. 2B) cut at the center in the extending direction of the gate signal line 16.
- the depression 161 a formed in the gate signal line 16 is covered with the gate insulating film 23 and the passivation film 27 stacked on the gate signal line 16 to form the recess 161.
- the recess 161 has a cross-sectional shape cut along a plane parallel to the array substrate 10 so that it is symmetrical with respect to the center line in the extending direction of the gate signal line 16, and is equally spaced and the same size. Is formed.
- the size of the recess 161 is determined based on the size of a spherical spacer 92 (details will be described later) arranged in the recess 161.
- the cross section (width) of the recess 161 cut along a plane parallel to the array substrate 10 is large enough to allow a predetermined number of spherical spacers 92 to be disposed without substantial gaps (with each spherical spacer 92 being substantially in contact). Is formed.
- the depth of the concave portion 161 is smaller than the diameter of the spherical spacer 92, for example, and is formed such that the spherical spacer 92 once arranged does not easily roll out of the concave portion 161.
- the depression 161 a constituting the recess 161 is not necessarily formed in the gate signal line 16.
- a recess 161 a that becomes the recess 161 may be formed in the gate insulating film 23 or the passivation film 27 stacked on the gate signal line 16.
- the array substrate 10 is formed with a protruding portion 291 formed so as to surround the periphery of each recess 161.
- the height of the protruding portion 291 is not more than a height at which the tip of the protruding portion 291 is not in contact with the color filter substrate 30 when the array substrate 10 and the color filter substrate 30 are bonded to each other. It is formed at a height that is impossible (preferably, a diameter of the spherical spacer 92 or more).
- the projecting portion 291 is formed of the same material as the source signal line 14 (source electrode 25, drain electrode 26), but is not limited to this, for example, the semiconductor layer 24 (first semiconductor).
- the layer 241 and the second semiconductor layer 242) may be formed of the same material.
- a lead-out wiring and other predetermined wiring are provided.
- FIG. 4 and 5 are diagrams for explaining the configuration of the color filter substrate 30.
- FIG. 4A is a schematic configuration diagram of the entire color filter substrate 30, and FIG. 4B is an enlarged view of a portion D in FIG. 4A.
- FIG. 5 (a) is a diagram schematically showing a cross section cut along a plane passing through the colored layer 33 (the EE cross section in FIG. 4 (b)), and FIG. 5 (b) is a diagram illustrating the colored layer.
- FIG. 5 is a diagram schematically showing a cross section cut along the light shielding film 32 between 33 (FF cross section in FIG. 4B).
- the color filter substrate 30 has a light shielding film 32 formed on the surface of a transparent substrate 91 made of glass or the like, and red, green, and blue are placed inside each lattice of the light shielding film 32.
- a colored layer 33 is formed.
- lattice in which the colored layer 33 is formed is arranged in the predetermined order.
- a protective film 34 is formed on the surface of the light shielding film 32 and the colored layer 33 of each color, and a transparent electrode (common electrode) 35 for applying a voltage to the liquid crystal layer is formed on the surface of the protective film 34.
- An alignment control protrusion 36 is formed on the surface of the transparent electrode (common electrode) 35.
- the light shielding film 32 is for optically separating the colored layers 33 and is called a so-called black matrix.
- the light shielding film 32 is formed of, for example, a resin material containing a black colorant.
- the colored layer 33 is for giving a predetermined color characteristic to the transmitted light of each picture element, and is formed of colored sensitizing materials of red, green, and blue.
- the alignment control protrusion 36 controls the alignment of the liquid crystal molecules to be filled in order to improve the visual characteristics of the display panel 1 and increase the response speed of the liquid crystal molecules (so that the liquid crystal molecules have a so-called pretilt with respect to the substrate). belongs to.
- the alignment control protrusion 36 is formed of, for example, a resin material, and the shape thereof is not particularly limited in the present embodiment.
- a convex portion 361 is formed on the protective film 34 along the light shielding film 32.
- the convex portion 361 is positioned so as to face the concave portion 161 when the color filter substrate 30 and the array substrate 10 are bonded together.
- the size of the cross section of the convex portion 361 cut along a plane parallel to the substrate is substantially the same as the size of the concave portion 161 that is opposed to the convex portion 361, and the height thereof is a predetermined value corresponding to the cell gap of the display panel 1 or the like. It is formed at a height. This predetermined height will be described later.
- the convex portion 361 is formed of the same material as that of the alignment control protrusion 36, but is not limited thereto, and is formed of, for example, the same material as the light shielding film 32 and the colored layer 33. It may be.
- the display panel 1 includes the array substrate 10 and the color filter substrate 30 configured as described above.
