WO2009041119A1 - アンテナ装置、表示装置基板、液晶表示ユニット、表示システム、アンテナ装置の製造方法、ならびに表示装置基板の製造方法 - Google Patents

アンテナ装置、表示装置基板、液晶表示ユニット、表示システム、アンテナ装置の製造方法、ならびに表示装置基板の製造方法 Download PDF

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Publication number
WO2009041119A1
WO2009041119A1 PCT/JP2008/060037 JP2008060037W WO2009041119A1 WO 2009041119 A1 WO2009041119 A1 WO 2009041119A1 JP 2008060037 W JP2008060037 W JP 2008060037W WO 2009041119 A1 WO2009041119 A1 WO 2009041119A1
Authority
WO
WIPO (PCT)
Prior art keywords
manufacturing
display
antenna device
device substrate
antenna
Prior art date
Application number
PCT/JP2008/060037
Other languages
English (en)
French (fr)
Inventor
Kazuhiko Miyata
Lloyd Lukama
Emmanuel Zyambo
Sunay Shah
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to EP08777048A priority Critical patent/EP2197074B1/en
Priority to US12/663,621 priority patent/US20100182207A1/en
Priority to JP2009534213A priority patent/JPWO2009041119A1/ja
Priority to CN2008800186677A priority patent/CN101682111B/zh
Publication of WO2009041119A1 publication Critical patent/WO2009041119A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/13—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body combined with thin-film or thick-film passive components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Liquid Crystal (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)
  • Telephone Set Structure (AREA)

Abstract

　本発明に係るアンテナ装置は、アンテナ（８１）、および、アンテナ（８１）と受信部（８２）とを接続する電気配線がアクティブマトリクス基板上に薄膜プロセスによってモノリシックに形成されたものである。そして、アンテナ（８１）を構成する材料の導電率が、上記電気配線を構成する材料の導電率よりも高くなっている。
PCT/JP2008/060037 2007-09-27 2008-05-30 アンテナ装置、表示装置基板、液晶表示ユニット、表示システム、アンテナ装置の製造方法、ならびに表示装置基板の製造方法 WO2009041119A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08777048A EP2197074B1 (en) 2007-09-27 2008-05-30 Antenna device, display device substrate, liquid crystal display unit, display system, method for manufacturing antenna device and method for manufacturing display device substrate
US12/663,621 US20100182207A1 (en) 2007-09-27 2008-05-30 Antenna device, display device substrate, liquid crystal display unit, display system, method for manufacturing antenna device and method for manufacturing display device substrate
JP2009534213A JPWO2009041119A1 (ja) 2007-09-27 2008-05-30 アンテナ装置、表示装置基板、液晶表示ユニット、表示システム、アンテナ装置の製造方法、ならびに表示装置基板の製造方法
CN2008800186677A CN101682111B (zh) 2007-09-27 2008-05-30 显示装置基板、液晶显示单元、显示系统、和显示装置基板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007252702 2007-09-27
JP2007-252702 2007-09-27

Publications (1)

Publication Number Publication Date
WO2009041119A1 true WO2009041119A1 (ja) 2009-04-02

Family

ID=40511019

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060037 WO2009041119A1 (ja) 2007-09-27 2008-05-30 アンテナ装置、表示装置基板、液晶表示ユニット、表示システム、アンテナ装置の製造方法、ならびに表示装置基板の製造方法

Country Status (5)

Country Link
US (1) US20100182207A1 (ja)
EP (1) EP2197074B1 (ja)
JP (1) JPWO2009041119A1 (ja)
CN (1) CN101682111B (ja)
WO (1) WO2009041119A1 (ja)

Cited By (12)

