WO2009044530A1 - 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体 - Google Patents

表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体 Download PDF

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Publication number
WO2009044530A1
WO2009044530A1 PCT/JP2008/002715 JP2008002715W WO2009044530A1 WO 2009044530 A1 WO2009044530 A1 WO 2009044530A1 JP 2008002715 W JP2008002715 W JP 2008002715W WO 2009044530 A1 WO2009044530 A1 WO 2009044530A1
Authority
WO
WIPO (PCT)
Prior art keywords
surface treatment
band
shaped thin
thin body
treatment device
Prior art date
Application number
PCT/JP2008/002715
Other languages
English (en)
French (fr)
Inventor
Izumi Ito
Hirofumi Asada
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Publication of WO2009044530A1 publication Critical patent/WO2009044530A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Coating Apparatus (AREA)

Abstract

　表面処理装置（１０）は、略鉛直方向に沿って配置された帯状薄体（Ｓ）における被処理面に沿って所定の表面処理液（Ｘ）を流下させて表面処理を行う装置である。そして、表面処理装置（１０）は、略鉛直方向に沿って配置された帯状薄体（Ｓ）に対して所定の微小な隙間（ｄ）を介して近接配置された壁部（１２ｂ）と、この隙間（ｄ）内において流下する表面処理液（Ｘ）を供給する供給部（１３）と、を備えている。
PCT/JP2008/002715 2007-10-02 2008-09-29 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体 WO2009044530A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-259182 2007-10-02
JP2007259182A JP2010280925A (ja) 2007-10-02 2007-10-02 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体

Publications (1)

Publication Number Publication Date
WO2009044530A1 true WO2009044530A1 (ja) 2009-04-09

Family

ID=40525962

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002715 WO2009044530A1 (ja) 2007-10-02 2008-09-29 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体

Country Status (3)

Country Link
JP (1) JP2010280925A (ja)
TW (1) TW200916612A (ja)
WO (1) WO2009044530A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102343338A (zh) * 2010-07-22 2012-02-08 株式会社电装 清洁和干燥方法和装置
JP2012024685A (ja) * 2010-07-22 2012-02-09 Denso Corp 洗浄乾燥方法及び洗浄乾燥装置
JP2014043613A (ja) * 2012-08-27 2014-03-13 C Uyemura & Co Ltd 表面処理装置
JP2017025414A (ja) * 2016-11-09 2017-02-02 上村工業株式会社 表面処理装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106350840B (zh) * 2016-11-04 2018-06-29 北京曙光航空电气有限责任公司 一种大长径比空心轴零件内壁表面防护方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262991A (ja) * 1984-06-08 1985-12-26 Hitachi Cable Ltd 液流下式めつき方法
JPS61127895A (ja) * 1984-11-26 1986-06-16 Hitachi Cable Ltd 帯状体への片面メッキ方法
JP2003129281A (ja) * 2001-10-26 2003-05-08 Alps Electric Co Ltd 電解処理装置、電解処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262991A (ja) * 1984-06-08 1985-12-26 Hitachi Cable Ltd 液流下式めつき方法
JPS61127895A (ja) * 1984-11-26 1986-06-16 Hitachi Cable Ltd 帯状体への片面メッキ方法
JP2003129281A (ja) * 2001-10-26 2003-05-08 Alps Electric Co Ltd 電解処理装置、電解処理方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102343338A (zh) * 2010-07-22 2012-02-08 株式会社电装 清洁和干燥方法和装置
JP2012024685A (ja) * 2010-07-22 2012-02-09 Denso Corp 洗浄乾燥方法及び洗浄乾燥装置
CN102343338B (zh) * 2010-07-22 2014-05-07 株式会社电装 清洁和干燥方法和装置
US8795436B2 (en) 2010-07-22 2014-08-05 Denso Corporation Cleaning and drying method and apparatus
JP2014043613A (ja) * 2012-08-27 2014-03-13 C Uyemura & Co Ltd 表面処理装置
JP2017025414A (ja) * 2016-11-09 2017-02-02 上村工業株式会社 表面処理装置

Also Published As

Publication number Publication date
TW200916612A (en) 2009-04-16
JP2010280925A (ja) 2010-12-16

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