WO2009084489A1 - Appareil et procédé de travail au laser - Google Patents

Appareil et procédé de travail au laser Download PDF

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Publication number
WO2009084489A1
WO2009084489A1 PCT/JP2008/073250 JP2008073250W WO2009084489A1 WO 2009084489 A1 WO2009084489 A1 WO 2009084489A1 JP 2008073250 W JP2008073250 W JP 2008073250W WO 2009084489 A1 WO2009084489 A1 WO 2009084489A1
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WO
WIPO (PCT)
Prior art keywords
substrate
crack
hook mechanism
dividing
convex portion
Prior art date
Application number
PCT/JP2008/073250
Other languages
English (en)
Japanese (ja)
Inventor
Atsushi Imura
Akira Ejimatani
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Publication of WO2009084489A1 publication Critical patent/WO2009084489A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups

Definitions

  • the present invention relates to a laser processing apparatus that heats a brittle material substrate by scanning a laser beam and then cools it to divide the substrate.
  • the “brittle material substrate” includes not only a glass substrate but also a substrate such as quartz, single crystal silicon, sapphire, semiconductor wafer, or ceramic. Further, a bonded substrate such as an LCD substrate is also included. The following description will be made mainly using a glass substrate, but the same applies to other brittle material substrates.
  • a brittle material substrate such as glass (hereinafter referred to as “substrate”) is heated at a temperature lower than the temperature at which the substrate softens while scanning with a laser beam, compressive stress is generated in the heating region. Furthermore, a cooling medium is sprayed and cooled behind the laser beam irradiation, thereby generating a tensile stress in the cooling region. In this manner, a stress gradient is formed by forming a region where tensile stress is generated in the vicinity of a region where compressive stress is generated. In recent years, a processing technique for dividing a glass substrate using this stress gradient has been used.
  • scribe processing There are two types of cutting using a laser: scribe processing and full cut processing.
  • a heating region compressive stress region
  • a cooling region tensile stress region
  • scribe processing after the scribe line is formed, the substrate can be divided by, for example, performing a break process that applies a bending moment by pressing a break bar along the scribe line.
  • full-cut processing is processing that forms a crack reaching the substrate back surface from the substrate surface, and is processing that can divide the substrate without performing a break treatment (see Patent Document 1 and Patent Document 2).
  • full cut processing due to the difference in stress in the front-rear direction between the front heating region (compressive stress region) and the rear cooling region (tensile stress region), the force to tear the back of the substrate in the left-right direction compared to the front This is a process in which the substrate is completely divided by working.
  • processing conditions such as heating conditions (irradiation time, irradiation power, scanning speed, etc.) and cooling conditions (refrigerant temperature, spray amount, spray position, etc.) It also depends on the contact state between the table surface on which the substrate to be processed is placed and the glass substrate.
  • FIG. 15 is a diagram showing a change when the edge material portion G1 of the substrate G is divided by full cut processing.
  • the central portion G0 of the substrate G is fixed to a table (not shown), and the edge side portion G1 is floated from the table to be in a non-contact state.
  • the heating / cooling mechanism 10 having the laser beam spot BS (laser beam irradiation region) and the cooling spot CS (refrigerant injection region) is formed on the substrate G as shown in FIG. It moves relatively from the division start end toward the division end end on the opposite side.
  • the moving direction of the beam spot BS and the cooling spot CS is defined as the Y direction.
  • the traveling distance d of the heating / cooling mechanism unit 10 is short, as shown in FIG. 15B, a crack is formed, and the edge material G1 is formed from the starting end of the division.
  • the opening width in the X direction orthogonal to the direction widens, and the dividing surface of the edge member G1 moves in the X direction.
  • the edge material G1 moves in the X direction against the weight of the edge material G1. Is likely to occur little by little, and a greater breaking force is required, making it difficult for the crack to progress.
  • the substrate holding mechanism is provided with a stress applying mechanism.
  • an external force applying unit that applies an external force to the substrate by a fine movement stage is provided, and applied in the lateral direction (X direction) when the position of the split unit moves from the dividing start point, the center, and the dividing end point. I try to control the force.
  • a movement sensor position detector
  • fine movement is applied so as to apply a preset lateral stress (breaking force) based on the detection result.
  • the stage is controlled. Therefore, stress is applied regardless of the progress of the crack, and depending on the progress of the crack, unnecessary force may be forcibly applied to the tip of the crack, or the formed crack may deviate from the planned cutting line. .
  • the present invention does not forcibly advance the progress of the crack by applying an external force at the beginning of the splitting, and the auxiliary splitting force is applied to the crack after it becomes necessary according to the progress of the crack. It is an object of the present invention to provide a laser processing apparatus which can be added to a sectional surface and can surely perform full cut processing to the end of the substrate.
  • an object of the present invention is to provide a laser processing apparatus capable of reliably performing full-cut processing up to the end of the substrate even on a bonded substrate.
  • an object of this invention is to provide the laser processing apparatus which can perform a full cut process, suppressing the wraparound of the refrigerant
  • the laser processing apparatus of the present invention made to solve the above problems includes a substrate support mechanism that floats a portion of the brittle material substrate on the edge side from the planned dividing line and fixes the substrate on the center side of the planned dividing line, and one end
  • An arm having a convex portion on the other end of the arm, and the convex portion of the arm enters a standby position where the convex portion of the arm is separated from the substrate and an opening of a crack formed in the substrate due to thermal stress.
  • a mechanism moving unit and an auxiliary dividing force control unit that applies a dividing force for controlling the hook mechanism and the hook mechanism moving unit to assist the progress of the crack, and the auxiliary dividing
  • the control unit inserts the convex portion into the opening of the crack, and then the hook mechanism
  • the horizontal movement is started to reduce the distance between the dividing surface of the edge portion and the convex portion, and after the protruding portion comes into contact with the dividing surface of the edge portion, the dividing portion of the edge portion is Control is performed so as to apply a breaking force that assists the development of cracks via the convex portion.
  • the laser processing apparatus of the present case includes a heating / cooling mechanism having a laser beam irradiation mechanism and a cooling mechanism for injecting a refrigerant, and a scanning mechanism for moving the heating / cooling mechanism relative to a substrate made of a brittle material.
  • the heating / cooling mechanism is relatively moved along the division line set for the substrate, heated at a temperature lower than the temperature at which the substrate is softened, and then the cooling spot is relatively moved along the trajectory through which the beam spot has passed. Then, by cooling the substrate and generating a crack penetrating the substrate due to thermal stress, the laser processing apparatus for the brittle material substrate that splits by proceeding with the crack along the planned cutting line.
  • the scanning mechanism may move on the substrate side, or the heating / cooling mechanism (laser beam irradiation mechanism and cooling mechanism) may be moved.
  • the laser beam irradiation mechanism is scanned along the scheduled cutting line, and then the cooling mechanism is scanned.
  • the heating / cooling mechanism laser beam irradiation mechanism and cooling mechanism
  • cracks penetrating from the upper surface to the lower surface of the substrate due to thermal stress will occur on the dividing line on the dividing start side. Is formed, and progresses along the line to be divided. At a rear position a little away from the tip of the developing crack, the crack spreads and an opening is formed.
  • the auxiliary dividing force control unit inserts the convex portion of the hook mechanism into the opening of the crack.
  • the timing of inserting the convex portion is after the crack has spread to such an extent that the convex portion and the cross section of the crack do not contact each other.
  • the timing may be set such that the heating / cooling mechanism (laser beam irradiation mechanism and cooling mechanism) is scanned at a constant speed, and is inserted after a certain time has elapsed from the start of scanning. That is, the convex portion is inserted when the beam spot and the cooling spot are scanned for a certain distance from the dividing start end.
  • the opening of a crack actually formed in the substrate may be monitored, and the convex portion may be inserted when the opening is sufficiently opened. Then, the hook mechanism moving unit horizontally moves the hook mechanism in a direction perpendicular to the planned dividing line (a direction away from the center of the substrate).
  • the opening of the crack grows as the crack tip progresses (when the crack tip is close to the dividing start end) at the beginning (the width of the opening widens), but when the crack tip moves away from the dividing start end, Eventually the growth will decrease (the width of the opening will not change easily). Therefore, the timing for starting the horizontal movement may be started immediately after the convex portion is inserted into the crack, or may be started after the width of the opening is sufficiently widened.
  • edge material When the hook mechanism is arranged on the lower surface side of the substrate and the distance between the crack section and the convex portion is made closer, the edge side portion (hereinafter referred to as edge material) can be moved on the arm of the hook mechanism. It is preferable to constitute such that it is supported. In such a configuration, when the tip of the formed crack does not advance a sufficient distance from the hook mechanism toward the end of cutting of the substrate, the edge member moves on the arm and moves in the X direction. If the tip of the crack is restrained and a sufficient distance has advanced from the hook mechanism toward the cutting end of the substrate, the edge material stays on the arm by the frictional force with the arm and moves in the X direction. It is preferable to set the frictional force between the material and the arm.
  • the edge member and the arm are connected with play, a factor that hinders the crack development according to the crack progress state such as the crack start position or the width of the formed opening (weight due to the extension of the edge member). Increase) can be easily removed. Furthermore, the convex part horizontally moved by the hook mechanism moving part comes close to the crack section, and eventually the crack section and the convex part come into contact with each other and press it. The magnitude of this pressing force is sufficient to press the edge material in the X direction so that the progress of the crack is not hindered by the weight of the formed edge material or the like. In this way, the actual crack propagation is reduced and an auxiliary breaking force is applied after it becomes necessary.
  • the auxiliary dividing force control unit is a step of inserting the convex portion into the opening of the crack at a predetermined timing, a step of starting the horizontal movement of the hook mechanism to reduce the distance between the crack sectional surface and the convex portion.
  • a control program may be set in advance so as to start the step of applying a breaking force that assists the progress of cracks via the convex portion.
  • each timing may be set by detecting the elapsed time from the start of the division of the heating / cooling mechanism or the position of the heating / cooling mechanism. Further, the crack may be observed with a camera, and each timing may be set based on the result.
  • the auxiliary dividing force control unit starts the horizontal movement of the hook mechanism to reduce the distance between the crack sectional surface and the convex part, and after the convex part comes into contact with the crack sectional surface, Alternatively, or immediately, a dividing force for assisting the progress of the crack may be applied to the convex portion with respect to the crack cross section.
  • the laser processing method of the present invention is a processing method in which a brittle material substrate is locally heated and a crack is formed in the substrate by the thermal stress to divide the substrate. A step of fixing the substrate to the substrate support mechanism at a center side of the line, a step of irradiating the laser beam while moving along the line to be divided, and an arm having a convex portion at one end is moved to the substrate.
