WO2009074297A3 - Vorrichtung und verfahren zum reinigen von gegenständen - Google Patents
Vorrichtung und verfahren zum reinigen von gegenständen Download PDFInfo
- Publication number
- WO2009074297A3 WO2009074297A3 PCT/EP2008/010460 EP2008010460W WO2009074297A3 WO 2009074297 A3 WO2009074297 A3 WO 2009074297A3 EP 2008010460 W EP2008010460 W EP 2008010460W WO 2009074297 A3 WO2009074297 A3 WO 2009074297A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tank
- fluid
- wafers
- parts
- nozzles
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT08860195T ATE545907T1 (de) | 2007-12-10 | 2008-12-10 | Vorrichtung und verfahren zum reinigen von gegenständen |
KR1020107011992A KR101177038B1 (ko) | 2007-12-10 | 2008-12-10 | 물품의 세정 장치 및 방법 |
CN2008801201994A CN101896994B (zh) | 2007-12-10 | 2008-12-10 | 用于清洁的设备和方法 |
EP08860195A EP2218004B1 (de) | 2007-12-10 | 2008-12-10 | Vorrichtung und verfahren zum reinigen von gegenständen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EPPCT/EP2007/010734 | 2007-12-10 | ||
PCT/EP2007/010734 WO2008071364A1 (de) | 2006-12-15 | 2007-12-10 | Vorrichtung und verfahren zum reinigen von gegenständen, insbesondere von dünnen scheiben |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009074297A2 WO2009074297A2 (de) | 2009-06-18 |
WO2009074297A3 true WO2009074297A3 (de) | 2009-10-15 |
Family
ID=40756182
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/010460 WO2009074297A2 (de) | 2007-12-10 | 2008-12-10 | Vorrichtung und verfahren zum reinigen von gegenständen |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101177038B1 (de) |
WO (1) | WO2009074297A2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008004548A1 (de) * | 2008-01-15 | 2009-07-16 | Rec Scan Wafer As | Waferstapelreinigung |
WO2009114043A1 (en) * | 2008-03-07 | 2009-09-17 | Automation Technology, Inc. | Solar wafer cleaning systems, apparatus and methods |
DE102010052635B4 (de) | 2010-11-29 | 2014-01-02 | Rena Gmbh | Halte-Reinigungsvorrichtung und Verfahren zum abschnittsweisen Reinigen gesägter Wafer |
KR101402846B1 (ko) * | 2013-02-06 | 2014-06-02 | 주식회사 엘지실트론 | 웨이퍼 세정 장치 |
EP2874183A1 (de) | 2013-11-15 | 2015-05-20 | mechatronic Systemtechnik GmbH | Vorrichtung zum wenigstens Entleeren eines Transportbehälters |
CN113866097A (zh) * | 2021-09-09 | 2021-12-31 | 中国科学院大气物理研究所 | 光学仪器镜面自动清洁系统及其使用方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0319806A1 (de) * | 1987-11-28 | 1989-06-14 | Kabushiki Kaisha Toshiba | Verfahren zur Obenflächenbehandlung eines Halbleiterplättchens |
US6416587B1 (en) * | 2000-01-27 | 2002-07-09 | Industrial Technology Research Institute | Apparatus and method for cleaning wafer |
US20040089325A1 (en) * | 2002-11-11 | 2004-05-13 | Ki-Hwan Park | Method of and apparatus for cleaning semiconductor wafers |
US20060060232A1 (en) * | 2004-04-15 | 2006-03-23 | Tokyo Electron Limited | Liquid treatment device and liquid treatment method |
WO2007065665A1 (de) * | 2005-12-06 | 2007-06-14 | Stangl Semiconductor Equipment Ag | Vorrichtung und verfahren zum reinigen eines gesägten waferblocks |
WO2008071364A1 (de) * | 2006-12-15 | 2008-06-19 | Rena Sondermaschinen Gmbh | Vorrichtung und verfahren zum reinigen von gegenständen, insbesondere von dünnen scheiben |
EP1935514A1 (de) * | 2006-12-18 | 2008-06-25 | Rena Sondermaschinen GmbH | Vorrichtung und Verfahren zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3851486B2 (ja) | 2000-03-27 | 2006-11-29 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP2007311756A (ja) | 2006-04-20 | 2007-11-29 | Pre-Tech Co Ltd | 超音波洗浄装置及び超音波洗浄方法 |
-
2008
- 2008-12-10 WO PCT/EP2008/010460 patent/WO2009074297A2/de active Application Filing
- 2008-12-10 KR KR1020107011992A patent/KR101177038B1/ko active IP Right Grant
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0319806A1 (de) * | 1987-11-28 | 1989-06-14 | Kabushiki Kaisha Toshiba | Verfahren zur Obenflächenbehandlung eines Halbleiterplättchens |
US6416587B1 (en) * | 2000-01-27 | 2002-07-09 | Industrial Technology Research Institute | Apparatus and method for cleaning wafer |
US20040089325A1 (en) * | 2002-11-11 | 2004-05-13 | Ki-Hwan Park | Method of and apparatus for cleaning semiconductor wafers |
US20060060232A1 (en) * | 2004-04-15 | 2006-03-23 | Tokyo Electron Limited | Liquid treatment device and liquid treatment method |
WO2007065665A1 (de) * | 2005-12-06 | 2007-06-14 | Stangl Semiconductor Equipment Ag | Vorrichtung und verfahren zum reinigen eines gesägten waferblocks |
WO2008071364A1 (de) * | 2006-12-15 | 2008-06-19 | Rena Sondermaschinen Gmbh | Vorrichtung und verfahren zum reinigen von gegenständen, insbesondere von dünnen scheiben |
WO2008071365A1 (de) * | 2006-12-15 | 2008-06-19 | Rena Sondermaschinen Gmbh | Vorrichtung und verfahren zum reinigen von gegenständen, insbesondere von dünnen scheiben |
EP1935514A1 (de) * | 2006-12-18 | 2008-06-25 | Rena Sondermaschinen GmbH | Vorrichtung und Verfahren zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben |
Also Published As
Publication number | Publication date |
---|---|
WO2009074297A2 (de) | 2009-06-18 |
KR101177038B1 (ko) | 2012-08-27 |
KR20100098519A (ko) | 2010-09-07 |
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