WO2009054523A1 - フレキシブルプリント配線板、それを用いたインレットシート、ｒｆｉｄメディア及びその製造方法 - Google Patents

フレキシブルプリント配線板、それを用いたインレットシート、ｒｆｉｄメディア及びその製造方法 Download PDF

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Publication number
WO2009054523A1
WO2009054523A1 PCT/JP2008/069415 JP2008069415W WO2009054523A1 WO 2009054523 A1 WO2009054523 A1 WO 2009054523A1 JP 2008069415 W JP2008069415 W JP 2008069415W WO 2009054523 A1 WO2009054523 A1 WO 2009054523A1
Authority
WO
WIPO (PCT)
Prior art keywords
rfid media
circuit board
printed circuit
flexible printed
producing
Prior art date
Application number
PCT/JP2008/069415
Other languages
English (en)
French (fr)
Inventor
Mutsuo Nishi
Yoshinori Itsuki
Yasushi Sasaki
Seiichiro Yokoyama
Original Assignee
Toyo Boseki Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007278471A external-priority patent/JP5157366B2/ja
Priority claimed from JP2007278470A external-priority patent/JP2009110987A/ja
Application filed by Toyo Boseki Kabushiki Kaisha filed Critical Toyo Boseki Kabushiki Kaisha
Priority to CN200880113333.8A priority Critical patent/CN101836512A/zh
Publication of WO2009054523A1 publication Critical patent/WO2009054523A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514—Oriented
    • B32B2307/518—Oriented bi-axially
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

【課題】ＲＦＩＤメディアに用いるに好適なＦＰＣを提供し、また生産速度と不良品発生率、電気的品質、製品外観を改善したＲＦＩＤメディア及びその製造方法を提供する。 【解決手段】共押出しにより熱接着層及び基材層を形成した二軸延伸ポリエステルフィルムと、熱接着層を介して該二軸延伸ポリエステルフィルム表面に接着された金属箔からなる積層体をエッチング処理して製造されたフレキシブルプリント配線板において、二軸延伸ポリエステルフィルムの基材層が２００～３００°Cに融点を有し、熱接着層がワックスを含有するポリエステル樹脂からなること特徴とするフレキシブルプリント配線板。
PCT/JP2008/069415 2007-10-26 2008-10-27 フレキシブルプリント配線板、それを用いたインレットシート、ｒｆｉｄメディア及びその製造方法 WO2009054523A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200880113333.8A CN101836512A (zh) 2007-10-26 2008-10-27 挠性印刷电路布线板、使用其的引入片、rfid媒介及其制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-278470 2007-10-26
JP2007278471A JP5157366B2 (ja) 2007-10-26 2007-10-26 Ｒｆｉｄメディアの製造方法
JP2007278470A JP2009110987A (ja) 2007-10-26 2007-10-26 フレキシブルプリント配線板、それを用いたインレットシート及びｒｆｉｄメディア
JP2007-278471 2007-10-26

Publications (1)

Publication Number Publication Date
WO2009054523A1 true WO2009054523A1 (ja) 2009-04-30

Family

ID=40579624

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069415 WO2009054523A1 (ja) 2007-10-26 2008-10-27 フレキシブルプリント配線板、それを用いたインレットシート、ｒｆｉｄメディア及びその製造方法

Country Status (4)

Country Link
KR (1) KR20100082360A (ja)
CN (1) CN101836512A (ja)
TW (1) TW200932523A (ja)
WO (1) WO2009054523A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101022697B1 (ko) * 2010-09-06 2011-03-22 (주)유엘티 알에프아이디 태그 안테나 제조에 있어서의 회로형성을 위한 알루미늄박 에칭공정
CN103538341B (zh) * 2012-07-17 2015-11-25 昆山雅森电子材料科技有限公司 热滚压合设备
CN105365304A (zh) * 2015-12-18 2016-03-02 无锡科睿坦电子科技有限公司 基于不透明pet薄膜的rfid标签天线及其制作工艺
CN112188741A (zh) * 2018-05-11 2021-01-05 张海根 下压式褶皱柔性pcb电子器件制备整机的制作方法
CN114195399A (zh) * 2020-09-18 2022-03-18 徐强 一种连续法生产柔性玻璃卷材的化学减薄工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155158A (ja) * 2000-11-21 2002-05-28 Teijin Ltd 光学用易接着性積層フィルム
JP2002270975A (ja) * 2001-03-07 2002-09-20 Toyo Kohan Co Ltd Ｉｃカード用基板、ｉｃカード用基板の製造方法、それらを用いたｉｃカード用コイル付き基板、およびそれらを用いたｉｃカード
JP2003078225A (ja) * 2001-09-06 2003-03-14 Taisei Laminator Co Ltd ラミネートフィルム
JP2005209171A (ja) * 2003-12-25 2005-08-04 Toyobo Co Ltd Ｉｃカードまたはｉｃタグの製造方法及びこれに用いる延伸プラスチックフィルム
JP2006155224A (ja) * 2004-11-29 2006-06-15 Mitsubishi Polyester Film Copp Ｒｆｉｄタグ用ポリエステルフィルム
JP2007131006A (ja) * 2005-04-28 2007-05-31 Toyobo Co Ltd Ｉｃカードまたはｉｃタグ用熱接着性ポリエステルフィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002155158A (ja) * 2000-11-21 2002-05-28 Teijin Ltd 光学用易接着性積層フィルム
JP2002270975A (ja) * 2001-03-07 2002-09-20 Toyo Kohan Co Ltd Ｉｃカード用基板、ｉｃカード用基板の製造方法、それらを用いたｉｃカード用コイル付き基板、およびそれらを用いたｉｃカード
JP2003078225A (ja) * 2001-09-06 2003-03-14 Taisei Laminator Co Ltd ラミネートフィルム
JP2005209171A (ja) * 2003-12-25 2005-08-04 Toyobo Co Ltd Ｉｃカードまたはｉｃタグの製造方法及びこれに用いる延伸プラスチックフィルム
JP2006155224A (ja) * 2004-11-29 2006-06-15 Mitsubishi Polyester Film Copp Ｒｆｉｄタグ用ポリエステルフィルム
JP2007131006A (ja) * 2005-04-28 2007-05-31 Toyobo Co Ltd Ｉｃカードまたはｉｃタグ用熱接着性ポリエステルフィルム

Also Published As

Publication number Publication date
KR20100082360A (ko) 2010-07-16
TW200932523A (en) 2009-08-01
CN101836512A (zh) 2010-09-15

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