  • the step of inserting the convex portion into the opening of the formed crack, and a part of the arm is brought into contact with the main surface of the edge side portion, and in this state, the distance between the sectional surface of the edge side portion and the convex portion is reduced. And a step of horizontally moving the arm. Furthermore, after the convex part of the arm abuts against the dividing surface of the edge side part, the step of operating the dividing part of the edge side part so as to apply a dividing force that assists the progress of cracks via the convex part. It comprises.
  • the convex portion of the locking portion comes into contact with the cross section of the crack, and then an auxiliary cutting force is applied. Therefore, an auxiliary cutting force can be applied without difficulty, and the cutting line is not formed outside the planned cutting line, and the full cut processing can be reliably performed up to the end of the substrate.
  • the hook mechanism is provided at least at a position near the substrate end on the dividing start side.
  • the hook mechanism provided at the dividing start end can assist the progress of the crack to the vicinity of the substrate end.
  • the hook mechanism may be provided at two locations, at least a position near the substrate end on the dividing start side and a position separated by a predetermined distance inside the substrate end on the dividing end side. According to this, the progress of the crack to the vicinity of the substrate end can be assisted by the hook mechanism provided at the dividing start end. Further, the hook mechanism provided in the vicinity of the substrate end can assist the dividing force in the vicinity of the substrate end by the laser irradiation mechanism, and the substrate can be reliably divided up to the end of the substrate.
  • the predetermined distance here means the distance to the region where the convex portion of the locking portion can enter the tear (gap) without contacting the dividing surface.
  • the edge side portion when the hook mechanism is arranged on the lower surface side of the substrate and the distance between the crack cross section and the convex portion is made closer, the edge side portion is supported so as to be movable on the arm of the hook mechanism. It may be. According to the present invention, it is possible to support the edge side portion that is being separated from the center side as the crack progresses in a state that it can move on the arm of the hook mechanism. As a result, a certain breaking force is applied while absorbing the displacement in the direction perpendicular to the direction of pulling the hook mechanism (X direction) (Y direction) and the rotational direction of the XY plane ( ⁇ direction). be able to.
  • the hook mechanism may move and / or turn the locking portion in the XYZ triaxial directions.
  • the hook mechanism has a contact portion where the convex portion of the locking portion comes into contact with the crack cross section, and assists the progress of the crack via the convex portion with respect to the crack cross section.
  • An adjustment mechanism that gives a degree of freedom other than the moving direction by the hook mechanism moving unit may be provided so that the contact portion is in close contact with and moves with respect to the divided cross section of the crack when the dividing force is applied.
  • the adjustment mechanism may be configured by a support shaft that rotates the locking portion with respect to the arm of the hook mechanism.
  • a support shaft for rotating the locking portion By providing a support shaft for rotating the locking portion, a degree of freedom other than the moving direction by the hook mechanism moving portion can be given.
  • an opening detection unit for detecting an opening of a crack may be further provided, and the auxiliary dividing force control unit may insert the convex portion of the hook mechanism into the opening according to the detected opening of the crack.
  • the auxiliary dividing force control unit may insert the convex portion of the hook mechanism into the opening according to the detected opening of the crack.
  • the substrate support mechanism may inject a curtain gas that prevents the coolant from entering the floating portion when the edge portion floats from the planned dividing line.
  • the substrate support mechanism may include a suction mechanism that prevents the refrigerant from entering the floating portion when the edge side portion is lifted from the planned dividing line.
  • the block diagram of the laser processing apparatus LM1 which is one Embodiment of this invention.
  • the figure which shows the control system of the laser processing apparatus of FIG. The figure which shows the advancing state of the crack of the board
  • the block diagram of the laser processing apparatus LM2 which is 2nd embodiment of this invention.
  • the front view of laser processing apparatus LM3 which is 3rd embodiment of this invention.
  • the front view of laser processing apparatus LM4 which is 4th embodiment of this invention.
  • the front view of laser processing apparatus LM5 which is 5th embodiment of this invention.
  • the perspective view of the laser processing apparatus LM6 which is 6th embodiment of this invention.
  • the figure which shows the control system of the laser processing apparatus LM6 of FIG. The figure which shows the deformation
  • FIG. 1 is an overall configuration diagram of a laser processing apparatus LM1 according to an embodiment of the present invention.
  • FIG. 1 (a) is a perspective view
  • FIG. 1 (b) is a front view
  • FIG. 1 (c) is a plan view.
  • the substrate to be processed is a single glass plate
  • the right edge material G1 of the substrate G is cut along the planned cutting line L on the lower surface of the substrate by full cut processing from the central substrate body G0.
  • laser beam irradiation and refrigerant injection are performed from the lower surface side of the substrate G.
  • the laser processing apparatus LM1 includes a heating / cooling mechanism unit 10 having a laser beam irradiation mechanism 11 and a cooling mechanism 12 for injecting a coolant, and a scanning mechanism 13 (not configured) that moves the heating / cooling mechanism unit 10 relative to the substrate G by driving a motor. ), A transport mechanism 14 for transporting the substrate, substrate support mechanisms 15 and 16, hook mechanisms 17 and 18, and hook mechanism moving portions 19 and 20.
  • the hook mechanism 18 and the hook mechanism moving unit 20, and the hook mechanism 17 and the hook mechanism moving unit 19 have the same structure, and are arranged on the back side of the drawing of the hook mechanism 17 and the hook mechanism moving unit 20 in FIG. Has been.
