WO2009044530A1 - 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体 - Google Patents

表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体 Download PDF

Info

Publication number
WO2009044530A1
WO2009044530A1 PCT/JP2008/002715 JP2008002715W WO2009044530A1 WO 2009044530 A1 WO2009044530 A1 WO 2009044530A1 JP 2008002715 W JP2008002715 W JP 2008002715W WO 2009044530 A1 WO2009044530 A1 WO 2009044530A1
Authority
WO
WIPO (PCT)
Prior art keywords
surface treatment
band
shaped thin
thin body
treatment device
Prior art date
Application number
PCT/JP2008/002715
Other languages
English (en)
French (fr)
Inventor
Izumi Ito
Hirofumi Asada
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Publication of WO2009044530A1 publication Critical patent/WO2009044530A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Coating Apparatus (AREA)

Abstract

　表面処理装置（１０）は、略鉛直方向に沿って配置された帯状薄体（Ｓ）における被処理面に沿って所定の表面処理液（Ｘ）を流下させて表面処理を行う装置である。そして、表面処理装置（１０）は、略鉛直方向に沿って配置された帯状薄体（Ｓ）に対して所定の微小な隙間（ｄ）を介して近接配置された壁部（１２ｂ）と、この隙間（ｄ）内において流下する表面処理液（Ｘ）を供給する供給部（１３）と、を備えている。
PCT/JP2008/002715 2007-10-02 2008-09-29 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体 WO2009044530A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007259182A JP2010280925A (ja) 2007-10-02 2007-10-02 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体
JP2007-259182 2007-10-02

Publications (1)

Publication Number Publication Date
WO2009044530A1 true WO2009044530A1 (ja) 2009-04-09

Family

ID=40525962

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002715 WO2009044530A1 (ja) 2007-10-02 2008-09-29 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体

Country Status (3)

Country Link
JP (1) JP2010280925A (ja)
TW (1) TW200916612A (ja)
WO (1) WO2009044530A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102343338A (zh) * 2010-07-22 2012-02-08 株式会社电装 清洁和干燥方法和装置
JP2012024685A (ja) * 2010-07-22 2012-02-09 Denso Corp 洗浄乾燥方法及び洗浄乾燥装置
JP2014043613A (ja) * 2012-08-27 2014-03-13 C Uyemura & Co Ltd 表面処理装置
JP2017025414A (ja) * 2016-11-09 2017-02-02 上村工業株式会社 表面処理装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106350840B (zh) * 2016-11-04 2018-06-29 北京曙光航空电气有限责任公司 一种大长径比空心轴零件内壁表面防护方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262991A (ja) * 1984-06-08 1985-12-26 Hitachi Cable Ltd 液流下式めつき方法
JPS61127895A (ja) * 1984-11-26 1986-06-16 Hitachi Cable Ltd 帯状体への片面メッキ方法
JP2003129281A (ja) * 2001-10-26 2003-05-08 Alps Electric Co Ltd 電解処理装置、電解処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262991A (ja) * 1984-06-08 1985-12-26 Hitachi Cable Ltd 液流下式めつき方法
JPS61127895A (ja) * 1984-11-26 1986-06-16 Hitachi Cable Ltd 帯状体への片面メッキ方法
JP2003129281A (ja) * 2001-10-26 2003-05-08 Alps Electric Co Ltd 電解処理装置、電解処理方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102343338A (zh) * 2010-07-22 2012-02-08 株式会社电装 清洁和干燥方法和装置
JP2012024685A (ja) * 2010-07-22 2012-02-09 Denso Corp 洗浄乾燥方法及び洗浄乾燥装置
CN102343338B (zh) * 2010-07-22 2014-05-07 株式会社电装 清洁和干燥方法和装置
US8795436B2 (en) 2010-07-22 2014-08-05 Denso Corporation Cleaning and drying method and apparatus
JP2014043613A (ja) * 2012-08-27 2014-03-13 C Uyemura & Co Ltd 表面処理装置
JP2017025414A (ja) * 2016-11-09 2017-02-02 上村工業株式会社 表面処理装置

Also Published As

Publication number Publication date
TW200916612A (en) 2009-04-16
JP2010280925A (ja) 2010-12-16

Similar Documents

Publication Publication Date Title
EP2035691A4 (en) APPARATUS AND METHOD FOR REGULATING ENERGY POTENTIAL IN A FLUID COLUMN LOCATED IN A PIPE
PL2061605T3 (pl) Urządzenie i sposób kontrolowania prędkości przepływu cieczy kriogenicznej przez dyszę
TW200738543A (en) Method and apparatus for transporting a substrate using non-newtonian fluid
EP2105715A4 (en) FLOW RATE MEASURING DEVICE, RIVER RATE MEASUREMENT PROGRAM, FLOW RATE MEASURING PROCEDURE AND LIQUID FEEDING SYSTEM
SG146545A1 (en) A flow control assembly having a fixed flow control device and an adjustable flow control device
WO2010024888A3 (en) Non-contact manipulating devices and methods
WO2009044530A1 (ja) 表面処理装置および表面処理システム、表面処理方法、これによって処理された帯状薄体
EP1948860A4 (en) DEVICE FOR LEADING AND LEAVING A LIQUID AND OPERATING METHOD THEREFOR
TWI346357B (en) Apparatus and method for treating substrate, and injection head used in the apparatus
EP1830393A4 (en) PHOTORESISTANT COATING LIQUID FEEDING APPARATUS AND METHOD AND PHOTORESISTANT COATING APPARATUS USING THE FIRST PHOTORESISTANT COATING APPARATUS
WO2006030235A3 (en) Fluid supply method and apparatus
EP2103718A4 (en) METHOD FOR APPLYING A CERAMIC FILM TO METAL, ELECTROLYSIS SOLUTION FOR USE IN THE METHOD AND CERAMIC FILM AND METAL MATERIAL
IL176620A0 (en) Method for water hammer-less opening of fluid passages, chemical supply method using the same, and water hammer-less opening device
WO2009015023A3 (en) Method and apparatus for water distribution
TW200637660A (en) Coating apparatus and coating method
MX2008009579A (es) Metodo para el tratamiento de dolor neuropatico.
GB2471595B (en) System and method for controlling the flow of fluid in branched wells
TWI347220B (en) Nozzle assembly, apparatus for supplying processing solutions having the same and method of supplying processing solutions using the same
EP2022755A4 (en) HYDROGEN PRODUCTION SYSTEM AND METHOD FOR CONTROLLING THE FLOW RATE OF EXHAUST GAS IN THE SYSTEM
EP2211236A4 (en) SURFACE TREATMENT LIQUID FOR A CONDUCTIVE ELASTIC LAYER, METHOD FOR SURFACE TREATMENT OF THIS AND SURFACE TREATED CONDUCTIVE LINK
TW200724893A (en) Hydraulic device for a blood analysis apparatus, associated method and analysis apparatus equipped with such a device
WO2011133932A3 (en) Water sterilization devices including nanostructures and uses thereof
IL182407A0 (en) Use of agomelating in obtaining medicaments intended for the treatment of generalized anxiety disorder
TWI369590B (en) Treatment liquid for resist substrate, and method of treating resist substrate using the same
FR2943001B1 (fr) Procede de regulation d'un debit de flux d'air, dispositif mettant en oeuvre le procede et vehicule

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08834970

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08834970

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP