WO2009078440A1 - ウエハ貼着用粘着シートおよびウエハの加工方法 - Google Patents

ウエハ貼着用粘着シートおよびウエハの加工方法 Download PDF

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Publication number
WO2009078440A1
WO2009078440A1 PCT/JP2008/072994 JP2008072994W WO2009078440A1 WO 2009078440 A1 WO2009078440 A1 WO 2009078440A1 JP 2008072994 W JP2008072994 W JP 2008072994W WO 2009078440 A1 WO2009078440 A1 WO 2009078440A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
adhesive sheet
bonding
processing method
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/072994
Other languages
English (en)
French (fr)
Inventor
Akira Yabuki
Syozo Yano
Satoshi Ota
Yuri Tamagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008306587A external-priority patent/JP5448430B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to CN2008801214941A priority Critical patent/CN101903983A/zh
Publication of WO2009078440A1 publication Critical patent/WO2009078440A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C09J2453/006—Presence of block copolymer in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Dicing (AREA)

Abstract

　基材フィルム１と、該基材フィルム上に形成された粘着剤層２とからなる粘着シートであって、該粘着シートを幅７ｍｍに加工した試験片を用いて動的粘弾性測定装置で測定した損失係数(２３°C、周波数１～１００Ｈｚ)が０.１５以上であるウエハ貼着用粘着シート、および、該ウエハ貼着用粘着シートにウエハを貼合する工程と、該ウエハのダイシング工程を含み、ダイシング工程においてウエハ貼着用粘着シートの基材フィルムまで切り込みを行わないウエハの加工方法。
PCT/JP2008/072994 2007-12-18 2008-12-17 ウエハ貼着用粘着シートおよびウエハの加工方法 Ceased WO2009078440A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008801214941A CN101903983A (zh) 2007-12-18 2008-12-17 晶圆粘贴用粘合片及晶圆的加工方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007326555 2007-12-18
JP2007-326555 2007-12-18
JP2008-306587 2008-12-01
JP2008306587A JP5448430B2 (ja) 2007-12-18 2008-12-01 ウエハ貼着用貼着シートおよびウエハの加工方法

Publications (1)

Publication Number Publication Date
WO2009078440A1 true WO2009078440A1 (ja) 2009-06-25

Family

ID=40795553

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072994 Ceased WO2009078440A1 (ja) 2007-12-18 2008-12-17 ウエハ貼着用粘着シートおよびウエハの加工方法

Country Status (1)

Country Link
WO (1) WO2009078440A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011004825A1 (ja) * 2009-07-08 2011-01-13 古河電気工業株式会社 ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
US20130171449A1 (en) * 2010-09-13 2013-07-04 Sumitomo Bakelite Co., Ltd. Dicing film
JP2013194187A (ja) * 2012-03-21 2013-09-30 Furukawa Electric Co Ltd:The 制振性粘着シート
WO2016151911A1 (ja) * 2015-03-23 2016-09-29 リンテック株式会社 半導体加工用シートおよび半導体装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320996A (ja) * 1996-03-29 1997-12-12 Denso Corp 半導体装置の製造方法
JP2002155249A (ja) * 2000-11-22 2002-05-28 Mitsui Chemicals Inc ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP2002294184A (ja) * 2001-03-29 2002-10-09 Toyo Chem Co Ltd 半導体ウエハ固定用シート
JP2003007646A (ja) * 2001-06-18 2003-01-10 Nitto Denko Corp ダイシング用粘着シートおよび切断片の製造方法
JP2003092273A (ja) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd 半導体ウエハ用ダイシングフィルム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320996A (ja) * 1996-03-29 1997-12-12 Denso Corp 半導体装置の製造方法
JP2002155249A (ja) * 2000-11-22 2002-05-28 Mitsui Chemicals Inc ウエハ加工用粘着テープ及びその製造方法並びに使用方法
JP2002294184A (ja) * 2001-03-29 2002-10-09 Toyo Chem Co Ltd 半導体ウエハ固定用シート
JP2003007646A (ja) * 2001-06-18 2003-01-10 Nitto Denko Corp ダイシング用粘着シートおよび切断片の製造方法
JP2003092273A (ja) * 2001-09-19 2003-03-28 Mitsubishi Plastics Ind Ltd 半導体ウエハ用ダイシングフィルム

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011004825A1 (ja) * 2009-07-08 2011-01-13 古河電気工業株式会社 ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
CN102473617A (zh) * 2009-07-08 2012-05-23 古河电气工业株式会社 晶片粘贴用粘合片及使用该粘合片的晶片的加工方法
JPWO2011004825A1 (ja) * 2009-07-08 2012-12-20 古河電気工業株式会社 ウエハ貼着用粘着シートおよびそれを用いたウエハの加工方法
KR101336430B1 (ko) * 2009-07-08 2013-12-04 후루카와 덴키 고교 가부시키가이샤 웨이퍼 첩착용 점착시트 및 이를 이용한 웨이퍼의 가공방법
TWI447202B (zh) * 2009-07-08 2014-08-01 古河電氣工業股份有限公司 Wafer bonding adhesive tape and the use of its wafer processing methods
CN102473617B (zh) * 2009-07-08 2015-04-29 古河电气工业株式会社 晶片粘贴用粘合片及使用该粘合片的晶片的加工方法
US20130171449A1 (en) * 2010-09-13 2013-07-04 Sumitomo Bakelite Co., Ltd. Dicing film
US9570335B2 (en) * 2010-09-13 2017-02-14 Sumitomo Bakelite Co., Ltd. Dicing film
JP2013194187A (ja) * 2012-03-21 2013-09-30 Furukawa Electric Co Ltd:The 制振性粘着シート
WO2016151911A1 (ja) * 2015-03-23 2016-09-29 リンテック株式会社 半導体加工用シートおよび半導体装置の製造方法

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