WO2009060048A1 - Verfahren zum laserritzen von spröden bauteilen - Google Patents
Verfahren zum laserritzen von spröden bauteilen Download PDFInfo
- Publication number
- WO2009060048A1 WO2009060048A1 PCT/EP2008/065096 EP2008065096W WO2009060048A1 WO 2009060048 A1 WO2009060048 A1 WO 2009060048A1 EP 2008065096 W EP2008065096 W EP 2008065096W WO 2009060048 A1 WO2009060048 A1 WO 2009060048A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- laser scribe
- laser
- line
- crossing point
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
Definitions
- the invention relates to a method for laser scribing of brittle components in preparation for its subsequent separation according to the preamble of claim 1 and a component which has been processed by this method.
- Such a method is used to replace mechanical cutting methods and has established itself as laser drilling in the scratching technique.
- Blind holes are lined up in a line and serve as predetermined breaking edges in brittle materials such as metal casting or ceramics. This method is also used for separating ceramic plates.
- Undefined crossing points can change the break at the intersections in any direction, resulting in the failure of the parts.
- the invention has for its object to provide a method for laser scribing, which ensures that when separating the break always runs along the laser scribe line, deviations deviating from the laser scribe line are avoided and the corners of the items are evenly shaped after breaking.
- This object is achieved according to the invention by introducing into the crossing point at least one selectively controlled and not accidentally generated crossing point injection, which weakens the component at the point of intersection. This ensures that the break always runs along the laser scribe line. Deviations from the laser scribe line are avoided and the corners of the individual parts are evenly shaped after breaking.
- At least one further time targeted control is injected into the crossing point. This specifically weakens the crossing point.
- Shots are controlled in the crossing point so that their depth is equal to or greater than the depth of the shots surrounding the crossing point on the laser scribe lines.
- a greater depth means a greater weakening of the component at the crossing point.
- Area of the crossing point in this case form a T-shape and not an x-shape. But this is also understood as a crossing point.
- laser scribe lines are placed on two opposite surfaces of the component so that they are located on two intersecting planes and the intersection point bullet points are on the intersection line of the planes. This greatly facilitates breaking along the laser scribe lines.
- At least one further deliberately controlled and not accidentally occurring shot is preferably also introduced in shots which do not lie at any crossing point. As a result, the entire laser scribe line is weakened.
- the shots and thus the laser scribe lines are preferably introduced so that after the breaking of the laser-scritted component along the laser scribe lines at least 3 individual parts.
- the laser scribe lines do not have to be straight, but can also run in curved lines.
- all crossing points are weakened by at least two selectively controlled crossing point injections. This ensures that all intersections are really weakened.
- a component produced by the method just described preferably consists of ceramics, such as aluminum oxides, zirconium oxides, aluminum nitrides, silicon nitrides or glass. It is also possible to use combinations of these materials.
- the component holes or notches are introduced in one embodiment.
- the slitting can be done simultaneously with the introduction of these holes or notches.
- the components are plate-shaped and consist of a ceramic with a thickness less than or equal to 1, 7 mm. This thickness is particularly suitable for the method according to the invention described.
- the components preferably have at least two plane-parallel surfaces. This simplifies the production. However, the components can also be formed in three dimensions.
- intersecting laser scribe lines are at an angle of 90 ° +/- 1 °, i. arranged at right angles to each other. As a result, rectangular components are produced after breaking.
- the components are preferably ceramic plates which are used as substrates for electronic or electrical components.
- FIG. 6 shows the laser scribing according to the prior art with reference to three embodiments.
- a component 8 On a component 8, sack-like shots 1 of a laser beam are introduced in preparation for its subsequent separation. These bullets 1 are lined up in a line and form a laser scribe line 2, which serves as a break initiation line during later breakage of the component into individual smaller components.
- a laser scribe line 2 is understood here and in the entire description of this invention to be an imaginary line which leads through the center of all the shots 1.
- On the component 8 at least two laser scribe lines 2 crossing each other in a crossing point 3 are introduced.
- the bullets 1 in the region 13 of the crossing points 3 are arranged at random. They can be arranged next to one another in the region 13 (FIG. 6b), overlapping (FIG. 6a) or touching one another (FIG. 6c).
- the break initiation line is not sharply defined at the intersection. As a result, the break at the crossing points can be changed in any direction, resulting in failure
- FIG. 1 shows the invention schematically on the basis of two laser scribe lines 2 on a component 8, which lead through the center of all the injections 1.
- a purposefully controlled and not accidentally generated intersection point margin 4 is introduced, which weakens the component 8 at the intersection point 3 in a targeted manner. Even if one or more shots have been introduced by chance into the region 13 (see FIG. 6) around the point of intersection, at least one intersection point shot 4 that is controlled in a controlled manner and does not occur by chance is always generated
- intersection point margin 4 is meant a shot into the intersection point 3 of the laser scribe lines 2.
- FIG. 2 shows a component 8 with a surface 9a into which shots 1 were introduced with a laser beam which form two laser scribe lines 2.
- a crossing point shot 4 has been introduced.
- the depth of the shots 1 is indicated by the reference numeral 14a
- the depth of the crossing point shank 4 is designated by the reference numeral 14b.
- the depth 14b of the intersection point bullet 4 is greater than the depth 14a of the bullets 1.
- the crossing point 3 is purposefully more weakened than the surrounding ones
- FIG. 1 also illustrates an angular bore 7 in the component 8, i. the component 8 can be formed arbitrarily, depending on the application.
- FIG. 3 shows a component 8 with two laser scribe lines 2, one of which ends at the intersection point 3 of the other laser scribe line. This intersection point 3 is weakened with a crossing point shot 4.
- the laser scribe lines 2 in the region of the crossing point 3 in this case form a T-shape and not an x-shape. But this is also understood as a crossing point.
- FIG. 4 shows a component 8 with two surfaces 9a, 9b on which shots 1 intersect laser scribe lines 2.
- the laser scribe lines 2 are arranged so that they are located on two intersecting planes 10a, 10b, wherein a first plane 10a is formed by the laser scribe lines 2a, 2b and the second plane 10b is formed by the laser scribe lines 2c, 2d.
- a first plane 10a is formed by the laser scribe lines 2a, 2b
- the second plane 10b is formed by the laser scribe lines 2c, 2d.
- FIG. 5 shows a plate-shaped component 8 with a thickness S of 1.7 mm and with a surface 9a on the laser scribe lines 2.
- Each two intersecting laser scribe lines 2 form an angle ⁇ of 90 ° + - 1 ° to each other.
- the crossing points 3 at least one specifically controlled and not accidentally generated crossing point shot 4 is introduced, which is the component
- Such plate-shaped components 8 weakens specifically at the intersection point 3.
- Such plate-shaped components 8 are ceramic plates which are used as substrates for electronic or electrical components. Its thickness S is preferably less than or equal to 1.7 mm.
- the position tolerance of the double shots is maximum +/- 30 ⁇ m. This ensures that the break always runs along the laser scribe line. Fractures deviating from the laser scribe line are avoided. The corners of the items after breaking are evenly shaped.
- the object of this invention was to perforate a component targeted controlled by laser scribing.
- the component remains as one piece after laser scribing and can be broken at a later time by applying an external force along the laser scribe lines.
- the laser system is controlled so that at least one intersecting point of at least two laser lines with any angle of the cutting lines at least one deliberately introduced introduced (not accidentally incurred) bullet on a surface of the part.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08848569A EP2209586A1 (de) | 2007-11-07 | 2008-11-07 | Verfahren zum laserritzen von spröden bauteilen |
US12/741,429 US20100247836A1 (en) | 2007-11-07 | 2008-11-07 | Method for the laser ablation of brittle components |
CN2008801152235A CN101939129A (zh) | 2007-11-07 | 2008-11-07 | 用于激光蚀刻脆性构件的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007000647.2 | 2007-11-07 | ||
DE102007000647 | 2007-11-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009060048A1 true WO2009060048A1 (de) | 2009-05-14 |
Family
ID=40317008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/065096 WO2009060048A1 (de) | 2007-11-07 | 2008-11-07 | Verfahren zum laserritzen von spröden bauteilen |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100247836A1 (de) |
EP (1) | EP2209586A1 (de) |
CN (1) | CN101939129A (de) |
DE (1) | DE102008043539A1 (de) |
WO (1) | WO2009060048A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010112412A1 (de) * | 2009-03-31 | 2010-10-07 | Ceramtec Ag | Bauteil mit einer überlappendenden laserspur; verfahren zur herstellung eines solchen bauteils |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101442067B1 (ko) * | 2011-12-22 | 2014-09-19 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료 기판의 할단 방법 |