  • the laser beam irradiation mechanism 11 includes a CO 2 laser light source and a lens optical system that irradiates the beam spot BS on the substrate by shaping the cross-sectional shape of the laser beam emitted from the laser light source into an ellipse.
  • the cooling mechanism 12 includes a nozzle that injects a coolant containing moisture to form a cooling spot CS on the substrate. These are moved along the planned dividing line L by a scanning mechanism 10 (not shown) while keeping the distance between the laser beam irradiation mechanism 11 and the cooling mechanism 12 constant.
  • the substrate support mechanism 15 Below the substrate body G0 side of the substrate G, three rail-shaped supports 15a, 15b, 15c arranged in parallel are installed as the substrate support mechanism 15. A large number of holes for suction chucks are provided in rows on the upper surfaces of the supports 15a to 15c. By operating the suction chucks, the substrate G (part of the substrate body G0) is adsorbed at a desired position. It can be fixed. Further, between the supports 15a and 15b and between 15b and 15c, roller groups 14a and 14b are arranged as a transport mechanism 14 for transporting the substrate. The transport mechanism 14 is used when the substrate G is carried into or out of the processing area.
  • a float table 16a is installed as a substrate support mechanism 16 below the edge G1 side of the substrate G0.
  • a large number of holes for blowing gas (dry air) onto the substrate are provided on the upper surface of the float table 16a so that the substrate (the portion of the edge material G1) can be floated.
  • the entire substrate G is supported substantially horizontally by the cooperation of the substrate support mechanism 15 and the substrate support mechanism 16.
  • the substrate G is separated from the substrate G on the center side from the planned dividing line and separated into the center. The support by the side substrate G is gradually lost, causing a shift in the vertical direction.
  • the edge member G1 in which the deviation occurs is supported on the arm 17c of the hook mechanism 17.
  • the float table 16a is provided with an inclination mechanism 16b for inclining the upper surface thereof, and the edge member G1 cut off by the hook mechanisms 17, 18 and the hook mechanism moving parts 19, 20 described later can be dropped. I can do it.
  • the hook mechanisms 17 and 18 include locking portions 17b and 18b having convex portions 17a and 18a, and arms 17c and 18c that can be swiveled by motor driving, and the locking portions 17b and 18b are separated from the substrate G.
  • the arm 17c is rotated between the position and the locking position where the protrusions 17a and 18a enter the vertical crack formed in the substrate G.
  • the hook mechanism moving portions 19 and 20 are driven by the motor when the locking portions 17b and 18b are in contact with the edge material G1 that has started to be separated from the substrate G, and the substrate body G0 (center side). It can be moved so as to be separated in the horizontal direction (X direction).
  • an elevating type cutter wheel for forming an initial crack (trigger crack) at the division start end of the substrate is provided together with the heating / cooling mechanism unit 10 so that an initial crack can be formed at the division start end of the line to be divided. It is.
  • An initial crack is formed in advance by a cutter wheel in the substrate G carried into the processing region.
  • the laser beam irradiation mechanism 11 and the cooling mechanism 12 are provided on the lower surface side of the substrate G. However, these may be provided on the upper surface side.
  • FIG. 2 is a block diagram of the control system.
  • the heating / cooling mechanism 10 laser beam irradiation mechanism 11, cooling mechanism 12
  • scanning mechanism 13 transport mechanism 14
  • substrate support mechanism (support) 15, substrate support mechanism (float table) 16
  • Each unit of the mechanisms 17 and 18 and the hook mechanism moving units 19 and 20 is controlled by a control unit 21 configured by a computer (CPU).
  • the control unit 21 is connected to an input unit 22 including a keyboard and a mouse, and a display unit 23 including a display screen for performing various displays. Necessary messages are displayed on the screen and necessary instructions and settings are made. It can be input. Then, the machining operation is executed based on the sequence program stored in advance.
  • FIG. 3 is a view showing a progress state of a crack of the substrate G at each time point during the cutting process
  • FIG. 4 is a view showing an operating state at each time point of the hook mechanisms 17 and 18 (corresponding to FIG. 1B). Figure).
  • FIG. 3A shows a state immediately after the scanning of the beam spot BS and the cooling spot CS is started from the division start end.
  • the substrate G that has been transported by the transport mechanism 14 has the substrate body side G0 adsorbed and fixed by the supports 15a to 15c.
  • the edge material G1 side is levitated by the gas blown from the float table 16a. Both hook mechanisms 17 and 18 have moved to a standby position away from the substrate G.
  • FIG. 3 (b) shows a state when the beam spot BS and the cooling spot CS have slightly advanced from the dividing start end.
  • a crack penetrating from the upper surface to the lower surface is generated on the planned dividing line on the dividing start end side, and an opening Gc is formed.
  • the hook mechanism 17 is operated, and the convex portion 17a of the hook mechanism 17 enters the opening Gc.
  • the convex portion 17a is not in contact with the partial cross section Gf. The timing for inserting 17a is adjusted.
  • a delay time from the start of scanning to the operation of the hook mechanism 17 is set, the beam spot BS and the cooling spot CS wait until the beam spot BS and the cooling spot CS progress to some extent along the planned dividing line, and then the convex portion 17a is moved. Enter the opening Gc.
  • the edge member G1 moves on the arm 17c as shown in FIG. 4C, and the crack opening Gc is slightly expanded.