- FIG. 6 shows a schematic diagram of a cross section (a cross section of the concave portion 161 and the convex portion 361) obtained by cutting the display panel 1 at the center in the extending direction of the gate signal line 16.
- a spherical spacer 92 is interposed between the array substrate 10 and the color filter substrate 30.
- the spherical spacer 92 is disposed in the concave portion 161 without a substantial gap (with each spherical spacer 92 being substantially in contact), and is in contact with a convex portion 361 formed at a position facing the concave portion 161. That is, the spherical spacer 92 is interposed between the bottom surface of the concave portion 161 formed on the array substrate 10 and the tip surface of the convex portion 361 formed on the color filter substrate 30.
- the cell gap of the display panel 1 is defined by the depth of the depression 161, the height of the projection 361, and the diameter of the spherical spacer 92. Therefore, by adjusting these values, a desired cell gap can be obtained. A display panel 1 is obtained.
- the recess 161 is recessed so that the interval between the periphery of the recess 161 and the periphery of the protrusion 361 is larger than the interval between the bottom surface of the recess 161 and the tip surface of the protrusion 361, that is, the diameter of the spherical spacer 92.
- the height of the convex portion 361, and the diameter of the spherical spacer 92 are set. Therefore, the spherical spacer 92 a that is not disposed in the recess 161 (overflowed from the recess 161) does not come into contact with both the array substrate 10 and the color filter substrate 30.
- the array substrate 10 is provided with the concave portion 161 in which the spherical spacer 92 is disposed, and the convex portion 361 in contact with the spacer disposed in the concave portion 161 is provided on the color filter substrate. Therefore, the variation in the number of the spherical spacers 92 that contribute to the definition of the cell gap, which occurs when the spherical spacers 92 are simply spread on the array substrate 10 or the color filter substrate 30, is reduced, and the cell gap is made uniform. can do.
- the gap between the periphery of the recess 161 and the periphery of the protrusion 361 is formed larger than the interval between the bottom surface of the recess 161 and the tip surface of the protrusion 361, the spherical spacer 92a overflowing from the recess 161 It will not contribute to the gap definition. That is, only the spherical spacers 92 arranged in the recesses 161 contribute to the definition of the cell gap, and the spherical spacers 92a scattered in other places do not contribute to the definition of the cell gap. The uneven distribution density of the spherical spacers 92 can be reduced.
- the projecting portion 291 is formed so as to surround the periphery of the recess 161, diffusion of the spacer leaking from the recess can be prevented. Therefore, a decrease in contrast and color tone of the display panel 1 due to the spherical spacer 92 moving to, for example, a picture element region is prevented.
- a plurality of the concave portions 161 and the convex portions 361 are formed at equal intervals on the array substrate 10 and the color filter substrate 30 constituting the display panel 1, and each of them is formed in the same size.
- the present embodiment includes an array substrate 10 manufacturing process, a color filter substrate 30 manufacturing process, and a panel (cell) manufacturing process. Each of these steps will be described in order.
- FIG. 7 is a cross-sectional view schematically showing the manufacturing process of the array substrate 10 constituting the display panel 1.
- 7A to 7F are diagrams schematically showing a cross section of the TFT 20, and
- FIGS. 7G to 7L are diagrams showing the array substrate 10 at the center in the extending direction of the gate signal line 16.
- FIG. It is the figure which showed the cut
- (a) and (g), (b) and (h), (c) and (i), (d) and (j), (e) and (k), (f) and ( l) shows the same process, respectively.
- the array substrate 10 according to the first embodiment is formed such that a predetermined conductor film, a semiconductor film, an insulating film, and the like are laminated in a predetermined order on one surface of the glass substrate 90.
- a gate signal line 16 As shown in FIGS. 7A and 7G, a gate signal line 16, an auxiliary capacitance line (not shown), and a gate electrode 22 are formed in the active region 12.
- a data lead-out wiring (not shown) is also formed in the panel frame region 13 together. Further, in this step, preliminary wiring (not shown) is formed.
- a single-layer or multilayer first conductor film made of chromium, tungsten, molybdenum, aluminum, or the like is formed on one surface of the glass substrate 90.
- Various known sputtering methods can be applied to the formation of the first conductor film.
- the thickness of the first conductor film is not particularly limited, for example, a film thickness of about 100 nm can be applied.
- the formed first conductor film is patterned into patterns of the gate signal line 16, the auxiliary capacitance line, the gate electrode 22, and the data lead-out wiring by a photolithography method or the like.
- Wet etching can be applied to the patterning of the first conductor film.
- the first conductor film is made of chromium
- wet etching using a (NH 4 ) 2 [Ce (NH 3 ) 6 ] + HNO 3 + H 2 O solution can be applied.