DE102012212131A1 (de) * | 2012-07-11 | 2014-06-26 | Semikron Elektronik Gmbh & Co. Kg | Substrat und Verfahren zur Bruchvorbereitung eines Substrats für mindestens ein Leistungshalbleiterbauelement |
JP6218646B2 (ja) * | 2014-03-06 | 2017-10-25 | 株式会社ディスコ | レーザー加工方法 |
CN103862179A (zh) * | 2014-03-12 | 2014-06-18 | 北京工业大学 | 一种陶瓷表面精细刻线结构激光加工方法 |
GB201505042D0 (en) * | 2015-03-25 | 2015-05-06 | Nat Univ Ireland | Methods and apparatus for cutting a substrate |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6236446B1 (en) * | 1997-09-25 | 2001-05-22 | Sharp Kabushiki Kaisha | Methods for cutting electric circuit carrying substrates and for using cut substrates in display panel fabrication |
US6407360B1 (en) * | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
WO2002048059A1 (de) * | 2000-12-15 | 2002-06-20 | Lzh Laserzentrum Hannover E.V. | Verfahren zum durchtrennen von bauteilen aus glas, keramik, glaskeramik oder dergleichen durch erzeugung eines thermischen spannungsrisses an dem bauteil entlang einer trennzone |
EP1518634A1 (de) * | 2003-09-23 | 2005-03-30 | Advanced Laser Separation International (ALSI) B.V. | Ein Verfahren und eine Vorrichtung zur Vereinzelung von in einer Waffel aus halbleitendem Material geformten Hableiter-Bauteilen |
DE102005022530A1 (de) * | 2004-05-18 | 2006-01-26 | Disco Corp. | Waferteilungsverfahren |
US20060134885A1 (en) * | 2004-12-17 | 2006-06-22 | Seiko Epson Corporation | Method of machining substrate and method of manufacturing element |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60124485A (ja) * | 1983-12-09 | 1985-07-03 | Ngk Spark Plug Co Ltd | セラミツク基板のレ−ザ−加工方法およびその基板 |
JPH0687085A (ja) * | 1992-09-10 | 1994-03-29 | Taiyo Yuden Co Ltd | セラミック基板の分割方法 |
JPH07273069A (ja) * | 1994-03-31 | 1995-10-20 | Nichia Chem Ind Ltd | 窒化ガリウム系化合物半導体チップの製造方法 |
US5578229A (en) * | 1994-10-18 | 1996-11-26 | Michigan State University | Method and apparatus for cutting boards using opposing convergent laser beams |
JPH0929472A (ja) * | 1995-07-14 | 1997-02-04 | Hitachi Ltd | 割断方法、割断装置及びチップ材料 |
EP0820640B1 (de) * | 1996-02-09 | 2011-07-13 | Advanced Laser Separation International (ALSI) B.V. | Lasertrennung von in einem halbleiterblättchen gebildetem halbleiterbauelement |
DE19827414C2 (de) * | 1998-06-19 | 2000-05-31 | Schulz Harder Juergen | Verfahren zum Herstellen eines Metall-Keramik-Substrates |
US6987786B2 (en) * | 1998-07-02 | 2006-01-17 | Gsi Group Corporation | Controlling laser polarization |
US6676878B2 (en) * | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
JP2002172479A (ja) * | 2000-09-20 | 2002-06-18 | Seiko Epson Corp | レーザ割断方法、レーザ割断装置、液晶装置の製造方法並びに液晶装置の製造装置 |
US6639177B2 (en) * | 2001-03-29 | 2003-10-28 | Gsi Lumonics Corporation | Method and system for processing one or more microstructures of a multi-material device |
SG108262A1 (en) * | 2001-07-06 | 2005-01-28 | Inst Data Storage | Method and apparatus for cutting a multi-layer substrate by dual laser irradiation |
DE60335538D1 (de) * | 2002-03-12 | 2011-02-10 | Hamamatsu Photonics Kk | Verfahren zum schneiden eines bearbeiteten objekts |
US6744009B1 (en) * | 2002-04-02 | 2004-06-01 | Seagate Technology Llc | Combined laser-scribing and laser-breaking for shaping of brittle substrates |
US7129114B2 (en) * | 2004-03-10 | 2006-10-31 | Micron Technology, Inc. | Methods relating to singulating semiconductor wafers and wafer scale assemblies |
US7772605B2 (en) * | 2004-03-19 | 2010-08-10 | Showa Denko K.K. | Compound semiconductor light-emitting device |
JP2006269897A (ja) * | 2005-03-25 | 2006-10-05 | Disco Abrasive Syst Ltd | ウエーハのレーザー加工方法 |
JP2007242787A (ja) * | 2006-03-07 | 2007-09-20 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
-
2008
- 2008-11-07 EP EP08848569A patent/EP2209586A1/de not_active Withdrawn
- 2008-11-07 CN CN2008801152235A patent/CN101939129A/zh active Pending
- 2008-11-07 US US12/741,429 patent/US20100247836A1/en not_active Abandoned
- 2008-11-07 WO PCT/EP2008/065096 patent/WO2009060048A1/de active Application Filing
- 2008-11-07 DE DE102008043539A patent/DE102008043539A1/de not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6236446B1 (en) * | 1997-09-25 | 2001-05-22 | Sharp Kabushiki Kaisha | Methods for cutting electric circuit carrying substrates and for using cut substrates in display panel fabrication |