  • the other hook mechanism 18 (the back side of the paper) is still in the standby position and is not operating.
  • FIG. 3C shows a state in which the beam spot BS and the cooling spot CS have further advanced and have moved away from the division start end.
  • the amount of movement of the edge member G1 on the arm 17c is reduced (or stopped).
  • the hook mechanism moving unit 19 starts to pull the hook mechanism 17 in the lateral direction (X direction). Since the movement amount of the edge member G1 is reduced, the protrusion 17a gradually approaches the dividing surface Gf of the edge member G1, and eventually the protrusion 17a of the hook mechanism 17 as shown in FIG. 4 (e). Comes into contact with the dividing surface Gf of the edge member G1.
  • the edge member G1 moves in the lateral direction (X direction), and the force to split right and left along the planned division line L (partitioning force) is assisted. Will be added. That is, when the hook mechanism 17 is disposed on the lower surface side of the substrate G and the distance between the crack cross section and the convex portion 17a is reduced, the edge member G1 side can be moved on the arm 17c of the hook mechanism 17. To support. Here, when the tip of the crack formed before the convex portion 17a contacts the dividing surface Gf of the edge member G1, the edge does not advance from the hook mechanism 17 toward the cutting end of the substrate G by a sufficient distance.
  • the material G1 moves on the arm 17c and is prevented from moving in the X direction. If the tip of the crack has advanced a sufficient distance from the hook mechanism 17 toward the cutting end of the substrate G before the projection 17a contacts the dividing surface Gf of the edge member G1, the edge member G1 is connected to the arm 17c. It stays on the arm 17c by the frictional force and moves in the X direction. Although the hook mechanism 17 supports the edge member G1 so as to be movable on the arm 17c, the edge member G1 contacts the arm 17c depending on the relationship between the air pressure that causes the substrate G to float and the weight of the edge member G1. In some cases, it will surface without any problems.
  • the edge member G1 has an appropriate play with the arm 17, that is, it is softly connected through the frictional force between the edge member G1 and the arm 17 (because it is not connected tightly). ) The force that presses the edge material in the X direction is automatically adjusted according to the crack progress state such as the leading position of the crack or the width of the formed opening. At this time, the other hook mechanism 18 is not operated.
  • FIG. 3D shows a state in which the beam spot BS and the cooling spot CS have further progressed, and the beam spot BS has approached the end of the division line L of the substrate G.
  • the hook mechanism 18 disposed on the side of the dividing end is newly activated, and the same operation state as that of the hook mechanism 17 shown in FIG. 4B, that is, the convex portion 18a of the locking portion 18b is opened.
  • Gc enters the state.
  • the timing at which the convex portion 18a is actuated is adjusted so that the convex portion 18a does not contact the dividing surface Gf (a delay time from the start of scanning until the hook mechanism 18 is actuated is set). After that, in the same operating state as the hook mechanism 17 shown in FIG.
  • the edge member G1 moves in the lateral direction (X direction), and tries to split left and right along the planned dividing line L.
  • Force (breaking force) is added as an auxiliary.
  • FIG. 3E shows a state at the time when the cooling spot CS is separated from the separation end of the substrate G.
  • the hook mechanism 18 assists the progress of cracks by pulling the substrate G in the lateral direction (X direction). As a result, the crack progresses to the end of the substrate and is completely divided.
  • the tilting mechanism 16b is operated, and the float table 16a is tilted, so that the edge member G1 falls from the table surface.
  • the edge material G1 is illustrated as an end material that is separated from the substrate body side G0 and discarded.
  • the edge material G1 is a unit substrate or a set of unit substrates that are individually separated from the substrate G that is a mother substrate.
  • the present invention is similarly applied to a strip substrate that is a body and is separated into unit substrates.
  • FIG. 5 is an overall configuration diagram of a laser processing apparatus LM2 according to the second embodiment of the present invention
  • FIG. 5 (a) is a perspective view
  • FIG. 5 (b) is a front view
  • FIG. 5 (c) is a plan view. is there.
  • hook mechanisms 23 and 24 are provided on the upper surface side of the substrate G in place of the hook mechanisms 17 and 18 described in FIG.
  • the laser beam irradiation mechanism 11 and the cooling mechanism 12 are configured to scan along the planned division line L by a scanning mechanism (not shown) provided on the upper side of the substrate G.
  • a scanning mechanism not shown
  • the hook mechanisms 23, 24 include locking portions 23 b, 24 b having convex portions 23 a, 24 a and arms 23 c, 24 c that can be turned by motor drive, and the locking positions 23 b, 24 b are separated from the substrate G. And the arm 17 can be rotated between the position where it contacts the dividing line L of the substrate.
  • the hook mechanism moving portions 19 and 20 are driven by a motor so that the edge member G1 is pulled away from the substrate main body G0 (center side) in the lateral direction when the locking portions 23b and 24b are in a position in contact with the planned dividing line L. It can be moved.
  • the control system is the same as that in FIG. 2 in the first embodiment.
  • FIG. 6 is a diagram showing the progress of cracks in the substrate G at each time during the cutting process
  • FIG. 7 is a diagram showing the operating states at each time of the hook mechanisms 23 and 24 (corresponding to FIG. 5B). Figure). 6 and 7 correspond to FIGS. 3 and 4 in the first embodiment, respectively.
  • FIG. 6A shows a state immediately after the scanning of the beam spot BS and the cooling spot CS is started from the division start end.