- the gate signal line 16 is patterned in a state in which a predetermined number of dents 161a to be the recesses 161 are formed at equal intervals along the extending direction.
- the shape of the recess 161a is as described above.
- a gate insulating film 23 is formed on the surface of the glass substrate 90 that has undergone the above-described steps.
- a material of the gate insulating film 23 for example, SiNx (silicon nitride) having a thickness of about 300 nm can be applied.
- the material of the gate insulating film 23 is formed by a method of depositing a predetermined thickness using a plasma CVD method.
- the gate insulating film 23 is formed, the gate signal line 16, the auxiliary capacitance line, and the gate electrode 22 are covered with the gate insulating film 23 as shown in FIGS.
- the gate insulating film 23 also covers the recess 161 a formed as the recess 161 formed in the gate signal line 16.
- the semiconductor composed of the first semiconductor layer 241 and the second semiconductor layer 242 is formed at a predetermined position on the surface of the gate insulating film 23 (specifically, a position overlapping with the gate electrode 22).
- Layer 24 is formed.
- amorphous silicon having a thickness of about 100 nm can be applied to the first semiconductor layer 241.
- n + -type amorphous silicon having a thickness of about 20 nm can be applied.
- the second semiconductor layer 242 is generally called an ohmic contact layer, and is used to improve the ohmic contact with the source electrode 25 and the drain electrode 26 formed in a later step.
- the first semiconductor layer 241 and the second semiconductor layer 242 can be formed by a plasma CVD method and a photolithography method, respectively. That is, first, the materials of the first semiconductor layer 241 and the second semiconductor layer 242 are deposited using plasma CVD. Then, the formed material of the first semiconductor layer 241 and the material of the second semiconductor layer 242 are patterned into a predetermined shape using a photolithography method or the like. For this patterning, for example, wet etching using HF + HNO 3 solution can be applied.
- the source signal line 14, the source electrode 25 and the drain electrode 26 constituting the TFT 20 are formed in the active region 12.
- a projecting portion 291 made of the same material as that of the source signal line 14 (source electrode 25, drain electrode 26) is provided so as to surround each recess 161a (recessed portion 161).
- the shape of the protruding portion 291 is as described above.
- a second conductor film is formed on the surface of the glass substrate 90 that has undergone the above steps.
- this second conductor film for example, a single-layer or multilayer conductor film made of titanium, aluminum, chromium, molybdenum, or the like can be applied.
- a plasma CVD method or the like can be applied as a method for forming the second conductor film.
- the second conductor film thus formed is patterned into a predetermined shape by a photolithography method or the like.
- the source signal line 14 and the source electrode 25 and the drain electrode 26 constituting the TFT 20 each having a predetermined shape made of the second conductor film are formed.
- the projecting portions 291 that surround the periphery of each recess 161 are simultaneously patterned to form a predetermined shape.
- the first semiconductor layer 241 and the second semiconductor layer 242 formed so as to overlap with the gate electrode 22 of the TFT 20 are etched by a predetermined depth.
- the TFT 20 that is an element including the gate electrode 22, the source electrode 25, and the drain electrode 26 is formed in the active region 12. Further, as shown in FIG. 7 (j), the gate signal line 16 is formed with a recess 161a that becomes the recess 161 in which the spherical spacer 92 is disposed, and the recess 161a (the recess 161) is formed on the gate signal line 16. ) Around the projection 291 is formed.
- a passivation film 27 is formed. Specifically, a passivation film 27 is formed on the surface of the glass substrate 90 that has undergone the above-described steps, and the formed passivation film 27 is patterned. Thereby, the passivation film 27 having a predetermined shape is obtained. For example, silicon nitride (SiNx) having a thickness of about 400 nm can be applied to the passivation film 27. As a method for forming the passivation film 27, a plasma CVD method can be applied, and as a patterning method, for example, dry etching using SF 6 + O 2 can be applied. A recess 161 a formed in the gate signal line 16 is covered with the gate insulating film 23 and the passivation film 27 to form a recess 161. The shape of the recess 161 is as described above.
- a contact hole 28 for electrically connecting the drain electrode 26 and the pixel electrode 181 is formed in the TFT 20 as shown in FIG.
- a pixel electrode 181 controlled by the TFT 20 is formed.
- ITO Indium Tin Oxide
- a thickness of about 150 nm can be applied.
- the pixel electrode 181 is formed by patterning the ITO film into a predetermined shape.
- wet etching using an HCl + HNO 3 + H 2 O solution can be applied.
- a pixel electrode 181 having a predetermined shape is formed in the active region 12 as shown in FIG.
- Each pixel electrode 181 is electrically connected to the drain wiring through a contact hole 28 formed in the passivation film 27.
- the array substrate 10 constituting the display panel 1 according to the embodiment of the present invention is obtained.
