WO2009054403A1 - 円盤状基板の検査装置 - Google Patents

円盤状基板の検査装置 Download PDF

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Publication number
WO2009054403A1
WO2009054403A1 PCT/JP2008/069125 JP2008069125W WO2009054403A1 WO 2009054403 A1 WO2009054403 A1 WO 2009054403A1 JP 2008069125 W JP2008069125 W JP 2008069125W WO 2009054403 A1 WO2009054403 A1 WO 2009054403A1
Authority
WO
WIPO (PCT)
Prior art keywords
disk
shaped substrate
thetav
captured image
inspection device
Prior art date
Application number
PCT/JP2008/069125
Other languages
English (en)
French (fr)
Inventor
Yoshinori Hayashi
Hiroshi Wakaba
Yoko Ono
Koichi Miyazono
Hideki Mori
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007275174A external-priority patent/JP5183146B2/ja
Priority claimed from JP2007275175A external-priority patent/JP5183147B2/ja
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to US12/738,760 priority Critical patent/US8488867B2/en
Priority to DE112008002813T priority patent/DE112008002813T5/de
Priority to KR1020107007872A priority patent/KR101202883B1/ko
Publication of WO2009054403A1 publication Critical patent/WO2009054403A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Abstract

【課題】円盤状基板の表面に形成される膜層の形成位置を精度良く定量的に検査することのできる円盤状基板の検査装置を提供すること。 【解決手段】膜層の形成された円盤状基板の検査装置であって、円盤状基板の外周部分における所定面を撮影する撮影部から順次出力される画像信号に基づいて、撮影視野範囲に対応した撮影画像を表す撮影画像データを生成し、前記撮影画像データから、前記撮影画像上における前記所定面に対応した面画像部分ＩSaとその外側画像部分ＩBKLとの境界線Ｅ15aの前記周方向の各位置（θ）での縦方向位置ＹE15aL（θ）を基準にして、前記面画像ＩSa上の膜層２４に対応した膜層画像部分ＩSa（２４）の縁線Ｅ24の前記周方向の対応した位置（θ）での縦方向位置を表す膜層縁位置情報Ｙ4E24（θ）を生成するようにした。
PCT/JP2008/069125 2007-10-23 2008-10-22 円盤状基板の検査装置 WO2009054403A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/738,760 US8488867B2 (en) 2007-10-23 2008-10-22 Inspection device for disk-shaped substrate
DE112008002813T DE112008002813T5 (de) 2007-10-23 2008-10-22 Prüfvorrichtung für scheibenförmige Substrate
KR1020107007872A KR101202883B1 (ko) 2007-10-23 2008-10-22 원반형 기판의 검사 장치

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007275174A JP5183146B2 (ja) 2007-10-23 2007-10-23 円盤状基板の検査装置
JP2007275175A JP5183147B2 (ja) 2007-10-23 2007-10-23 円盤状基板の検査装置
JP2007-275175 2007-10-23
JP2007-275174 2007-10-23

Publications (1)

Publication Number Publication Date
WO2009054403A1 true WO2009054403A1 (ja) 2009-04-30

Family

ID=40579507

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/069125 WO2009054403A1 (ja) 2007-10-23 2008-10-22 円盤状基板の検査装置

Country Status (4)

Country Link
US (1) US8488867B2 (ja)
KR (1) KR101202883B1 (ja)
DE (1) DE112008002813T5 (ja)
WO (1) WO2009054403A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9796045B2 (en) * 2013-12-19 2017-10-24 Sunpower Corporation Wafer alignment with restricted visual access
WO2019198458A1 (ja) * 2018-04-13 2019-10-17 株式会社Sumco 半導体ウェーハの評価方法および半導体ウェーハの製造方法
EP4297113A1 (de) * 2022-06-20 2023-12-27 Sonplas GmbH Prüfvorrichtung und verfahren zum prüfen von elektrodenfolien
US11828713B1 (en) 2022-06-30 2023-11-28 Camtek Ltd Semiconductor inspection tool system and method for wafer edge inspection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005008170A2 (en) * 2003-07-14 2005-01-27 August Technology Corporation Edge normal process
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法
JP2007218889A (ja) * 2006-02-15 2007-08-30 Nippon Electro Sensari Device Kk 表面欠陥検出方法および表面欠陥検出装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5258844A (en) * 1990-07-13 1993-11-02 Casio Computer Co., Ltd. Video camera apparatus having an image projection function
JP3629244B2 (ja) 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
JP2007142181A (ja) 2005-11-18 2007-06-07 Toshiba Corp 基板処理方法及びリンス装置
US8433102B2 (en) 2005-12-06 2013-04-30 Shibaura Mechatronics Corporation Surface roughness inspection system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005008170A2 (en) * 2003-07-14 2005-01-27 August Technology Corporation Edge normal process
WO2006059647A1 (ja) * 2004-11-30 2006-06-08 Shibaura Mechatronics Corporation 表面検査装置及び表面検査方法
JP2007218889A (ja) * 2006-02-15 2007-08-30 Nippon Electro Sensari Device Kk 表面欠陥検出方法および表面欠陥検出装置

Also Published As

Publication number Publication date
DE112008002813T5 (de) 2011-01-27
US20100246934A1 (en) 2010-09-30
KR101202883B1 (ko) 2012-11-19
KR20100050578A (ko) 2010-05-13
US8488867B2 (en) 2013-07-16

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