  • the substrate G that has been transported by the transport mechanism 14 has the substrate body side G0 adsorbed and fixed by the supports 15a to 15c.
  • the edge material G1 side is levitated by the gas blown from the float table 16a.
  • the gas blowing amount is set so that the upper surface side of the edge member G1 can be kept in contact with the lower surfaces of the arms 23c and 24c of the hook mechanism 17. Both hook mechanisms 23 and 24 have been moved to a standby position away from the substrate G.
  • FIG. 6B shows a state when the beam spot BS and the cooling spot CS have slightly advanced from the dividing start end.
  • a crack is generated on the division planned line L on the division start end side, and an opening Gc is formed.
  • the hook mechanism 23 is operated, and the convex portion 23a of the hook mechanism 23 enters the opening Gc. In that case, the timing which inserts the convex part 23a is adjusted so that the convex part 23a may not contact the dividing surface Gf.
  • a delay time from the start of scanning until the hook mechanism 17 is activated is set, and the beam spot BS and the cooling spot CS wait until the beam spot BS and the cooling spot CS travel to some extent along the planned dividing line. Enter the opening Gc.
  • FIG. 6C shows a state in which the beam spot BS and the cooling spot CS have further advanced and have moved away from the dividing start end.
  • the moving amount of the edge material G1 is reduced (or stopped).
  • the hook mechanism moving unit 19 starts to pull the hook mechanism 23 in the lateral direction (X direction). Since the amount of movement of the edge member G1 is reduced, the protrusion 23a gradually approaches the dividing surface Gf of the edge member G1, and eventually the protrusion 23a of the hook mechanism 23 as shown in FIG. Comes into contact with the dividing surface Gf of the edge member G1.
  • the edge member G1 moves in the lateral direction (X direction), and the force to split right and left along the planned division line L (dividing force) is assisted. Will be added. That is, when the hook mechanism 23 is disposed on the upper surface side of the substrate G and the substrate G floated by a gas blown from below with an appropriate air pressure reduces the distance between the crack sectional surface Gf and the convex portion 23a.
  • the upper surface side of the edge member G1 is movably supported by the arm 17c of the hook mechanism 17.
  • the tip of the formed crack does not advance a sufficient distance from the hook mechanism 17 toward the end of the division of the substrate G
  • the upper surface of the edge member G1 comes into contact with the lower surfaces of the arms 23c and 24c. Movement in the direction is suppressed.
  • the tip of the crack has advanced a sufficient distance from the hook mechanism 17 toward the end of the division of the substrate G
  • the upper surface of the edge member G1 is caused by the frictional force between the lower surfaces of the arms 23c and 24c and the arms 23c and 24c. Stay on and move in the X direction.
  • the edge member G1 has moderate play with the arms 23c and 24c, that is, the edge member G1 is softly connected via the frictional force between the edge member G1 and the arms 23c and 24c (is connected tightly).
  • the force for pressing the edge material in the X direction is automatically adjusted according to the crack progress state such as the crack start position or the width of the formed opening. At this time, the other hook mechanism 24 is not operated.
  • FIG. 6D shows a state in which the beam spot BS and the cooling spot CS have further progressed, and the beam spot BS has approached the end of the division line L of the substrate G.
  • the hook mechanism 24 disposed on the dividing end end side is newly activated, and the same operation state as that of the hook mechanism 23 shown in FIG. 7B, that is, the convex portion 24a of the locking portion 24b is opened.
  • Gc enters the state.
  • the timing at which the convex portion 24a is actuated is adjusted so that the convex portion 24a does not contact the dividing surface Gf (a delay time from the start of scanning until the hook mechanism 24 is actuated is set). Thereafter, in the same operating state as the hook mechanism 23 shown in FIG.
  • the edge member G1 moves in the lateral direction (X direction), and tries to split left and right along the planned dividing line L.
  • Force breaking force
  • a forcible breaking force that promotes the progress of cracks is also applied from the hook mechanism 24.
  • FIG. 6E shows a state at the time when the cooling spot CS is separated from the separation end of the substrate G.
  • the hook mechanism 24 assists the progress of cracks by pulling the substrate G in the lateral direction (X direction). Thereby, a crack progresses to the termination
  • the tilting mechanism 16b is operated, and the float table 16a is tilted, so that the edge member G1 falls from the table surface.
  • the laser beam irradiation mechanism 11 and the cooling mechanism 12 are provided on the upper surface side, and the hook mechanisms 23 and 24 are also provided on the upper surface side, but one may be provided on the lower surface side and the other may be provided on the upper surface side. .
  • FIG. 8 is a front view of a laser processing apparatus LM3 according to the third embodiment of the present invention.
  • the end material (end portion) of the lower substrate of the bonded substrate board is divided to expose the terminal electrode portion of the upper substrate.
  • the beam spot BS by the laser irradiation mechanism 11 and the cooling spot CS by the cooling mechanism 12 are separated from each other on the substrate HG in the same manner as the laser processing apparatus LM1. Scan from below to the lower substrate. Also in this case, the board
  • the laser irradiation mechanism is arranged above and below.
  • the substrate can be divided by the same operation procedure.
  • FIG. 9 is a front view of the LM 4 of the laser processing apparatus according to the fourth embodiment of the present invention.
  • the curtain gas CG for preventing the refrigerant injected from the cooling mechanism 12 from flowing around the upper surface of the float table 16a at the end of the float table 16a. Is provided with a curtain gas nozzle 16c.