- the depression 161 a that becomes the recess 161 in which the spherical spacer 92 is disposed is simultaneously formed in the formation process of the gate signal line 16. Therefore, a new process for forming the recess 161 is not required. Further, when the gate signal line 16 is patterned by, for example, photolithography, the photomask may be changed according to the shape of the recess 161 and the number of necessary photomasks is not increased.
- the recess 161 a that becomes the recess 161 is not necessarily formed in the gate signal line 16, and may be formed in the gate insulating film 23 or the passivation film 27. Even in this case, since the depression 161a can be formed at the same time in the process of forming the gate insulating film 23 and the passivation film 27, a new process for forming the recess 161 is not required.
- the protruding portion 291 provided so as to surround the concave portion 161 is formed of the same material as that of the source signal line 14 (the source electrode 25 and the drain electrode 26). Therefore, the protruding portion 291 can be formed in the same process as the source signal line 14 (the source electrode 25 and the drain electrode 26), and a process for forming the protruding portion 291 is newly required. Absent. For example, when patterning is performed by a photolithography method, the photomask may be changed according to the shape of the protruding portion 291 and the number of necessary photomasks is not increased.
- the protruding portion 291 is not necessarily formed of the same material as the source signal line 14 (the source electrode 25 and the drain electrode 26).
- the semiconductor layer 24 (the first semiconductor layer 241) is used.
- the second semiconductor layer 242) may be formed of the same material. In this case, if the projecting portion 291 is formed in the same process as the process of forming the semiconductor layer 24, it is not necessary to newly increase the number of processes.
- FIG. 8 is a cross-sectional view schematically showing the manufacturing process of the color filter substrate 30.
- FIGS. 8A to 8E are diagrams schematically showing cross sections cut along a plane passing through the colored layer 33
- FIGS. 8F to 8 J are diagrams between the colored layers 33. It is the figure which showed typically the cross section cut along the light-shielding film.
- (a) and (f), (b) and (g), (c) and (h), (d) and (i), and (e) and (j) are the same steps. Show.
- the color filter manufacturing process includes a light shielding film (black matrix) forming process, a colored layer forming process, a protective film forming process, a transparent electrode (common electrode) forming process, and an alignment control protrusion forming process.
- the contents of the light shielding film forming step are as follows for the resin BM method, for example.
- a BM resist (referred to as a photosensitive resin composition containing a black colorant) or the like is applied to the surface of the transparent substrate 91.
- the applied BM resist is formed into a predetermined pattern using a photolithography method or the like. Thereby, the light shielding film 32 having a predetermined pattern is obtained.
- the color sensitive material method is as follows. First, a colored photosensitive material (referred to as a solution in which a pigment of a predetermined color is dispersed in a photosensitive material) is applied to the surface of the transparent substrate 91 on which the light shielding film 32 is formed. Next, the applied colored light-sensitive material is formed into a predetermined pattern using a photolithography method or the like. Such a process is performed for each color of red, green, and blue. Thereby, the colored layer 33 of each color is obtained.
- a colored photosensitive material referred to as a solution in which a pigment of a predetermined color is dispersed in a photosensitive material
- the method used in the light shielding film forming step is not limited to the resin BM method, and various known methods such as a chromium BM method and an overlay method can be applied.
- the method used in the colored layer forming step is not limited to the color sensitive material method, and various known methods such as a printing method, a dyeing method, an electrodeposition method, a transfer method, and an etching method can be applied. Further, a back exposure method in which the colored layer 33 is formed first and the light shielding film 32 is formed thereafter may be used.
- a protective film 34 is formed on the surface of the light shielding film 32 and the colored layer 33 in the protective film forming step.
- the protective film 34 having a predetermined pattern is formed using a method (overall coating method) in which a protective film material is applied to the surface of the transparent substrate 91 that has undergone the above-described steps using a spin coater, or a printing or photolithography method.
- a method (patterning method) or the like can be applied.
- the protective film material for example, an acrylic resin or an epoxy resin can be applied.
- a transparent electrode (common electrode) 35 is formed on the surface of the protective film 34.
- a transparent electrode (common electrode) 35 is formed by depositing ITO (IndiumInTin Oxide) or the like by sputtering or the like.
- the alignment control protrusion 36 is formed.
- the alignment control protrusion 36 is formed using, for example, a photolithography method. A photosensitive material is applied to the surface of the transparent substrate 91 that has undergone the above-described process, and the applied photosensitive material is exposed to a predetermined pattern through a photomask. Then, unnecessary portions are removed in the subsequent development process, so that a photosensitive material having a predetermined pattern remains. That is, the alignment control protrusion 36 having a predetermined pattern is formed.
