WO2009041593A1 - ポジ型感光性ポリイミド樹脂組成物 - Google Patents

ポジ型感光性ポリイミド樹脂組成物 Download PDF

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Publication number
WO2009041593A1
WO2009041593A1 PCT/JP2008/067455 JP2008067455W WO2009041593A1 WO 2009041593 A1 WO2009041593 A1 WO 2009041593A1 JP 2008067455 W JP2008067455 W JP 2008067455W WO 2009041593 A1 WO2009041593 A1 WO 2009041593A1
Authority
WO
WIPO (PCT)
Prior art keywords
positive
type photosensitive
polyimide resin
photosensitive polyimide
resin composition
Prior art date
Application number
PCT/JP2008/067455
Other languages
English (en)
French (fr)
Inventor
Ri Ri
Go Matsuoka
Hiroyuki Wakui
Mayumi Akashi
Original Assignee
Toyo Boseki Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Boseki Kabushiki Kaisha filed Critical Toyo Boseki Kabushiki Kaisha
Publication of WO2009041593A1 publication Critical patent/WO2009041593A1/ja

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

【課題】微細パターンの加工ができ、得られた被膜の耐熱性と基材との線膨張係数が近接し、かつ高温でのイミド化を必要としない、電気特性や解像性などを劣化させることのない、耐熱性樹脂膜を与えることができるポジ型感光性ポリイミド組成物を提供する。 【解決手段】特定の骨格を有する有機溶剤可溶性のポリイミド樹脂と、（ｂ）活性光線照射により酸を発生する化合物とを含有することを特徴とするポジ型感光性ポリイミド樹脂組成物。
PCT/JP2008/067455 2007-09-28 2008-09-26 ポジ型感光性ポリイミド樹脂組成物 WO2009041593A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007253823A JP2009086147A (ja) 2007-09-28 2007-09-28 ポジ型感光性ポリイミド樹脂組成物
JP2007-253823 2007-09-28

Publications (1)

Publication Number Publication Date
WO2009041593A1 true WO2009041593A1 (ja) 2009-04-02

Family

ID=40511473

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067455 WO2009041593A1 (ja) 2007-09-28 2008-09-26 ポジ型感光性ポリイミド樹脂組成物

Country Status (2)

Country Link
JP (1) JP2009086147A (ja)
WO (1) WO2009041593A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117120511A (zh) * 2021-03-29 2023-11-24 三井化学株式会社 聚酰胺酸组合物、聚酰亚胺组合物、粘接剂和层叠体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000045435A1 (en) * 1999-01-29 2000-08-03 The University Of Akron Polyimides used as microelectronic coatings
JP2001183834A (ja) * 1999-12-22 2001-07-06 Dainippon Printing Co Ltd ポジ型感光性樹脂組成物、及びそれを用いたパターン形成方法
JP2002206056A (ja) * 2001-01-09 2002-07-26 Hitachi Cable Ltd 感光性ポリイミド樹脂組成物およびその製造方法
WO2008047591A1 (fr) * 2006-10-04 2008-04-24 Toyo Boseki Kabushiki Kaisha Résine de polyimide, vernis de polyimide et film de polyimide

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000045435A1 (en) * 1999-01-29 2000-08-03 The University Of Akron Polyimides used as microelectronic coatings
JP2001183834A (ja) * 1999-12-22 2001-07-06 Dainippon Printing Co Ltd ポジ型感光性樹脂組成物、及びそれを用いたパターン形成方法
JP2002206056A (ja) * 2001-01-09 2002-07-26 Hitachi Cable Ltd 感光性ポリイミド樹脂組成物およびその製造方法
WO2008047591A1 (fr) * 2006-10-04 2008-04-24 Toyo Boseki Kabushiki Kaisha Résine de polyimide, vernis de polyimide et film de polyimide

Also Published As

Publication number Publication date
JP2009086147A (ja) 2009-04-23

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