  • the substrate HG comes into close contact with the float table 16a when entering between the upper surface of the float table 16a and the substrate HG, and the substrate cannot be divided. Therefore, the refrigerant including the cooling water can be used by preventing the wraparound by injecting the curtain gas CG to the end portion on the front end side of the float table 16a.
  • the curtain gas CG by spraying the curtain gas CG, it is possible to prevent the cooling water from entering between the upper substrate and the lower substrate of the bonded substrate HG from the formed cracks. It is also possible to prevent close contact between each other.
  • FIG. 10 is a front view of the LM 5 of the laser processing apparatus according to the fifth embodiment of the present invention.
  • a suction port 16d for removing unnecessary refrigerant including moisture is provided instead of the curtain nozzle 16c of the laser processing apparatus LM4 shown in FIG. 9.
  • a push-pull type air curtain is formed, and wraparound to the float table 16a can be prevented.
  • FIG. 11 is a perspective view showing an overall configuration of a laser processing apparatus LM6 according to the sixth embodiment of the present invention.
  • FIG. 12 is a diagram showing a control system of the laser processing apparatus LM6.
  • a camera 25 for observing the state of the opening Gc of the crack formed in the substrate is mounted in the laser processing apparatus described with reference to FIG.
  • the control system 21 is provided with an aperture detection unit 26 that detects the size of the aperture based on the image captured by the camera 25.
  • the opening detection unit 26 detects from the image of the camera 25 whether the width of the crack (opening width) that can be placed at the dividing start end is equal to or larger than a preset threshold value, and when the opening width is equal to or larger than the threshold value, the hook mechanism 17. It is determined that a sufficient opening has been opened to operate. By incorporating this determination operation, the hook mechanism 17 is prevented from operating when a sufficient opening is not formed for some reason.
  • the operation of the hook mechanism 17 may be started or stopped by judging the timing of starting and ending the step of reducing the distance of the step, and the step of applying a dividing force for assisting the progress of cracks via the convex portion 17a.
  • FIG. 13 is a modified embodiment of the locking portion 17b (18b, 23b, 24b) of the hook mechanism 17 (18, 23, 24) in each of the above-described embodiments.
  • the hook mechanism 17 connects the arm 17c and the locking portion 17b via a support shaft 17d so as to have a degree of freedom in the rotational direction within the XY plane.
  • the edge side substrate G1 not only moves in the X direction, but also moves in the Y direction or rotates in the XY plane (referred to as ⁇ rotation).
  • the substrate of the convex portion 17a of the hook mechanism 17 and the contact surface are fixed, the movement in the Y direction or the ⁇ rotation cannot be absorbed, so that the displacement of the contact portion occurs and the edge portion is pulled.
  • the support shaft 17d by providing a degree of freedom in the direction of rotation by the support shaft 17d, it is possible to absorb movement in the Y direction and ⁇ rotation, and to the edge material side substrate G1. It is possible to reliably transmit the breaking force.
  • FIG. 13 shows an example in which the convex portion of the locking portion of the hook mechanism 17 (18, 23, 24) is in surface contact with the crack cross section, the hook mechanism 17 (18, 23, 24) is locked.
  • the convex portion 17a of the portion 17 may be in line contact or point contact with the crack cross section.
  • a pin 17e is provided on the base 17f of the locking portion 17b.
  • the pins 17e are supported so as to be slidable along the grooves 17g provided in the base 17f, and the number of pins 17e and the interval between them can be changed.
  • a resin such as Teflon (registered trademark) having a low frictional resistance is preferably used.
  • the arm 17c and the locking portion 17b of the hook mechanism 17 are movable in the X direction and have a degree of freedom in the rotational direction within the XY plane.
  • the locking portion 17b may be configured to perform movement in the XYZ triaxial directions and ⁇ rotation (turning).
  • the movement in the Y direction can be achieved by moving the arm 17c and the locking portion 17b of the hook mechanism 17 in the Y direction.
  • By adding the movement in the Y direction the movement in an arbitrary direction can be performed in the XY plane.
  • a precise auxiliary breaking force is transmitted to the marginal part.
  • the movement in the Z direction can be achieved by moving the arm 17c and the locking portion 17b of the hook mechanism 17 in the Z direction perpendicular to the XY plane.
  • the ⁇ rotation is possible by configuring the arm 17c and the locking portion 17b of the hook mechanism 17 to pivot about the fulcrum O (FIG. 13). By adding the ⁇ rotation, any rotation in the XY plane is possible. The auxiliary breaking force is transmitted to the marginal part more precisely in the direction.
  • the two hook mechanisms 17 and 18 (23, 24) are disposed.
  • one or more hook mechanisms may be provided, for example, only on the dividing start end side of the substrate G.
  • the two hook mechanisms 17, 18 (23, 24) may be additionally provided.
  • the auxiliary cutting force control unit starts the horizontal movement of the hook mechanism 17 to place the convex portion 17a in the opening of the crack, and reduces the distance between the crack sectional surface and the convex portion 17a.
  • the step of applying and the step of applying a breaking force for assisting the progress of cracks via the convex portion 17a were operated at a preset timing.
  • the convex portion 17a was formed into the opening Gc.
  • the horizontal movement may be started, and the convex portion 17a may be further moved horizontally as it is after coming into contact with the sectional surface of the edge member G1.
  • the edge on one end side of the substrate G is levitated to perform full-cut processing.
  • the edge portions on both ends of the substrate G or the other edge on the other side of the substrate G are almost simultaneously. The same full cut processing can be performed.
  • the 1st hook mechanism 17 and the 2nd hook mechanism 18 were fixed and installed along the division
  • a processing example in which the edge material of the substrate is removed or the terminal electrode is exposed has been described.
  • the purpose of the processing is not limited to this, and the mother substrate of a single plate or a bonded substrate is formed in a strip shape.
  • the present apparatus is applied to divide the strip into individual product substrates.
  • the present invention can be used for a laser processing apparatus using full cut processing by laser irradiation.

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  • Physics & Mathematics (AREA)
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  • Materials Engineering (AREA)
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  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
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Abstract

La présente invention se rapporte à un appareil de travail au laser qui peut appliquer une force de séparation auxiliaire au plan de séparation de la fissure conformément aux situations de progression d'une fissure, pour ainsi réaliser un travail de découpe totale de manière fiable sur l'extrémité terminale du substrat. l'appareil de travail au laser comprend des mécanismes de support de substrat (15 et 16) pour faire flotter un côté de bord (1), un mécanisme d'accrochage (17), une unité de déplacement de mécanisme d'accrochage (19) destinée à déplacer le mécanisme d'accrochage à l'horizontale, et une unité de commande de force de séparation auxiliaire destinée à commander le mécanisme d'accrochage et l'unité de déplacement de mécanisme d'accrochage (19) afin d'appliquer ainsi la force de séparation pour contribuer à la progression de la fissure. L'unité de commande de force de séparation auxiliaire effectue des commandes pour insérer une saillie dans l'ouverture de la fissure, lorsque distance entre le plan de séparation de substrat central et le plan de séparation de côté de bord de la fissure ouverte suffit, pour commencer le déplacement horizontal du mécanisme d'accrochage, afin de rapprocher ainsi le plan de séparation de la fissure et la saillie, et pour appliquer la force de séparation au plan de séparation de la fissure une fois que la saillie s'appuie contre le plan de séparation de la fissure.
PCT/JP2008/073250 2007-12-28 2008-12-19 Appareil et procédé de travail au laser WO2009084489A1 (fr)

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ITVI20090260A1 (it) * 2009-10-28 2011-04-28 G F P M Srl Dispositivo di estrazione degli spezzoni delle lastre in vetro in una macchina per il taglio di dette lastre
JP2011116611A (ja) * 2009-12-07 2011-06-16 Nippon Electric Glass Co Ltd 板状ガラスの切断方法及びその切断装置
JP2013103852A (ja) * 2011-11-11 2013-05-30 Nippon Electric Glass Co Ltd 脆性板状物の切断装置および切断方法
WO2014057879A1 (fr) * 2012-10-12 2014-04-17 株式会社Ihi Dispositif de coupe
CN105328348A (zh) * 2015-11-14 2016-02-17 苏州光韵达光电科技有限公司 一种旋转式激光切割装置
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CN109834392A (zh) * 2017-11-24 2019-06-04 三星显示有限公司 显示装置的加工装置及显示装置的加工方法
CN110919867A (zh) * 2019-12-18 2020-03-27 段瑞兰 一种玻璃花边定距器

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WO2012035721A1 (fr) * 2010-09-16 2012-03-22 パナソニック株式会社 Dispositif de traitement au laser et procédé de traitement au laser
TWI694512B (zh) * 2018-05-08 2020-05-21 藍德工業股份有限公司 熱裁切裝置

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ITVI20090260A1 (it) * 2009-10-28 2011-04-28 G F P M Srl Dispositivo di estrazione degli spezzoni delle lastre in vetro in una macchina per il taglio di dette lastre
JP2011116611A (ja) * 2009-12-07 2011-06-16 Nippon Electric Glass Co Ltd 板状ガラスの切断方法及びその切断装置
KR20180057730A (ko) * 2011-05-13 2018-05-30 니폰 덴키 가라스 가부시키가이샤 적층체, 적층체의 절단 방법, 적층체의 가공 방법, 및 취성 판상물의 절단 장치 및 절단 방법
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US9446566B2 (en) 2011-05-13 2016-09-20 Nippon Electric Glass Co., Ltd. Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
KR101941483B1 (ko) * 2011-05-13 2019-01-23 니폰 덴키 가라스 가부시키가이샤 적층체, 적층체의 절단 방법, 적층체의 가공 방법, 및 취성 판상물의 절단 장치 및 절단 방법
JP2013103852A (ja) * 2011-11-11 2013-05-30 Nippon Electric Glass Co Ltd 脆性板状物の切断装置および切断方法
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WO2014057879A1 (fr) * 2012-10-12 2014-04-17 株式会社Ihi Dispositif de coupe
CN105328348B (zh) * 2015-11-14 2017-09-01 苏州光韵达光电科技有限公司 一种旋转式激光切割装置
CN105328348A (zh) * 2015-11-14 2016-02-17 苏州光韵达光电科技有限公司 一种旋转式激光切割装置
CN109834392A (zh) * 2017-11-24 2019-06-04 三星显示有限公司 显示装置的加工装置及显示装置的加工方法
CN110919867A (zh) * 2019-12-18 2020-03-27 段瑞兰 一种玻璃花边定距器

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TW200936291A (en) 2009-09-01

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