WO2009054092A1 - 表面処理装置 - Google Patents
表面処理装置 Download PDFInfo
- Publication number
- WO2009054092A1 WO2009054092A1 PCT/JP2008/002734 JP2008002734W WO2009054092A1 WO 2009054092 A1 WO2009054092 A1 WO 2009054092A1 JP 2008002734 W JP2008002734 W JP 2008002734W WO 2009054092 A1 WO2009054092 A1 WO 2009054092A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- treatment
- surface treatment
- end area
- treatment device
- flowing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Coating Apparatus (AREA)
- Chemically Coating (AREA)
- Absorbent Articles And Supports Therefor (AREA)
Abstract
表面処理液が、処理を所望しない裏面側へ回り込むことを防止しつつ、被処理面の端部領域も高精度に処理を施すことが可能な表面処理装置を提供する。表面処理装置(1)は、処理液Xをシート材(10)の被処理面(16)に沿って流下させて表面処理を施す表面処理装置(1)であって、端部領域処理面(17c)を有する端部領域処理部(3)を備えている。端部領域処理面(17c)は、シート材(10)の被処理面(16)に対して、微小隙間を介して対向して設けられている。そして、端部領域処理部(3)の下端部(17a)は、供給ガイド面(13)上を流れる処理液Xの一部に対して接するように配置されている。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007279510A JP2011006715A (ja) | 2007-10-26 | 2007-10-26 | 表面処理装置 |
JP2007-279510 | 2007-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009054092A1 true WO2009054092A1 (ja) | 2009-04-30 |
Family
ID=40579202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/002734 WO2009054092A1 (ja) | 2007-10-26 | 2008-09-30 | 表面処理装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2011006715A (ja) |
TW (1) | TW200925331A (ja) |
WO (1) | WO2009054092A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6403739B2 (ja) * | 2016-09-27 | 2018-10-10 | 上村工業株式会社 | 表面処理装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60262991A (ja) * | 1984-06-08 | 1985-12-26 | Hitachi Cable Ltd | 液流下式めつき方法 |
JPS61127895A (ja) * | 1984-11-26 | 1986-06-16 | Hitachi Cable Ltd | 帯状体への片面メッキ方法 |
JP2003129281A (ja) * | 2001-10-26 | 2003-05-08 | Alps Electric Co Ltd | 電解処理装置、電解処理方法 |
-
2007
- 2007-10-26 JP JP2007279510A patent/JP2011006715A/ja active Pending
-
2008
- 2008-09-30 WO PCT/JP2008/002734 patent/WO2009054092A1/ja active Application Filing
- 2008-09-30 TW TW97137474A patent/TW200925331A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60262991A (ja) * | 1984-06-08 | 1985-12-26 | Hitachi Cable Ltd | 液流下式めつき方法 |
JPS61127895A (ja) * | 1984-11-26 | 1986-06-16 | Hitachi Cable Ltd | 帯状体への片面メッキ方法 |
JP2003129281A (ja) * | 2001-10-26 | 2003-05-08 | Alps Electric Co Ltd | 電解処理装置、電解処理方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2011006715A (ja) | 2011-01-13 |
TW200925331A (en) | 2009-06-16 |
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