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CN102262312A (zh) * 2010-05-26 2011-11-30 汉王科技股份有限公司 具备电磁感应功能的液晶显示设备及对其的控制方法
JP2011249935A (ja) * 2010-05-24 2011-12-08 Tdk Corp 近接型アンテナ及び無線通信機器
JP2011249937A (ja) * 2010-05-24 2011-12-08 Tdk Corp 近接型アンテナ及び無線通信機器
CN102364567A (zh) * 2011-10-06 2012-02-29 友达光电股份有限公司 平面显示器
WO2013108477A1 (ja) * 2012-01-20 2013-07-25 株式会社日立製作所 半導体装置およびその製造方法
JP2013537392A (ja) * 2010-09-10 2013-09-30 サムスン エレクトロニクス カンパニー リミテッド 電子機器の電力供給方法と、ソース及びターゲット電子機器
JP2017138529A (ja) * 2016-02-05 2017-08-10 トッパン・フォームズ株式会社 電極基板及びこれを用いた情報表示媒体
JP2018033031A (ja) * 2016-08-25 2018-03-01 株式会社ジャパンディスプレイ 電子機器及び表示装置
JP2018125755A (ja) * 2017-02-02 2018-08-09 株式会社ジャパンディスプレイ 表示装置
TWI696989B (zh) * 2018-07-10 2020-06-21 友達光電股份有限公司 具有多通道資料傳輸的無線顯示面板
JP2020102661A (ja) * 2018-12-19 2020-07-02 株式会社ジャパンディスプレイ 電子機器
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CN107924665A (zh) * 2015-08-31 2018-04-17 夏普株式会社 转移控制装置、终端装置及转移控制方法
CN106597717A (zh) * 2015-10-19 2017-04-26 上海蓝沛信泰光电科技有限公司 一种液晶显示模组叠层结构及电子设备
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US10985469B2 (en) * 2016-02-19 2021-04-20 Sharp Kabushiki Kaisha Scanning antenna and method for manufacturing same
WO2017170133A1 (ja) * 2016-03-29 2017-10-05 シャープ株式会社 走査アンテナ、走査アンテナの検査方法および走査アンテナの製造方法
US10573641B2 (en) * 2016-05-16 2020-02-25 Sharp Kabushiki Kaisha TFT substrate, scanning antenna provided with TFT substrate, and method for producing TFT substrate
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CN109643848B (zh) * 2016-08-12 2021-04-13 夏普株式会社 扫描天线
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Cited By (16)

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JP2011249935A (ja) * 2010-05-24 2011-12-08 Tdk Corp 近接型アンテナ及び無線通信機器
JP2011249937A (ja) * 2010-05-24 2011-12-08 Tdk Corp 近接型アンテナ及び無線通信機器
CN102262312A (zh) * 2010-05-26 2011-11-30 汉王科技股份有限公司 具备电磁感应功能的液晶显示设备及对其的控制方法
JP2013537392A (ja) * 2010-09-10 2013-09-30 サムスン エレクトロニクス カンパニー リミテッド 電子機器の電力供給方法と、ソース及びターゲット電子機器
CN102364567A (zh) * 2011-10-06 2012-02-29 友达光电股份有限公司 平面显示器
CN102364567B (zh) * 2011-10-06 2016-03-23 友达光电股份有限公司 平面显示器
WO2013108477A1 (ja) * 2012-01-20 2013-07-25 株式会社日立製作所 半導体装置およびその製造方法
JP2013149833A (ja) * 2012-01-20 2013-08-01 Hitachi Ltd 半導体装置およびその製造方法
JP2017138529A (ja) * 2016-02-05 2017-08-10 トッパン・フォームズ株式会社 電極基板及びこれを用いた情報表示媒体
JP2018033031A (ja) * 2016-08-25 2018-03-01 株式会社ジャパンディスプレイ 電子機器及び表示装置
US10564487B2 (en) 2016-08-25 2020-02-18 Japan Display Inc. Electronic device comprising first and second conductive lines that form a coil with a bridge line and display device
JP2018125755A (ja) * 2017-02-02 2018-08-09 株式会社ジャパンディスプレイ 表示装置
TWI696989B (zh) * 2018-07-10 2020-06-21 友達光電股份有限公司 具有多通道資料傳輸的無線顯示面板
JP2020102661A (ja) * 2018-12-19 2020-07-02 株式会社ジャパンディスプレイ 電子機器
JP7271162B2 (ja) 2018-12-19 2023-05-11 株式会社ジャパンディスプレイ 電子機器
JP2021048596A (ja) * 2020-11-17 2021-03-25 株式会社ジャパンディスプレイ 表示装置

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Publication number Publication date
EP2197074B1 (en) 2012-12-12
EP2197074A1 (en) 2010-06-16
JPWO2009041119A1 (ja) 2011-01-20
EP2197074A4 (en) 2011-11-02
US20100182207A1 (en) 2010-07-22
CN101682111B (zh) 2013-01-16
CN101682111A (zh) 2010-03-24

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