WO2009099277A3 - 고성능 낸드 플래시 메모리 셀 스트링 및 셀 소자 및 스위칭 소자 - Google Patents
고성능 낸드 플래시 메모리 셀 스트링 및 셀 소자 및 스위칭 소자 Download PDFInfo
- Publication number
- WO2009099277A3 WO2009099277A3 PCT/KR2009/000327 KR2009000327W WO2009099277A3 WO 2009099277 A3 WO2009099277 A3 WO 2009099277A3 KR 2009000327 W KR2009000327 W KR 2009000327W WO 2009099277 A3 WO2009099277 A3 WO 2009099277A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flash memory
- cell
- memory cell
- cell string
- charge storage
- Prior art date
Links
- 238000009413 insulation Methods 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000007423 decrease Effects 0.000 abstract 1
- 230000005684 electric field Effects 0.000 abstract 1
- 230000005641 tunneling Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Abstract
본 발명은 평탄 채널 플래시 메모리 셀 스트링, 셀 소자 및 스위칭 소자에 관한 것이다. 상기 플래시 메모리 셀 스트링은 다수 개의 셀 소자 및 상기 셀 소자의 끝단에 연결되는 스위칭 소자를 구비한다. 상기 셀 소자는 반도체 기판, 반도체 기판에 순차적으로 적층되는 투과 절연막, 전하 저장 노드, 컨트롤 절연막 및 제어 전극을 구비한다. 상기 전하저장노드는 도전성 물질로 이루어지며 "I"형 또는 "T"형의 구조로 형성된다. 전술한 구조를 갖는 전하저장노드는 상기 제어전극과의 커플링 비를 증가시키고 셀 사이의 cross-talk을 줄이게 된다. 본 발명에 의하여 NAND 플래시 메모리의 셀 소자의 축소화 특성과 성능을 개선하고, 필요시 제어 전극 및 전하 저장 노드로부터의 fringing 전계를 통해 채널의 반전층을 유기해서 셀과 셀 사이 또는 셀 string이 전기적으로 연결되도록 한다.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0011345 | 2008-02-04 | ||
KR1020080011345A KR100941619B1 (ko) | 2008-02-04 | 2008-02-04 | 고성능 낸드 플래시 메모리 셀 스트링 및 셀 소자 및스위칭 소자 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009099277A2 WO2009099277A2 (ko) | 2009-08-13 |
WO2009099277A3 true WO2009099277A3 (ko) | 2009-10-22 |
Family
ID=40952549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/000327 WO2009099277A2 (ko) | 2008-02-04 | 2009-01-22 | 고성능 낸드 플래시 메모리 셀 스트링 및 셀 소자 및 스위칭 소자 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100941619B1 (ko) |
WO (1) | WO2009099277A2 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9293502B2 (en) * | 2013-07-26 | 2016-03-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor switching device separated by device isolation |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5814854A (en) * | 1996-09-09 | 1998-09-29 | Liu; David K. Y. | Highly scalable FLASH EEPROM cell |
KR20040055172A (ko) * | 2002-12-20 | 2004-06-26 | 삼성전자주식회사 | 플로팅 게이트를 갖는 비휘발성 기억 셀 및 그 형성방법 |
US20050145923A1 (en) * | 2004-01-06 | 2005-07-07 | Chiou-Feng Chen | NAND flash memory with enhanced program and erase performance, and fabrication process |
KR20060035551A (ko) * | 2004-10-21 | 2006-04-26 | 삼성전자주식회사 | 비휘발성 메모리 소자 및 그 제조 방법 |
KR20080009321A (ko) * | 2005-06-08 | 2008-01-28 | 마이크론 테크놀로지, 인크. | 확산 접합이 없는 비휘발성 메모리 셀 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100914684B1 (ko) * | 2007-12-07 | 2009-08-28 | 경북대학교 산학협력단 | 플래시 메모리 셀 스트링, 셀 소자, 및 그 제조 방법 |
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2008
- 2008-02-04 KR KR1020080011345A patent/KR100941619B1/ko active IP Right Grant
-
2009
- 2009-01-22 WO PCT/KR2009/000327 patent/WO2009099277A2/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5814854A (en) * | 1996-09-09 | 1998-09-29 | Liu; David K. Y. | Highly scalable FLASH EEPROM cell |
KR20040055172A (ko) * | 2002-12-20 | 2004-06-26 | 삼성전자주식회사 | 플로팅 게이트를 갖는 비휘발성 기억 셀 및 그 형성방법 |
US20050145923A1 (en) * | 2004-01-06 | 2005-07-07 | Chiou-Feng Chen | NAND flash memory with enhanced program and erase performance, and fabrication process |
KR20060035551A (ko) * | 2004-10-21 | 2006-04-26 | 삼성전자주식회사 | 비휘발성 메모리 소자 및 그 제조 방법 |
KR20080009321A (ko) * | 2005-06-08 | 2008-01-28 | 마이크론 테크놀로지, 인크. | 확산 접합이 없는 비휘발성 메모리 셀 |
Also Published As
Publication number | Publication date |
---|---|
KR20090085446A (ko) | 2009-08-07 |
WO2009099277A2 (ko) | 2009-08-13 |
KR100941619B1 (ko) | 2010-02-11 |
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