WO2009066366A1 - プローブカード、それを備えた電子部品試験装置、及び、プローブ針のクリーニング決定方法 - Google Patents

プローブカード、それを備えた電子部品試験装置、及び、プローブ針のクリーニング決定方法 Download PDF

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Publication number
WO2009066366A1
WO2009066366A1 PCT/JP2007/072397 JP2007072397W WO2009066366A1 WO 2009066366 A1 WO2009066366 A1 WO 2009066366A1 JP 2007072397 W JP2007072397 W JP 2007072397W WO 2009066366 A1 WO2009066366 A1 WO 2009066366A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
determing
cleaning
electronic component
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2007/072397
Other languages
English (en)
French (fr)
Inventor
Nobutaka Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to PCT/JP2007/072397 priority Critical patent/WO2009066366A1/ja
Publication of WO2009066366A1 publication Critical patent/WO2009066366A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

プローブカード(30)は、半導体ウェハに造り込まれたICデバイスのパッドに接触するプローブ針(31)と、プローブ針(31)が実装されたプリント基板(32)と、テストヘッドに電気的に接続されるコネクタ(33)と、プローブカード(30)に関する情報を記憶しておくメモリ(35)と、を備えている。
PCT/JP2007/072397 2007-11-19 2007-11-19 プローブカード、それを備えた電子部品試験装置、及び、プローブ針のクリーニング決定方法 Ceased WO2009066366A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/072397 WO2009066366A1 (ja) 2007-11-19 2007-11-19 プローブカード、それを備えた電子部品試験装置、及び、プローブ針のクリーニング決定方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/072397 WO2009066366A1 (ja) 2007-11-19 2007-11-19 プローブカード、それを備えた電子部品試験装置、及び、プローブ針のクリーニング決定方法

Publications (1)

Publication Number Publication Date
WO2009066366A1 true WO2009066366A1 (ja) 2009-05-28

Family

ID=40667204

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072397 Ceased WO2009066366A1 (ja) 2007-11-19 2007-11-19 プローブカード、それを備えた電子部品試験装置、及び、プローブ針のクリーニング決定方法

Country Status (1)

Country Link
WO (1) WO2009066366A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104681093A (zh) * 2014-12-26 2015-06-03 复旦大学 一种半导体存储器件电学参数测试系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05297021A (ja) * 1992-04-24 1993-11-12 Nec Corp プローブカード
JPH10209231A (ja) * 1997-01-17 1998-08-07 Nippon Steel Corp プローブ装置及びプローブ装置による検査方法
JP2005164411A (ja) * 2003-12-03 2005-06-23 Seiko Epson Corp Icソケット及び半導体装置の検査方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05297021A (ja) * 1992-04-24 1993-11-12 Nec Corp プローブカード
JPH10209231A (ja) * 1997-01-17 1998-08-07 Nippon Steel Corp プローブ装置及びプローブ装置による検査方法
JP2005164411A (ja) * 2003-12-03 2005-06-23 Seiko Epson Corp Icソケット及び半導体装置の検査方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104681093A (zh) * 2014-12-26 2015-06-03 复旦大学 一种半导体存储器件电学参数测试系统

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