- the convex portion 361 is formed together with the orientation control projection 36. That is, the convex portion 361 is made of a photosensitive material constituting the alignment control protrusion 36, and is patterned simultaneously with the alignment control protrusion 36 by a photomask in which the pattern of the alignment control protrusion 36 and the convex portion 361 is formed.
- the convex portion 361 is formed at a position facing the concave portion 161 formed in the array substrate 10 when the color filter substrate 30 is bonded to the array substrate 10 in a panel (cell) manufacturing process described later. Moreover, the shape of this convex part 361 is as above-mentioned.
- the color filter substrate 30 is manufactured through these steps.
- the convex portion 361 that contacts the spherical spacer 92 is simultaneously formed in the process of forming the alignment control protrusion 36. Therefore, a new process for forming the convex portion 361 is not required.
- the photomask may be changed according to the shape of the convex portion 361 and the number of necessary photomasks does not increase.
- the convex portion 361 is not necessarily formed of the same material as the alignment control protrusion 36, and may be formed of the same material as the light shielding film 32 and the colored layer 33, for example. . In this case, if the projection 361 is formed in the same process as the process of forming the light shielding film 32 and the colored layer 33, it is not necessary to newly increase the number of processes.
- alignment films are formed on the surfaces of the array substrate 10 and the color filter substrate 30 obtained through the above-described steps as follows.
- an alignment material is applied to the respective surfaces of the array substrate 10 and the color filter substrate 30 using an alignment material application device or the like.
- the alignment material refers to a solution containing a material that is a raw material for the alignment film.
- a conventional general method such as a pressure printing device or an ink jet printing device can be applied.
- the applied alignment material is heated and baked using an alignment film baking apparatus or the like.
- alignment treatment is performed on the baked alignment film.
- this alignment treatment there is a method of scratching the surface of the alignment film using a rubbing roll or the like, or a photo-alignment treatment that adjusts the surface properties of the alignment film by irradiating the alignment film surface with light energy such as ultraviolet rays.
- Various known processing methods can be applied.
- a seal material is applied to one surface of the array substrate 10 and the color filter substrate 30 by using a seal patterning device or the like.
- spherical spacers 92 for keeping the cell gap uniform at a predetermined value are dispersed on the surface of the array substrate 10. Specifically, it is as follows.
- spacer spraying is performed using an ink jet type spacer spraying device. That is, a spacer dispersion liquid in which spherical spacers 92 are dispersed in a predetermined liquid is dispersed (discharged) on the array substrate 10 by an ink jet method.
- the spacer-dispersed liquid is a liquid that has a property that the spherical spacers 92 dispersed in the liquid aggregate when the discharged droplets are dried.
- Examples of the spacer dispersion having such properties include L265EX0034KRC (L265: model of liquid (solvent), EX0034KRC: model of spherical spacer) manufactured by Sekisui Chemical Co., Ltd.
- the spacer dispersion liquid is discharged by an ink jet method toward each recess 161 formed in advance on the array substrate 10 (spacer discharge step). And the liquid is removed by drying the spacer dispersion liquid discharged by each recessed part 161 (drying process).
- a liquid having a property that the dispersed spherical spacers 92 aggregate when dried is used as the liquid to be dispersed in the spacer.
- the number of spherical spacers 92 included is equal to or greater than the number of spherical spacers 92 that can be disposed in each recess 161, even if there is a spherical spacer 92 whose landing point deviates from the recess 161, the recess The spherical spacer 92 can be reliably arranged in the 161 without any shortage.
- the concave portions 161 are formed in the same size, the number of spherical spacers 92 disposed in the concave portions 161 can be made the same.
- a protruding portion 291 is formed so as to surround them. Therefore, as long as the spacer dispersion liquid is discharged into the protruding portion 291, the spherical spacer 92 can be reliably disposed in the recess 161 due to the cohesiveness of the liquid. Further, the protruding portion 291 can prevent the spherical spacer 92 overflowing from the concave portion 161 from freely diffusing, and the contrast of the display panel 1 due to the movement of the spherical spacer 92 to, for example, a picture element region. And deterioration of color tone are prevented.
- the array substrate 10 and the color filter substrate 30 are bonded together under a reduced pressure atmosphere (substrate bonding step), and liquid crystal is filled between them.
- substrate bonding step a method may be used in which liquid crystal is injected between the array substrate 10 and the color filter substrate 30 after the sealing material is solidified.
- the display panel 1 according to the embodiment of the present invention is obtained through the final lighting inspection.
- Fig.9 (a) is the figure which showed typically the cross section of the display panel 2 which concerns on 2nd embodiment of this invention.
- the same components as those of the display panel 1 according to the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
- the display panel 2 includes an array substrate 102 (hereinafter also referred to as the array substrate 102 according to the second embodiment) and a color filter substrate 302 (hereinafter also referred to as the color filter substrate 302 according to the second embodiment).