US6407360B1 (en) * | 1998-08-26 | 2002-06-18 | Samsung Electronics, Co., Ltd. | Laser cutting apparatus and method |
WO2002048059A1 (de) * | 2000-12-15 | 2002-06-20 | Lzh Laserzentrum Hannover E.V. | Verfahren zum durchtrennen von bauteilen aus glas, keramik, glaskeramik oder dergleichen durch erzeugung eines thermischen spannungsrisses an dem bauteil entlang einer trennzone |
EP1518634A1 (de) * | 2003-09-23 | 2005-03-30 | Advanced Laser Separation International (ALSI) B.V. | Ein Verfahren und eine Vorrichtung zur Vereinzelung von in einer Waffel aus halbleitendem Material geformten Hableiter-Bauteilen |
DE102005022530A1 (de) * | 2004-05-18 | 2006-01-26 | Disco Corp. | Waferteilungsverfahren |
US20060134885A1 (en) * | 2004-12-17 | 2006-06-22 | Seiko Epson Corporation | Method of machining substrate and method of manufacturing element |
Non-Patent Citations (1)
Title |
---|
See also references of EP2209586A1 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010112412A1 (de) * | 2009-03-31 | 2010-10-07 | Ceramtec Ag | Bauteil mit einer überlappendenden laserspur; verfahren zur herstellung eines solchen bauteils |
US8822003B2 (en) | 2009-03-31 | 2014-09-02 | Ceramtec Gmbh | Component having an overlapping laser track; method for producing such a component |
Also Published As
Publication number | Publication date |
---|---|
DE102008043539A1 (de) | 2009-05-14 |
US20100247836A1 (en) | 2010-09-30 |
EP2209586A1 (de) | 2010-07-28 |
CN101939129A (zh) | 2011-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009060048A1 (de) | Verfahren zum laserritzen von spröden bauteilen | |
DE3343786C2 (de) | ||
DD222152A5 (de) | Thermistor sowie verfahren zu dessen herstellung | |
EP0562141A1 (de) | Schmucksteinfassung | |
DE102010061321A1 (de) | Verfahren zum Fräsen einer Ausnehmung in einem Werkstück und Werkstück mit einer Ausnehmung | |
EP3597020B1 (de) | Explosionsgeschütztes gehäuse und verfahren zu dessen herstellung | |
CH688306A5 (de) | Verfahren und Einrichtung zum Stanzen von Loechernin ein flaches Werkstueck. | |
DE102011010317B4 (de) | Bauelement mit Lotstoppvertiefung | |
EP1726192A1 (de) | Leiterplatte mit wenigstens einer anschlussbohrung für einen anschlussdraht bzw. -pin eines bedrahteten elektronischen bauteils | |
DE10225159B4 (de) | Anlage zur Herstellung von Gipskarton-Lochplatten sowie Verfahren zur Herstellung von Gipskarton-Lochplatten und deren Verlegung | |
EP2414132B1 (de) | Bauteil mit einer überlappendenden laserspur; verfahren zur herstellung eines solchen bauteils | |
DE102016113571A1 (de) | Gewindebohrer und Verfahren | |
DE102006035357B4 (de) | Hydraulische Einheit | |
EP1738622B8 (de) | Leiterplattennutzen mit einer vielzahl an schaltungsträgern und verfahren zum vereinzeln von schaltungsträgern aus einem leiterplattennutzen | |
DE102013113030A1 (de) | Verfahren zur Kantenverrundung von Halbleiter-Wafern | |
DE3933765C2 (de) | Dichtungselement und Verfahren zur Herstellung | |
EP2151149A1 (de) | Chip-resistor-substrat | |
DE102011078792A1 (de) | Schraubverbindung zwischen zwei Maschinenteilen mit erhöhter Belastbarkeit | |
DE10105893A1 (de) | Verbundkörper und Verfahren zu dessen Herstellung | |
DE10222284B4 (de) | Bauteilpaarung und Verfahren zur Einstellung der Materialfließfähigkeit zumindest eines Bauteils einer Bauteilpaarung | |
DE19930639A1 (de) | Verfahren und Vorrichtung zum Zertrennen eines plattenförmigen Gegenstands | |
EP1287915A1 (de) | Klebeadapter für Ausbeulgerät | |
EP3535080B1 (de) | Bohrwerkzeug | |
EP0491919A1 (de) | Verfahren zum herstellen einer spitze bei einem kontaktstift sowie werkzeug zum durchführen des verfahrens | |
DE102013007764A1 (de) | Mehrschichtiger Datenträger |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880115223.5 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08848569 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12741429 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2008848569 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008848569 Country of ref document: EP |