WO2009041235A1 - 電子部品の実装方法及び実装装置 - Google Patents

電子部品の実装方法及び実装装置 Download PDF

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Publication number
WO2009041235A1
WO2009041235A1 PCT/JP2008/065906 JP2008065906W WO2009041235A1 WO 2009041235 A1 WO2009041235 A1 WO 2009041235A1 JP 2008065906 W JP2008065906 W JP 2008065906W WO 2009041235 A1 WO2009041235 A1 WO 2009041235A1
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WO
WIPO (PCT)
Prior art keywords
electronic part
anisotropic conductive
adhesive film
conductive adhesive
chip
Prior art date
Application number
PCT/JP2008/065906
Other languages
English (en)
French (fr)
Inventor
Takashi Matsumura
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Publication of WO2009041235A1 publication Critical patent/WO2009041235A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/065—Press rams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　弾性体を用いた熱圧着の利点を活かしながら、ボイドの発生を最小限に抑え、接続不良の発生を大幅に低減することが可能な電子部品の実装方法及び実装装置を提供する。配線基板１１上に接着剤（例えば異方導電性接着フィルム１３）を介して電子部品（ＩＣチップ１２）を配置し、弾性体からなる圧着部４を備えた熱圧着ヘッド２により電子部品であるＩＣチップ１２を加圧するとともに、異方導電性接着フィルム１３を加熱し、ＩＣチップ１２を配線基板１１に熱圧着する。この時、異方導電性接着フィルム１３の温度が異方導電性接着フィルム１３に含まれる結着樹脂１３ａの硬化開始温度Ｋに到達する前に、熱圧着ヘッド２による加圧力が所定の圧力（ボイドを追い出すのに必要な圧力）に到達するように設定する。
PCT/JP2008/065906 2007-09-27 2008-09-03 電子部品の実装方法及び実装装置 WO2009041235A1 (ja)

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CN113611688A (zh) * 2021-08-03 2021-11-05 东莞记忆存储科技有限公司 一种芯片结构及其加工方法

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WO2015037632A1 (ja) * 2013-09-11 2015-03-19 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
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