WO2009044527A1 - 転写装置 - Google Patents

転写装置 Download PDF

Info

Publication number
WO2009044527A1
WO2009044527A1 PCT/JP2008/002709 JP2008002709W WO2009044527A1 WO 2009044527 A1 WO2009044527 A1 WO 2009044527A1 JP 2008002709 W JP2008002709 W JP 2008002709W WO 2009044527 A1 WO2009044527 A1 WO 2009044527A1
Authority
WO
WIPO (PCT)
Prior art keywords
stamper
substrate
resin
transfer apparatus
contact
Prior art date
Application number
PCT/JP2008/002709
Other languages
English (en)
French (fr)
Inventor
Haruka Narita
Hisashi Nishigaki
Original Assignee
Shibaura Mechatronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corporation filed Critical Shibaura Mechatronics Corporation
Priority to JP2009535962A priority Critical patent/JP4679664B2/ja
Publication of WO2009044527A1 publication Critical patent/WO2009044527A1/ja

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/263—Preparing and using a stamper, e.g. pressing or injection molding substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

スタンパの凹凸を、基板の正確な位置に転写できる転写装置を提供する。基板Ｐ上の樹脂ＲにスタンパＳの凹凸面を接触させ、樹脂Ｒを硬化させることによって、樹脂Ｒに凹凸を転写する転写装置であって、基板Ｐを保持するピン３３ｃと、スタンパＳを保持する支持台３２ａと、基板Ｐ及びスタンパＳのアラインメントマークを検出するＣＣＤカメラ３２ｃと、樹脂ＲとスタンパＳとを接触させる際に、ＣＣＤカメラ３２ｃにより検出されたアラインメントマークに基づいて、スタンパＳを接触面と平行な方向に移動させることにより、基板Ｐに対してスタンパＳの位置決めを行う位置決め装置３２とを有する。
PCT/JP2008/002709 2007-10-04 2008-09-29 転写装置 WO2009044527A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009535962A JP4679664B2 (ja) 2007-10-04 2008-09-29 転写装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-261408 2007-10-04
JP2007261408 2007-10-04

Publications (1)

Publication Number Publication Date
WO2009044527A1 true WO2009044527A1 (ja) 2009-04-09

Family

ID=40525959

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002709 WO2009044527A1 (ja) 2007-10-04 2008-09-29 転写装置

Country Status (3)

Country Link
JP (1) JP4679664B2 (ja)
TW (1) TW200936362A (ja)
WO (1) WO2009044527A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09106573A (ja) * 1995-10-12 1997-04-22 Sony Corp 多層光学記録媒体とその製造方法と製造装置
JP2003022585A (ja) * 2001-07-06 2003-01-24 Hitachi Maxell Ltd スタンパの製造方法及び原盤露光装置
JP2003045091A (ja) * 2001-08-01 2003-02-14 Sony Corp 光学記録媒体の製造方法
JP2006040407A (ja) * 2004-07-27 2006-02-09 Sony Corp 光ディスク装置
JP2006221767A (ja) * 2005-02-14 2006-08-24 Canon Inc 光記録媒体およびその製造方法
JP2006244635A (ja) * 2005-03-04 2006-09-14 Global Mach Kk 光情報記録媒体の製造装置
JP2006260664A (ja) * 2005-03-16 2006-09-28 Global Mach Kk 光情報記録媒体の製造装置
JP2006318610A (ja) * 2005-05-16 2006-11-24 Lintec Corp 貼合装置及び貼合方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007226870A (ja) * 2006-02-22 2007-09-06 Sony Corp ディスク製造方法、転写装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09106573A (ja) * 1995-10-12 1997-04-22 Sony Corp 多層光学記録媒体とその製造方法と製造装置
JP2003022585A (ja) * 2001-07-06 2003-01-24 Hitachi Maxell Ltd スタンパの製造方法及び原盤露光装置
JP2003045091A (ja) * 2001-08-01 2003-02-14 Sony Corp 光学記録媒体の製造方法
JP2006040407A (ja) * 2004-07-27 2006-02-09 Sony Corp 光ディスク装置
JP2006221767A (ja) * 2005-02-14 2006-08-24 Canon Inc 光記録媒体およびその製造方法
JP2006244635A (ja) * 2005-03-04 2006-09-14 Global Mach Kk 光情報記録媒体の製造装置
JP2006260664A (ja) * 2005-03-16 2006-09-28 Global Mach Kk 光情報記録媒体の製造装置
JP2006318610A (ja) * 2005-05-16 2006-11-24 Lintec Corp 貼合装置及び貼合方法

Also Published As

Publication number Publication date
TW200936362A (en) 2009-09-01
JPWO2009044527A1 (ja) 2011-02-03
JP4679664B2 (ja) 2011-04-27

Similar Documents

Publication Publication Date Title
WO2009022457A1 (ja) 基板貼り合わせ装置及び基板貼り合わせ方法
WO2007123249A3 (en) Alignment method, imprint method, alignment apparatus, and position measurement method
WO2009022469A1 (ja) 位置決め装置、貼り合わせ装置、積層基板製造装置、露光装置および位置決め方法
JP2009117877A5 (ja)
SG165169A1 (en) Liquid immersion exposure apparatus
TW200707133A (en) Lithographic apparatus and positioning apparatus
TW200802684A (en) Substrate processing apparatus and substrate transferring method
EP1847875A3 (en) Pattern transfer apparatus, imprint apparatus, and pattern transfer method
GB0606299D0 (en) Clamping device
JP2009220405A5 (ja)
WO2008142784A1 (ja) インプリント装置
EP1731963A3 (en) Mold, pattern forming method, and pattern forming apparatus
WO2009069224A1 (ja) 移載装置
TW200732090A (en) Methods of measuring and compensating cutting size on chamfering machine of sheet material
WO2008115372A8 (en) Apparatus and methods for keeping immersion fluid adjacent to an optical assembly during wafer exchange in an immersion lithography machine
TW201130076A (en) Method and apparatus to detect the alignment of a substrate
ATE532887T1 (de) Beschichterplatten-ausrichtungswerkzeug
CN203416570U (zh) 一种对位组装机
TW200745793A (en) Alignment unit and image recording apparatus using same
WO2008091571A3 (en) High-throughput apparatus for patterning flexible substrates and method of using the same
CN105149166A (zh) 随动接触式点胶机
TW200740673A (en) Article alignment apparatus
WO2009044527A1 (ja) 転写装置
DK0884177T3 (da) Anordning til fastgørelse af redskaber til overføring af metalfilm på et substrat og fremgangsmåde til fremstilling af en skabelon til anbringelse af disse redskaber
TW200622516A (en) Alignment method of using alignment marks on wafer edge

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08836021

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009535962

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08836021

Country of ref document: EP

Kind code of ref document: A1