- the liquid crystal is filled between these substrates facing each other with a predetermined cell gap.
- the array substrate 102 As shown in FIG. 9A, the array substrate 102 according to the second embodiment has a recess 161a (hereinafter referred to as a first recess 161a) that becomes the recess 161 formed in the gate signal line 16. 2), a second recess 162a to be the auxiliary recess 162 is formed. That is, in the array substrate 10, the concave portions 161 and the auxiliary concave portions 162 are alternately formed along the gate signal lines 16.
- the size of the cross-section of the auxiliary recess 162 cut along a plane parallel to the array substrate 10 is such that a predetermined number of spherical spacers 92 are arranged substantially without gaps (with each spherical spacer 92 being substantially in contact), like the recess 161. It is formed in a size that can be.
- the depth of the recess of the auxiliary recess 162 is larger than that of the recess 161.
- the depth of the first depression 161a and the second depression 162a formed in the gate signal line 16 is the same. That is, the first recess 161a is covered with the gate insulating film 23 and the passivation film 27 to form the recess 161, whereas the second recess 162a serving as the auxiliary recess 162 is formed by removing the passivation film 27. Only the gate insulating film 23 is covered. That is, the depth of the depression is configured to be larger in the auxiliary recess 162 than in the recess 161 by the thickness of the passivation film 27.
- the second recess 162a formed in the gate signal line 16 may be configured to be covered only by the passivation film 27 so that the auxiliary recess 162 is deepened by the thickness of the gate insulating film 23. .
- the gate insulating film 23 and the passivation film 27 are not partially removed, and the first recess 161a and the second recess 162a formed in the gate signal line 16 are provided with a difference in depth. It is good also as a difference of the depth of the auxiliary
- a configuration may be employed in which the second depression 162 a serving as the auxiliary recess 162 is formed in the gate insulating film 23 and the passivation film 27 instead of the gate signal line 16.
- the auxiliary recess 162 formed in any one of the gate signal line 16, the gate insulating film 23, and the passivation film 27 may be configured so that the depth of the recess is larger than that of the recess 161.
- the method for forming the second recess 162a to be the auxiliary recess 162 in the present embodiment is the same as the method for forming the first recess 161a to be the recess 161 described in the first embodiment.
- the removal of the passivation film 27 stacked on the bottom surface of the second depression 162a may be performed in the same process as the patterning process (contact hole 28 forming process) of the passivation film 27 so as not to increase the manufacturing process. .
- the color filter substrate 30 according to the second embodiment has a convex portion 361 formed on the protective film 34.
- the shape of the convex portion 361 is the same as that described in the first embodiment.
- the convex portion 361 is formed at a position facing the concave portion 161 and also at a position facing the auxiliary concave portion 162 when the color filter substrate 30 and the array substrate 10 are bonded together.
- the method of forming the convex portion 361 formed at a position facing the auxiliary concave portion 162 is the same as the method of forming the concave portion 161 described in the first embodiment.
- the spherical spacer 92 for defining the cell gap is not only interposed between the concave portion 161 and the convex portion 361, but also interposed between the auxiliary concave portion 162 and the convex portion 361 formed to face the auxiliary concave portion 162.
- the spherical spacer disposed in the auxiliary recess 162 is indicated by reference numeral 92b.
- an ink jet method can be suitably applied as in the arrangement (dispersion) method in the recesses 161.
- the spherical spacer 92b disposed in the auxiliary recess 162 is formed such that the recess of the auxiliary recess 162 is formed deeper than the recess 161, so that at least one of the tip surface of the protrusion 361 or the bottom surface of the auxiliary recess 162, A predetermined gap (in the present embodiment, the thickness of the passivation film 27) is spaced apart. That is, the spherical spacer 92b does not contribute to the definition of the cell gap of the display panel 2 in a normal state. However, as shown in FIG.
- the spherical spacer 92b arranged in the auxiliary recess 162 functions as an auxiliary support member that works only when an external force is applied to the display panel 2, and thus the display panel The mechanical strength of 2 can be improved.
- auxiliary recesses 162 are merely examples. Since the auxiliary recesses 162 are provided to supplementarily improve the mechanical strength of the display panel, the number and size thereof may be increased or decreased as necessary. Further, if the protruding portion 291 is formed so as to surround the auxiliary concave portion 162, diffusion of the spherical spacer 92 overflowing from the auxiliary concave portion 162 can be prevented.
- the concave portion 161 is formed on the array substrate 10 and the convex portion 361 is formed on the color filter substrate 30, but the concave portion 161 is on the color filter substrate 30 and the convex portion 361 is on the array substrate 10.
- a part of the light shielding film 32 of the color filter substrate 30 is peeled to form a recess 161, and the source signal line 14 (semiconductor layer 24) and passivation are formed.
- the convex part 361 may be comprised by the film
- the light shielding film 32 when a part of the light shielding film 32 is peeled to reduce the light shielding property and the contrast of the display panel is lowered, the light shielding film 32 is completely removed as shown in FIG. What is necessary is just to pattern in the state which did not peel but left in the thickness direction (it should just pattern using what is called halftone exposure). Thereby, the recessed part 161 can be formed in the light shielding film 32, maintaining the light shielding property by the light shielding film 32 (2nd modification).
- the spacer for defining the cell gap is not necessarily limited to a spherical one.
- each process which comprises the manufacturing process of the said display panel can be suitably changed within the range which does not deviate from the technical idea of this invention.
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Abstract
Description
Claims (24)
- 所定のセルギャップをおいて対向する一対の基板のうち、いずれか一方の基板上には、凹部が形成され、他方の基板上には、前記凹部に対向する位置に凸部が形成され、前記凹部の底面と前記凸部の先端面との間にスペーサが介在されていることを特徴とする表示パネル。
- 前記凹部の周辺と前記凸部の周辺との間隔は、前記凹部の底面と前記凸部の先端面の間隔より大きいことを特徴とする請求項1に記載の表示パネル。
- 前記凹部は、前記一方の基板上に形成された導体膜または絶縁膜の少なくともいずれかに形成されていることを特徴とする請求項1または2に記載の表示パネル。
- 前記導体膜は、ゲート信号線であることを特徴とする請求項3に記載の表示パネル。
- 前記絶縁膜は、ゲート絶縁膜またはパッシベーション膜であることを特徴とする請求項3または4に記載の表示パネル。
- 前記凸部は、配向制御用突起、遮光膜、および着色層の少なくともいずれかと同一材料で形成されていることを特徴とする請求項1から5のいずれかに記載の表示パネル。
- 前記凹部を取り囲むように突状部が形成されていることを特徴とする請求項1から6のいずれかに記載の表示パネル。
- 前記突状部は、ソース信号線または半導体層を形成する材料と同一材料で形成されていることを特徴とする請求項7に記載の表示パネル。
- 前記凹部は、等間隔に複数形成され、それぞれが同一の大きさに形成されていると共に、前記凸部は、等間隔に複数形成され、それぞれが同一の大きさに形成されていることを特徴とする請求項1から8のいずれかに記載の表示パネル。
- 前記一方の基板上には、前記凹部より深さが所定量大きい補助凹部がさらに形成され、前記他方の基板上には、該補助凹部と対向する位置にさらに前記凸部が形成され、前記補助凹部の底面と前記凸部の先端面との間に前記スペーサが介在されていることを特徴とする請求項1から9のいずれかに記載の表示パネル。
- 対向する基板とのセルギャップを規定するスペーサが配置される凹部が形成されていることを特徴とするアレイ基板。
- 前記凹部は、導体膜または絶縁膜の少なくともいずれかに形成されていることを特徴とする請求項11に記載のアレイ基板。
- 前記導体膜は、ゲート信号線であることを特徴とする請求項12に記載のアレイ基板。
- 前記絶縁膜は、ゲート絶縁膜またはパッシベーション膜であることを特徴とする請求項12または13に記載のアレイ基板。
- 前記凹部を取り囲むように突状部が形成されていることを特徴とする請求項11から14のいずれかに記載のアレイ基板。
- 前記突状部は、ソース信号線または半導体層を形成する材料と同一材料で形成されていることを特徴とする請求項15に記載のアレイ基板。
- 前記凹部は、等間隔に複数形成され、それぞれが同一の大きさに形成されていることを特徴とする請求項11から16のいずれかに記載のアレイ基板。
- 対向する基板とのセルギャップを規定するスペーサと当接する凸部が形成されていることを特徴とするカラーフィルタ基板。
- 前記凸部は、配向制御用突起、遮光膜、および着色層の少なくともいずれかと同一材料で形成されていることを特徴とする請求項18に記載のカラーフィルタ基板。
- 前記凸部は、等間隔に複数形成され、それぞれが同一の大きさに形成されていることを特徴とする請求項18または19に記載のカラーフィルタ基板。
- 所定のセルギャップをおいて対向してなる表示パネルの製造方法であって、一方の基板上に形成された凹部に対してスペーサが液体中に分散されたスペーサ分散液を吐出するスペーサ吐出工程と、吐出したスペーサ分散液を乾燥する乾燥工程と、該凹部に対向する位置に凸部が形成された他方の基板を前記一方の基板に張り合わせる基板貼合工程と、を有することを特徴とする表示パネルの製造方法。
- 前記スペーサを分散させた液体は、乾燥すると液体中に分散させた前記スペーサが凝集する性質を有するものであることを特徴とする請求項21に記載の表示パネルの製造方法。
- 前記スペーサ吐出工程において前記凹部に対して吐出するスペーサ分散液に含まれる前記スペーサの数を、前記凹部に配置することができる前記スペーサの数より多くなるようにすることを特徴とする請求項21または22に記載の表示パネルの製造方法。
- 前記一方の基板上には、前記凹部を取り囲むように突状部が設けられており、前記スペーサ吐出工程において該突状部に囲まれた範囲内に前記スペーサ分散液を吐出することを特徴とする請求項23に記載の表示パネルの製造方法。
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CN200980107753XA CN101960369B (zh) | 2008-03-04 | 2009-02-26 | 显示面板、阵列基板、滤色器基板以及显示面板的制造方法 |
US12/921,041 US20110001915A1 (en) | 2008-03-04 | 2009-02-26 | Display panel, array substrate, color filter substrate, and method for producing display panel |
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CN109782493A (zh) * | 2018-01-29 | 2019-05-21 | 友达光电(昆山)有限公司 | 一种显示面板 |
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JP4757628B2 (ja) * | 2005-12-27 | 2011-08-24 | Nec液晶テクノロジー株式会社 | 液晶パネル及びその製造方法 |
JP2012252182A (ja) * | 2011-06-03 | 2012-12-20 | Nippon Steel & Sumikin Chemical Co Ltd | カラーフィルターの製造方法、カラーフィルター、及び反射型表示装置 |
TWI471663B (zh) * | 2012-10-15 | 2015-02-01 | Au Optronics Corp | 顯示面板 |
CN103728788A (zh) * | 2013-12-27 | 2014-04-16 | 深圳市华星光电技术有限公司 | 显示面板及显示装置 |
GB2544727A (en) * | 2015-11-16 | 2017-05-31 | Optonor As | Optical interferometry |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07191332A (ja) * | 1993-12-27 | 1995-07-28 | Toshiba Corp | アクティブマトリクス型液晶表示装置 |
JP2001109000A (ja) * | 1999-10-05 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 反射型液晶表示素子およびそれを用いた画像表示装置 |
JP2007140203A (ja) * | 2005-11-18 | 2007-06-07 | Sharp Corp | 液晶表示装置 |
JP2007178652A (ja) * | 2005-12-27 | 2007-07-12 | Nec Lcd Technologies Ltd | 液晶パネル及びその製造方法 |
JP2008015346A (ja) * | 2006-07-07 | 2008-01-24 | Sekisui Chem Co Ltd | スペーサ粒子分散液、液晶表示装置の製造方法及び液晶表示装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3768367B2 (ja) * | 1998-10-14 | 2006-04-19 | シャープ株式会社 | 液晶表示装置 |
CN101103306A (zh) * | 2004-12-27 | 2008-01-09 | 积水化学工业株式会社 | 液晶显示装置的制造方法、间隔粒子分散液及液晶显示装置 |
JP4761782B2 (ja) * | 2005-01-27 | 2011-08-31 | 東芝モバイルディスプレイ株式会社 | 液晶表示装置及びその製造方法 |
TWI319099B (en) * | 2005-06-10 | 2010-01-01 | Au Optronics Corp | Liquid crystal display device and method for fabricating the same |
-
2009
- 2009-02-26 CN CN200980107753XA patent/CN101960369B/zh not_active Expired - Fee Related
- 2009-02-26 US US12/921,041 patent/US20110001915A1/en not_active Abandoned
- 2009-02-26 WO PCT/JP2009/053515 patent/WO2009110367A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07191332A (ja) * | 1993-12-27 | 1995-07-28 | Toshiba Corp | アクティブマトリクス型液晶表示装置 |
JP2001109000A (ja) * | 1999-10-05 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 反射型液晶表示素子およびそれを用いた画像表示装置 |
JP2007140203A (ja) * | 2005-11-18 | 2007-06-07 | Sharp Corp | 液晶表示装置 |
JP2007178652A (ja) * | 2005-12-27 | 2007-07-12 | Nec Lcd Technologies Ltd | 液晶パネル及びその製造方法 |
JP2008015346A (ja) * | 2006-07-07 | 2008-01-24 | Sekisui Chem Co Ltd | スペーサ粒子分散液、液晶表示装置の製造方法及び液晶表示装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109782493A (zh) * | 2018-01-29 | 2019-05-21 | 友达光电(昆山)有限公司 | 一种显示面板 |
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US20110001915A1 (en) | 2011-01-06 |
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CN101960369A (zh) | 2011-01-26 |
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